IEEE Transactions on Components Packaging and Manufacturing Technology

Article	Citations
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	192
Blank Page	123
Intra-Lid Multi-Core Vapor Chamber Architecture for Heterogeneous Electronic Packages: Technology Concept to Prototype Evaluation	64
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	62
Table of Contents	56
Jet-Dispensing-Based Assembly of Electric Field Adaptively Controlled Structure in Power Electronic Modules	49
Predictive Modeling Of TCV-Cu Protrusion Under Thermal Cycling	49
Advances in Package Microvia Interconnects: Breakthroughs With Picosecond UV Laser Ablation	47
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	46
Investigation of Graphene Film as Ground Plane Material for RF and Microwave Electronics	46
Wideband 3-D-Printed Chip Interconnects for DC-Millimeter Wave Applications	46
Enhancing Defect Detection in Circuit Board Assembly Using AI and Text Analytics for Component Failure Classification	46
Reliability Risk Assessment of Server CPU Package in Single Phase Hydrocarbon-Based Immersion Fluid	43
Simulation of the Dynamic Process and Quality-Influencing Mechanisms in Wafer-to-Wafer Hybrid Bonding	39
Accelerated Life Test and Prediction of Electromigration in Aluminum Interconnects Coupling Multiphysics Full Coupled Model With Optimized Atomic Flux Divergence Simulation	36
A Data-Driven Approach to Collaborative Optimization for Enhancing TSV Multiphysics Performance	35
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	34
Thermomechanical Modeling and Stress Analysis of Copper Inverse Opal (CIO) Structure for Capillary-Fed Boiling	32
Design and Implementation of an Electrostatic Force-Based Microcirculation Cooling System for Microelectronic Devices	32
Compact In-Line Multiband Bandpass Filters With Independently Controllable Passbands Using Quarter-Mode SIW Cavities	31
Reconfigurable SIW Phase Shifter Based on Parallel Stubs Loaded With Surface Mount p-i-n Diodes	31
A Multifault Testing Method for TSVs Based on GAF-DRSN and Mirror Constant Current Source Structure	31
Dual-Band Dual-Polarized Microstrip Patch Antenna With Parasitic Elements for 5G Antenna-in-Package Design at Millimeter-Wave Frequencies	30
Microstructural Evolution of SAC-Based Solder Joints Exposed to Thermal Cycling: Effect of Paste Alloy, Paste Volume, and Surface Finish	29
Ultralow-Temperature Deposition and Enhanced Bonding of SiCN Films for Advanced 3-D Integration	28

Integrated Circuit Packaging Defect Analysis and Deep Learning Detection Method	27
Spray Deposition for Board-Level Shielding Assessed Through MSRC Measurements	27
Degradation Mechanisms in Die-to-Wafer Hybrid Bonding Governed by Surface Activation Lifetime and Moisture Evaporation	27
mm-Wave 3-D-Printed 2 × 2 Antenna Subarray With Structurally Packaged Beamforming IC and Thermal Management	27
Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating	26
Rapid Multiobjective Optimization Strategy of TSV-Based 3-D Inductor Using Vector Fitting and Evolutionary Algorithm	26
Substrate Integrated Waveguide Filters in Glass Interposer for mmWave Applications	26
Low-Loss FeSi–FeNi Inductor Cores for >5–1-V Integrated Voltage Regulators	25
Board-Level Reliability of 100 × 100 mm Large Glass Packages: Warpage and Thermomechanical Reliability for AI/HPC Applications	25
Mechanistic Study on Regulating the Aspect Ratio of Silver Lines in Dry Aerosol Jet Printing via Focusing Ratio	25
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	24
The investigation of microparticles loaded auxiliary encapsulation layer on angular color uniformity improvement of phosphor-free and full spectra color-mixed LEDs	24
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	24
Table of Contents	23
