OOIR: Observatory of International Research

Papers

(The TQCC of IEEE Transactions on Components Packaging and Manufacturing Technology is 4. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-04-01 to 2025-04-01.)

Article	Citations
Table of Contents	277
Blank Page	93
Front Cover	75
Front Cover	72
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	51
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	44
Highly Manufacturable Packaging of an Implantable Episcleral Surface Stimulator with Reliability and Safety Validations	44
Solder Reflow Resistant Thermoplastic for Optical Coupling	43
Blank page	39
An Integrated Multi-Output Classification Based Defect Diagnosis Model for Pick and Place Machines	38
Smartphone Antenna on Display (AoD) Design at Millimeter-wave Frequencies with Enhanced Transparency and Ground Plane	37
Investigation of Graphene Film as Ground Plane Material for RF and Microwave Electronics	35
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	34
Front Cover	34
Partially Omnidirectional and Circularly Polarized MIMO Antenna Covering Sub-6-GHz Band for 5G Fast Plan	33
Ratcheting Behavior of Sintered Copper Joints for Electronic Packaging	32
Table of Contents	30
Blank Page	30
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	29
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	29
Member Get-A-Member (MGM) Program	27
Blank page	24
Antenna Array on Glass Interposer for 6G Wireless Communications	24
Blank Page	23
Front Cover	23

IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	22
Table of Contents	22
IEEE Transactions on Components, Packaging and Manufacturing Technology publication information	22
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	21
2023 Index IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 13	21
Front Cover	20
A High-Performance Dual-Band Switchable Bandpass Filter and Its Application in 5G Signal Detector	20
IEEE Open Access Publishing	20
Mitigation of Transient Fluctuations During Flow Boiling in Microchannels via Adaptive Vapor Venting	20
Experimental Study on Arc Breaking Characteristics of DC Contactor With Different Media	20
Foreword: Special Section on Multiphysics Aspects of Power Electronics Packaging—Power Die, Power Module, and Converter Level—Part 1	20
Table of Contents	20
Experimental and Finite Element Analysis of Epoxy-Based Composites for Packaging Materials to Reduce Electric Field and Power Loss Under AC and DC Conditions	19
Planar Multilayer Integrated Asymmetric MIMO Full-Digital Beamforming Array at 24.25–27.5 GHz	19
A Data-Driven Approach to Collaborative Optimization for Enhancing TSV Multiphysics Performance	19
A Simplified Radiation Model for Amplitude-only Near-field Reconstruction of Multiple Sources on Package Interconnects	18
IEEE Transactions on Components, Packaging and Manufacturing Technology publication information	18
Predictive Modeling and Optimization of Wafer Warpage in FOPoP Packaging Using Element Birth and Death Technique	18
IEEE Components, Packaging, and Manufacturing Technology Society information for authors	18
2021 Index IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 11	17
Front Cover	17
Member Get-A-Member (MGM) Program	17
IEEE Components, Packaging, and Manufacturing Technology Society information for authors	17
Our Thanks to Reviewers IEEE Transactions on Components, Packaging, and Manufacturing Technology	17
Front Cover	17
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	16
Front Cover	16
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	16
Table of Contents	16
Front Cover	16
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	16
A Novel 3D-Printed Passive Microfluidic Temperature Sensor for Medical Applications	15
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	15
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	15
Achievement and Assessment of 6-inch Wafer Bonding Based on A Novel Nanosilver Sintering Method	15
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	15
Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV Interposers	15
Table of Contents	15
IEEE Open Access Publishing	14
2024 Index IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 14	14
Vacuum Reflow Process Optimization for Solder Void Size Reduction in Semiconductor Packaging Assembly	14
Design and Distortion Analysis of a Power Delivery Network in the Presence of Internal Supply Noise	14
