IEEE Transactions on Components Packaging and Manufacturing Technology

Article	Citations
Recent Advances and Trends in Advanced Packaging	110
A Review of 5G Front-End Systems Package Integration	104
Demystifying Machine Learning for Signal and Power Integrity Problems in Packaging	48
Deep Reinforcement Learning-Based Optimal Decoupling Capacitor Design Method for Silicon Interposer-Based 2.5-D/3-D ICs	47
A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs)	41
Power Delivery for High-Performance Microprocessors—Challenges, Solutions, and Future Trends	39
Thermal TSV Optimization and Hierarchical Floorplanning for 3-D Integrated Circuits	36
Universal Chiplet Interconnect Express (UCIe): An Open Industry Standard for Innovations With Chiplets at Package Level	35
An Adaptive Machine Learning Method Based on Finite Element Analysis for Ultra Low-k Chip Package Design	32
Characterization of ABF/Glass/ABF Substrates for mmWave Applications	30
Solder Joint Recognition Using Mask R-CNN Method	30
Automatic Industry PCB Board DIP Process Defect Detection System Based on Deep Ensemble Self-Adaption Method	29
Electric Field Mitigation in High-Voltage High-Power IGBT Modules Using Nonlinear Conductivity Composites	28
Long Short-Term Memory Neural Networks for Modeling Nonlinear Electronic Components	27
Low Insertion-Loss MMIC Bandpass Filter Using Lumped-Distributed Parameters for 5G Millimeter-Wave Application	27
Electrical and Reliability Investigation of Cu-to-Cu Bonding With Silver Passivation Layer in 3-D Integration	26
Silicon-Interconnect Fabric for Fine-Pitch (≤10 μm) Heterogeneous Integration	25
The ICECool Fundamentals Effort on Evaporative Cooling of Microelectronics	25
Wafer-to-Wafer Hybrid Bonding Development by Advanced Finite Element Modeling for 3-D IC Packages	25
Numerical Simulation and Analytical Modeling of the Thermal Behavior of Single- and Double-Sided Cooled Power Modules	24
Modular Integration of a Passive RFID Sensor With Wearable Textile Antennas for Patient Monitoring	23
Fatigue Behavior of SAC-Bi and SAC305 Solder Joints With Aging	22
Influence of Operation Numbers on Arc Erosion of Ag/CdO Electrical Contact Materials	22
Diamond-Incorporated Flip-Chip Integration for Thermal Management of GaN and Ultra-Wide Bandgap RF Power Amplifiers	22
Low-Cost Energy-Efficient On-Chip Hotspot Targeted Microjet Cooling for High- Power Electronics	21

Viscoelastic Warpage Modeling of Fan-Out Wafer-Level Packaging During Wafer-Level Mold Cure Process	20
Performance Analysis and Shape Optimization of an Impingement Microchannel Cold Plate	20
An Improved Cauer Model of IGBT Module: Inclusive Void Fraction in Solder Layer	19
CPU Overclocking: A Performance Assessment of Air, Cold Plates, and Two-Phase Immersion Cooling	19
Panel-Level Fan-Out RDL-First Packaging for Heterogeneous Integration	19
Optically Transparent Protective Coating for ITO-Coated PET-Based Microwave Metamaterial Absorbers	19
Low-Loss Gap Waveguide Transmission Line and Transitions at 220–320 GHz Using Dry Film Micromachining	18
Optimization of Converging and Diverging Microchannel Heat Sink for Electronic Chip Cooling	18
Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV-Less Interposers	17
Additively Manufactured Dual-Mode Reconfigurable Filter Employing VO₂-Based Switches	17
Hybrid Substrate by Fan-Out RDL-First Panel-Level Packaging	17
Comparative Study of Surrogate Modeling Methods for Signal Integrity and Microwave Circuit Applications	17
A Contactless PCBA Defect Detection Method: Convolutional Neural Networks With Thermographic Images	16
