OOIR: Observatory of International Research

Papers

(The median citation count of IEEE Transactions on Components Packaging and Manufacturing Technology is 1. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-09-01 to 2025-09-01.)

Article	Citations
Blank Page	373
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	111
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	65
Study on the Performance of Insulating Substrate Based on Silver Sintering	55
Thermomechanical Modeling and Stress Analysis of Copper Inverse Opal (CIO) Structure for Capillary-Fed Boiling	54
Hybrid Integration of VCSEL and 3-μm Silicon Waveguide Based on a Monolithic Lens System	53
Intra-Lid Multi-Core Vapor Chamber Architecture for Heterogeneous Electronic Packages: Technology Concept to Prototype Evaluation	49
RF Performance Benchmarking of TSV Integrated Surface Electrode Ion Trap for Quantum Computing	43
Table of Contents	42
Skew-Symmetric Slotted Waveguide With Mode Select Effect	42
Compact In-Line Multiband Bandpass Filters with Independently Controllable Passbands using Quarter-Mode SIW Cavities	41
System Optimization: High-Frequency Buck Converter With 3-D In-Package Air-Core Inductor	38
Investigation of Graphene Film as Ground Plane Material for RF and Microwave Electronics	36
Microstructural Evolution of SAC-Based Solder Joints Exposed to Thermal Cycling: Effect of Paste Alloy, Paste Volume, and Surface Finish	33
Accelerated Life Test and Prediction of Electromigration in Aluminum Interconnects Coupling Multiphysics Full Coupled Model With Optimized Atomic Flux Divergence Simulation	33
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	32
Design and Implementation of an Electrostatic Force-Based Microcirculation Cooling System for Microelectronic Devices	30
A Multifault Testing Method for TSVs Based on GAF-DRSN and Mirror Constant Current Source Structure	30
Dual-Band Dual-Polarized Microstrip Patch Antenna With Parasitic Elements for 5G Antenna-in-Package Design at Millimeter-Wave Frequencies	28
Wideband 3-D-Printed Chip Interconnects for DC-Millimeter Wave Applications	26
A Data-Driven Approach to Collaborative Optimization for Enhancing TSV Multiphysics Performance	26
Substrate Integrated Waveguide Filters in Glass Interposer for mmWave Applications	26
Reconfigurable SIW Phase Shifter Based on Parallel Stubs Loaded With Surface Mount p-i-n Diodes	26
Integrated Circuit Packaging Defect Analysis and Deep Learning Detection Method	26
Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating	25

Jet-Dispensing-Based Assembly of Electric Field Adaptively Controlled Structure in Power Electronic Modules	25
Rapid Multiobjective Optimization Strategy of TSV-Based 3-D Inductor Using Vector Fitting and Evolutionary Algorithm	25
A Wettability-Mediated Microdroplet Under Electrowetting Effect for Hotspot Cooling	23
Enhancing Defect Detection in Circuit Board Assembly Using AI and Text Analytics for Component Failure Classification	23
Reliability Risk Assessment of Server CPU Package in Single-Phase, Hydrocarbon-Based Immersion Fluid	23
Table of Contents	22
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	22
Member Get-a-Member (MGM) Program	22
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	22
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	22
IEEE Transactions on Components, Packaging and Manufacturing Technology publication information	22
Power, Performance, Area, and Cost Analysis of Face-to-Face-Bonded 3-D ICs	21
Enhancing Humidity Robustness of Electronics: Understanding the Crucial Role of Solder Flux Chemistry in Determining Humidity Boundary for Failure	21
Machine Learning-Based Diagnosis of Defects in 2.5-D and 3-D Interconnects	21
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	21
Gate Voltage Oscillation Mitigation in Solid-State Circuit Breakers With Single-Gate Driven Series-Connected Power Devices	20
100 Gb/s Multichannel TOSA With Low Tracking Error at the Industry Operating Temperature	20
A Low-Profile Filtering Magneto-Electric Dipole Antenna Based on High-Density-Interconnect (HDI) Packaging	20
Reliability Improvement of 3.3 kV Full-SiC Power Modules for Power Cycling Tests With Sintered Copper Die Attach Technology	20
Optimization of the Wire Bonding Process for Enhanced Thermomechanical Performance of Quad Flat No-Lead (QFN) Packages in Automotive Applications	20