TechRxiv: Share Your Preprint Research With the World!	14
Reliability Concerns of TSV-Based 3-D Integration: Impact of Interfacial Crack	14
Design and Implementation of High-Performance Tantalum Thin Film Capacitors for Embedded Technologies	14
Intra-Lid Multi-Core Vapor Chamber Architecture for Heterogeneous Electronic Packages: Technology Concept to Prototype Evaluation	14
Enhancing Defect Detection in Circuit Board Assembly Using AI and Text Analytics for Component Failure Classification	14
Table of Contents	14
Design and Additive Manufacture of Multi-Tapered Coaxial Baluns	14
Thermoelectric Generator with Boost Converter as a Portable Power Source for Battery Charging	14

Broadband Millimeter-Wave Dielectric Properties of Liquid Crystal Polymer Materials	14
SLA-Printed K-Band Waveguide Components Using Tollens Reaction Silver Plating	13
Prediction of Defect Distribution in Solder Joint Using Device Stress Toward Prognostic Health Management of Power Modules	13
Experimental and Modeling Study of RF Performance of a Screen-Printed Coplanar Waveguide (CPW) up to 20 GHz Under Monotonic Stretching	13
Form-Stable Composite Phase Change Material Based Cooling of Small Brushless DC Motor Windings	13
The Connection Between Electromigration Resistance and Thin-Film Adhesion and Their Degradation With Temperature	13
Novel Optimization Methodology of Design Parameters in High-Speed Differential Via for PCIe Gen5 Channels Based on Particle Swarm Optimization Algorithm	13
On the Fast Prediction of the Aerodynamic Performance of Electronics Cooling Fans Considering the Effect of Tip Clearance	13
Role of Interfacial Evaporation Process in Thin Vapor Chambers With Variable Pillar Spacing and Nonuniform Heat Flux	13
Critical Threshold Limit for Effective Solder Void Size Reduction by Vacuum Reflow Process for Power Electronics Packaging	13
Engineering-Informed Design Space Reduction for PCB-Based Power Delivery Networks	13
Metalized 3-D Printed Plastic Resonator Demonstrating Superconductivity Below 4 K	12
Foreword Special Section on “Advances in Electrical Modeling and Validation of Electronic Packaging and Systems”	12
Foreword Special Section on “Evolving Trends in Electrical Modeling, Validation, and Signal and Power Integrity Analysis in Electronic Packaging and Systems”	12
Metal-Assisted Chemical Etching Toward Scallop-Free-Sidewall Through-Silicon Vias: A Review	12
Thermal Management of Electronics During Continuous and Intermittent Operation Mode Employing Phase Change Material-Based Heat Sinks—Numerical Study	12
Enhanced Junction Temperature Prediction Model for CoWoS Packaging With Multiple Chiplets	12
A Multifault Testing Method for TSVs Based on GAF-DRSN and Mirror Constant Current Source Structure	12
Measurement Deviation of the Virtual Junction Temperature by the Saturation Voltage Drop Method for Insulated-Gate Bipolar Transistors	12
Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV-Less Interposers	11
Miniature and Symmetrical Transformer Based on Through-Silicon Vias	11
Spectrum Splitting-Based Performance of Combined Photovoltaic Thermoelectric Generator System	11
Integrated Circuit Packaging Defect Analysis and Deep Learning Detection Method	11
A Wettability-Mediated Microdroplet Under Electrowetting Effect for Hotspot Cooling	11
A Wideband Dual-Polarized Antenna-in-Package for 5G Millimeter-Wave User Equipment	11
Preparation and Characterization of a Thermal Insulating Carbon Xerogel-Epoxy Composite Adhesive for Electronics Applications	11
Reducing Thickness Deviation of W-Shaped Structures in Manufacturing DRAM Products Using RSM and ANN_GA	11
Foreword: Special Section on Advances in Electronics System Integration Technology	11
Experimental and Numerical Investigations of the Warpage of Fan-Out Wafer-Level Packaging With SAW Filters	11
Investigations of an Influence of the Assembling Method of the Die to the Case on Thermal Parameters of IGBTs	10
Supervised Machine-Learning Approach for the Optimal Arrangement of Active Hotspots in 3-D Integrated Circuits	10
Solder Joint Defect Inspection Method Based on ConvNeXt-YOLOX	10
Study on the Performance of Insulating Substrate Based on Silver Sintering	10
Thermal Performance of Hollow Hybrid Fin Heat Sinks Under Air Impingement	10
Characterization of Additively Produced RF-Structures on Low-Cost PCB Materials Based on Inkjet Technology for Industrial Applications up to 80 GHz	10