Ultralow-Loss Substrate-Integrated Waveguides in Glass-Based Substrates for Millimeter-Wave Applications	16
An Analysis of Solder Joint Formation and Self-Alignment of Chip Capacitors	16
A Review of Recent Developments in Pumped Two-Phase Cooling Technologies for Electronic Devices	16
Thickness Dependence and Anisotropy of Capped Diamond Thermal Conductivity on Cooling of Pulse-Operated GaN HEMTs	16
Residue-Assisted Water Layer Build-Up Under Transient Climatic Conditions and Failure Occurrences in Electronics	16
Effects of Surface Finish on the Shear Fatigue of SAC-Based Solder Alloys	16
Materials and Interface Challenges in High-Vapor-Quality Two-Phase Flow Boiling Research	16
Package-Integrated, Wideband Power Dividing Networks and Antenna Arrays for 28-GHz 5G New Radio Bands	16
Electromigration Reliability of Advanced High-Density Fan-Out Packaging With Fine-Pitch 2-/2-μm L/S Cu Redistribution Lines	16
Iterative Machine Learning-Aided Framework Bridges Between Fatigue and Creep Damages in Solder Interconnections	16
3-D-Printing and High-Precision Milling of W-Band Filter Components With Admittance Inverter Sequences	16
Evaluation of Launderability of Electrically Conductive Fabrics for E-Textile Applications	15
A Novel Approach to Control of Piezo-Transducer in Microelectronics Packaging: PSO-PID and Editing Trajectory Optimization	15
Electrical Performance Degradation Model and Residual Electrical Life Prediction for AC Contactor	15
Investigation of Low-Temperature Cu–Cu Direct Bonding With Pt Passivation Layer in 3-D Integration	15
Thermal Design, Optimization, and Packaging of Planar Magnetic Components	15
Crosstalk Noise Suppression Between Single and Differential Transmission Lines Using Spoof Surface Plasmon Polaritons	15
A Comprehensive Review of the Finite Element Modeling of Electrical Connectors Including Their Contacts	15
Thermal Management of Electronic Devices Using Gold and Carbon Nanofluids in a Lid-Driven Square Cavity Under the Effect of Variety of Magnetic Fields	14
FE Simulation Model for Warpage Evaluation of Glass Interposer Substrate Packages	14
Thermal Management System for Press-Pack IGBT Based on Liquid Metal Coolant	14
Comparison of Mechanical Modeling to Warpage Estimation of RDL-First Fan-Out Panel-Level Packaging	14
A Novel High-Isolation Resistor-Less Millimeter-Wave Power Divider Based on Metamaterial Structures for 5G Applications	13
Low-Temperature (260 °C) Solderless Cu–Cu Bonding for Fine-Pitch 3-D Packaging and Heterogeneous Integration	13
A Variational Autoencoder Enhanced Deep Learning Model for Wafer Defect Imbalanced Classification	13
Thermal–Mechanical Performance Analysis and Structure Optimization of the TSV in 3-D IC	13
Development of 3-D Wafer Level Packaging for SAW Filters Using Thin Glass Capping Technology	13
Luffa/Epoxy Composites: Electrical Properties for PCB Application	12
Experimental Investigation on the Sintering Kinetics of Nanosilver Particles Used in High-Power Electronic Packaging	12
Development and Characterization of Novel Composite and Flexible Electrode Based on Titanium Dioxide	12
Thermal Optimization of High-Temperature Downhole Electronic Devices	12
Electrical Circuit Modeling and Validation of Through-Silicon Vias Embedded in a Silicon Microfluidic Pin-Fin Heat Sink Filled With Deionized Water	12
Anomaly Detection for Solder Joints Using β-VAE	12
Modeling of the RF Coaxial TSV Configuration Inside the Silicon Interposer With Embedded Cooling Cavity	12