Optimization and Analysis of Microchannels Under Complex Power Distribution in 3-D ICs	19
A Novel Approach to Evaluate and Predict the Impact of Randomly Distributed Voids on Junction Temperature for Power Modules	19
Influence of Au Substrate Crystal Structure on Ag–Au Interdiffusion for WBG Packaging	19
Application of Lévêque Analogy to Open Cellular Porous Materials	19
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	19
Thermal Onboard Detection of Voids in the Solder Layer Between Power Semiconductor and PCB	19
Extending Copper Interconnects and Epoxy Dielectrics to Multi-GHz Frequencies	18
High-Dimensional Uncertainty Quantification Using Stochastic Galerkin and Tensor Decomposition	18
Comparison Between Synthetic Oil Lubricants for Reducing Fretting Degradation in Lightly Loaded Gold-Plated Contacts	17
Dielectric Breakdown by Metallic Particles in COF Packaging for Display Driver IC	17
Effect of Solar Irradiation on Thermal Performance of Heatsink—Numerical and Experimental Study	17
A Stepwise Integration Separation of Variables Solver for Full-Chip Thermal Uncertainty Analysis	17
Thermal Design and Evaluation of a Rectifier for Electric Vehicle Wireless Charging Using Hybrid PCBs and Planar Magnetics	17
A Cavity Balun for High-Power Shortwave Transmission	17
Analysis of Power Delivery Network (PDN) in Bridge-Chips for 2.5-D Heterogeneous Integration	16
Transient Flow Boiling and Maldistribution Characteristics in Heated Parallel Channels Induced by Flow Regime Oscillations	16
Using Hybrid Bonding for Stacked Bi-color Micro Light Emitting Diodes	16
Deep Reinforcement Learning-Based Optimal and Fast Hybrid Equalizer Design Method for High-Bandwidth Memory (HBM) Module	16
D-Band Waveguide Diplexer Fabricated Using Micro Laser Sintering	16
Front Cover	16
Electro-Thermal-Stress Multiphysical Field Coupling Optimization Design for Coaxial Through Silicon Via Array	16
Estimation of Heat Generation in Semiconductors Centrally Mounted on Printed Circuit Boards	15
Design and Demonstration of Dual-Core Spiral Package-Embedded Inductors for Integrated Voltage Regulators	15
Analysis of Discharge Caused by Soldering Defect in Wire-Bonding Power Module	15
Signal Integrity Analysis of Through-Silicon Via (TSV) With a Silicon Dioxide Well to Reduce Leakage Current for High-Bandwidth Memory Interface	15
Differential-Fed Magneto-Electric Dipole Antenna With Integrated Balun Based on Ball Grid Array Packaging	15
Packaged Millimeter-Wave On-Chip Bandpass Filter Using SHMSIW and Microstrip Hybrid Structure in 0.25-μm GaAs pHEMT Technology	14
Miniaturized Metasurface-Inspired Tunable Power Divider and Phase Shifter	14
Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme	14
Optically Transparent Adhesives for Microwave Metamaterial Absorber With PET–PDMS Interface	14

IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	14
Compact Interdigital Bandpass Filter, Diplexer, and Triplexer Based on Through Quartz Vias (TQVs)	14
Third Quadrant Operation of SiC MOSFETs: Comprehensive Analysis and Condition Monitoring Solution	14
Warpage Analysis and Prediction of the Advanced Fan-Out Technology Based on Process Mechanics	14
Blank Page	14
The Impact of Bonding Wire Failure in Microelectronic Package on Near-Field Radiation	14
High-Dimensional Uncertainty Quantification via Tensor Regression With Rank Determination and Adaptive Sampling	13
Low-Profile UWB Millimeter-Wave Antenna Array Under Triple Resonant Modes Based on PCB Technology	13
Solder Joint Geometry Effects on Thermomechanical Fatigue Lifetime of End-Capped Chip Component Assemblies	13
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	13
Monolithically GaN-Based Optocoupler With Chip Scaling	13
A Wideband Transition From Coaxial Line to Substrate-Integrated Waveguide	13
High-Selectivity Bandpass Filter-Integrated SPDT Switch Using Switchable Dual-Mode Hybrid Resonators	13
On the Use of Acoustic Methods for the Detection of Electrostatic Capture of Diaphragm in Capacitive MEMS Microphones	13
Development of 3-D Wafer Level Packaging for SAW Filters Using Thin Glass Capping Technology	13
Ball Grid Array Package Intermittent Partial Connection Defect Analysis in DDR4 Data Channel	13
Modeling of Tunable Electronic Waveguide Devices in Graphene Using Conservative Higher Order Time Stepping	13
Corrections to “A Fully Integrated Arbitrary Power Divider on Printed Circuit Board by a Novel SMD-Resistor-Free Isolation Network”	13