Design and Analysis of Dual-Band Resonance Inductive Coupling for Wireless Power Transfer and Near-Field Wireless Communication Applications	10
Analysis and Optimization of HBM3 PPA for TSV Model With Micro-Bump and Hybrid Bonding	10
A 3-D Pillar-Based Electromagnetic Interference Shield for W-Band Antenna on Silicon Using Wire Bonding Technology	10
Parameter Optimization of Pretin Printing Process of Wireless Communication Module	10
Low-Profile Polymer Composite Radar Absorber Embedded With Frequency Selective Surface	10
Electrothermal Analysis of a Double-side Cooling Power Module with Large-area SiC MOSFETs	10
Environment-Adaptable Printed-Circuit Board Positioning Using Deep Reinforcement Learning	10
System Optimization: High-Frequency Buck Converter With 3-D In-Package Air-Core Inductor	10
Skew-Symmetric Slotted Waveguide With Mode Select Effect	10
Impact of Thermo-Mechanical Stress Due to Probing and Wire Bonding on CUP Devices	10
3-D-Printing and High-Precision Milling of W-Band Filter Components With Admittance Inverter Sequences	10
Sulfur Ingression on Encapsulated Leadframe of Discrete Semiconductor Package	10
Embedding and Contacting of Electrical Components for Hybrid Additive Manufacturing	10
Error-Controlled Static Layered-Medium Green’s Function Computation via hp-Adaptive Spectral Differential Equation Approximation Method	10
Electro-Opto-Thermal Dynamic Compact Model for Ring Modulator Arrays	10
High-Temperature RF Transmission Loss Characteristics of Platinum–Inconel 600 and Platinum–304 Steel Interconnects	9
Conservative Gaussian Process Models for Uncertainty Quantification and Bayesian Optimization in Signal Integrity Applications	9
Monitoring Void Fatigue in Solder Layer of IGBT Module Based on Common Mode Interference Spectrum	9
Wideband 3-D-Printed Chip Interconnects for DC-Millimeter Wave Applications	9
Hybrid Integration of VCSEL and 3-μm Silicon Waveguide Based on a Monolithic Lens System	9
Testing and Analysis of Ar Plasma Processed LED at Different Ar Gas Flow Rate and Process Time: Thermal and Surface Verification	9
Microstructure Observation, Accumulated Equivalent Stress, and Creep Strain Simulation of SPD Disconnector Solder Joint Based on Isothermal Aging	9
Reinforcement-Learning-Based Signal Integrity Optimization and Analysis of a Scalable 3-D X-Point Array Structure	9
Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz	9
Substrate Integrated Waveguide Filters in Glass Interposer for mmWave Applications	9
A Compact Symmetrical Single-Cell Bidirectional Absorption Common-Mode Filter	9
A mm-Wave 5G System Architecture With Enhanced-Gain Antenna Solution	9
Single-Layer Obstacle-Aware Multiple-Bus Routing Considering Simultaneous Escape Length	9
Mechanical Characterization of Ultra-Thin, Flexible Glass Substrates for RF Applications	9
Wireless Fully Passive Package-Embedded Seismocardiogram With RF Backscattering	9
Reliability Evaluation of Isolated LDMOS Devices and Condition Monitoring Solution	9
Ultra-Wideband Spurious Radiation Suppression in Microstrip Antennas Using Integrated Uniplanar Compact Coupling Structure With Controllable Transmission-Zeros Matching Approach	9
MCB-DPO: Multiport Constrained Barrier Method-Based Decoupling Capacitor Placement Optimization on Irregularly Shaped Planes	9
High-Temperature Encapsulation Materials for Power Modules: Technology and Future Development Trends	9
Fan-Out Antenna-in-Package Integration Using Heatsink Antenna	9
A Low-Cost 60-GHz Modular Front-End Design for Channel Sounding	8
A Universal Scaling Formulation of the Generalized Peck’s Equation for Corrosion Limited Lifetime in Self-Heated ICs	8
Thermal-Flow Network Modeling for Virtual Prototyping of Power Electronics	8
Wideband, High Efficiency On-Chip Monolithic Integrated Antenna at W-Band Using Miniaturized Cavity and Through Silicon Via	8
Thermal Management of β-Ga₂O₃ Current Aperture Vertical Electron Transistors	8
Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating	8
Electrical Demonstration of an RF Embedded Multichip Module Enabled by Fused-Silica Stitch-Chip Technology	8
Characterization and Optimization of the Heat Dissipation Capability of a Chip-On-Board Package Using Finite Element Methods	8
Reducing Thermal Interface Resistance by Oxygen Plasma Treatment for FCBGA Advanced Package	8