Accelerated Degradation Test Investigation for Life-Time Performance Analysis of LED Luminaires	12
3-D Printing Structural Electronics With Conductive Filaments	12
Analysis of Parameter Variability in an Integrated Wireless Power Transfer System via Partial Least-Squares Regression	12

Analysis and Optimization of Electrolytic Capacitor Technology for High-Frequency Integrated Inverter	12
Noncontact Reflow Oven Thermal Profile Prediction Based on Artificial Neural Network	12
Study of Warpage Evolution and Control for Six-Side Molded WLCSP in Different Packaging Processes	12
Failure Analysis and Modeling of Solder Joints in BGA Packaged Electronic Chips	12
Mechanical and Electrical Behavior of Printed Silver Conductor in Adaptive Curvature Flexure Test	12
A Method of Defect Detection for Focal Hard Samples PCB Based on Extended FPN Model	12
Smarter Temperature Setup for Reflow Oven to Minimize Temperature Variation Among Components	12
A Physical Thermal Network Model of Press Pack IGBTs Considering Spreading and Coupling Effects	12
Comprehensive Analysis of a Cu Nitride Passivated Surface That Enhances Cu-to-Cu Bonding	12
Thermal Management Modeling for β-Ga2O3-Highly Thermal Conductive Substrates Heterostructures	11
Fully Integrated Wireless Elastic Wearable Systems for Health Monitoring Applications	11
Thermal Management of β-Ga₂O₃ Current Aperture Vertical Electron Transistors	11
High-Dimensional Uncertainty Quantification via Tensor Regression With Rank Determination and Adaptive Sampling	11
Reliability Study of Polymers Used in Sub-4-μm Pitch RDL Applications	11
Materials and Devices for On-Chip and Off-Chip Peltier Cooling: A Review	11
Fatigue Life Degradation Modeling of SnAgCu Solder Joints After Aging	11
High-Temperature Thermal Conductivity and Thermal Cycling Behavior of Cu–B/Diamond Composites	11
Low-Loss Impedance-Matched Sub-25-μm Vias in 3-D Millimeter-Wave Packages	11
Additive Manufacture of Custom Radiofrequency Connectors	11
Synthetic Jet Cooling Technology for Electronics Thermal Management—A Critical Review	11
Signal Integrity Design and Analysis of 3-D X-Point Memory Considering Crosstalk and IR Drop for Higher Performance Computing	11
A Comparative Study of Energy Savings in a Liquid-Cooled Server by Dynamic Control of Coolant Flow Rate at Server Level	11
Characteristics of Intermittent Fault in Electrical Connectors Under Vibration Environment	11
DC IR-Drop Analysis of Multilayered Power Distribution Network by Discontinuous Galerkin Method With Thermal Effects Incorporated	10
Modeling and Characterization of Differential Multibit Carbon-Nanotube Through-Silicon Vias	10
Q-Thermal: A Q-Learning-Based Thermal-Aware Routing Algorithm for 3-D Network On-Chips	10
Evaluation of Additive Manufacturing Techniques Applied to a Waveguide Mode Transducer	10
Thermal and Mechanical Analyses of Clamping Area on the Performance of Press-Pack IGBT in Series-Connection Stack Application	10
A Finite Element Analysis on the Reliability of Heavy Bonding Wire for High-Power IGBT Module	10
Smaller Microvias for Packaging Interconnects by Picosecond UV Laser With a Nanometer Metal Barrier Layer: A Feasibility Study	10
Laminated Glass-Based, Compact Inline Stepped-Impedance Resonator Bandpass Filters for 5G New Radio Modules	10
Single-Phase Microfluidic Cooling of 2.5D-SICs for Heterogeneous Integration	10
A Predictive Abnormality Detection Model Using Ensemble Learning in Stencil Printing Process	10
Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme	10
