Nature Electronics

Papers
(The TQCC of Nature Electronics is 32. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-12-01 to 2025-12-01.)
ArticleCitations
New visions for touchless interfaces654
A conformal array for understanding plants625
Wafer-scale transfer of tungsten disulfide474
Nanosheet FETs with low leakage463
Gigahertz heterojunction bipolar transistors on CMOS412
Author Correction: An asynchronous wireless network for capturing event-driven data from large populations of autonomous sensors398
Omnidirectional printing of stretchable electronics345
An update for brain–computer interfaces306
A flexible skin-mounted haptic interface for multimodal cutaneous feedback297
A unified realization of electrical quantities from the quantum International System of Units294
An implantable CMOS deep-brain fluorescence imager with single-neuron resolution277
Integrated two-dimensional microwave transmitters fabricated on the wafer scale277
Time-resolved detection of spin–orbit torque switching of magnetization and exchange bias273
A vacuum-deposited polymer dielectric for wafer-scale stretchable electronics272
The next generation of gate-all-around transistors263
High-performance inorganic metal halide perovskite transistors257
Imperfection-enabled memristive switching in van der Waals materials246
Bridging spinal cord injuries wirelessly245
A Josephson diode that works at zero field244
Photodiodes promote electrochemical synthesis242
A single-transducer echomyography system for monitoring muscle activity235
Transistor qubits heat up231
Memristive circuits based on multilayer hexagonal boron nitride for millimetre-wave radiofrequency applications219
Indium selenide wafers for 2D electronics217
A printed gallium oxide dielectric for 2D transistors210
A programmable metasurface antenna that approaches the wireless information mapping limit206
The case for silicon again203
The future of semiconductor technology shapes up197
Large spin–orbit torque in bismuthate-based heterostructures196
Neuromorphic scaling advantages for energy-efficient random walk computations187
Residue-free wafer-scale direct imprinting of two-dimensional materials185
A wearable in-sensor computing platform based on stretchable organic electrochemical transistors179
Monolithic and heterogeneous three-dimensional integration of two-dimensional materials with high-density vias179
A CMOS-integrated spintronic compute-in-memory macro for secure AI edge devices177
Twin physically unclonable functions based on aligned carbon nanotube arrays174
Laser-induced wet stability and adhesion of pure conducting polymer hydrogels165
In-sensor dynamic computing for intelligent machine vision161
Critical challenges in the development of electronics based on two-dimensional transition metal dichalcogenides161
Biomimetic olfactory chips based on large-scale monolithically integrated nanotube sensor arrays160
Noise reveals single defects in boron nitride160
Controlling qubits with cryogenic devices158
Reservoir computing with 2D materials156
Stacked single-crystalline field-effect transistors154
Reconfigurable logic-in-memory153
One-shot learning goes 3D153
Tailoring heat flow in 2D materials152
Monolithic 3D stacking for neural network acceleration152
Searching for MXenes149
Improved organic electrochemical transistor stability using solvent degassing and chemical doping149
A multifunctional display based on photo-responsive perovskite light-emitting diodes145
Scaling up superconducting quantum computers143
Stable and reliable bio-interfacing electrodes based on conductive hydrogels130
Micro light-emitting diodes129
Sideband-free space–time-coding metasurface antennas128
High-efficiency cooling via the monolithic integration of copper on electronic devices123
Hydrogen technology is unlikely to play a major role in sustainable road transport122
A spiking artificial neuron based on one diffusive memristor, one transistor and one resistor122
A self-healing electrically conductive organogel composite122
A wafer-scale van der Waals dielectric made from an inorganic molecular crystal film121
Direct bonding of gold on flexible substrates121
Reconfigurable logic-in-memory architectures based on a two-dimensional van der Waals heterostructure device118
Electrically tunable magnetic fluctuations in multilayered vanadium-doped tungsten diselenide118
Building in three dimensions116
Pixels that can focus115
A subdural chip with 65,000 channels115
MicroLEDs get in line113
Unexpected large spin currents in the normal state of an oxide superconductor113
