IEEE Transactions on Components Packaging and Manufacturing Technology

Papers
(The H4-Index of IEEE Transactions on Components Packaging and Manufacturing Technology is 22. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2020-04-01 to 2024-04-01.)
ArticleCitations
Recent Advances and Trends in Advanced Packaging121
A Review of 5G Front-End Systems Package Integration108
Demystifying Machine Learning for Signal and Power Integrity Problems in Packaging50
Universal Chiplet Interconnect Express (UCIe): An Open Industry Standard for Innovations With Chiplets at Package Level44
A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs)42
Power Delivery for High-Performance Microprocessors—Challenges, Solutions, and Future Trends39
Thermal TSV Optimization and Hierarchical Floorplanning for 3-D Integrated Circuits37
An Adaptive Machine Learning Method Based on Finite Element Analysis for Ultra Low-k Chip Package Design32
Automatic Industry PCB Board DIP Process Defect Detection System Based on Deep Ensemble Self-Adaption Method32
Electric Field Mitigation in High-Voltage High-Power IGBT Modules Using Nonlinear Conductivity Composites31
Characterization of ABF/Glass/ABF Substrates for mmWave Applications30
Low Insertion-Loss MMIC Bandpass Filter Using Lumped-Distributed Parameters for 5G Millimeter-Wave Application29
Wafer-to-Wafer Hybrid Bonding Development by Advanced Finite Element Modeling for 3-D IC Packages28
Long Short-Term Memory Neural Networks for Modeling Nonlinear Electronic Components28
Electrical and Reliability Investigation of Cu-to-Cu Bonding With Silver Passivation Layer in 3-D Integration27
Silicon-Interconnect Fabric for Fine-Pitch (≤10 μm) Heterogeneous Integration25
Numerical Simulation and Analytical Modeling of the Thermal Behavior of Single- and Double-Sided Cooled Power Modules25
The ICECool Fundamentals Effort on Evaporative Cooling of Microelectronics25
Modular Integration of a Passive RFID Sensor With Wearable Textile Antennas for Patient Monitoring24
CPU Overclocking: A Performance Assessment of Air, Cold Plates, and Two-Phase Immersion Cooling22
Influence of Operation Numbers on Arc Erosion of Ag/CdO Electrical Contact Materials22
Diamond-Incorporated Flip-Chip Integration for Thermal Management of GaN and Ultra-Wide Bandgap RF Power Amplifiers22
Fatigue Behavior of SAC-Bi and SAC305 Solder Joints With Aging22
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