IEEE Transactions on Components Packaging and Manufacturing Technology

Article	Citations
Recent Advances and Trends in Advanced Packaging	189
A Review of 5G Front-End Systems Package Integration	130
Universal Chiplet Interconnect Express (UCIe): An Open Industry Standard for Innovations With Chiplets at Package Level	64
A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs)	60
Power Delivery for High-Performance Microprocessors—Challenges, Solutions, and Future Trends	56
Automatic Industry PCB Board DIP Process Defect Detection System Based on Deep Ensemble Self-Adaption Method	42
Electric Field Mitigation in High-Voltage High-Power IGBT Modules Using Nonlinear Conductivity Composites	38
Long Short-Term Memory Neural Networks for Modeling Nonlinear Electronic Components	37
Wafer-to-Wafer Hybrid Bonding Development by Advanced Finite Element Modeling for 3-D IC Packages	37
Characterization of ABF/Glass/ABF Substrates for mmWave Applications	36
An Adaptive Machine Learning Method Based on Finite Element Analysis for Ultra Low-k Chip Package Design	35
Electrical and Reliability Investigation of Cu-to-Cu Bonding With Silver Passivation Layer in 3-D Integration	34
The ICECool Fundamentals Effort on Evaporative Cooling of Microelectronics	33
Silicon-Interconnect Fabric for Fine-Pitch (≤10 μm) Heterogeneous Integration	33
Low Insertion-Loss MMIC Bandpass Filter Using Lumped-Distributed Parameters for 5G Millimeter-Wave Application	32
A Contactless PCBA Defect Detection Method: Convolutional Neural Networks With Thermographic Images	31
CPU Overclocking: A Performance Assessment of Air, Cold Plates, and Two-Phase Immersion Cooling	28
Diamond-Incorporated Flip-Chip Integration for Thermal Management of GaN and Ultra-Wide Bandgap RF Power Amplifiers	27
Modular Integration of a Passive RFID Sensor With Wearable Textile Antennas for Patient Monitoring	27
Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV-Less Interposers	26
Comparison of Mechanical Modeling to Warpage Estimation of RDL-First Fan-Out Panel-Level Packaging	25
A Review of Recent Developments in Pumped Two-Phase Cooling Technologies for Electronic Devices	24
Investigation of Low-Temperature Cu–Cu Direct Bonding With Pt Passivation Layer in 3-D Integration	22
A Method of Defect Detection for Focal Hard Samples PCB Based on Extended FPN Model	22
A Variational Autoencoder Enhanced Deep Learning Model for Wafer Defect Imbalanced Classification	21

3-D-Printing and High-Precision Milling of W-Band Filter Components With Admittance Inverter Sequences	21
Low-Temperature (260 °C) Solderless Cu–Cu Bonding for Fine-Pitch 3-D Packaging and Heterogeneous Integration	21
Anomaly Detection for Solder Joints Using β-VAE	21
Comparative Study of Surrogate Modeling Methods for Signal Integrity and Microwave Circuit Applications	21
Iterative Machine Learning-Aided Framework Bridges Between Fatigue and Creep Damages in Solder Interconnections	20
Materials and Interface Challenges in High-Vapor-Quality Two-Phase Flow Boiling Research	20
An Analysis of Solder Joint Formation and Self-Alignment of Chip Capacitors	19
Low-Loss Gap Waveguide Transmission Line and Transitions at 220–320 GHz Using Dry Film Micromachining	19
Solder Joint Defect Inspection Method Based on ConvNeXt-YOLOX	19
Thickness Dependence and Anisotropy of Capped Diamond Thermal Conductivity on Cooling of Pulse-Operated GaN HEMTs	18
A Finite Element Analysis on the Reliability of Heavy Bonding Wire for High-Power IGBT Module	18
Recent Advances and Trends in Cu–Cu Hybrid Bonding	18
Hybrid Substrate by Fan-Out RDL-First Panel-Level Packaging	18