Uniformly Stable Parameterized Macromodeling Through Positive Definite Basis Functions	10
Substrate Integrated Waveguide Filters in Glass Interposer for mmWave Applications	10
Fast and Stable Time-Domain Simulation Based on Modified Numerical Inversion of the Laplace Transform	10
Plasma Treatment and Copper Metallization for Reliable Plated-Through-Holes in Microwave PCBs for Space Electronic Packaging	10
Compact Fractional-Order Model of On-Chip Inductors With BCB on High Resistivity Silicon	9
A Review of Methods for the Reliability Testing of Flexible Hybrid Electronics	9
Near-Field Scanning Based Shielding Effectiveness Analysis of System in Package	9
Experimental Study of Electrical Contact Nonlinearity and its Passive Intermodulation Effect	9
Design of Sustainable PV Module for Efficient Power Generation During Faults	9
Solder Joint Defect Inspection Method Based on ConvNeXt-YOLOX	9
The Impact of Connection Failure of Bonding Wire on Signal Transmission in Radio Frequency Circuits	9
Impact of Pressure Drop Oscillations on Surface Temperature and Critical Heat Flux During Flow Boiling in a Microchannel	9
Modeling of Signal Distortion Caused by Passive Intermodulation and Cross Modulation in Coaxial Connectors	9
Warpage Analysis and Prediction of the Advanced Fan-Out Technology Based on Process Mechanics	9
Shape Memory Alloy-Based Frequency Reconfigurable Ultrawideband Antenna for Cognitive Radio Systems	9
Mechanical and High-Frequency Electrical Study of Printed, Flexible Antenna Under Deformation	9
High-Density Hybrid Substrate for Heterogeneous Integration	9
Self-Evolution Cascade Deep Learning Model for High-Speed Receiver Adaptation	9
Millimeter-Wave Dielectric Slab-Based Chip-to-Chip Interconnect Network Allowing for Relaxed Assembly Tolerances	9
Mode-Selective Transmission Line—Part I: Theoretical Foundation and Physical Mechanism	9
GVF: GPU-Based Vector Fitting for Modeling of Multiport Tabulated Data Networks	9
Experimental and Numerical Study of 3-D Printed Direct Jet Impingement Cooling for High-Power, Large Die Size Applications	9
Effects of Filler Configuration and Moisture on Dissipation Factor and Critical Electric Field of Epoxy Composites for HV-ICs Encapsulation	9
Effect of Boron Nitride Nanosheets on Properties of a Commercial Epoxy Molding Compound Used in Fan-Out Wafer-Level Packaging	8
Monolithic 3-D Printing of an Integrated Marchand Balun With a Dipole Antenna	8
Wideband Low-Profile Dual-Polarized Antenna Based on a Gain-Enhanced EBG Reflector	8
Some Investigations on Direct Substrate-Attachment Process for Wideband Instantaneous Frequency Measurement Receiver Development	8
A Transfer Learning LSTM Network-Based Severity Evaluation for Intermittent Faults of an Electrical Connector	8
Design of 3-D Integrated SIW Multiband Bandpass Filter With Split-Type Extended Doublet Topology	8
Application of Steinberg Model for Vibration Lifetime Evaluation of Sn-Ag-Cu-Based Solder Joints in Power Semiconductors	8
Optical Beam-Based Defect Localization Methodologies for Open and Short Failures in Micrometer-Scale 3-D TSV Interconnects	8
An Estimate of Heat Generation, Electric, and Magnetic Parameters From Temperature Fields in Porous Fins for Electronic Cooling Systems	8
Development and Reliability Study of 3-D Wafer Level Packaging for SAW Filter Using Thin Film Capping	8
A CNN-Based CMP Planarization Model Considering LDE Effect	8
A New Theoretical Model to Study the Closing Bounce Characteristics of the Electromagnetic Relay Under Capacitive Loads	8
