IEEE Transactions on Components Packaging and Manufacturing Technology

Papers
(The H4-Index of IEEE Transactions on Components Packaging and Manufacturing Technology is 23. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-04-01 to 2025-04-01.)
ArticleCitations
Table of Contents277
Blank Page93
Front Cover75
Front Cover72
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors51
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors44
Highly Manufacturable Packaging of an Implantable Episcleral Surface Stimulator with Reliability and Safety Validations44
Solder Reflow Resistant Thermoplastic for Optical Coupling43
Blank page39
An Integrated Multi-Output Classification Based Defect Diagnosis Model for Pick and Place Machines38
Smartphone Antenna on Display (AoD) Design at Millimeter-wave Frequencies with Enhanced Transparency and Ground Plane37
Investigation of Graphene Film as Ground Plane Material for RF and Microwave Electronics35
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information34
Front Cover34
Partially Omnidirectional and Circularly Polarized MIMO Antenna Covering Sub-6-GHz Band for 5G Fast Plan33
Ratcheting Behavior of Sintered Copper Joints for Electronic Packaging32
Table of Contents30
Blank Page30
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information29
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information29
Member Get-A-Member (MGM) Program27
Antenna Array on Glass Interposer for 6G Wireless Communications24
Blank page24
Front Cover23
Blank Page23
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