Thermal Onboard Detection of Voids in the Solder Layer Between Power Semiconductor and PCB	23
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	23
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	22
Application of Lévêque Analogy to Open Cellular Porous Materials	22
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	22
100 Gb/s Multichannel TOSA With Low Tracking Error at the Industry Operating Temperature	22
Packaged Millimeter-Wave On-Chip Bandpass Filter Using SHMSIW and Microstrip Hybrid Structure in 0.25-μm GaAs pHEMT Technology	21
High Airtightness Passivation Layer for High-Temperature All-Solid-State Thin-Film Batteries	21
Member Get-a-Member (MGM) Program	21
Design and Demonstration of Dual-Core Spiral Package-Embedded Inductors for Integrated Voltage Regulators	21
Front Cover	21
Analysis of Power Delivery Network (PDN) in Bridge-Chips for 2.5-D Heterogeneous Integration	21
Optimization of the Wire Bonding Process for Enhanced Thermomechanical Performance of Quad Flat No-Lead (QFN) Packages in Automotive Applications	21
Miniaturized Metasurface-Inspired Tunable Power Divider and Phase Shifter	20
A Slow Wave Power Divider Based on the HISL Platform	20
Machine Learning-Based Diagnosis of Defects in 2.5-D and 3-D Interconnects	20
Effect of Process and Design Parameters in Cu/SiCN Hybrid Bonding Process: A Finite Element Analysis Study	20
High-Dimensional Uncertainty Quantification Using Stochastic Galerkin and Tensor Decomposition	20
Thermal Design and Evaluation of a Rectifier for Electric Vehicle Wireless Charging Using Hybrid PCBs and Planar Magnetics	20
Optically Transparent Adhesives for Microwave Metamaterial Absorber With PET–PDMS Interface	19
Gate Voltage Oscillation Mitigation in Solid-State Circuit Breakers With Single-Gate Driven Series-Connected Power Devices	19
Extending Copper Interconnects and Epoxy Dielectrics to Multi-GHz Frequencies	19
Influence of Au Substrate Crystal Structure on Ag–Au Interdiffusion for WBG Packaging	19
A Low-Profile Filtering Magneto-Electric Dipole Antenna Based on High-Density-Interconnect (HDI) Packaging	19
Enhancing Humidity Robustness of Electronics: Understanding the Crucial Role of Solder Flux Chemistry in Determining Humidity Boundary for Failure	19
Analysis of Discharge Caused by Soldering Defect in Wire-Bonding Power Module	19
Using Hybrid Bonding for Stacked Bi-Color Micro-Light-Emitting Diodes	18
D-Band Waveguide Diplexer Fabricated Using Micro Laser Sintering	18
High Reliability and Low Thermal Resistance Spacer Based on Via-DPC for Double-Side Cooling Module	18
Power, Performance, Area, and Cost Analysis of Face-to-Face-Bonded 3-D ICs	18
Reliability Improvement of 3.3 kV Full-SiC Power Modules for Power Cycling Tests With Sintered Copper Die Attach Technology	18
Application of Nonlinear Fracture Mechanics Parameter Δ T * to Estimating Wire-Liftoff Lifetime: Effect of Creep Constitut	18
Deep Reinforcement Learning-Based Optimal and Fast Hybrid Equalizer Design Method for High-Bandwidth Memory (HBM) Module	18
A Stepwise Integration Separation of Variables Solver for Full-Chip Thermal Uncertainty Analysis	17
Electro-Thermal-Stress Multiphysical Field Coupling Optimization Design for Coaxial Through Silicon Via Array	17
Signal Integrity Analysis of Through-Silicon Via (TSV) With a Silicon Dioxide Well to Reduce Leakage Current for High-Bandwidth Memory Interface	17

IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	17
Machine learning-based co-design of advanced flipchip packages: co-optimization of package warpage, die stress, solder joint reliability, thermal management, and signal integrity	17
Fabrication and Testing of Dual In-Line Packaged Programmable Optically Variable Resistors Utilizing Optical Coupling of Laser and Photoresistor	17