Improving the Energy-Conversion Efficiency of a PV–TE System With an Intelligent Power-Track Switching Technique and Efficient Thermal-Management Scheme	8
Additive Manufacturing of Hetero-Magnetic Coupled Inductors	8
Cu–Cu Bonding Using Selective Cobalt Atomic Layer Deposition for 2.5-D/3-D Chip Integration Technologies	8
Microstructural Characterization and Unified Reliability Assessment of Aged Solder Joints in a PV Module	8
Mode-Selective Transmission Line—Part II: Excitation Scheme and Experimental Verification	8
Fan-Out Panel-Level Packaging of Mini-LED RGB Display	8
A Signaling Figure of Merit (s-FoM) for Advanced Packaging	8
A Hybrid CN-FDTD-SPICE Solver for Field-Circuit Analyses in Low-Frequency Wideband Problems	8
Comparative Reliability of Inkjet-Printed Electronics Packaging	8
3-D Printed Microjet Impingement Cooling for Thermal Management of Ultrahigh-Power GaN Transistors	8
Analysis of Thermal Performance Metrics—Application to CPU Cooling in HPC Servers	8

Cyclic Bending Effects on Resistance of Screen-Printed Silver Conductors	8
High-Reliability Wireless Packaging for High-Temperature SiC Power Device Sintered by Novel Organic-Free Nanomaterial	8
Characterization of Alumina Ribbon Ceramic Substrates for 5G and mm-Wave Applications	7
Thermal Lifetime Calculation of Capacitor Insulation Using the Activation Energy Method	7
Effect of Solder Paste Volume and Reflow Parameters on Solder Paste Wicking and Joint Shear Strength of Ni–Au-Coated Cu Spheres	7
Additive Manufacturing of Interdigital Filters With Arbitrary Line Cross Section	7
Ultrasonic Bonding of Ag and Ag-Alloy Ribbon—An Innovative Alternative for High Power IC Packages	7
Experimental Characterization of Additively Manufactured Metallic Heat Exchangers	7
Laser Ablation Cutting-Based Metal Patterning Technique Enabling 3D-Printed Broadband Antennas for Sub-6 GHz Wireless Communications Applications	7
A 5-Gb/s Adaptive Continuous Time Linear Equalizer Using Ferroelectric Capacitor	7
Modeling and Analysis of Signal Integrity of Ball Grid Array Packages With Failed Ground Solder Balls	7
Micropackaged Compact Switchable Filters With High Isolation in 3-D TSV-MEMS Process	7
Technological Investigation of Metal 3-D Printed Microwave Cavity Filters Based on Different Topologies and Materials	7
Practical Aspects and Limitations of Hermeticity Testing of Microencapsulations Using Cumulative Helium Leak Detection for Miniaturized Implantable Medical Devices	7
Effects of Environmental Temperature on Passive Intermodulation in Electrical Connectors	7
Thermal Aging Reliability of Socketable BGA Packages With Ni–Au-Coated SAC305 Spheres	7
Vacuum Reflow Process Optimization for Solder Void Size Reduction in Semiconductor Packaging Assembly	7
A Temperature and Dielectric Roughness-Aware Matrix Rational Approximation Model for the Reliability Assessment of Copper– Graphene Hybrid On-Chip Interconnects	7
Preparation and Characterization of a Thermal Insulating Carbon Xerogel-Epoxy Composite Adhesive for Electronics Applications	7
Experimental Analysis of the Condenser Design in a Thermosiphon System for Cooling of Telecommunication Electronics	7
Study on the Separation Packaging Structure of Quantum Dot–Phosphor Hybrid White Light-Emitting Diodes for Backlight Display	7
Thermo-Mechanical Analysis of Blister Formation on a Rigid Substrate in Blister-Actuated Laser-Induced Forward Transfer	7
Assembly Process and Electrical Properties of Top-Transferred Graphene on Carbon Nanotubes for Carbon-Based 3-D Interconnects	7
