OOIR: Observatory of International Research

Papers

(The H4-Index of IEEE Transactions on Components Packaging and Manufacturing Technology is 24. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-05-01 to 2025-05-01.)

Article	Citations
Blank Page	296
Blank page	95
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	77
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	52
Enhancing Defect Detection in Circuit Board Assembly Using AI and Text Analytics for Component Failure Classification	49
Accelerated Life Test and Prediction of Electromigration in Aluminum Interconnects coupling Multiphysics Full Coupled Model with Optimized Atomic Flux Divergence Simulation	45
A Data-Driven Approach to Collaborative Optimization for Enhancing TSV Multiphysics Performance	43
A Wettability-Mediated Microdroplet Under Electrowetting Effect for Hotspot Cooling	40
Study on the Performance of Insulating Substrate Based on Silver Sintering	40
Thermomechanical Modeling and Stress Analysis of Copper Inverse Opal (CIO) Structure for Capillary-Fed Boiling	39
Hybrid Integration of VCSEL and 3-μm Silicon Waveguide Based on a Monolithic Lens System	38
Integrated Circuit Packaging Defect Analysis and Deep Learning Detection Method	37
Practical Early Quality–Reliability Analysis of Microwirewound Resistor Transition Zone	36
Intra-Lid Multi-Core Vapor Chamber Architecture for Heterogeneous Electronic Packages: Technology Concept to Prototype Evaluation	35
System Optimization: High-Frequency Buck Converter With 3-D In-Package Air-Core Inductor	35
Wideband 3-D-Printed Chip Interconnects for DC-Millimeter Wave Applications	35
A Multifault Testing Method for TSVs Based on GAF-DRSN and Mirror Constant Current Source Structure	30
RF Performance Benchmarking of TSV Integrated Surface Electrode Ion Trap for Quantum Computing	30
Rapid Multiobjective Optimization Strategy of TSV-Based 3-D Inductor Using Vector Fitting and Evolutionary Algorithm	29
Skew-Symmetric Slotted Waveguide With Mode Select Effect	27
Design and Implementation of an Electrostatic Force-Based Microcirculation Cooling System for Microelectronic Devices	25
Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating	25
Reconfigurable SIW Phase Shifter Based on Parallel Stubs Loaded With Surface Mount p-i-n Diodes	24
Table of Contents	24
Investigation of Graphene Film as Ground Plane Material for RF and Microwave Electronics	24