FE Simulation Model for Warpage Evaluation of Glass Interposer Substrate Packages	17
Thermal Management System for Press-Pack IGBT Based on Liquid Metal Coolant	17
Thermal Design, Optimization, and Packaging of Planar Magnetic Components	16
Thermal–Mechanical Performance Analysis and Structure Optimization of the TSV in 3-D IC	16
Reliability Study of Polymers Used in Sub-4-μm Pitch RDL Applications	16
Thermal Management Modeling for β-Ga2O3-Highly Thermal Conductive Substrates Heterostructures	16
Smarter Temperature Setup for Reflow Oven to Minimize Temperature Variation Among Components	15
Thermal Management of Electronic Devices Using Gold and Carbon Nanofluids in a Lid-Driven Square Cavity Under the Effect of Variety of Magnetic Fields	15
Failure Analysis and Modeling of Solder Joints in BGA Packaged Electronic Chips	15
Noncontact Reflow Oven Thermal Profile Prediction Based on Artificial Neural Network	15
The Heat-Dissipation Sintered Interface of Power Chip and Heat Sink and Its High-Temperature Thermal Analysis	15
Substrate Integrated Waveguide Filters in Glass Interposer for mmWave Applications	15
Thermal Optimization of High-Temperature Downhole Electronic Devices	15
A Comparative Study of Energy Savings in a Liquid-Cooled Server by Dynamic Control of Coolant Flow Rate at Server Level	15
Modeling of the RF Coaxial TSV Configuration Inside the Silicon Interposer With Embedded Cooling Cavity	15
Laminated Glass-Based, Compact Inline Stepped-Impedance Resonator Bandpass Filters for 5G New Radio Modules	14
Synthetic Jet Cooling Technology for Electronics Thermal Management—A Critical Review	14
Comprehensive Analysis of a Cu Nitride Passivated Surface That Enhances Cu-to-Cu Bonding	14
Novel SiC-Based Power Device Bonding Materials of Nano Foam Sheet and Its Characteristic and Properties	14
Analysis of Parameter Variability in an Integrated Wireless Power Transfer System via Partial Least-Squares Regression	14
Materials and Devices for On-Chip and Off-Chip Peltier Cooling: A Review	13
Impact of Pressure Drop Oscillations on Surface Temperature and Critical Heat Flux During Flow Boiling in a Microchannel	13
Thermal and Mechanical Characterization of 2.5-D and Fan-Out Chip on Substrate Chip-First and Chip-Last Packages	13
Evaluation of 3-D Printed Monolithic G-Band Waveguide Components	13
High-Temperature Encapsulation Materials for Power Modules: Technology and Future Development Trends	13
3-D Printing Structural Electronics With Conductive Filaments	13
Modeling and Analysis of Signal Integrity of Ball Grid Array Packages With Failed Ground Solder Balls	13
A Novel High-Isolation Resistor-Less Millimeter-Wave Power Divider Based on Metamaterial Structures for 5G Applications	13
Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme	13
Shape Memory Alloy-Based Frequency Reconfigurable Ultrawideband Antenna for Cognitive Radio Systems	13
Thermal Management of β-Ga₂O₃ Current Aperture Vertical Electron Transistors	13
Varactor–Graphene-Based Bandpass Filter With Independently Tunable Characteristics of Frequency and Amplitude	13
Fully Integrated Wireless Elastic Wearable Systems for Health Monitoring Applications	13
High-Dimensional Uncertainty Quantification via Tensor Regression With Rank Determination and Adaptive Sampling	13
Development of 3-D Wafer Level Packaging for SAW Filters Using Thin Glass Capping Technology	13
Laser Ablation Cutting-Based Metal Patterning Technique Enabling 3D-Printed Broadband Antennas for Sub-6 GHz Wireless Communications Applications	13
A Review of Methods for the Reliability Testing of Flexible Hybrid Electronics	12

