IEEE Transactions on Components Packaging and Manufacturing Technology

Article	Citations
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IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	77
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	52
Enhancing Defect Detection in Circuit Board Assembly Using AI and Text Analytics for Component Failure Classification	49
Accelerated Life Test and Prediction of Electromigration in Aluminum Interconnects coupling Multiphysics Full Coupled Model with Optimized Atomic Flux Divergence Simulation	45
A Data-Driven Approach to Collaborative Optimization for Enhancing TSV Multiphysics Performance	43
Study on the Performance of Insulating Substrate Based on Silver Sintering	40
A Wettability-Mediated Microdroplet Under Electrowetting Effect for Hotspot Cooling	40
Thermomechanical Modeling and Stress Analysis of Copper Inverse Opal (CIO) Structure for Capillary-Fed Boiling	39
Hybrid Integration of VCSEL and 3-μm Silicon Waveguide Based on a Monolithic Lens System	38
Integrated Circuit Packaging Defect Analysis and Deep Learning Detection Method	37
Practical Early Quality–Reliability Analysis of Microwirewound Resistor Transition Zone	36
Intra-Lid Multi-Core Vapor Chamber Architecture for Heterogeneous Electronic Packages: Technology Concept to Prototype Evaluation	35
System Optimization: High-Frequency Buck Converter With 3-D In-Package Air-Core Inductor	35
Wideband 3-D-Printed Chip Interconnects for DC-Millimeter Wave Applications	35
A Multifault Testing Method for TSVs Based on GAF-DRSN and Mirror Constant Current Source Structure	30
RF Performance Benchmarking of TSV Integrated Surface Electrode Ion Trap for Quantum Computing	30
Rapid Multiobjective Optimization Strategy of TSV-Based 3-D Inductor Using Vector Fitting and Evolutionary Algorithm	29
Skew-Symmetric Slotted Waveguide With Mode Select Effect	27
Design and Implementation of an Electrostatic Force-Based Microcirculation Cooling System for Microelectronic Devices	25
Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating	25
Reconfigurable SIW Phase Shifter Based on Parallel Stubs Loaded With Surface Mount p-i-n Diodes	24
Table of Contents	24
Investigation of Graphene Film as Ground Plane Material for RF and Microwave Electronics	24

Substrate Integrated Waveguide Filters in Glass Interposer for mmWave Applications	22
Compact In-Line Multiband Bandpass Filters with Independently Controllable Passbands using Quarter-Mode SIW Cavities	21
In Memoriam Prof. Avram Bar-Cohen	21
Dual-Band Dual-Polarized Microstrip Patch Antenna With Parasitic Elements for 5G Antenna-in-Package Design at Millimeter-Wave Frequencies	21
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	21
Enhancing Humidity Robustness of Electronics: Understanding the Crucial Role of Solder Flux Chemistry in Determining Humidity Boundary for Failure	21
Member Get-a-Member (MGM) Program	20
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	20
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	20
IEEE Transactions on Components, Packaging and Manufacturing Technology publication information	20
Analysis of Power Delivery Network (PDN) in Bridge-Chips for 2.5-D Heterogeneous Integration	20
Table of Contents	20
Power, Performance, Area, and Cost Analysis of Face-to-Face-Bonded 3-D ICs	20
Packaged Millimeter-Wave On-Chip Bandpass Filter Using SHMSIW and Microstrip Hybrid Structure in 0.25-μm GaAs pHEMT Technology	19
A Novel Approach to Evaluate and Predict the Impact of Randomly Distributed Voids on Junction Temperature for Power Modules	19
Influence of Au Substrate Crystal Structure on Ag–Au Interdiffusion for WBG Packaging	19
Optimization and Analysis of Microchannels Under Complex Power Distribution in 3-D ICs	18
Warpage Analysis and Prediction of the Advanced Fan-Out Technology Based on Process Mechanics	18
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	18
Application of Lévêque Analogy to Open Cellular Porous Materials	17
Signal Integrity Analysis of Through-Silicon Via (TSV) With a Silicon Dioxide Well to Reduce Leakage Current for High-Bandwidth Memory Interface	17
Thermal Onboard Detection of Voids in the Solder Layer Between Power Semiconductor and PCB	17
Optimization of the Wire Bonding Process for Enhanced Thermomechanical Performance of Quad Flat No-lead (QFN) Packages in Automotive Applications	17