A Novel Approach for Cooling Chiplets in Heterogeneously Integrated 2.5-D Packages Applying Microchannel Heatsink Embedded in the Interposer	8

Wafer Bonding for Processing Small Wafers in Large Wafer Facilities	8
Response Surface Analysis of Process Parameters for Thermocompression Ultrasonic Flip Bonding of Chips	8
A Miniaturized High-Power Integrated Front-End for Phased Array Antenna	8
Rapid Multiobjective Optimization Strategy of TSV-Based 3-D Inductor Using Vector Fitting and Evolutionary Algorithm	8
Corrections to “Structural Integrity of 3-D Metal–Insulator–Metal Capacitor Embedded in Fully Filled Cu Through-Silicon Via”	8
Thermal Analysis and Design of Electronics Systems Across Scales Using State-Space Modeling Technique	8
Thermomechanical Modeling and Stress Analysis of Copper Inverse Opal (CIO) Structure for Capillary-Fed Boiling	8
An Optimized Wearable Textile Antenna Using Surrogate Ensemble Learning for ISM On-Body Communications	8
Investigation of Creep Failure in Ag-4Pd Bonding Wire Under Dynamic Mechanical Analysis Tests	8
Temperature Calibration for Distributed Temperature Sensing of Printed Circuit Boards Using Optical Fiber Sensors	8
High-Temperature Constitutive Behavior of Electroplated Copper TGV Through Numerical Simulation	8
Impedance and Admittance Waveguide Inverter Applications: A Practical Sub-Terahertz Region Tolerance Analysis for Large-Scale Production	8
Electrothermal Transient Co-Simulation With Domain Decomposition Method for 3-D Complex Integrated Systems	8
Advanced Reliability Assessment Approach of Power Modules under Low-Cycle Thermal Fatigue through Redefined Three-Dimensional J-Integral	8
A Flexible Implantable Polyimide Catheter Device for Targeted Treatment of Cardiovascular Diseases by Aggregating Magnetic Nanoparticles	8
Research on High-Precision Oxygen Partial Pressure Sensor Based on TDLAS Technology	8
Thermal Circuit Models of Microstrip Lines Based on Precise Heat Spreading Angles and Convection Boundary Conditions	8
NOMA: A Novel Reliability Improvement Methodology for 3-D IC-based Neuromorphic Systems	8
Electrical Characterization of Shielded TSVs With Airgap Isolation for RF/mmWave Applications	8
Study on the Performance of a Novel Mixed-Particle Silver Paste Sintered at 180 °C	7
On the Junction Temperature Extraction Approach With a Hybrid Model of Voltage-Rise Time and Voltage-Rise Loss	7
Quantification of Performance Variation and Crack Evolution of Bond-Wire Interconnects Under Harsh Temperature Environments by S-Parameter Analysis	7
Modeling and Analysis of Silver-Sintered Molybdenum Packaging for SiC Power Modules With Improved Lifetime and Temperature Range	7
Hybrid Substrate by Fan-Out RDL-First Panel-Level Packaging	7
A Slow Wave Folded Ridge HMSIW Using Spoof Surface Plasmon Polaritons Structure and Its Application in Coupler Design	7
Selection and Characterization of Photosensitive Polyimide for Fan-Out Wafer-Level Packaging	7
An Artificial Intelligence-Based Pick-and-Place Process Control for Quality Enhancement in Surface Mount Technology	7
Dual-Band Dual-Polarized Microstrip Patch Antenna With Parasitic Elements for 5G Antenna-in-Package Design at Millimeter-Wave Frequencies	7
Low-Temperature Cu-Cu Bonding by Using Cu₂O Nanoparticle Coated Hierarchical Structure	7
Electromechanical Performance of Microprobe Test With Cuboid Magnetorheological Damper in Microelectronic Packaging	7
Development and Reliability Study of 3-D Wafer Level Packaging for SAW Filter Using Thin Film Capping	7
Practical Early Quality–Reliability Analysis of Microwirewound Resistor Transition Zone	7
Fan-Out Panel-Level Packaging of Mini-LED RGB Display	7
Review of the Failure Mechanism and Methodologies of IGBT Bonding Wire	7
Laser Ablation Cutting-Based Metal Patterning Technique Enabling 3D-Printed Broadband Antennas for Sub-6 GHz Wireless Communications Applications	7
Sensitivity Analysis for Geometrical Parameters of BGA in Flip-Chip Packaging Under Random Shear Stress and Thermal Temperature	7
A Cost-Effective Wideband Dual-Polarized L-Shaped Probe-Fed Phased Array Antenna for 60-GHz AiP Applications	7
Design and Implementation of an Electrostatic Force-Based Microcirculation Cooling System for Microelectronic Devices	7
Reconfigurable SIW Phase Shifter Based on Parallel Stubs Loaded With Surface Mount p-i-n Diodes	7