The Impact of Substrate Vibrations on Self-Alignment Accuracy in BGA/Flip-Chip Assembly	13
Table of Contents	13
Embedded p-i-n-Diode Die Interconnections With Aerosol-Jet Printing	12
Double-Sided Copper Filling of Small Diameter, High-Aspect Ratio Through-Glass Vias in High-Density Glass Interposers	12
Influence of Copper Pad Dimension on Thermal Fatigue Life Performance of BGA Packages	12
Characterization of Alumina Ribbon Ceramic Substrates for 5G and mm-Wave Applications	12
Table of Contents	12
Emerging Trends in System-Integrated Wearable Epidermal and Flexible Electrodes: Material Design and Applications in Physiological Monitoring	12
A Dual-Band Mushroom EBG Structure With Inductive via Coupling for Wideband Parallel-Plate Mode Suppression	12
A method for detecting the initiation of solder joint delamination in a 3D PCB assembly of WBG SiC MOSFET	12
Prefabricated and Assembled Electromagnetic Shields Inside Electronic Packages to Reduce Near-Field Capacitive and Inductive Coupling	12
Wide-Stopband Diplexer With Small Frequency Ratio Based on SIW Dual-Mode Resonators for Millimeter-Wave Applications	12
A TSV-Based 3-D Electromagnetic Bandgap Structure on an Interposer for Noise Suppression	12
A Review of Recent Developments in Pumped Two-Phase Cooling Technologies for Electronic Devices	12
Front Cover	11
On the Use of an In-Package Dielectric Lens Antenna for Radar-Based Applications	11
Free-Form Filters Designed Using Binary Optimization Algorithm	11
A Miniaturized Balanced-to-Balanced Power Divider With Common-Mode Noise Absorption	11
Front Cover	11
Blank Page	11
Failure Mechanism and Reliability Research of Solder Layer Tilt in Double-Sided Cooling Power Modules	11
Improving Transfer Accuracy of LEDs Utilizing the Alignment Structure	11
Member Get-A-Member (MGM) Program	11
Material Property Variability of Composites in Thermo-Mechanical Studies Involving Virtual Design of Experiments	11
Front Cover	11
IEEE Open Access Publishing	11
Application of Ferroelectric Capacitors for Equalization of High-Speed Digital Signaling	11
Benchmarking and Demonstration of Low-Loss Fused-Silica Stitch-Chips With Compressible Microinterconnects for RF/mm-Wave Chiplet-Based Modules	11
In Memoriam - A Tribute: Prof. Avram Bar-Cohen	11
Bus-Aware IO Alignment Considering Length-Matching Constraints in 3-D IC Designs	11
Front Cover	11
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	11
Numerical and Experimental Analyses of Component Failure Risk in a Mobile Phone Under Drop Test	11
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	10
Preventing Corrosion-Related Failures in Electronic Assembly: A Multicase Study Analysis	10
Design of Three-State Dual-Band Diplexer Based on SCPW-MS With Broadside-Coupled Technique	10
A Machine Learning-Based Method for Tuning the Control Loop of Fully Integrated Voltage Regulators	10
Determination of Fatigue Model Constants for Bi-Based SAC305 Hybrid Solder Joint	10
Quad Port MIMO Al₂O₃ Ceramic-Based Integrated Reconfigurable Wideband Sensing and Communication Dielectric Antenna for 5G Cognitive Radio	10
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	10
Metrology of Silicon Wafers Through Synchrotron Section Topography and X-Ray Diffraction Imaging	10
Effect of Oxygen Content on Bonding Performance of Sintered Silver Joint on Bare Copper Substrate	10
Membrane-Based Two Phase Heat Sinks for High Heat Flux Electronics and Lasers	10
Ka-Band Substrate Integrated Waveguide Equalizer With Larger Equalization Value Based on Capacitive Loading Technology and Tiny Gap Effect	10
Structurally Integrated Radar in an Aerospace Composite Laminate	10
An Improved Inductance and Self-Resonance Frequency Modelling and Estimation of Single Turn On-chip Inductors for Millimeter-wave Applications	10
Moisture Diffusion Inside the BEOL of an FC-PBGA Package	10
Comparative Drop Shock Reliability Study of SAC-Based Alloys in BGA Assemblies	10
Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics	10
Flexible/Conformal Inkjet-Printed 3-D “Ramp” Interconnects for 5G/mmWave System-on-Package Designs and Wearable Applications	10
SiC Power Module Packaging Using Printed Electronics Materials and Processes	10
Member Get-a-Member (MGM) Program	9
Effects of Interconnect Shape and Thermal-Electro-Migration on Solder Creep of Copper-Pillar Flip Chip Joints	9
