IEEE Transactions on Components Packaging and Manufacturing Technology

Papers
(The TQCC of IEEE Transactions on Components Packaging and Manufacturing Technology is 4. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-05-01 to 2025-05-01.)
ArticleCitations
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IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information77
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information52
Enhancing Defect Detection in Circuit Board Assembly Using AI and Text Analytics for Component Failure Classification49
Accelerated Life Test and Prediction of Electromigration in Aluminum Interconnects coupling Multiphysics Full Coupled Model with Optimized Atomic Flux Divergence Simulation45
A Data-Driven Approach to Collaborative Optimization for Enhancing TSV Multiphysics Performance43
A Wettability-Mediated Microdroplet Under Electrowetting Effect for Hotspot Cooling40
Study on the Performance of Insulating Substrate Based on Silver Sintering40
Thermomechanical Modeling and Stress Analysis of Copper Inverse Opal (CIO) Structure for Capillary-Fed Boiling39
Hybrid Integration of VCSEL and 3-μm Silicon Waveguide Based on a Monolithic Lens System38
Integrated Circuit Packaging Defect Analysis and Deep Learning Detection Method37
Practical Early Quality–Reliability Analysis of Microwirewound Resistor Transition Zone36
Wideband 3-D-Printed Chip Interconnects for DC-Millimeter Wave Applications35
Intra-Lid Multi-Core Vapor Chamber Architecture for Heterogeneous Electronic Packages: Technology Concept to Prototype Evaluation35
System Optimization: High-Frequency Buck Converter With 3-D In-Package Air-Core Inductor35
RF Performance Benchmarking of TSV Integrated Surface Electrode Ion Trap for Quantum Computing30
A Multifault Testing Method for TSVs Based on GAF-DRSN and Mirror Constant Current Source Structure30
Rapid Multiobjective Optimization Strategy of TSV-Based 3-D Inductor Using Vector Fitting and Evolutionary Algorithm29
Skew-Symmetric Slotted Waveguide With Mode Select Effect27
Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating25
Design and Implementation of an Electrostatic Force-Based Microcirculation Cooling System for Microelectronic Devices25
Investigation of Graphene Film as Ground Plane Material for RF and Microwave Electronics24
Reconfigurable SIW Phase Shifter Based on Parallel Stubs Loaded With Surface Mount p-i-n Diodes24
Table of Contents24
Substrate Integrated Waveguide Filters in Glass Interposer for mmWave Applications22
Dual-Band Dual-Polarized Microstrip Patch Antenna With Parasitic Elements for 5G Antenna-in-Package Design at Millimeter-Wave Frequencies21
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information21
Enhancing Humidity Robustness of Electronics: Understanding the Crucial Role of Solder Flux Chemistry in Determining Humidity Boundary for Failure21
Compact In-Line Multiband Bandpass Filters with Independently Controllable Passbands using Quarter-Mode SIW Cavities21
In Memoriam Prof. Avram Bar-Cohen21
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors20
IEEE Transactions on Components, Packaging and Manufacturing Technology publication information20
Analysis of Power Delivery Network (PDN) in Bridge-Chips for 2.5-D Heterogeneous Integration20
Table of Contents20
Power, Performance, Area, and Cost Analysis of Face-to-Face-Bonded 3-D ICs20
Member Get-a-Member (MGM) Program20
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information20
A Novel Approach to Evaluate and Predict the Impact of Randomly Distributed Voids on Junction Temperature for Power Modules19
Influence of Au Substrate Crystal Structure on Ag–Au Interdiffusion for WBG Packaging19
Packaged Millimeter-Wave On-Chip Bandpass Filter Using SHMSIW and Microstrip Hybrid Structure in 0.25-μm GaAs pHEMT Technology19
Warpage Analysis and Prediction of the Advanced Fan-Out Technology Based on Process Mechanics18
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information18
Optimization and Analysis of Microchannels Under Complex Power Distribution in 3-D ICs18
Optimization of the Wire Bonding Process for Enhanced Thermomechanical Performance of Quad Flat No-lead (QFN) Packages in Automotive Applications17
Deep Reinforcement Learning-Based Optimal and Fast Hybrid Equalizer Design Method for High-Bandwidth Memory (HBM) Module17
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information17