Reflow Recipe Establishment Based on CFD-Informed Machine Learning Model	12
Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV Interposers	12
Additive Manufacture of Custom Radiofrequency Connectors	12
Influence of Humidity on the Power Cycling Lifetime of SiC MOSFETs	12
Application of Steinberg Model for Vibration Lifetime Evaluation of Sn-Ag-Cu-Based Solder Joints in Power Semiconductors	12
A Review of Low-Temperature Solders in Microelectronics Packaging	12
Analysis and Optimization of Electrolytic Capacitor Technology for High-Frequency Integrated Inverter	12
High-Reliability Wireless Packaging for High-Temperature SiC Power Device Sintered by Novel Organic-Free Nanomaterial	12
Design of 3-D Integrated SIW Multiband Bandpass Filter With Split-Type Extended Doublet Topology	11
Investigation on the Reliability of Die-Attach Structures for Double-Sided Cooling Power Module	11
Effect of Ag Sintered Bondline Thickness on High-Temperature Reliability of SiC Power Devices	11
Chiplet/Interposer Co-Design for Power Delivery Network Optimization in Heterogeneous 2.5-D ICs	11
Design Flow for Active Interposer-Based 2.5-D ICs and Study of RISC-V Architecture With Secure NoC	11
Thermal Modeling of a Chiplet-Based Packaging With a 2.5-D Through-Silicon Via Interposer	11
Near-Field Scanning Based Shielding Effectiveness Analysis of System in Package	11
Plasma Treatment and Copper Metallization for Reliable Plated-Through-Holes in Microwave PCBs for Space Electronic Packaging	11
Technological Investigation of Metal 3-D Printed Microwave Cavity Filters Based on Different Topologies and Materials	10
Mode-Selective Transmission Line—Part I: Theoretical Foundation and Physical Mechanism	10
Analysis of Thermal Performance Metrics—Application to CPU Cooling in HPC Servers	10
Fan-Out Panel-Level Packaging of Mini-LED RGB Display	10
Fast and Stable Time-Domain Simulation Based on Modified Numerical Inversion of the Laplace Transform	10
A Critical Review of Lithography Methodologies and Impacts of Topography on 2.5-D/3-D Interposers	10
Uniformly Stable Parameterized Macromodeling Through Positive Definite Basis Functions	10
Warpage Analysis and Prediction of the Advanced Fan-Out Technology Based on Process Mechanics	10
Performance Analysis Using Air Gap Defected Through Silicon Via: Impact on Crosstalk and Power	10
Antenna With Embedded Die in Glass Interposer for 6G Wireless Applications	10
Analysis of Thermal Crosstalk in Photonic Integrated Circuit Using Dynamic Compact Models	10
Characterization of Alumina Ribbon Ceramic Substrates for 5G and mm-Wave Applications	10
Experimental and Numerical Study of 3-D Printed Direct Jet Impingement Cooling for High-Power, Large Die Size Applications	10
Thermal and Mechanical Analyses of Clamping Area on the Performance of Press-Pack IGBT in Series-Connection Stack Application	10
Wideband Low-Profile Dual-Polarized Antenna Based on a Gain-Enhanced EBG Reflector	9
Flexible Chip-First Millimeter-Wave Packaging Using Multiple Dielectrics	9
Comparative Reliability of Inkjet-Printed Electronics Packaging	9
Microstructure Development of Cu/SiO₂ Hybrid Bond Interconnects After Reliability Tests	9
Millimeter-Wave Dielectric Slab-Based Chip-to-Chip Interconnect Network Allowing for Relaxed Assembly Tolerances	9
Modeling of Signal Distortion Caused by Passive Intermodulation and Cross Modulation in Coaxial Connectors	9
An Estimate of Heat Generation, Electric, and Magnetic Parameters From Temperature Fields in Porous Fins for Electronic Cooling Systems	9
The Connection Between Electromigration Resistance and Thin-Film Adhesion and Their Degradation With Temperature	9