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Physics Information Neural Network-based High-Fidelity Thermal Modeling of Through Silicon Via	17
Third Quadrant Operation of SiC MOSFETs: Comprehensive Analysis and Condition Monitoring Solution	17
Geometry Optimization of Nonideal Through-Glass Vias (TGVs) for Enhanced Electrical and Mechanical Performance	17
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	17
Table of Contents	17
The Impact of Substrate Vibrations on Self-Alignment Accuracy in BGA/Flip-Chip Assembly	16
Prefabricated and Assembled Electromagnetic Shields Inside Electronic Packages to Reduce Near-Field Capacitive and Inductive Coupling	16
The Impact of Bonding Wire Failure in Microelectronic Package on Near-Field Radiation	16
On the Use of an In-Package Dielectric Lens Antenna for Radar-Based Applications	16
A Wideband Transition From Coaxial Line to Substrate-Integrated Waveguide	16
Table of Contents	16
A Method for Detecting the Initiation of Solder Joint Delamination in a 3-D PCB Assembly of WBG SiC MOSFET	16
Ball Grid Array Package Intermittent Partial Connection Defect Analysis in DDR4 Data Channel	16
Modeling of Tunable Electronic Waveguide Devices in Graphene Using Conservative Higher Order Time Stepping	16
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	15
Low-Profile UWB Millimeter-Wave Antenna Array Under Triple Resonant Modes Based on PCB Technology	15
Analysis of Interface Evolution and Failure Mechanism of Sn 3.5 Ag Microcopper Pillar Solder Joints Under High Current Density	15
Benchmarking and Demonstration of Low-Loss Fused-Silica Stitch-Chips With Compressible Microinterconnects for RF/mm-Wave Chiplet-Based Modules	15
Stress-Strain Analysis and Fatigue Life Prediction of SnBiInZn High-Entropy Alloy QFN Solder Joints Under Random Vibration	15
Table of Contents	15
Monolithically GaN-Based Optocoupler With Chip Scaling	15
Design and Demonstration of an Ultrasonic-Laser Coupled Microjoining Platform for Electronic Device Packaging	15
Solder Joint Geometry Effects on Thermomechanical Fatigue Lifetime of End-Capped Chip Component Assemblies	15
A Lossy Decoupling Network for Anti-Resonance Suppression and Capacitor Reduction in CoWoP	14
A Multiphysics Domain Decomposition Method for Transient Electro-Thermo-Mechanical Analysis	14
Characterization of Alumina Ribbon Ceramic Substrates for 5G and mm-Wave Applications	14
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	14
Front Cover	14
Front Cover	14
A Dual-Band Mushroom EBG Structure With Inductive via Coupling for Wideband Parallel-Plate Mode Suppression	14
Wide-Stopband Diplexer With Small Frequency Ratio Based on SIW Dual-Mode Resonators for Millimeter-Wave Applications	14
Influence of Copper Pad Dimension on Thermal Fatigue Life Performance of BGA Packages	14
Improving Transfer Accuracy of LEDs Utilizing the Alignment Structure	14
Front Cover	14
Gaussian Process Regression–Driven Thermal Modeling of 5 nm Stacked Nanosheet FETs for Advanced CMOS Thermal Management and Reliability	14
Emerging Trends in System-Integrated Wearable Epidermal and Flexible Electrodes: Material Design and Applications in Physiological Monitoring	14
High-Selectivity Bandpass Filter-Integrated SPDT Switch Using Switchable Dual-Mode Hybrid Resonators	14
Embedded p-i-n-Diode Die Interconnections With Aerosol-Jet Printing	14
Double-Sided Copper Filling of Small Diameter, High-Aspect Ratio Through-Glass Vias in High-Density Glass Interposers	14
Application of Ferroelectric Capacitors for Equalization of High-Speed Digital Signaling	14
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	13
Front Cover	13
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	13