Application of Lévêque Analogy to Open Cellular Porous Materials17
Signal Integrity Analysis of Through-Silicon Via (TSV) With a Silicon Dioxide Well to Reduce Leakage Current for High-Bandwidth Memory Interface17
Thermal Onboard Detection of Voids in the Solder Layer Between Power Semiconductor and PCB17
Third Quadrant Operation of SiC MOSFETs: Comprehensive Analysis and Condition Monitoring Solution16
Holistic Chiplet–Package Co-Optimization for Agile Custom 2.5-D Design16
Reliability Improvement of 3.3 kV Full-SiC Power Modules for Power Cycling Tests With Sintered Copper Die Attach Technology16
High-Dimensional Uncertainty Quantification Using Stochastic Galerkin and Tensor Decomposition16
Extending Copper Interconnects and Epoxy Dielectrics to Multi-GHz Frequencies16
Gate Voltage Oscillation Mitigation in Solid-State Circuit Breakers With Single-Gate Driven Series-Connected Power Devices16
Estimation of Heat Generation in Semiconductors Centrally Mounted on Printed Circuit Boards15
A Stepwise Integration Separation of Variables Solver for Full-Chip Thermal Uncertainty Analysis15
Comparison Between Synthetic Oil Lubricants for Reducing Fretting Degradation in Lightly Loaded Gold-Plated Contacts15
A Cavity Balun for High-Power Shortwave Transmission15
Effect of Solar Irradiation on Thermal Performance of Heatsink—Numerical and Experimental Study15
Thermal Design and Evaluation of a Rectifier for Electric Vehicle Wireless Charging Using Hybrid PCBs and Planar Magnetics15
Dielectric Breakdown by Metallic Particles in COF Packaging for Display Driver IC15
Electro-Thermal-Stress Multiphysical Field Coupling Optimization Design for Coaxial Through Silicon Via Array14
Analysis of Discharge Caused by Soldering Defect in Wire-Bonding Power Module14
Machine Learning-Based Diagnosis of Defects in 2.5D and 3D Interconnects14
D-Band Waveguide Diplexer Fabricated Using Micro Laser Sintering14
Front Cover14
A Low-Profile Filtering Magneto-Electric Dipole Antenna Based on High-Density-Interconnect (HDI) Packaging14
Compact Interdigital Bandpass Filter, Diplexer, and Triplexer Based on Through Quartz Vias (TQVs)14
Transient Flow Boiling and Maldistribution Characteristics in Heated Parallel Channels Induced by Flow Regime Oscillations14
Optically Transparent Adhesives for Microwave Metamaterial Absorber With PET–PDMS Interface14
Table of Contents13
IEEE Components, Packaging, and Manufacturing Technology Society Information13
Blank Page13
Double-Sided Copper Filling of Small diameter, High-Aspect Ratio Through-Glass Vias in High-Density Glass Interposers13
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information13
Emerging trends in system-integrated wearable epidermal and flexible electrodes: Material design and applications in physiological monitoring13
Wide-Stopband Diplexer With Small Frequency Ratio Based on SIW Dual-Mode Resonators for Millimeter-Wave Applications13
Differential-Fed Magneto-Electric Dipole Antenna With Integrated Balun Based on Ball Grid Array Packaging13
A TSV-Based 3-D Electromagnetic Bandgap Structure on an Interposer for Noise Suppression13
Design and demonstration of dual-core spiral package-embedded inductors for Integrated Voltage Regulators13
Embedded p-i-n-Diode Die Interconnections With Aerosol-Jet Printing13
Characterization of Alumina Ribbon Ceramic Substrates for 5G and mm-Wave Applications12
Ball Grid Array Package Intermittent Partial Connection Defect Analysis in DDR4 Data Channel12
A Wideband Transition From Coaxial Line to Substrate-Integrated Waveguide12
On the Use of an In-Package Dielectric Lens Antenna for Radar-Based Applications12
High-Dimensional Uncertainty Quantification via Tensor Regression With Rank Determination and Adaptive Sampling12
Benchmarking and Demonstration of Low-Loss Fused-Silica Stitch-Chips With Compressible Microinterconnects for RF/mm-Wave Chiplet-Based Modules12
Modeling of Tunable Electronic Waveguide Devices in Graphene Using Conservative Higher Order Time Stepping12
Monolithically GaN-Based Optocoupler With Chip Scaling12
Influence of Copper Pad Dimension on Thermal Fatigue Life Performance of BGA Packages12
On the Use of Acoustic Methods for the Detection of Electrostatic Capture of Diaphragm in Capacitive MEMS Microphones12
Solder Joint Geometry Effects on Thermomechanical Fatigue Lifetime of End-Capped Chip Component Assemblies11
Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme11