Contact Reconstruction and Contact Spot Analysis of Microscopic Contact Surfaces Based on Feature Matching	9
Member Get-a-Member (MGM) Program	9
YOLO Algorithm With Hybrid Attention Feature Pyramid Network for Solder Joint Defect Detection	9
Local Heat/Mass Transfer of Array Jet Impingement Cooling With Pin-Fin Heat Sinks	9
Rapid Design of Litz Wire Using Surrogate-Assisted Optimization Embedding Adjacent Trust Region	9
Table of Contents	9
Miniaturized Dual-/Tri-/Quad-Band Bandpass Filters Using Perturbed Multimode SIW Cavity	9
A Reflection Self-Canceling Design Technique for Multidrop Memory Interfaces	9
IEEE Open Access Publishing	9

Study on Wear Debris Distribution and Performance Degradation of Electrical Connector Under Step Random Vibration Stress	9
Air-Cooled Loop Thermosyphon Cooling System for High Heat Load CPUs—Part I: Design and Performance Simulation	9
Transient thermo-mechanical characteristic of segmented thermoelectric cooler for hot-spot thermal management	9
Study on Thermomigration-Induced Void Formation in Advanced Copper Interconnects	9
Thermal Modeling of a Chiplet-Based Packaging With a 2.5-D Through-Silicon Via Interposer	9
Artificial Intelligence-Driven Optimization for 3-D Integrated Circuit Manufacturing: A System of Systems Framework	9
Table of Contents	9
Tunable Ultra-Wideband (UWB) Liquid Metal Phase Shifter Based on SISL Platform	9
Aerosol-Jet Printed Transferable Millimeter-Wave Circuits	9
Blank Page	9
Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure With Thermal Transmission Line for High Bandwidth Memory Module	9
On the Generation of SPICE-Compatible Nonlinear Behavioral Macromodels	9
Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network	9
IEEE Components, Packaging, and Manufacturing Technology Society Information	9
Low Cost/Insertion Loss Substrate-Integrated Waveguide Equalizer Based on Absorbing Materials	8
State of the Art of Cu–Cu Hybrid Bonding	8
Experimental Analysis on Reliability of Needle Electrodes in Ionic Wind	8
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	8
IEEE Components, Packaging, and Manufacturing Technology Society information for authors	8
Comprehensive Influences of Manufacturing Process Integrated With Thermal Cycling Test Loading on Mechanical Responses of Power Module	8
A Broadband Antenna With Folded Structure and Packaged Solar Cell	8
High-Density Hybrid Substrate for Heterogeneous Integration	8
A Sensitive Data Labeling Strategy for Optimizing a Broadband Vertical Transition in W Band	8
Mixed-Mode Fiber Array Alignment and Coupling to Photonic Integrated Circuits	8
Co-Designed Silicon Photonics Chip I/O for Energy-Efficient Petascale Connectivity	8
Characterization of Microstrip Line and SIW on ABF in Glass Interposers for mmWave Applications	8
On-Chip Dual-Band Balanced Bandpass Filter Design with High Common-Mode Absorption Rate	8
High-Selectivity Bandpass Filters With Low Loss and Reduced Size Based on HCILA Slow Wave Technology Encapsulated in Patch Cavities	8
A Cavitied Cold Plate for Enhanced Thermal Uniformity and Cooling	8
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	8
PIDDN: Pair-Image-Based Defect Detection Network With Template for PCB Inspection	8
Origami-Driven Manufacturing of Reflectarrays or Transmitarrays With Feeds and Fixture	8
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	8
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	8
Numerical Analysis of Pool Boiling of Nanofluids for High Heat Dissipation Applications	8
FPCB Surface Defect Detection Using Multiscale Spectral-Spatial Features Fusion	8
Electronic Components Provenance Assurance Through AI and Big Data in Assembly Processes	8
Symmetrical Multilayer Dielectric Model of Thermal Stress and Strain of Silicon-Core Coaxial Through-Silicon Vias in 3-D Integrated Circuit	8
Low-Profile Wideband D-Band Absorber Utilizing Resistive Thin-Film Screen-Printing	8
The Influence of Mechanical Cyclic Bending Stress on the Reliability of the Emerging DDR5 Memories in the Industrial Market	8
On-Chip Single-/Dual-Notch-Band Half-Mode Substrate Integrated Plasmonic Waveguide Filters Based on Through Glass Via Technology	8
Ultrawideband Chip-to-Chip Interconnect Using Bond Wire With Sidewalls	8
Performance Analysis Using Air Gap Defected Through Silicon Via: Impact on Crosstalk and Power	8
