OOIR: Observatory of International Research

Papers

(The H4-Index of IEEE Transactions on Components Packaging and Manufacturing Technology is 25. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-09-01 to 2025-09-01.)

Article	Citations
Blank Page	373
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	111
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	65
Study on the Performance of Insulating Substrate Based on Silver Sintering	55
Thermomechanical Modeling and Stress Analysis of Copper Inverse Opal (CIO) Structure for Capillary-Fed Boiling	54
Hybrid Integration of VCSEL and 3-μm Silicon Waveguide Based on a Monolithic Lens System	53
Intra-Lid Multi-Core Vapor Chamber Architecture for Heterogeneous Electronic Packages: Technology Concept to Prototype Evaluation	49
RF Performance Benchmarking of TSV Integrated Surface Electrode Ion Trap for Quantum Computing	43
Skew-Symmetric Slotted Waveguide With Mode Select Effect	42
Table of Contents	42
Compact In-Line Multiband Bandpass Filters with Independently Controllable Passbands using Quarter-Mode SIW Cavities	41
System Optimization: High-Frequency Buck Converter With 3-D In-Package Air-Core Inductor	38
Investigation of Graphene Film as Ground Plane Material for RF and Microwave Electronics	36
Microstructural Evolution of SAC-Based Solder Joints Exposed to Thermal Cycling: Effect of Paste Alloy, Paste Volume, and Surface Finish	33
Accelerated Life Test and Prediction of Electromigration in Aluminum Interconnects Coupling Multiphysics Full Coupled Model With Optimized Atomic Flux Divergence Simulation	33
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	32
Design and Implementation of an Electrostatic Force-Based Microcirculation Cooling System for Microelectronic Devices	30
A Multifault Testing Method for TSVs Based on GAF-DRSN and Mirror Constant Current Source Structure	30
Dual-Band Dual-Polarized Microstrip Patch Antenna With Parasitic Elements for 5G Antenna-in-Package Design at Millimeter-Wave Frequencies	28
A Data-Driven Approach to Collaborative Optimization for Enhancing TSV Multiphysics Performance	26
Substrate Integrated Waveguide Filters in Glass Interposer for mmWave Applications	26
Reconfigurable SIW Phase Shifter Based on Parallel Stubs Loaded With Surface Mount p-i-n Diodes	26
Integrated Circuit Packaging Defect Analysis and Deep Learning Detection Method	26
Wideband 3-D-Printed Chip Interconnects for DC-Millimeter Wave Applications	26
Jet-Dispensing-Based Assembly of Electric Field Adaptively Controlled Structure in Power Electronic Modules	25

Rapid Multiobjective Optimization Strategy of TSV-Based 3-D Inductor Using Vector Fitting and Evolutionary Algorithm	25
Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating	25