Deep Reinforcement Learning-Based Optimal and Fast Hybrid Equalizer Design Method for High-Bandwidth Memory (HBM) Module	17
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	17
Reliability Improvement of 3.3 kV Full-SiC Power Modules for Power Cycling Tests With Sintered Copper Die Attach Technology	16
High-Dimensional Uncertainty Quantification Using Stochastic Galerkin and Tensor Decomposition	16
Extending Copper Interconnects and Epoxy Dielectrics to Multi-GHz Frequencies	16
Gate Voltage Oscillation Mitigation in Solid-State Circuit Breakers With Single-Gate Driven Series-Connected Power Devices	16
Third Quadrant Operation of SiC MOSFETs: Comprehensive Analysis and Condition Monitoring Solution	16
Holistic Chiplet–Package Co-Optimization for Agile Custom 2.5-D Design	16
Effect of Solar Irradiation on Thermal Performance of Heatsink—Numerical and Experimental Study	15
Thermal Design and Evaluation of a Rectifier for Electric Vehicle Wireless Charging Using Hybrid PCBs and Planar Magnetics	15
Dielectric Breakdown by Metallic Particles in COF Packaging for Display Driver IC	15
Estimation of Heat Generation in Semiconductors Centrally Mounted on Printed Circuit Boards	15
A Stepwise Integration Separation of Variables Solver for Full-Chip Thermal Uncertainty Analysis	15
Comparison Between Synthetic Oil Lubricants for Reducing Fretting Degradation in Lightly Loaded Gold-Plated Contacts	15
A Cavity Balun for High-Power Shortwave Transmission	15
Compact Interdigital Bandpass Filter, Diplexer, and Triplexer Based on Through Quartz Vias (TQVs)	14
Transient Flow Boiling and Maldistribution Characteristics in Heated Parallel Channels Induced by Flow Regime Oscillations	14
Optically Transparent Adhesives for Microwave Metamaterial Absorber With PET–PDMS Interface	14
Electro-Thermal-Stress Multiphysical Field Coupling Optimization Design for Coaxial Through Silicon Via Array	14
Analysis of Discharge Caused by Soldering Defect in Wire-Bonding Power Module	14
Machine Learning-Based Diagnosis of Defects in 2.5D and 3D Interconnects	14
D-Band Waveguide Diplexer Fabricated Using Micro Laser Sintering	14
Front Cover	14
A Low-Profile Filtering Magneto-Electric Dipole Antenna Based on High-Density-Interconnect (HDI) Packaging	14
Wide-Stopband Diplexer With Small Frequency Ratio Based on SIW Dual-Mode Resonators for Millimeter-Wave Applications	13
Differential-Fed Magneto-Electric Dipole Antenna With Integrated Balun Based on Ball Grid Array Packaging	13
A TSV-Based 3-D Electromagnetic Bandgap Structure on an Interposer for Noise Suppression	13

Design and demonstration of dual-core spiral package-embedded inductors for Integrated Voltage Regulators	13
Embedded p-i-n-Diode Die Interconnections With Aerosol-Jet Printing	13
Table of Contents	13
IEEE Components, Packaging, and Manufacturing Technology Society Information	13
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Double-Sided Copper Filling of Small diameter, High-Aspect Ratio Through-Glass Vias in High-Density Glass Interposers	13
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	13
Emerging trends in system-integrated wearable epidermal and flexible electrodes: Material design and applications in physiological monitoring	13
Modeling of Tunable Electronic Waveguide Devices in Graphene Using Conservative Higher Order Time Stepping	12
Monolithically GaN-Based Optocoupler With Chip Scaling	12
Characterization of Alumina Ribbon Ceramic Substrates for 5G and mm-Wave Applications	12
Ball Grid Array Package Intermittent Partial Connection Defect Analysis in DDR4 Data Channel	12
On the Use of Acoustic Methods for the Detection of Electrostatic Capture of Diaphragm in Capacitive MEMS Microphones	12
High-Dimensional Uncertainty Quantification via Tensor Regression With Rank Determination and Adaptive Sampling	12
Benchmarking and Demonstration of Low-Loss Fused-Silica Stitch-Chips With Compressible Microinterconnects for RF/mm-Wave Chiplet-Based Modules	12
A Wideband Transition From Coaxial Line to Substrate-Integrated Waveguide	12
On the Use of an In-Package Dielectric Lens Antenna for Radar-Based Applications	12
Influence of Copper Pad Dimension on Thermal Fatigue Life Performance of BGA Packages	12
High-Selectivity Bandpass Filter-Integrated SPDT Switch Using Switchable Dual-Mode Hybrid Resonators	11
Table of Contents	11
Member Get-A-Member (MGM) Program	11
YOLO Algorithm With Hybrid Attention Feature Pyramid Network for Solder Joint Defect Detection	11