System-level integration of 2D electronics112
An ultrathin organic–inorganic integrated device for optical biomarker monitoring112
Integrating 2D materials and metal electrodes110
The success and failure of quantum computing start-ups109
Towards zero-power 6G communication switches using atomic sheets109
AI chips that flip109
Rapid cryogenic characterization of 1,024 integrated silicon quantum dot devices108
Low-loss electronics with superconducting diodes108
Building resilience in high-tech supply chains107
Bilayer tungsten diselenide transistors with on-state currents exceeding 1.5 milliamperes per micrometre106
Adhesive bioelectronics for sutureless epicardial interfacing105
Van der Waals integration of high-κ perovskite oxides and two-dimensional semiconductors105
Three-dimensional flexible electronics using solidified liquid metal with regulated plasticity104
An anomalous Hall effect in altermagnetic ruthenium dioxide103
The future of electric vehicle charging infrastructure103
An n-doped capacitive transparent conductor for all-polymer electrochromic displays103
An inference chip in one101
Sensors that aren’t too bright101
Accelerating deep learning with precision98
Transistors pile up94
Ultrasound on the go92
Memristors level up92
Electrical control of quantum acoustics91
A probe that measures more neurons across the brain90
Scientific challenges in governing military AI90
Getting two-dimensional materials ready for industrial manufacturing89
Materials and devices as solutions to computational problems in machine learning86
Massively parallel probabilistic computing with sparse Ising machines84
A biocompatible elastomeric organic transistor for implantable electronics83
An integrated magneto-optic modulator for cryogenic applications83
Perovskite devices power up82
Scaling quantum computers with electronic–photonic chips82
Heterostructures make light work of photodetection81
Field-free and unconventional switching of perpendicular magnetization at room temperature81
Hybrid memory to empower edge AI81
Laser-assisted direct three-dimensional printing of free-standing thermoset devices79
Emerging reporting standards79
A self-controlled reconfigurable intelligent surface inspired by optical holography79
Perovskite potential78
Thin-film transistors for large-area electronics78
Blue light-emitting diodes based on quasi-two-dimensional perovskite with efficient charge injection and optimized phase distribution via an alkali metal salt77
Author Correction: Biomimetic olfactory chips based on large-scale monolithically integrated nanotube sensor arrays77
Powering from behind77
Making spectrometers that fit on a chip77
Low-light imaging with SPAD pixels77
Lasers on 300-mm silicon wafers76
Publisher Correction: An integrated CMOS–silicon photonics transmitter with a 112 gigabaud transmission and picojoule per bit energy efficiency76
Scaling up stretchable electronics74
Glass microfibres guide acoustic waves in textiles74
A clean van der Waals interface between the high-k dielectric zirconium oxide and two-dimensional molybdenum disulfide73
A thin hydrogel that won’t dry out72
Sub-millimetre light detection and ranging using perovskites72
Optogenetic stimulation probes with single-neuron resolution based on organic LEDs monolithically integrated on CMOS72
Thin-film image sensors with a pinned photodiode structure70
A bioinspired adaptive acoustic sensor with integrated signal processing70
Extreme-ultraviolet lithography packs more transistors on chip68
Stacked two-dimensional semiconductors from a direct bonding–debonding process67
Wirelessly powered large-area electronics for the Internet of Things67
Out-of-equilibrium phonons in gated superconducting switches66
Integrated acoustic resonators in commercial fin field-effect transistor technology65
A programmable and self-adaptive ultrasonic wireless implant for personalized chronic pain management64
A platform for quantum computing64
Colorimetric fliers for remote sensing63
The potential of superconducting electronics63
A self-filtering liquid acoustic sensor for voice recognition63
Low-resistance metal contacts to encapsulated semiconductor monolayers with long transfer length63
Brain organoid reservoir computing for artificial intelligence61
A memristor-based analogue reservoir computing system for real-time and power-efficient signal processing61
Micro-thermoelectric devices60
Physical reservoir computing with emerging electronics60
Nanofluidic logic with mechano–ionic memristive switches60
