OOIR: Observatory of International Research

Papers

(The H4-Index of IEEE Transactions on Components Packaging and Manufacturing Technology is 27. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-06-01 to 2026-06-01.)

Article	Citations
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	168
Blank Page	101
Intra-Lid Multi-Core Vapor Chamber Architecture for Heterogeneous Electronic Packages: Technology Concept to Prototype Evaluation	57
Table of Contents	50
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	50
Predictive Modeling Of TCV-Cu Protrusion Under Thermal Cycling	46
Ultralow-Temperature Deposition and Enhanced Bonding of SiCN Films for Advanced 3-D Integration	45
Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating	45
Jet-Dispensing-Based Assembly of Electric Field Adaptively Controlled Structure in Power Electronic Modules	45
Low-Loss FeSi–FeNi Inductor Cores for >5–1-V Integrated Voltage Regulators	42
Advances in Package Microvia Interconnects: Breakthroughs With Picosecond UV Laser Ablation	39
Degradation Mechanisms in Die-to-Wafer Hybrid Bonding Governed by Surface Activation Lifetime and Moisture Evaporation	39
Wideband 3-D-Printed Chip Interconnects for DC-Millimeter Wave Applications	37
Compact In-Line Multiband Bandpass Filters With Independently Controllable Passbands Using Quarter-Mode SIW Cavities	34
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	34
Investigation of Graphene Film as Ground Plane Material for RF and Microwave Electronics	33
Enhancing Defect Detection in Circuit Board Assembly Using AI and Text Analytics for Component Failure Classification	33
Skew-Symmetric Slotted Waveguide With Mode Select Effect	31
Reliability Risk Assessment of Server CPU Package in Single Phase Hydrocarbon-Based Immersion Fluid	31
Simulation of the Dynamic Process and Quality-Influencing Mechanisms in Wafer-to-Wafer Hybrid Bonding	30
Rapid Multiobjective Optimization Strategy of TSV-Based 3-D Inductor Using Vector Fitting and Evolutionary Algorithm	29
Accelerated Life Test and Prediction of Electromigration in Aluminum Interconnects Coupling Multiphysics Full Coupled Model With Optimized Atomic Flux Divergence Simulation	29
Spray deposition for Board Level Shielding assessed through MSRC measurements	29
A Data-Driven Approach to Collaborative Optimization for Enhancing TSV Multiphysics Performance	29
Board-Level Reliability of 100 × 100 mm Large Glass Packages: Warpage and Thermomechanical Reliability for AI/HPC Applications	28

IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	28
Design and Implementation of an Electrostatic Force-Based Microcirculation Cooling System for Microelectronic Devices	27