A Dual-Band Mushroom EBG Structure With Inductive via Coupling for Wideband Parallel-Plate Mode Suppression11
A Review of Recent Developments in Pumped Two-Phase Cooling Technologies for Electronic Devices11
Front Cover11
Metrology of Silicon Wafers Through Synchrotron Section Topography and X-Ray Diffraction Imaging11
Corrections to “A Fully Integrated Arbitrary Power Divider on Printed Circuit Board by a Novel SMD-Resistor-Free Isolation Network”11
Low-Profile UWB Millimeter-Wave Antenna Array Under Triple Resonant Modes Based on PCB Technology11
The Impact of Substrate Vibrations on Self-Alignment Accuracy in BGA/Flip-Chip Assembly11
The Impact of Bonding Wire Failure in Microelectronic Package on Near-Field Radiation11
Ka-Band Substrate Integrated Waveguide Equalizer With Larger Equalization Value Based on Capacitive Loading Technology and Tiny Gap Effect11
Development of 3-D Wafer Level Packaging for SAW Filters Using Thin Glass Capping Technology11
Prefabricated and Assembled Electromagnetic Shields Inside Electronic Packages to Reduce Near-Field Capacitive and Inductive Coupling11
High-Selectivity Bandpass Filter-Integrated SPDT Switch Using Switchable Dual-Mode Hybrid Resonators11
Table of Contents11
Member Get-A-Member (MGM) Program11
YOLO Algorithm With Hybrid Attention Feature Pyramid Network for Solder Joint Defect Detection11
Material Property Variability of Composites in Thermo-Mechanical Studies Involving Virtual Design of Experiments10
Quad Port MIMO Al₂O₃ Ceramic-Based Integrated Reconfigurable Wideband Sensing and Communication Dielectric Antenna for 5G Cognitive Radio10
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information10
Front Cover10
Local Heat/Mass Transfer of Array Jet Impingement Cooling With Pin-Fin Heat Sinks10
Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network10
In Memoriam - A Tribute: Prof. Avram Bar-Cohen10
Membrane-Based Two Phase Heat Sinks for High Heat Flux Electronics and Lasers10
Application of Ferroelectric Capacitors for Equalization of High-Speed Digital Signaling10
Rapid Design of Litz Wire Using Surrogate-Assisted Optimization Embedding Adjacent Trust Region10
IEEE Open Access Publishing10
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Preventing Corrosion-Related Failures in Electronic Assembly: A Multicase Study Analysis10
Free-Form Filters Designed Using Binary Optimization Algorithm10
Numerical and Experimental Analyses of Component Failure Risk in a Mobile Phone Under Drop Test10
Failure Mechanism and Reliability Research of Solder Layer Tilt in Double-Sided Cooling Power Modules10
Bus-Aware IO Alignment Considering Length-Matching Constraints in 3-D IC Designs10
A Miniaturized Balanced-to-Balanced Power Divider With Common-Mode Noise Absorption10
Study on Thermomigration-Induced Void Formation in Advanced Copper Interconnects10
Front Cover10
Front Cover10
A Machine Learning-Based Method for Tuning the Control Loop of Fully Integrated Voltage Regulators10
SiC Power Module Packaging Using Printed Electronics Materials and Processes10
Structurally Integrated Radar in an Aerospace Composite Laminate9
Thermal Modeling of a Chiplet-Based Packaging With a 2.5-D Through-Silicon Via Interposer9
Moisture Diffusion Inside the BEOL of an FC-PBGA Package9
Flexible/Conformal Inkjet-Printed 3-D “Ramp” Interconnects for 5G/mmWave System-on-Package Designs and Wearable Applications9
Member Get-a-Member (MGM) Program9
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Air-Cooled Loop Thermosyphon Cooling System for High Heat Load CPUs—Part I: Design and Performance Simulation9
Miniaturized Dual-/Tri-/Quad-Band Bandpass Filters Using Perturbed Multimode SIW Cavity9
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information9
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors9
Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure With Thermal Transmission Line for High Bandwidth Memory Module9
Table of Contents9
Study on Wear Debris Distribution and Performance Degradation of Electrical Connector Under Step Random Vibration Stress9
Numerical Analysis of Pool Boiling of Nanofluids for High Heat Dissipation Applications9
Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics9
Effect of Oxygen Content on Bonding Performance of Sintered Silver Joint on Bare Copper Substrate9
Artificial Intelligence-Driven Optimization for Three-Dimensional Integrated Circuit Manufacturing: A System of Systems Framework9