Transient Cooling and Heating Effects in Holey Silicon-Based Lateral Thermoelectric Devices for Hot Spot Thermal Management	9
Large-Area Substrate Bonding With Single-Printing Silver Paste Sintering for Power Modules	9
Large-Area Bonding by Sintering of a Resin-Free Nanosilver Paste at Ultralow Temperature of 180 °C	9
3-D Printed Microjet Impingement Cooling for Thermal Management of Ultrahigh-Power GaN Transistors	9
Cu–Cu Bonding Using Selective Cobalt Atomic Layer Deposition for 2.5-D/3-D Chip Integration Technologies	9
Mechanical–Thermal–Electrical Coupling Modeling and Temperature Rise Characteristic of a Parallel Groove Clamp With Improved Representation of Contact Interactions	9
Mode-Selective Transmission Line—Part II: Excitation Scheme and Experimental Verification	9
High-Density Hybrid Substrate for Heterogeneous Integration	9
A Transfer Learning LSTM Network-Based Severity Evaluation for Intermittent Faults of an Electrical Connector	9
Additive Manufacturing of Hetero-Magnetic Coupled Inductors	9
A Low-Cost Substrate Integrated Suspended Line Platform With Multiple Inner Boards and Its Applications in Coupled-Line Circuits	9
Cyclic Bending Effects on Resistance of Screen-Printed Silver Conductors	9
Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) for a 122-GHz Radar Chip	9
On the Junction Temperature Extraction Approach With a Hybrid Model of Voltage-Rise Time and Voltage-Rise Loss	9
An Artificial Intelligence-Based Pick-and-Place Process Control for Quality Enhancement in Surface Mount Technology	8
Jet Impingement Heat Sinks With Application Toward Power Electronics Cooling: A Review	8
Improving the Energy-Conversion Efficiency of a PV–TE System With an Intelligent Power-Track Switching Technique and Efficient Thermal-Management Scheme	8
Physical Modeling of Monolithic Self-Rolled-Up Microtube Interdigital Capacitors	8
A 5-Gb/s Adaptive Continuous Time Linear Equalizer Using Ferroelectric Capacitor	8
A Scalable HPC-Based Domain Decomposition Method for Multiphysics Modeling of RF Devices	8
Micropackaged Compact Switchable Filters With High Isolation in 3-D TSV-MEMS Process	8
Heterogeneous Integration System in Display (HiSID) for Next-Generation Terminal Device	8
D-Band Waveguide Diplexer Fabricated Using Micro Laser Sintering	8
Preparation and Characterization of a Thermal Insulating Carbon Xerogel-Epoxy Composite Adhesive for Electronics Applications	8
A Wettability-Mediated Microdroplet Under Electrowetting Effect for Hotspot Cooling	8
Development and Reliability Study of 3-D Wafer Level Packaging for SAW Filter Using Thin Film Capping	8
Thermal Aging Reliability of Socketable BGA Packages With Ni–Au-Coated SAC305 Spheres	8
Experimental Characterization of Additively Manufactured Metallic Heat Exchangers	8
Three-Dimensional SIP Design of the Four-Channel RF Transceiver Based on Silicon and ALN for X-Band Radar Applications	8
Structurally Integrated Radar in an Aerospace Composite Laminate	8
The Influence and Application of Bond Wires Failure on Electrothermal Characteristics of IGBT Module	8
Embedded Inductors Using Composite Magnetic Materials for 12–1-V Integrated Voltage Regulators	8
Optically Transparent Adhesives for Microwave Metamaterial Absorber With PET–PDMS Interface	8
Sensitivity Analysis for Geometrical Parameters of BGA in Flip-Chip Packaging Under Random Shear Stress and Thermal Temperature	8
A Fully Integrated Arbitrary Power Divider on Printed Circuit Board by a Novel SMD-Resistor-Free Isolation Network	8
Reinforcement-Learning-Based Signal Integrity Optimization and Analysis of a Scalable 3-D X-Point Array Structure	8