RF Performance Benchmarking of TSV Integrated Surface Electrode Ion Trap for Quantum Computing	7
Contactless Optical Packaging Concept for Laser to Fiber Coupling	7
A Novel Approach Using Finite Element Modeling and Contact Area Parameter for Predicting Wire Bond Shear Strength Nondestructively	7
The Effect of Corrosion on the Electrical Contact Performance of Aviation Connectors Revealed by In Situ Impedance Measurements	7
Accelerated Life Test and Prediction of Electromigration in Aluminum Interconnects coupling Multiphysics Full Coupled Model with Optimized Atomic Flux Divergence Simulation	7
Additive Manufacturing of a Terahertz Back-to-Back Horn Antenna for Use in Life Sciences	7
Thermal Simulations in GaN HEMTs Considering the Coupling Effects of Ballistic-Diffusive Transport and Thermal Spreading	7
Jet Impingement Heat Sinks With Application Toward Power Electronics Cooling: A Review	7
Simulation and Experimental Verification of Moisture Diffusion in Embedded Component Packages	6
TechRxiv: Share Your Preprint Research with the World!	6
Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink	6
Compact Self-Shielding Components for Beamforming Networks Implemented in Substrate Integrated Coaxial Line Technology	6
Electrochemical Vibrating Fan Based on Manganese Dioxide	6
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	6
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	6
Characterization of Additively Manufactured Suspended Finite Ground CPW Interconnects Enhanced by Femtosecond Laser Micromachining	6
Thermal Design and Evaluation of a Rectifier for Electric Vehicle Wireless Charging Using Hybrid PCBs and Planar Magnetics	6
Ultracompact Bandpass Filter With Multiple Transmission Zeros and Low Insertion Loss	6
Machine Learning-Based Diagnosis of Defects in 2.5D and 3D Interconnects	6
Table of Contents	6
IEEE Components, Packaging, and Manufacturing Technology Society Information	6
3-D Integrated Chiplet Encapsulation (3-D ICE): High-Density Heterogeneous Integration Using SiO₂-Reconstituted Tiers	6
Two-Branch Coupling Cauer Model in IGBT Module Considering FWD Thermal Coupling Effect	6
Thermal Onboard Detection of Voids in the Solder Layer Between Power Semiconductor and PCB	6
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Unified Microwave Terahertz Waveguide Coupler for Multiband Wireless Applications	6
Table of Contents	6
Front Cover	6
Nested Latin Hypercube-Based Sampling for Efficient Uncertainty Quantification Using Sensitivity-Assisted Least Squares SVM	6
IEEE Components, Packaging, and Manufacturing Technology Society Information	6
Achieving high reliability in silicon photonics optical transceivers for harsh environments over 100°C in excess of 10 year operation	6
IEEE Components, Packaging, and Manufacturing Technology Society Information	6
In Memoriam Prof. Avram Bar-Cohen	6
Modular Neural Network-Based Models of High-Speed Link Transceivers	6
A Stepwise Integration Separation of Variables Solver for Full-Chip Thermal Uncertainty Analysis	6
Millimeter-Wave Active Integrated Semielliptic CPW Slot Antenna With Ultrawideband Compensation of Ball Grid Array Interconnection	6
Determination of Equivalent Material Properties of Microsystem Structure for Structural Simulation Analysis	6
Table of Contents	6
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	6
Table of contents	6
Front Cover	6
High-Dimensional Uncertainty Quantification Using Stochastic Galerkin and Tensor Decomposition	6
Complex Permittivity Characterization of Low-loss Slabs Using Time-gating Technique	6
IEEE Components, Packaging, and Manufacturing Technology Society Information	6
Antenna-Integrated and PA-Embedded Glass Substrates for D-Band InP Power Amplifier Modules	6
IEEE Transactions on Components, Packaging and Manufacturing Technology publication information	5
Front Cover	5
A Compact SISL Dual-Band Bandpass Filter With Enhanced Q-factor of Hybrid Resonator Cell	5
IEEE Components, Packaging, and Manufacturing Technology Society information for authors	5
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	5
A Bandpass Power Combined Amplifier Based on All-ports Reflectionless Filtering Power Divider	5
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	5
A High-Voltage Low-Dropout Regulator with Wide Ranges of Output Capacitance and Au80Sn20 Alloy Solder for Packaging	5
Table of Contents	5
Front Cover	5
Table of Contents	5