Comparative Drop Shock Reliability Study of SAC-Based Alloys in BGA Assemblies9
IEEE Components, Packaging, and Manufacturing Technology Society Information9
Member Get-a-Member (MGM) Program9
Contact Reconstruction and Contact Spot Analysis of Microscopic Contact Surfaces Based on Feature Matching9
Table of Contents9
A Broadband Antenna with Folded Structure and Packaged Solar Cell8
Characterization of Microstrip Line and SIW on ABF in Glass Interposers for mmWave Applications8
Aerosol-Jet Printed Transferable Millimeter-Wave Circuits8
FPCB Surface Defect Detection Using Multiscale Spectral-Spatial Features Fusion8
Mixed-Mode Fiber Array Alignment and Coupling to Photonic Integrated Circuits8
Low Cost/Insertion Loss Substrate-Integrated Waveguide Equalizer Based on Absorbing Materials8
Experimental Analysis on Reliability of Needle Electrodes in Ionic Wind8
A Reflection Self-Canceling Design Technique for Multidrop Memory Interfaces8
Electronic Components Provenance Assurance Through AI and Big Data in Assembly Processes8
Investigation and Improvements of UWB Microstrip Delay Lines8
Co-Designed Silicon Photonics Chip I/O for Energy-Efficient Petascale Connectivity8
Effects of Interconnect Shape and Thermal-Electro-Migration on Solder Creep of Copper-Pillar Flip Chip Joints8
Symmetrical Multilayer Dielectric Model of Thermal Stress and Strain of Silicon-Core Coaxial Through-Silicon Vias in 3-D Integrated Circuit8
State of the Art of Cu–Cu Hybrid Bonding8
CPU Overclocking: A Performance Assessment of Air, Cold Plates, and Two-Phase Immersion Cooling8
IEEE Components, Packaging, and Manufacturing Technology Society information for authors8
IEEE Open Access Publishing8
Thermal Decouple Design of Multichip SiC Power Module With Thermal Anisotropic Graphite8
Tunable Ultra-Wideband (UWB) Liquid Metal Phase Shifter Based on SISL Platform8
High-Selectivity Bandpass Filters with Low Loss and Reduced Size Based on HCILA Slow-Wave Technology Encapsulated in Patch Cavities8
The Influence of Mechanical Cyclic Bending Stress on the Reliability of the Emerging DDR5 Memories in the Industrial Market8
Low-Profile Wideband D-Band Absorber Utilizing Resistive Thin-Film Screen-Printing8
Out-of-Plane Optical Coupling to Photonic Integrated Circuits Using Turning-Mirror Lens Arrays8
Cu Sintering for Cu Pillar Bonding: A Comparative Study Among Pressure-Less, Pressure-Assisted, and Transient Liquid Phase Sinter Pastes7
Segmentation Method for Modeling Heterogeneous Components to Suppress Broadband Simultaneous Switching Noise on a Multilayer Structure7
Origami-Driven Manufacturing of Reflectarrays or Transmitarrays With Feeds and Fixture7
Table of Contents7
Achievement and Assessment of 6-inch Wafer Bonding Based on A Novel Nanosilver Sintering Method7
Our Thanks to Reviewers IEEE Transactions on Components, Packaging, and Manufacturing Technology7
Front Cover7
Ultrawideband Chip-to-Chip Interconnect Using Bond Wire With Sidewalls7
On-Chip Single-/Dual-Notch-Band Half-Mode Substrate Integrated Plasmonic Waveguide Filters Based on Through Glass Via Technology7
Theoretical and Simulations Based Investigation of Heat Transfer and Thermal Runaway in Power MOSFET Devices7
High-Density Hybrid Substrate for Heterogeneous Integration7
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information7
Design of Manifolded 3-D μ-Coolers Enabling High Heat Flux Capillary-Driven Boiling Over Large Areas7
IEEE Open Access Publishing7
IEEE Open Access Publishing7
IEEE Components, Packaging, and Manufacturing Technology Society information for authors7
Front Cover7
Enhancing Glass-to-Glass Bonding at Room Temperatures Using Laser Surface Modification With Ti/Cu/Ti/TiO2 Thin Films7
Performance Analysis Using Air Gap Defected Through Silicon Via: Impact on Crosstalk and Power7
PIDDN: Pair-Image-Based Defect Detection Network With Template for PCB Inspection7
Design Guidelines for 2.5-D Packages Featuring Organic Interposer With Bridges Embedded7
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information7
Comprehensive Influences of Manufacturing Process Integrated With Thermal Cycling Test Loading on Mechanical Responses of Power Module7
Improving the Energy-Conversion Efficiency of a PV–TE System With an Intelligent Power-Track Switching Technique and Efficient Thermal-Management Scheme7
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors7
