IEEE Transactions on Components Packaging and Manufacturing Technology

Journal Metrics
(Based on the publications from the last 4 years)
(from 2022-08-01 to roughly 2026-08-01)
Number of papers1425
H4-Index27
TQCC5
Average citations4.392
Median citations1
Impact Factor3.300 (based on Web of Science 2025)

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Categories & Ranks
Metric:
(Based on the publications from the last 4 years)
Impactful Papers
(Based on publications since 2023; last updated 2026-01-22)
Altmetric Attention Score: 7
A Compressed Multivariate Macromodeling Framework for Fast Transient Verification of System-Level Power Delivery Networks
IEEE Transactions on Components Packaging and Manufacturing Technology 2023-10-22
Altmetric Attention Score: 7
Facilitating Small-Pitch Interconnects With Low-Temperature Solid-Liquid Interdiffusion Bonding
IEEE Transactions on Components Packaging and Manufacturing Technology 2025-03-26
Altmetric Attention Score: 7
Thermally Conductive Electrically Insulating Electronics Packaging for Water Immersion Cooling
IEEE Transactions on Components Packaging and Manufacturing Technology 2025-06-29
Altmetric Attention Score: 7
Advanced Chiplet Placement and Routing Optimization Considering Signal Integrity
IEEE Transactions on Components Packaging and Manufacturing Technology 2025-11-27
Altmetric Attention Score: 7
Thermal Modeling and Analysis of Equivalent Thermal Properties for Advanced BEOL Stacks
IEEE Transactions on Components Packaging and Manufacturing Technology 2025-08-24
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