Solder Joint Geometry Effects on Thermomechanical Fatigue Lifetime of End-Capped Chip Component Assemblies	11
Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme	11
A Dual-Band Mushroom EBG Structure With Inductive via Coupling for Wideband Parallel-Plate Mode Suppression	11
A Review of Recent Developments in Pumped Two-Phase Cooling Technologies for Electronic Devices	11
Front Cover	11
Metrology of Silicon Wafers Through Synchrotron Section Topography and X-Ray Diffraction Imaging	11
Corrections to “A Fully Integrated Arbitrary Power Divider on Printed Circuit Board by a Novel SMD-Resistor-Free Isolation Network”	11
Low-Profile UWB Millimeter-Wave Antenna Array Under Triple Resonant Modes Based on PCB Technology	11
The Impact of Substrate Vibrations on Self-Alignment Accuracy in BGA/Flip-Chip Assembly	11
The Impact of Bonding Wire Failure in Microelectronic Package on Near-Field Radiation	11
Ka-Band Substrate Integrated Waveguide Equalizer With Larger Equalization Value Based on Capacitive Loading Technology and Tiny Gap Effect	11
Development of 3-D Wafer Level Packaging for SAW Filters Using Thin Glass Capping Technology	11
Prefabricated and Assembled Electromagnetic Shields Inside Electronic Packages to Reduce Near-Field Capacitive and Inductive Coupling	11
A Machine Learning-Based Method for Tuning the Control Loop of Fully Integrated Voltage Regulators	10
SiC Power Module Packaging Using Printed Electronics Materials and Processes	10
Material Property Variability of Composites in Thermo-Mechanical Studies Involving Virtual Design of Experiments	10
Quad Port MIMO Al₂O₃ Ceramic-Based Integrated Reconfigurable Wideband Sensing and Communication Dielectric Antenna for 5G Cognitive Radio	10
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	10
Front Cover	10
Local Heat/Mass Transfer of Array Jet Impingement Cooling With Pin-Fin Heat Sinks	10
Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network	10
In Memoriam - A Tribute: Prof. Avram Bar-Cohen	10
Membrane-Based Two Phase Heat Sinks for High Heat Flux Electronics and Lasers	10
Application of Ferroelectric Capacitors for Equalization of High-Speed Digital Signaling	10
Rapid Design of Litz Wire Using Surrogate-Assisted Optimization Embedding Adjacent Trust Region	10
IEEE Open Access Publishing	10
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Preventing Corrosion-Related Failures in Electronic Assembly: A Multicase Study Analysis	10
Free-Form Filters Designed Using Binary Optimization Algorithm	10
Numerical and Experimental Analyses of Component Failure Risk in a Mobile Phone Under Drop Test	10
Failure Mechanism and Reliability Research of Solder Layer Tilt in Double-Sided Cooling Power Modules	10
Bus-Aware IO Alignment Considering Length-Matching Constraints in 3-D IC Designs	10
A Miniaturized Balanced-to-Balanced Power Divider With Common-Mode Noise Absorption	10
Study on Thermomigration-Induced Void Formation in Advanced Copper Interconnects	10
Front Cover	10
Front Cover	10
Contact Reconstruction and Contact Spot Analysis of Microscopic Contact Surfaces Based on Feature Matching	9
Table of Contents	9
Structurally Integrated Radar in an Aerospace Composite Laminate	9
Thermal Modeling of a Chiplet-Based Packaging With a 2.5-D Through-Silicon Via Interposer	9
Moisture Diffusion Inside the BEOL of an FC-PBGA Package	9
Flexible/Conformal Inkjet-Printed 3-D “Ramp” Interconnects for 5G/mmWave System-on-Package Designs and Wearable Applications	9
Member Get-a-Member (MGM) Program	9
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Air-Cooled Loop Thermosyphon Cooling System for High Heat Load CPUs—Part I: Design and Performance Simulation	9
Miniaturized Dual-/Tri-/Quad-Band Bandpass Filters Using Perturbed Multimode SIW Cavity	9
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	9
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	9
Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure With Thermal Transmission Line for High Bandwidth Memory Module	9
Table of Contents	9
Study on Wear Debris Distribution and Performance Degradation of Electrical Connector Under Step Random Vibration Stress	9
Numerical Analysis of Pool Boiling of Nanofluids for High Heat Dissipation Applications	9
Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics	9
Effect of Oxygen Content on Bonding Performance of Sintered Silver Joint on Bare Copper Substrate	9
