OOIR: Observatory of International Research

Papers

(The H4-Index of IEEE Transactions on Components Packaging and Manufacturing Technology is 22. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2020-11-01 to 2024-11-01.)

Article	Citations
Recent Advances and Trends in Advanced Packaging	189
A Review of 5G Front-End Systems Package Integration	130
Universal Chiplet Interconnect Express (UCIe): An Open Industry Standard for Innovations With Chiplets at Package Level	64
A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs)	60
Power Delivery for High-Performance Microprocessors—Challenges, Solutions, and Future Trends	56
Automatic Industry PCB Board DIP Process Defect Detection System Based on Deep Ensemble Self-Adaption Method	42
Electric Field Mitigation in High-Voltage High-Power IGBT Modules Using Nonlinear Conductivity Composites	38
Long Short-Term Memory Neural Networks for Modeling Nonlinear Electronic Components	37
Wafer-to-Wafer Hybrid Bonding Development by Advanced Finite Element Modeling for 3-D IC Packages	37
Characterization of ABF/Glass/ABF Substrates for mmWave Applications	36
An Adaptive Machine Learning Method Based on Finite Element Analysis for Ultra Low-k Chip Package Design	35
Electrical and Reliability Investigation of Cu-to-Cu Bonding With Silver Passivation Layer in 3-D Integration	34
The ICECool Fundamentals Effort on Evaporative Cooling of Microelectronics	33
Silicon-Interconnect Fabric for Fine-Pitch (≤10 μm) Heterogeneous Integration	33
Low Insertion-Loss MMIC Bandpass Filter Using Lumped-Distributed Parameters for 5G Millimeter-Wave Application	32
A Contactless PCBA Defect Detection Method: Convolutional Neural Networks With Thermographic Images	31
CPU Overclocking: A Performance Assessment of Air, Cold Plates, and Two-Phase Immersion Cooling	28
Diamond-Incorporated Flip-Chip Integration for Thermal Management of GaN and Ultra-Wide Bandgap RF Power Amplifiers	27
Modular Integration of a Passive RFID Sensor With Wearable Textile Antennas for Patient Monitoring	27
Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV-Less Interposers	26
Comparison of Mechanical Modeling to Warpage Estimation of RDL-First Fan-Out Panel-Level Packaging	25
A Review of Recent Developments in Pumped Two-Phase Cooling Technologies for Electronic Devices	24
Investigation of Low-Temperature Cu–Cu Direct Bonding With Pt Passivation Layer in 3-D Integration	22
A Method of Defect Detection for Focal Hard Samples PCB Based on Extended FPN Model	22