IEEE Transactions on Components Packaging and Manufacturing Technology

Papers
(The H4-Index of IEEE Transactions on Components Packaging and Manufacturing Technology is 25. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-01-01 to 2026-01-01.)
ArticleCitations
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information461
Blank Page140
Hybrid Integration of VCSEL and 3-μm Silicon Waveguide Based on a Monolithic Lens System81
Intra-Lid Multi-Core Vapor Chamber Architecture for Heterogeneous Electronic Packages: Technology Concept to Prototype Evaluation53
Skew-Symmetric Slotted Waveguide With Mode Select Effect48
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information47
Table of Contents42
Board-Level Reliability of 100 mm × 100 mm Large Glass Packages: Warpage and Thermo-Mechanical Reliability for AI/HPC Applications40
Compact In-Line Multiband Bandpass Filters with Independently Controllable Passbands using Quarter-Mode SIW Cavities40
Jet-Dispensing-Based Assembly of Electric Field Adaptively Controlled Structure in Power Electronic Modules40
Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating39
Mm-Wave 3D Printed 2×2 Antenna Subarray with Structurally Packaged Beamforming IC and Thermal Management37
A Data-Driven Approach to Collaborative Optimization for Enhancing TSV Multiphysics Performance32
Thermomechanical Modeling and Stress Analysis of Copper Inverse Opal (CIO) Structure for Capillary-Fed Boiling32
Design and Implementation of an Electrostatic Force-Based Microcirculation Cooling System for Microelectronic Devices29
System Optimization: High-Frequency Buck Converter With 3-D In-Package Air-Core Inductor28
Study on the Performance of Insulating Substrate Based on Silver Sintering28
Investigation of Graphene Film as Ground Plane Material for RF and Microwave Electronics28
Microstructural Evolution of SAC-Based Solder Joints Exposed to Thermal Cycling: Effect of Paste Alloy, Paste Volume, and Surface Finish27
Rapid Multiobjective Optimization Strategy of TSV-Based 3-D Inductor Using Vector Fitting and Evolutionary Algorithm27
Reliability Risk Assessment of Server CPU Package in Single-Phase, Hydrocarbon-Based Immersion Fluid27
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information27
Ultralow-Temperature Deposition and Enhanced Bonding of SiCN Films for Advanced 3-D Integration26
Integrated Circuit Packaging Defect Analysis and Deep Learning Detection Method26
Accelerated Life Test and Prediction of Electromigration in Aluminum Interconnects Coupling Multiphysics Full Coupled Model With Optimized Atomic Flux Divergence Simulation26
Low-Loss FeSi–FeNi Inductor Cores for >5–1-V Integrated Voltage Regulators25
0.36608791351318