Stretchable graphene–hydrogel interfaces for wearable and implantable bioelectronics59
An electronic skin that learns to feel pain59
How to report and benchmark emerging field-effect transistors58
Reconfigurable assembly of self-healing stretchable transistors and circuits for integrated systems58
A honeycomb that’s as busy as its bees54
Power from below53
A phased-array transceiver in 65 nm CMOS for 6G52
A spotlight on optoelectronics52
A complementary oxide semiconductor52
Electronics devices that can be crumpled and stored in capsules52
Free-standing perovskites for micro-LEDs52
Accelerated intestinal wound healing via dual electrostimulation from a soft and biodegradable electronic bandage51
Microcomb-synchronized optoelectronics51
A terahertz nonlinear diode chain based on an asymmetric double-layer topology51
A seamless graphene spin valve based on proximity to van der Waals magnet Cr2Ge2Te651
Reply to: Safe practices for mobility evaluation in field-effect transistors and Hall effect measurements using emerging materials50
Improving carrier mobility in two-dimensional semiconductors with rippled materials49
High-density logic-in-memory devices using vertical indium arsenide nanowires on silicon49
Device-scale atomistic modelling of phase-change memory materials49
A cryo-CMOS chip that integrates silicon quantum dots and multiplexed dispersive readout electronics48
Spin injection in graphene using ferromagnetic van der Waals contacts of indium and cobalt48
Two-dimensional-materials-based transistors using hexagonal boron nitride dielectrics and metal gate electrodes with high cohesive energy47
Inorganic molecular crystals for 2D electronics47
Sub-terahertz electromechanics47
The development of carbon-neutral data centres in space46
Gigahertz topological valley Hall effect in nanoelectromechanical phononic crystals46
A reconfigurable transistor and memory based on a two-dimensional heterostructure and photoinduced trapping45
A hole spin qubit in a fin field-effect transistor above 4 kelvin45
High-performance p-type field-effect transistors using substitutional doping and thickness control of two-dimensional materials45
Monolithically integrated high-density vertical organic electrochemical transistor arrays and complementary circuits45
Chips with a pulse44
Graphene on edge43
Lowering the barrier to organic tunnel transistors43
A reliable 64 Gb magnetic random-access memory43
A quantum standard of resistance without a magnetic field43
STT-MRAM that works at high temperatures43
Building inverters with stacked complementary nanosheet transistors42
Wood-based electronics that fold42
Build it up41
Probabilistic computers based on digital logic and magnetic nanodevices41
Design–technology co-optimization for 2D electronics41
Channel and contact length scaling of two-dimensional transistors using composite metal electrodes40
A memristor-based Bayesian machine40
Energy-efficient computing at cryogenic temperatures40
Fast-response electroluminescence from quantum-dot light-emitting diodes40
Vertically grown metal nanosheets integrated with atomic-layer-deposited dielectrics for transistors with subnanometre capacitance-equivalent thicknesses40
3D-printed coolers40
Metaphotonic photodetectors for direct Stokes quantification39
Observation of orbital pumping39
Perovskites for next-generation colour conversion displays38
High-performance, power-efficient three-dimensional system-in-package designs with universal chiplet interconnect express38
Ultrasound brain stimulation technologies for targeted therapeutics38
Safe practices for mobility evaluation in field-effect transistors and Hall effect measurements using emerging materials37
Three-dimensional integrated metal-oxide transistors37
A self-biased non-reciprocal magnetic metasurface for bidirectional phase modulation37
Perovskite light-emitting diodes36
Magnesium niobate as a high-κ gate dielectric for two-dimensional electronics36
A wearable echomyography system based on a single transducer35
A real-time, scalable, fast and resource-efficient decoder for a quantum computer35
Build it up again34
A CMOS inverter from stacked ribbons34
Integrated devices that can recognize hand gestures34
Making diamonds with sticky tape34
Acoustically powered underwater imaging33
Making robots move more like humans33
Tso-Ping Ma (1945−2021)32
Petal-like stamps make curvy devices32
Controlling a superconducting quantum processor32
Lego-like reconfigurable AI chips32
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