Artificial Intelligence-Driven Optimization for Three-Dimensional Integrated Circuit Manufacturing: A System of Systems Framework	9
Comparative Drop Shock Reliability Study of SAC-Based Alloys in BGA Assemblies	9
IEEE Components, Packaging, and Manufacturing Technology Society Information	9
Member Get-a-Member (MGM) Program	9

High-Selectivity Bandpass Filters with Low Loss and Reduced Size Based on HCILA Slow-Wave Technology Encapsulated in Patch Cavities	8
The Influence of Mechanical Cyclic Bending Stress on the Reliability of the Emerging DDR5 Memories in the Industrial Market	8
Low-Profile Wideband D-Band Absorber Utilizing Resistive Thin-Film Screen-Printing	8
Out-of-Plane Optical Coupling to Photonic Integrated Circuits Using Turning-Mirror Lens Arrays	8
A Broadband Antenna with Folded Structure and Packaged Solar Cell	8
Characterization of Microstrip Line and SIW on ABF in Glass Interposers for mmWave Applications	8
Aerosol-Jet Printed Transferable Millimeter-Wave Circuits	8
FPCB Surface Defect Detection Using Multiscale Spectral-Spatial Features Fusion	8
Mixed-Mode Fiber Array Alignment and Coupling to Photonic Integrated Circuits	8
Low Cost/Insertion Loss Substrate-Integrated Waveguide Equalizer Based on Absorbing Materials	8
Experimental Analysis on Reliability of Needle Electrodes in Ionic Wind	8
Co-Designed Silicon Photonics Chip I/O for Energy-Efficient Petascale Connectivity	8
A Reflection Self-Canceling Design Technique for Multidrop Memory Interfaces	8
Electronic Components Provenance Assurance Through AI and Big Data in Assembly Processes	8
Investigation and Improvements of UWB Microstrip Delay Lines	8
Effects of Interconnect Shape and Thermal-Electro-Migration on Solder Creep of Copper-Pillar Flip Chip Joints	8
Symmetrical Multilayer Dielectric Model of Thermal Stress and Strain of Silicon-Core Coaxial Through-Silicon Vias in 3-D Integrated Circuit	8
State of the Art of Cu–Cu Hybrid Bonding	8
CPU Overclocking: A Performance Assessment of Air, Cold Plates, and Two-Phase Immersion Cooling	8
IEEE Components, Packaging, and Manufacturing Technology Society information for authors	8
Tunable Ultra-Wideband (UWB) Liquid Metal Phase Shifter Based on SISL Platform	8
IEEE Open Access Publishing	8
Thermal Decouple Design of Multichip SiC Power Module With Thermal Anisotropic Graphite	8
Origami-Driven Manufacturing of Reflectarrays or Transmitarrays With Feeds and Fixture	7
Table of Contents	7
Achievement and Assessment of 6-inch Wafer Bonding Based on A Novel Nanosilver Sintering Method	7
Our Thanks to Reviewers IEEE Transactions on Components, Packaging, and Manufacturing Technology	7
Front Cover	7
Ultrawideband Chip-to-Chip Interconnect Using Bond Wire With Sidewalls	7
On-Chip Single-/Dual-Notch-Band Half-Mode Substrate Integrated Plasmonic Waveguide Filters Based on Through Glass Via Technology	7
Theoretical and Simulations Based Investigation of Heat Transfer and Thermal Runaway in Power MOSFET Devices	7
High-Density Hybrid Substrate for Heterogeneous Integration	7
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	7
Design of Manifolded 3-D μ-Coolers Enabling High Heat Flux Capillary-Driven Boiling Over Large Areas	7
IEEE Open Access Publishing	7
IEEE Open Access Publishing	7
IEEE Components, Packaging, and Manufacturing Technology Society information for authors	7
Front Cover	7
Enhancing Glass-to-Glass Bonding at Room Temperatures Using Laser Surface Modification With Ti/Cu/Ti/TiO2 Thin Films	7
Performance Analysis Using Air Gap Defected Through Silicon Via: Impact on Crosstalk and Power	7
PIDDN: Pair-Image-Based Defect Detection Network With Template for PCB Inspection	7
Design Guidelines for 2.5-D Packages Featuring Organic Interposer With Bridges Embedded	7
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	7
Comprehensive Influences of Manufacturing Process Integrated With Thermal Cycling Test Loading on Mechanical Responses of Power Module	7
Improving the Energy-Conversion Efficiency of a PV–TE System With an Intelligent Power-Track Switching Technique and Efficient Thermal-Management Scheme	7
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	7
Characterization of Additively Manufactured Suspended Finite Ground CPW Interconnects Enhanced by Femtosecond Laser Micromachining	7
Front Cover	7
A Novel 3D-Printed Passive Microfluidic Temperature Sensor for Medical Applications	7
