IEEE Transactions on Components Packaging and Manufacturing Technology

Papers
(The H4-Index of IEEE Transactions on Components Packaging and Manufacturing Technology is 24. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-05-01 to 2025-05-01.)
ArticleCitations
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IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information77
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information52
Enhancing Defect Detection in Circuit Board Assembly Using AI and Text Analytics for Component Failure Classification49
Accelerated Life Test and Prediction of Electromigration in Aluminum Interconnects coupling Multiphysics Full Coupled Model with Optimized Atomic Flux Divergence Simulation45
A Data-Driven Approach to Collaborative Optimization for Enhancing TSV Multiphysics Performance43
A Wettability-Mediated Microdroplet Under Electrowetting Effect for Hotspot Cooling40
Study on the Performance of Insulating Substrate Based on Silver Sintering40
Thermomechanical Modeling and Stress Analysis of Copper Inverse Opal (CIO) Structure for Capillary-Fed Boiling39
Hybrid Integration of VCSEL and 3-μm Silicon Waveguide Based on a Monolithic Lens System38
Integrated Circuit Packaging Defect Analysis and Deep Learning Detection Method37
Practical Early Quality–Reliability Analysis of Microwirewound Resistor Transition Zone36
System Optimization: High-Frequency Buck Converter With 3-D In-Package Air-Core Inductor35
Wideband 3-D-Printed Chip Interconnects for DC-Millimeter Wave Applications35
Intra-Lid Multi-Core Vapor Chamber Architecture for Heterogeneous Electronic Packages: Technology Concept to Prototype Evaluation35
RF Performance Benchmarking of TSV Integrated Surface Electrode Ion Trap for Quantum Computing30
A Multifault Testing Method for TSVs Based on GAF-DRSN and Mirror Constant Current Source Structure30
Rapid Multiobjective Optimization Strategy of TSV-Based 3-D Inductor Using Vector Fitting and Evolutionary Algorithm29
Skew-Symmetric Slotted Waveguide With Mode Select Effect27
Design and Implementation of an Electrostatic Force-Based Microcirculation Cooling System for Microelectronic Devices25
Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating25
Table of Contents24
Investigation of Graphene Film as Ground Plane Material for RF and Microwave Electronics24
Reconfigurable SIW Phase Shifter Based on Parallel Stubs Loaded With Surface Mount p-i-n Diodes24
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