OOIR: Observatory of International Research

Papers

(The H4-Index of IEEE Transactions on Components Packaging and Manufacturing Technology is 26. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-04-01 to 2026-04-01.)

Article	Citations
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	163
Blank Page	95
Hybrid Integration of VCSEL and 3-μm Silicon Waveguide Based on a Monolithic Lens System	55
Intra-Lid Multi-Core Vapor Chamber Architecture for Heterogeneous Electronic Packages: Technology Concept to Prototype Evaluation	45
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	44
Jet-Dispensing-Based Assembly of Electric Field Adaptively Controlled Structure in Power Electronic Modules	43
Table of Contents	43
Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating	42
Thermomechanical Modeling and Stress Analysis of Copper Inverse Opal (CIO) Structure for Capillary-Fed Boiling	41
Integrated Circuit Packaging Defect Analysis and Deep Learning Detection Method	40
Accelerated Life Test and Prediction of Electromigration in Aluminum Interconnects Coupling Multiphysics Full Coupled Model With Optimized Atomic Flux Divergence Simulation	33
Enhancing Defect Detection in Circuit Board Assembly Using AI and Text Analytics for Component Failure Classification	32
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	32
Wideband 3-D-Printed Chip Interconnects for DC-Millimeter Wave Applications	31
Substrate Integrated Waveguide Filters in Glass Interposer for mmWave Applications	31
A Multifault Testing Method for TSVs Based on GAF-DRSN and Mirror Constant Current Source Structure	31
Dual-Band Dual-Polarized Microstrip Patch Antenna With Parasitic Elements for 5G Antenna-in-Package Design at Millimeter-Wave Frequencies	31
Ultralow-Temperature Deposition and Enhanced Bonding of SiCN Films for Advanced 3-D Integration	30
Low-Loss FeSi–FeNi Inductor Cores for >5–1-V Integrated Voltage Regulators	28
Predictive Modeling Of TCV-Cu Protrusion Under Thermal Cycling	28
Advances in Package Microvia Interconnects: Breakthroughs With Picosecond UV Laser Ablation	28
Degradation Mechanisms in Die-to-Wafer Hybrid Bonding Governed by Surface Activation Lifetime and Moisture Evaporation	28
Investigation of Graphene Film as Ground Plane Material for RF and Microwave Electronics	27
Reliability Risk Assessment of Server CPU Package in Single Phase Hydrocarbon-Based Immersion Fluid	27
A Data-Driven Approach to Collaborative Optimization for Enhancing TSV Multiphysics Performance	26

Compact In-Line Multiband Bandpass Filters With Independently Controllable Passbands Using Quarter-Mode SIW Cavities