Wide-Stopband Substrate Integrated Waveguide Filter Power Divider Based on Through Glass Quartz Via (TQV) Technology	8
An UHF Reconfigurable Liquid-Metal Monopole Antenna Based on a 2-D Surface	8
Air-Cooled Loop Thermosyphon Cooling System for High Heat Load CPUs—Part II: Experimental Results and Validation	8
DC IR-Drop Analysis of Power Distribution Networks by a Robin Transmission Condition-Enhanced Discontinuous Galerkin Method	8
Thermal Modeling of Fan-Cooled Plate–Fin Heatsink Considering Air Temperature Rise for Virtual Prototyping of Power Electronics	8
Average Power Handling Capability of Microstrip Lines Considering Heat Convection and Self-Heating Effects With Temperature-Dependent Resistivity	8

Intermittent Fault Modeling and RUL Prediction for Degraded Electrical Connectors in Vibration Environments	8
Multimaterial Aerosol Jet Printed Magnetic Nanocomposites for Microwave Circuits	8
Effects of Environmental Temperature on Passive Intermodulation in Electrical Connectors	7
Signal Integrity Modeling and Analysis of Large-Scale Memristor Crossbar Array in a High-Speed Neuromorphic System for Deep Neural Network	7
A D-Band Magnetoelectric Dipole Antenna-in-Package (AiP) Implemented on BT-Based Organic Substrate	7
Fan-Out Antenna-in-Package Integration Using Heatsink Antenna	7
An FR4-Based Self-Packaged Full Ka-Band Low-Loss 1:4 Power Divider Using SISL to Air-Filled SIW T-Junction	7
Flexible Ink-Minimized Screen-Printed Frequency Selective Surfaces With Increased Optical Transparency for 5G Electromagnetic Interference Mitigation	7
Revealing Hidden Defects in Electronic Components With an AI-Based Inspection Method: A Corrosion Case Study	7
Noise and Jitter Characterization of High-Speed Interfaces in Heterogeneous Integrated Systems	7
Monolithic Microfluidic Cooling of a Heterogeneous 2.5-D FPGA With Low-Profile 3-D Printed Manifolds	7
Vertical Noise Reduction in 3-D Mixed-Signal Integrated Circuits With Graphene Nanoribbon and Carbon Nanotube Interconnects	7
Evaluation of the Quality of BGA Solder Balls in FCBGA Packages Subjected to Thermal Cycling Reliability Test Using Laser Ultrasonic Inspection Technique	7
Toward Fully Automated High-Dimensional Parameterized Macromodeling	7
Environment-Adaptable Printed-Circuit Board Positioning Using Deep Reinforcement Learning	7
Investigation of Electrical and Thermal Properties of Epoxy Resin/Silicon Carbide Whisker Composites for Electronic Packaging Materials	7
77/79-GHz Forward-Wave Directional Coupler Component Based on Microstrip and SIW for FMCW Radar Application	7
Exploring Advanced Packaging Technologies for Reverse Engineering a System-in-Package (SiP)	7
A Miniaturized Wideband SIR Interdigital Bandpass Filter With High Performance Based on TSV Technology for W-Band Application	7
Miniaturized Dual-/Tri-/Quad-Band Bandpass Filters Using Perturbed Multimode SIW Cavity	7
A Balanced Filtering Directional Coupler Based on Slotline Using Asymmetric Parallel Loaded Branches	7
Study of Bondable Laser Release Material Using 355 nm Energy to Facilitate RDL-First and Die-First Fan-Out Wafer-Level Packaging (FOWLP)	7
Shear Fatigue Analysis of SAC-Bi Solder Joint Exposed to Varying Stress Cycling Conditions	7
Thermo-Mechanical Characteristics and Reliability of Die-Attach Through Self-Propagating Exothermic Reaction Bonding	7
Vacuum Reflow Process Optimization for Solder Void Size Reduction in Semiconductor Packaging Assembly	7
Wideband and Low-Profile Multi-Polarization Reconfigurable Filtering Antenna Based on Nonuniform Metasurface	7