A Low-Loss Fan-Out Wafer-Level Package With a Novel Redistribution Layer Pattern and Its Measurement Methodology for Millimeter-Wave Application	7
Influence of Humidity on the Power Cycling Lifetime of SiC MOSFETs	7
Thermal Sensation Modeling and Experiments for Liquid-Cooled Garments	7
Thermal and Mechanical Characterization of 2.5-D and Fan-Out Chip on Substrate Chip-First and Chip-Last Packages	7
Toward Fully Automated High-Dimensional Parameterized Macromodeling	7
Design Flow for Active Interposer-Based 2.5-D ICs and Study of RISC-V Architecture With Secure NoC	7
Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV Interposers	7
Performance Analysis Using Air Gap Defected Through Silicon Via: Impact on Crosstalk and Power	7
Modeling of Intergranular Mechanical Fatigue of a Sintered Nanosilver Die Attachment for Power Electronics	7
Varactor–Graphene-Based Bandpass Filter With Independently Tunable Characteristics of Frequency and Amplitude	7
On the Junction Temperature Extraction Approach With a Hybrid Model of Voltage-Rise Time and Voltage-Rise Loss	7
Impact of Microstructure Evolution on the Long-Term Reliability of Wafer-Level Chip-Scale Package Sn–Ag–Cu Solder Interconnects	7
Effect of Ag Sintered Bondline Thickness on High-Temperature Reliability of SiC Power Devices	7
A Study on the Dynamic Bending Property of Chip-on-Flex Assembly Using Anchoring Polymer Layer Anisotropic Conductive Films	7
A Low-Cost Substrate Integrated Suspended Line Platform With Multiple Inner Boards and Its Applications in Coupled-Line Circuits	7
Planar Feeding Techniques for Wearable Textile Antennas	7
Flexible Chip-First Millimeter-Wave Packaging Using Multiple Dielectrics	6
A Fully Integrated Arbitrary Power Divider on Printed Circuit Board by a Novel SMD-Resistor-Free Isolation Network	6
Electrothermal Design of SIW Slot Antenna Array With Fin-Shaped Heatsink Enclosed	6
Design and Development of Single-Qubit Ion Trap on Glass and Si Substrates With RF Analysis and Performance Benchmarking	6
Air-Cooled Loop Thermosyphon Cooling System for High Heat Load CPUs—Part II: Experimental Results and Validation	6
DC IR-Drop Analysis of Power Distribution Networks by a Robin Transmission Condition-Enhanced Discontinuous Galerkin Method	6
Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) for a 122-GHz Radar Chip	6
Average Power Handling Capability of Microstrip Lines Considering Heat Convection and Self-Heating Effects With Temperature-Dependent Resistivity	6
Evaluation of 3-D Printed Monolithic G-Band Waveguide Components	6
Glass-Based Bandpass Filters for New Radio (NR) K-/Ka-Band Communications	6
Galerkin’s Projection Framework for BCI CTMs—Part I: Extended FANTASTIC Approach	6
Optically Transparent Adhesives for Microwave Metamaterial Absorber With PET–PDMS Interface	6
Mean-Time-To-Failure Equations for Electromigration, Thermomigration, and Stress Migration	6
A Wettability-Mediated Microdroplet Under Electrowetting Effect for Hotspot Cooling	6
Laguerre–Volterra Feed-Forward Neural Network for Modeling PAM-4 High-Speed Links	6
Humidity Control in Electronic Devices: Water Sorption Properties of Desiccants and Related Humidity Build-Up in Enclosures	6
Large-Area Bonding by Sintering of a Resin-Free Nanosilver Paste at Ultralow Temperature of 180 °C	6
An UHF Reconfigurable Liquid-Metal Monopole Antenna Based on a 2-D Surface	6
Thermal Modeling of a Chiplet-Based Packaging With a 2.5-D Through-Silicon Via Interposer	6
Monolithic Microfluidic Cooling of a Heterogeneous 2.5-D FPGA With Low-Profile 3-D Printed Manifolds	6