Least Squares Polynomial Chaos Regression for Stochastic Analysis of Transmission Lines Without and With Noise	8
Theoretical and Simulation-Based Investigation of Heat Transfer and Thermal Runaway in Power MOSFET Devices	8
Segmentation Method for Modeling Heterogeneous Components to Suppress Broadband Simultaneous Switching Noise on a Multilayer Structure	8
CPU Overclocking: A Performance Assessment of Air, Cold Plates, and Two-Phase Immersion Cooling	8
Table of Contents	8
Design of Vertically Integrated Folded SISL Patch Bandpass Filters With Single and Multiband Responses	7
Out-of-Plane Optical Coupling to Photonic Integrated Circuits Using Turning-Mirror Lens Arrays	7
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	7
Metal-Assisted Chemical Etching Toward Scallop-Free-Sidewall Through-Silicon Vias: A Review	7
Sulfur Ingression on Encapsulated Leadframe of Discrete Semiconductor Package	7
Electrothermal Transient Co-Simulation With Domain Decomposition Method for 3-D Complex Integrated Systems	7
Characterization of Additively Manufactured Suspended Finite Ground CPW Interconnects Enhanced by Femtosecond Laser Micromachining	7
NOMA: A Novel Reliability Improvement Methodology for 3-D IC-based Neuromorphic Systems	7
Front Cover	7
2024 Index IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 14	7
Our Thanks to Reviewers IEEE Transactions on Components, Packaging, and Manufacturing Technology	7
Design of Manifolded 3-D μ-Coolers Enabling High Heat Flux Capillary-Driven Boiling Over Large Areas	7
Cu Sintering for Cu Pillar Bonding: A Comparative Study Among Pressure-Less, Pressure-Assisted, and Transient Liquid Phase Sinter Pastes	7
Enhancing Glass-to-Glass Bonding at Room Temperatures Using Laser Surface Modification With Ti/Cu/Ti/TiO₂ Thin Films	7
Spectral Bayesian Optimization Using a Physics-Informed Rational Szegö Kernel for Microwave Design	7
Achievement and Assessment of 6-in Wafer Bonding Based on a Novel Nanosilver Sintering Method	7
Enhanced Junction Temperature Prediction Model for CoWoS Packaging With Multiple Chiplets	7
MCB-DPO: Multiport Constrained Barrier Method-Based Decoupling Capacitor Placement Optimization on Irregularly Shaped Planes	7
A Slow Wave Folded Ridge HMSIW Using Spoof Surface Plasmon Polaritons Structure and Its Application in Coupler Design	7
Table of Contents	7
Impedance and Admittance Waveguide Inverter Applications: A Practical Sub-Terahertz Region Tolerance Analysis for Large-Scale Production	7
Front Cover	7
IEEE Open Access Publishing	7
Low-Cost Functional Testing Based on Data Imputation Integrating Fault Tree Analysis and XGBoost	7
Reliability of immersion coolant and PCB materials evaluated through accelerated thermal testing	7
3-D Stacking of SiC Integrated Circuit Chips With Gold Wire Bonded Interconnects for Long-Duration High-Temperature Applications	7
IEEE Open Access Publishing	7
Low-Profile Polymer Composite Radar Absorber Embedded With Frequency Selective Surface	7
Highly Manufacturable Packaging of an Implantable Episcleral Surface Stimulator With Reliability and Safety Validations	7
A mm-Wave 5G System Architecture With Enhanced-Gain Antenna Solution	7
Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz	7
3-D Packaging Technologies for Advanced Integrated Photonics Modules: A Review	7
Analysis and Optimization of HBM3 PPA for TSV Model With Micro-Bump and Hybrid Bonding	7
IEEE Components, Packaging, and Manufacturing Technology Society information for authors	7
Conservative Gaussian Process Models for Uncertainty Quantification and Bayesian Optimization in Signal Integrity Applications	7
Front Cover	7
Electromechanical Performance of Microprobe Test With Cuboid Magnetorheological Damper in Microelectronic Packaging	7
Advanced Chiplet Placement and Routing Optimization considering Signal Integrity	7
Design Guidelines for 2.5-D Packages Featuring Organic Interposer With Bridges Embedded	7
Front Cover	6
Table of Contents	6
Table of Contents	6
Using Particle Image Velocimetry to Visualize Jet Impingement Flow Mechanics on Modified Surfaces	6
Table of contents	6
Waveguide Integration and Packaging of a Multichannel Power Amplifier in a SiGe BiCMOS Technology for mm-Wave Applications	6
FEM Thermo-Fluid Dynamic Analysis of Advanced Metal Finned Liquid Cold Plates for High Power Semiconductor Devices and Modules	6
IEEE Components, Packaging, and Manufacturing Technology Society Information	6