Design of Vertically Integrated Folded SISL Patch Bandpass Filters With Single and Multiband Responses	7
Least Squares Polynomial Chaos Regression for Stochastic Analysis of Transmission Lines Without and With Noise	7
Advanced Chiplet Placement and Routing Optimization considering Signal Integrity	7
A Sensitive Data Labeling Strategy for Optimizing a Broadband Vertical Transition in W Band	7
3-D Stacking of SiC Integrated Circuit Chips With Gold Wire Bonded Interconnects for Long-Duration High-Temperature Applications	7
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	7
Cu Sintering for Cu Pillar Bonding: A Comparative Study Among Pressure-Less, Pressure-Assisted, and Transient Liquid Phase Sinter Pastes	7
Segmentation Method for Modeling Heterogeneous Components to Suppress Broadband Simultaneous Switching Noise on a Multilayer Structure	7
Selection and Characterization of Photosensitive Polyimide for Fan-Out Wafer-Level Packaging	6
Solder Joint Defect Inspection Method Based on ConvNeXt-YOLOX	6
Development and Reliability Study of 3-D Wafer Level Packaging for SAW Filter Using Thin Film Capping	6
Highly Manufacturable Packaging of an Implantable Episcleral Surface Stimulator With Reliability and Safety Validations	6
Quantification of Performance Variation and Crack Evolution of Bond-Wire Interconnects Under Harsh Temperature Environments by S-Parameter Analysis	6
Metal-Assisted Chemical Etching Toward Scallop-Free-Sidewall Through-Silicon Vias: A Review	6
MCB-DPO: Multiport Constrained Barrier Method-Based Decoupling Capacitor Placement Optimization on Irregularly Shaped Planes	6
NOMA: A Novel Reliability Improvement Methodology for 3-D IC-based Neuromorphic Systems	6
Analysis and Optimization of HBM3 PPA for TSV Model With Micro-Bump and Hybrid Bonding	6
Conservative Gaussian Process Models for Uncertainty Quantification and Bayesian Optimization in Signal Integrity Applications	6
Characterization and Optimization of the Heat Dissipation Capability of a Chip-On-Board Package Using Finite Element Methods	6
TechRxiv: Share Your Preprint Research With the World!	6
TechRxiv: Share Your Preprint Research with the World!	6
Reliability Concerns of TSV-Based 3-D Integration: Impact of Interfacial Crack	6
Electrical Demonstration of an RF Embedded Multichip Module Enabled by Fused-Silica Stitch-Chip Technology	6
Enhanced Junction Temperature Prediction Model for CoWoS Packaging With Multiple Chiplets	6
The Connection Between Electromigration Resistance and Thin-Film Adhesion and Their Degradation With Temperature	6
A mm-Wave 5G System Architecture With Enhanced-Gain Antenna Solution	6
Broadband Millimeter-Wave Dielectric Properties of Liquid Crystal Polymer Materials	6
Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz	6
Electromechanical Performance of Microprobe Test With Cuboid Magnetorheological Damper in Microelectronic Packaging	6
Impact of Thermo-Mechanical Stress Due to Probing and Wire Bonding on CUP Devices	6
Thermal Management of β-Ga₂O₃ Current Aperture Vertical Electron Transistors	6
On the Fast Prediction of the Aerodynamic Performance of Electronics Cooling Fans Considering the Effect of Tip Clearance	6
MEMS Package for an Iron–Gallium Nanowire-Based Acoustic Sensor	6
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	6
Sensitivity Analysis for Geometrical Parameters of BGA in Flip-Chip Packaging Under Random Shear Stress and Thermal Temperature	6
A Slow Wave Folded Ridge HMSIW Using Spoof Surface Plasmon Polaritons Structure and Its Application in Coupler Design	6
2024 Index IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 14	6
Hybrid Substrate by Fan-Out RDL-First Panel-Level Packaging	6
Sulfur Ingression on Encapsulated Leadframe of Discrete Semiconductor Package	6
Parameter Optimization of Pretin Printing Process of Wireless Communication Module	6
Low-Profile Polymer Composite Radar Absorber Embedded With Frequency Selective Surface	6
Impedance and Admittance Waveguide Inverter Applications: A Practical Sub-Terahertz Region Tolerance Analysis for Large-Scale Production	6
Electrothermal Transient Co-Simulation With Domain Decomposition Method for 3-D Complex Integrated Systems	6
Impact of EMI on the Reliability of Crossbar Architecture-based Inference in CMOS Technology	6
IEEE Transactions on Components, Packaging and Manufacturing Technology publication information	6
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	5