Contacting Inkjet-Printed Silver Structures and SMD by ICA and Solder	6
Reflow Recipe Establishment Based on CFD-Informed Machine Learning Model	6
Investigation on the Reliability of Die-Attach Structures for Double-Sided Cooling Power Module	6
Panel-Level Chip-Scale Package With Multiple Diced Wafers	6
Large-Area Substrate Bonding With Single-Printing Silver Paste Sintering for Power Modules	6
Thermo-Mechanical Characteristics and Reliability of Die-Attach Through Self-Propagating Exothermic Reaction Bonding	6
An FR4-Based Self-Packaged Full Ka-Band Low-Loss 1:4 Power Divider Using SISL to Air-Filled SIW T-Junction	6
Intermetallic Compounds at the Interfaces of Ag–Pd Alloy Stud Bumps With Al Pads	6
Cascaded Multicore Vapor Chambers for Intrapackage Spreading of High-Power, Heterogeneous Heat Loads	6
A Novel Intermetallic Compound Insertion Bonding to Improve Throughput for Sequential 3-D Stacking	6
Evaluation of Stochastic and Periodic Cellular Materials for Combined Heat Dissipation and Noise Reduction: Experiments and Modeling	6
Thin Film Metallization Stacks Serve as Reliable Conductors on Ceramic-Based Substrates for Active Implants	6
Phase-Field Study of Thermomigration in 3-D IC Micro Interconnects	6
Structurally Integrated Radar in an Aerospace Composite Laminate	6
Back-Side Release of Slot Waveguides for the Integration of Functional Materials in a Silicon Photonic Technology With a Full BEOL	6
High-Density Electrical and Optical Assembly for Subminiature VCSEL-Based Optical Engine	6
Signal Integrity Modeling and Analysis of Large-Scale Memristor Crossbar Array in a High-Speed Neuromorphic System for Deep Neural Network	6
Research on Flip-Chip Bonding Process and Thermal Cycle Reliability Simulation of 3-D Stacked Structure	6
Intermittent Fault Modeling and RUL Prediction for Degraded Electrical Connectors in Vibration Environments	6
Influence of Lateral Temperature Gradients on the Failure Modes at Power Cycling	6
Multimaterial Aerosol Jet Printed Magnetic Nanocomposites for Microwave Circuits	6
Comparisons of the Thermal Stability of Poly(3,4-Ethylenedioxythiophene) (PEDOT) and ITO on Flexible Substrates	5
MEMS Chip With Amplifier for 4-W Power Combining up to 100 GHz	5
Experimental and Numerical Investigations of the Warpage of Fan-Out Wafer-Level Packaging With SAW Filters	5
Sensitivity Analysis for Geometrical Parameters of BGA in Flip-Chip Packaging Under Random Shear Stress and Thermal Temperature	5
RF Performance Benchmarking of TSV Integrated Surface Electrode Ion Trap for Quantum Computing	5
D-Band Waveguide Diplexer Fabricated Using Micro Laser Sintering	5
Open Defect Detection Not Utilizing Boundary Scan Flip-Flops in Assembled Circuit Boards	5
SLA-Printed K-Band Waveguide Components Using Tollens Reaction Silver Plating	5
77/79-GHz Forward-Wave Directional Coupler Component Based on Microstrip and SIW for FMCW Radar Application	5
An Optimized Ag–5Pd–3.5Au Bonding Wire for the Resistance of Ag Ion Migration in LED Packages	5
The Influence and Application of Bond Wires Failure on Electrothermal Characteristics of IGBT Module	5
Holistic Chiplet–Package Co-Optimization for Agile Custom 2.5-D Design	5
The Impact of Variation in Filling Ratios, Evacuation Pressure, and Heat Input on Thermal Performance of Pulsating Heat Pipe	5
Reinforcement-Learning-Based Signal Integrity Optimization and Analysis of a Scalable 3-D X-Point Array Structure	5
Multichannel Parallel Testing of Intermittent Faults and Reliability Assessment for Electronic Equipment	5