Bus-Aware IO Alignment Considering Length-Matching Constraints in 3-D IC Designs	13
Blank Page	13
Moisture Diffusion Inside the BEOL of an FC-PBGA Package	13
SiC Power Module Packaging Using Printed Electronics Materials and Processes	13
Integrating a Degradation-Driven Methodology in Board Level Vibration Testing	13
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	13
IEEE Open Access Publishing	13
Preventing Corrosion-Related Failures in Electronic Assembly: A Multicase Study Analysis	13
Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network	13
Table of Contents	13
Low-Loss Millimeter-Wave Surface-Mounted Wideband Filtering Power Divider Based on MEFAB Process	12
Ka-Band Substrate Integrated Waveguide Equalizer With Larger Equalization Value Based on Capacitive Loading Technology and Tiny Gap Effect	12
Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics	12
An Improved Inductance and Self-Resonance Frequency Modeling and Estimation of Single-Turn On-Chip Inductors for Millimeter-Wave Applications	12
Quad Port MIMO Al₂O₃ Ceramic-Based Integrated Reconfigurable Wideband Sensing and Communication Dielectric Antenna for 5G Cognitive Radio	12
On the Generation of SPICE-Compatible Nonlinear Behavioral Macromodels	12
Compact Microstrip MIMO Antenna With Enhanced Isolation Using Self-Decoupling and Stub-Based Techniques	12
Design of Three-State Dual-Band Diplexer Based on SCPW-MS With Broadside-Coupled Technique	12
Failure Mechanism and Reliability Research of Solder Layer Tilt in Double-Sided Cooling Power Modules	12
A Holistic Process-Chain Optimization Framework for High-Reliability High-I/O Silicon-to-Silicon Flip-Chip Packaging	12
Effect of Oxygen Content on Bonding Performance of Sintered Silver Joint on Bare Copper Substrate	12
Study on Thermomigration-Induced Void Formation in Advanced Copper Interconnects	12
Electroplated Bonding of Copper Pillar Micro-Bumps Using an Accelerator–Suppressor System	12
Table of Contents	12
Table of Contents	11
Flexible/Conformal Inkjet-Printed 3-D “Ramp” Interconnects for 5G/mmWave System-on-Package Designs and Wearable Applications	11
Numerical Analysis of Pool Boiling of Nanofluids for High Heat Dissipation Applications	11
High-Selectivity Bandpass Filters With Low Loss and Reduced Size Based on HCILA Slow Wave Technology Encapsulated in Patch Cavities	11
A Novel Surrogate Modeling Framework Based on Fast Time-Domain Simulation and Transfer Learning for Signal Integrity Analysis	11
Aerosol-Jet Printed Transferable Millimeter-Wave Circuits	11
IEEE Open Access Publishing	11
Optimization of a Compact Manifold Heatsink in External Airflow for Power Devices Using a Multiobjective Genetic Algorithm	11
Rapid Design of Litz Wire Using Surrogate-Assisted Optimization Embedding Adjacent Trust Region	11

Mechanical–Optical Co-Design for Structural Integrity Optimization in Heterogeneous VCSEL Array Packaging	11
Transient Thermomechanical Characteristic of Segmented Thermoelectric Cooler for Hotspot Thermal Management	11
Member Get-a-Member (MGM) Program	11
Metrology of Silicon Wafers Through Synchrotron Section Topography and X-Ray Diffraction Imaging	11
A Cavitied Cold Plate for Enhanced Thermal Uniformity and Cooling	11
Member Get-a-Member (MGM) Program	11
A Wideband D-Band Microbump Antenna With Self-Packaged Design	11
MINNs: MNA Informed Neural Networks for Fast Transient Simulation of Nonlinear Transmission Lines Subject to Parametric Uncertainty	11
Blank Page	11
Miniaturized Dual-/Tri-/Quad-Band Bandpass Filters Using Perturbed Multimode SIW Cavity	11
Resiliency of Liquid-to-Liquid Cooling Systems in Data Centers Under Failure Scenarios	11
Free-Form Filters Designed Using Binary Optimization Algorithm	11
Comparative Drop Shock Reliability Study of SAC-Based Alloys in BGA Assemblies	11
Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure With Thermal Transmission Line for High Bandwidth Memory Module	11
Additive Manufactured Millimeter-Wave Power Amplifier Package with Embedded Heat Spreader	11
A Reflection Self-Canceling Design Technique for Multidrop Memory Interfaces	11
Tunable Ultra-Wideband (UWB) Liquid Metal Phase Shifter Based on SISL Platform	11
Table of Contents	11
Effects of Interconnect Shape and Thermal-Electro-Migration on Solder Creep of Copper-Pillar Flip Chip Joints	11
Study on Wear Debris Distribution and Performance Degradation of Electrical Connector Under Step Random Vibration Stress	11
YOLO Algorithm With Hybrid Attention Feature Pyramid Network for Solder Joint Defect Detection	11
Artificial Intelligence-Driven Optimization for 3-D Integrated Circuit Manufacturing: A System of Systems Framework	11
Determination of Fatigue Model Constants for Bi-Based SAC305 Hybrid Solder Joint	11
A Miniaturized Balanced-to-Balanced Power Divider With Common-Mode Noise Absorption	11
The Influence of Mechanical Cyclic Bending Stress on the Reliability of the Emerging DDR5 Memories in the Industrial Market	10
On-Chip Dual-Band Balanced Bandpass Filter Design With High Common-Mode Absorption Rate	10
Mixed-Mode Fiber Array Alignment and Coupling to Photonic Integrated Circuits	10
Predictive Modeling of PCB Thermomechanical Properties for Reliable Stack-Up Configurations	10
SIDDER: A Deep Reinforcement Learning Framework for Crosstalk-Aware Equalization in Chiplet Die-to-Die Interfaces	10
Co-Designed Silicon Photonics Chip I/O for Energy-Efficient Petascale Connectivity	10
A Broadband Antenna With Folded Structure and Packaged Solar Cell	10
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	10
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	10
State of the Art of Cu–Cu Hybrid Bonding	10
Low-Profile Wideband D-Band Absorber Utilizing Resistive Thin-Film Screen-Printing	10
Contact Reconstruction and Contact Spot Analysis of Microscopic Contact Surfaces Based on Feature Matching	10
Electronic Components Provenance Assurance Through AI and Big Data in Assembly Processes	10
FPCB Surface Defect Detection Using Multiscale Spectral-Spatial Features Fusion	10
Ultrawideband Chip-to-Chip Interconnect Using Bond Wire With Sidewalls	10
Least Squares Polynomial Chaos Regression for Stochastic Analysis of Transmission Lines Without and With Noise	10
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	10
Fused Filament Fabrication 3-D Printing for Electronics Packaging	10
The Dynamic Capillary Limits of a Heat Pipe: Mapping the Operating Power Ranges using a Transient Dryout and Rewetting Model	10
Innovating the Next Discontinuity Tight Coupling for AI and HPC	10
Characterization of Microstrip Line and SIW on ABF in Glass Interposers for mmWave Applications	10
Experimental Analysis on Reliability of Needle Electrodes in Ionic Wind	10
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	10
Low-Cost Functional Testing Based on Data Imputation Integrating Fault Tree Analysis and XGBoost	10
Electroless-Plated Gold Nanolayer for Low-Temperature Copper Hybrid Bonding	9
Advanced Chiplet Placement and Routing Optimization Considering Signal Integrity	9
Reliability Analysis and Improvement of Hermetic LTCC-CBGA Board-Level Interconnects	9
Theoretical and Simulation-Based Investigation of Heat Transfer and Thermal Runaway in Power MOSFET Devices	9
Advanced 3-ω Method for Evaluating Anisotropic Thermal Conductivity in Carbon Nanotubes	9
Improved Electrical Isolation and Reliability in SiO₂-insulated Flip-Chip Packaging of SiC Chips for High Temperature Operation	9
Reliability of Immersion Coolant and PCB Materials Evaluated Through Accelerated Thermal Testing	9