An Ultrawideband Four-Port Composite Probe With Simultaneous Measurement of Multicomponent Fields and Improvement of Electric-Field Suppression	7
Improved Thermal Conductivity and Reliability Through Graphene Reinforced Nanopaste for Power Devices in New Energy Vehicles	7
Mechanical Performance and Reliability of a Sn–Ag–Cu–Sb Alloy at Elevated Temperatures	7
Degradation Mechanism of Silver Sintering Die Attach Based on Thermal and Mechanical Reliability Testing	7
A Compact Sixth-Order Common-Mode Noise Suppression Filter Based on 3-D Integration Technology	7
Laguerre–Volterra Feed-Forward Neural Network for Modeling PAM-4 High-Speed Links	6
Investigation on Graphene-Coated Silver-Palladium Microelectrical Contact and Effect of Coating Thickness	6
Cascaded Multicore Vapor Chambers for Intrapackage Spreading of High-Power, Heterogeneous Heat Loads	6
Compact CEBG Filter for High-Frequency Applications With Low Insertion Loss	6
A Cost-Effective W-Band Antenna-in-Package Using IPD and PCB Technologies	6
An Exploration of the Friction, Wear, and Electrical Effects of Nanoparticle Enhanced and Conventional Lubricants	6
Warpage Estimation and Demonstration of Panel-Level Fan-Out Packaging With Cu Pillars Applied on a Highly Integrated Architecture	6
Proposed Inductor Power Loss Metric and Novel Embedded Toroidal Inductor for Integrated Voltage Regulators	6
Thermomechanical Challenges of 2.5-D Packaging: A Review of Warpage and Interconnect Reliability	6
Glass-Based Bandpass Filters for New Radio (NR) K-/Ka-Band Communications	6
3-D Stacking of SiC Integrated Circuit Chips With Gold Wire Bonded Interconnects for Long-Duration High-Temperature Applications	6
Review of the Failure Mechanism and Methodologies of IGBT Bonding Wire	6
Equivalent Circuit Synthesis of Multiport S Parameters in Pole–Residue Form	6
Humidity Control in Electronic Devices: Water Sorption Properties of Desiccants and Related Humidity Build-Up in Enclosures	6
Influence of Lateral Temperature Gradients on the Failure Modes at Power Cycling	6
SLA-Printed K-Band Waveguide Components Using Tollens Reaction Silver Plating	6
Visualization and Characterization of Cumulative Arc Erosion Behavior Using 2-D Microscopic Images	6
Electrothermal Design of SIW Slot Antenna Array With Fin-Shaped Heatsink Enclosed	6
Adaptive 5G Architecture for an mmWave Antenna Front-End Package Consisting of Tunable Matching Network and Surface-Mount Technology	6
Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure With Thermal Transmission Line for High Bandwidth Memory Module	6
Analysis of Repetitive Bending on Flexible Wireless Power Transfer (WPT) PCB Coils for Flexible Wearable Devices	6
High-Density Electrical and Optical Assembly for Subminiature VCSEL-Based Optical Engine	6
Laser-Assisted Sintering of Silver Nanoparticle Paste for Bonding of Silicon to DBC for High-Temperature Electronics Packaging	6
Broadband Dielectric Properties of Integrated Circuit Packaging Materials Across the 6G Spectrum	6
The Effect of Pitch Distance on the Statistics and Morphology of Through-Silicon Via Extrusion	6
Investigations of an Influence of the Assembling Method of the Die to the Case on Thermal Parameters of IGBTs	6
Research on Flip-Chip Bonding Process and Thermal Cycle Reliability Simulation of 3-D Stacked Structure	6
Experimental and Finite Element Analysis of Epoxy-Based Composites for Packaging Materials to Reduce Electric Field and Power Loss Under AC and DC Conditions	6
Power Module Using Ceramic Heat Sink and Multilayers Silver Sintering	6
RF Performance Benchmarking of TSV Integrated Surface Electrode Ion Trap for Quantum Computing	6