Characterization of Additively Manufactured Suspended Finite Ground CPW Interconnects Enhanced by Femtosecond Laser Micromachining7
Front Cover7
A Novel 3D-Printed Passive Microfluidic Temperature Sensor for Medical Applications7
Design of Vertically Integrated Folded SISL Patch Bandpass Filters With Single and Multiband Responses7
Least Squares Polynomial Chaos Regression for Stochastic Analysis of Transmission Lines Without and With Noise7
Advanced Chiplet Placement and Routing Optimization considering Signal Integrity7
A Sensitive Data Labeling Strategy for Optimizing a Broadband Vertical Transition in W Band7
3-D Stacking of SiC Integrated Circuit Chips With Gold Wire Bonded Interconnects for Long-Duration High-Temperature Applications7
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information7
Impact of EMI on the Reliability of Crossbar Architecture-based Inference in CMOS Technology6
IEEE Transactions on Components, Packaging and Manufacturing Technology publication information6
Selection and Characterization of Photosensitive Polyimide for Fan-Out Wafer-Level Packaging6
Solder Joint Defect Inspection Method Based on ConvNeXt-YOLOX6
Development and Reliability Study of 3-D Wafer Level Packaging for SAW Filter Using Thin Film Capping6
Highly Manufacturable Packaging of an Implantable Episcleral Surface Stimulator With Reliability and Safety Validations6
Quantification of Performance Variation and Crack Evolution of Bond-Wire Interconnects Under Harsh Temperature Environments by S-Parameter Analysis6
Metal-Assisted Chemical Etching Toward Scallop-Free-Sidewall Through-Silicon Vias: A Review6
MCB-DPO: Multiport Constrained Barrier Method-Based Decoupling Capacitor Placement Optimization on Irregularly Shaped Planes6
NOMA: A Novel Reliability Improvement Methodology for 3-D IC-based Neuromorphic Systems6
Analysis and Optimization of HBM3 PPA for TSV Model With Micro-Bump and Hybrid Bonding6
Conservative Gaussian Process Models for Uncertainty Quantification and Bayesian Optimization in Signal Integrity Applications6
Characterization and Optimization of the Heat Dissipation Capability of a Chip-On-Board Package Using Finite Element Methods6
TechRxiv: Share Your Preprint Research With the World!6
TechRxiv: Share Your Preprint Research with the World!6
Reliability Concerns of TSV-Based 3-D Integration: Impact of Interfacial Crack6
Electrical Demonstration of an RF Embedded Multichip Module Enabled by Fused-Silica Stitch-Chip Technology6
Enhanced Junction Temperature Prediction Model for CoWoS Packaging With Multiple Chiplets6
The Connection Between Electromigration Resistance and Thin-Film Adhesion and Their Degradation With Temperature6
A mm-Wave 5G System Architecture With Enhanced-Gain Antenna Solution6
Broadband Millimeter-Wave Dielectric Properties of Liquid Crystal Polymer Materials6
Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz6
Electromechanical Performance of Microprobe Test With Cuboid Magnetorheological Damper in Microelectronic Packaging6
Impact of Thermo-Mechanical Stress Due to Probing and Wire Bonding on CUP Devices6
Thermal Management of β-Ga₂O₃ Current Aperture Vertical Electron Transistors6
On the Fast Prediction of the Aerodynamic Performance of Electronics Cooling Fans Considering the Effect of Tip Clearance6
MEMS Package for an Iron–Gallium Nanowire-Based Acoustic Sensor6
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information6
Sensitivity Analysis for Geometrical Parameters of BGA in Flip-Chip Packaging Under Random Shear Stress and Thermal Temperature6
A Slow Wave Folded Ridge HMSIW Using Spoof Surface Plasmon Polaritons Structure and Its Application in Coupler Design6
2024 Index IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 146
Hybrid Substrate by Fan-Out RDL-First Panel-Level Packaging6
Sulfur Ingression on Encapsulated Leadframe of Discrete Semiconductor Package6
Parameter Optimization of Pretin Printing Process of Wireless Communication Module6
Low-Profile Polymer Composite Radar Absorber Embedded With Frequency Selective Surface6
Impedance and Admittance Waveguide Inverter Applications: A Practical Sub-Terahertz Region Tolerance Analysis for Large-Scale Production6
Electrothermal Transient Co-Simulation With Domain Decomposition Method for 3-D Complex Integrated Systems6
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors5
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