Performance Analysis Using Air Gap Defected Through Silicon Via: Impact on Crosstalk and Power	9
3-D Stacking of SiC Integrated Circuit Chips With Gold Wire Bonded Interconnects for Long-Duration High-Temperature Applications	9
Bus-Aware Simultaneous Escape Routing With Through-Bus Net Avoidance	9
QMSIW Filtering Balun Using IPD Technology for High-Frequency Applications	9
Design of Manifolded 3-D μ-Coolers Enabling High Heat Flux Capillary-Driven Boiling Over Large Areas	9
Comprehensive Influences of Manufacturing Process Integrated With Thermal Cycling Test Loading on Mechanical Responses of Power Module	9
Al/Ni Post-Heating Technique for Improving Mechanical Reliability of Sintered Ag Die-Attach Assembly	9
A 3-D Printing Filter for High-Power Satellite Applications	9
Origami-Driven Manufacturing of Reflectarrays or Transmitarrays With Feeds and Fixture	9
PIDDN: Pair-Image-Based Defect Detection Network With Template for PCB Inspection	9
On-Chip Single-/Dual-Notch-Band Half-Mode Substrate Integrated Plasmonic Waveguide Filters Based on Through Glass Via Technology	9
Out-of-Plane Optical Coupling to Photonic Integrated Circuits Using Turning-Mirror Lens Arrays	9
Bare-Die Embedded PCB Technique: An EMI Perspective	9
A Sensitive Data Labeling Strategy for Optimizing a Broadband Vertical Transition in W Band	9
Enhancing Glass-to-Glass Bonding at Room Temperatures Using Laser Surface Modification With Ti/Cu/Ti/TiO2 Thin Films	9
Cu Sintering for Cu Pillar Bonding: A Comparative Study Among Pressure-Less, Pressure-Assisted, and Transient Liquid Phase Sinter Pastes	9
Design of Vertically Integrated Folded SISL Patch Bandpass Filters With Single and Multiband Responses	9
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	8
Enhanced Junction Temperature Prediction Model for CoWoS Packaging With Multiple Chiplets	8
Electrical Demonstration of an RF Embedded Multichip Module Enabled by Fused-Silica Stitch-Chip Technology	8
The Connection Between Electromigration Resistance and Thin-Film Adhesion and Their Degradation With Temperature	8
Failure Mechanisms and Predictive Modeling of Micro Solder Joints Under Thermal Cycling	8
D-Band Substrate Integrated Waveguide-Fed Endfire Antenna Array in Ultrathin Glass Interposer	8
Compact IPD Bandpass Filter With Wide Upper Stopband in GaAs Technology	8
Table of Contents	8
Electrothermal Transient Co-Simulation With Domain Decomposition Method for 3-D Complex Integrated Systems	8
Analysis and Optimization of HBM3 PPA for TSV Model With Micro-Bump and Hybrid Bonding	8
On the Fast Prediction of the Aerodynamic Performance of Electronics Cooling Fans Considering the Effect of Tip Clearance	8
Spectral Bayesian Optimization Using a Physics-Informed Rational Szegö Kernel for Microwave Design	8
A Slow Wave Folded Ridge HMSIW Using Spoof Surface Plasmon Polaritons Structure and Its Application in Coupler Design	8
Table of Contents	8
A Stacked Glass Wafer-Level Antenna for W-Band Scalable Phased Arrays	8
Characterization of Additively Manufactured Suspended Finite Ground CPW Interconnects Enhanced by Femtosecond Laser Micromachining	8
NOMA: A Novel Reliability Improvement Methodology for 3D IC-Based Neuromorphic Systems	8
Reliability Concerns of TSV-Based 3-D Integration: Impact of Interfacial Crack	8
Low-Profile Polymer Composite Radar Absorber Embedded With Frequency Selective Surface	8
Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz	8
Impedance and Admittance Waveguide Inverter Applications: A Practical Sub-Terahertz Region Tolerance Analysis for Large-Scale Production	8
Solder Joint Defect Inspection Method Based on ConvNeXt-YOLOX	8
The Impact of Large-Amplitude Intermittent Current Pulsing on the Reliability of Die Metal–Dielectric Structures	8