Simulation and Experimental Study on Temperature Rise Characteristic of a Piercing Connector	6
Thin Film Metallization Stacks Serve as Reliable Conductors on Ceramic-Based Substrates for Active Implants	6
Manufacturing, Developments, and Constraints in Full 3-D Printing of Frequency-Selective Surface Using Low-Cost Open-Source Printer	6
Structural Integrity of 3-D Metal–Insulator–Metal Capacitor Embedded in Fully Filled Cu Through-Silicon via	6
Tarnishing (Ag2S) Layer on Silver-Plated Electrical Contacts: Its Influence on Electrical Contact Resistance	6
Contacting Inkjet-Printed Silver Structures and SMD by ICA and Solder	6
Effect of TIM Deterioration on Monitoring of IGBT Module Thermal Resistance and Its Compensation Strategy	6
Holistic Chiplet–Package Co-Optimization for Agile Custom 2.5-D Design	6
Galerkin’s Projection Framework for BCI CTMs—Part I: Extended FANTASTIC Approach	6
Conductivity Improvement of Microdispensed Microstrip Lines and Grounded Coplanar Waveguides Using Laser Micromachining	6
Simulation and Experimental Study of Flexible Cooling System Based on Microchannel in PDMS	5
Cost-Effective Surface-Mount Magnetoelectric Dipole Antenna Based on Ball Grid Array Packaging Technology for 5G Millimeter-Wave New Radio Band Applications	5
Aerosol Jet Printed, Microwave Microstrip Ring Resonators for System-In-Package Applications	5
Asymmetric Sawtooth Microstructure-Induced Vapor Mobility for Suppressed Buoyancy Conditions: Terrestrial Experiment and Design for ISS Experiments	5
Ultra-Wideband Spurious Radiation Suppression in Microstrip Antennas Using Integrated Uniplanar Compact Coupling Structure With Controllable Transmission-Zeros Matching Approach	5
An Optimized Ag–5Pd–3.5Au Bonding Wire for the Resistance of Ag Ion Migration in LED Packages	5
Antenna Array on Glass Interposer for 6G Wireless Communications	5
Thermal-Flow Network Modeling for Virtual Prototyping of Power Electronics	5
Manufacturing Considerations for the Development of Reconfigurable Antennas Using Inexpensive Inkjet Printing	5
Harmonized Rapid Prototyping of Millimeter-Wave Components Using Additive and Subtractive Manufacturing	5
Open Defect Detection in Assembled Circuit Boards With Built-In Relaxation Oscillators	5
MCB-DPO: Multiport Constrained Barrier Method-Based Decoupling Capacitor Placement Optimization on Irregularly Shaped Planes	5
Supervised Machine-Learning Approach for the Optimal Arrangement of Active Hotspots in 3-D Integrated Circuits	5
A Compact Symmetrical Single-Cell Bidirectional Absorption Common-Mode Filter	5
Low-Profile Polymer Composite Radar Absorber Embedded With Frequency Selective Surface	5
Experimental and Numerical Investigations of the Warpage of Fan-Out Wafer-Level Packaging With SAW Filters	5
An Efficient ADI Method for Transient Thermal Simulation of Liquid-Cooled 3-D ICs	5
The Impact of Variation in Filling Ratios, Evacuation Pressure, and Heat Input on Thermal Performance of Pulsating Heat Pipe	5
An Evaluation Method for Electrical Contact Failure Based on High-Frequency Impedance Model	5
Partially Omnidirectional and Circularly Polarized MIMO Antenna Covering Sub-6-GHz Band for 5G Fast Plan	5
Contactless Optical Packaging Concept for Laser to Fiber Coupling	5
A Flexible Implantable Polyimide Catheter Device for Targeted Treatment of Cardiovascular Diseases by Aggregating Magnetic Nanoparticles	5
Modeling and Analysis of Silver-Sintered Molybdenum Packaging for SiC Power Modules With Improved Lifetime and Temperature Range	5
The Implementation of Sapphire Microreflector for Monolithic Micro-LED Array	5