Nature Electronics

Papers
(The H4-Index of Nature Electronics is 90. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-12-01 to 2025-12-01.)
ArticleCitations
New visions for touchless interfaces654
A conformal array for understanding plants625
Wafer-scale transfer of tungsten disulfide474
Nanosheet FETs with low leakage463
Gigahertz heterojunction bipolar transistors on CMOS412
Author Correction: An asynchronous wireless network for capturing event-driven data from large populations of autonomous sensors398
Omnidirectional printing of stretchable electronics345
An update for brain–computer interfaces306
A flexible skin-mounted haptic interface for multimodal cutaneous feedback297
A unified realization of electrical quantities from the quantum International System of Units294
Integrated two-dimensional microwave transmitters fabricated on the wafer scale277
An implantable CMOS deep-brain fluorescence imager with single-neuron resolution277
Time-resolved detection of spin–orbit torque switching of magnetization and exchange bias273
A vacuum-deposited polymer dielectric for wafer-scale stretchable electronics272
The next generation of gate-all-around transistors263
High-performance inorganic metal halide perovskite transistors257
Imperfection-enabled memristive switching in van der Waals materials246
Bridging spinal cord injuries wirelessly245
A Josephson diode that works at zero field244
Photodiodes promote electrochemical synthesis242
A single-transducer echomyography system for monitoring muscle activity235
Transistor qubits heat up231
Memristive circuits based on multilayer hexagonal boron nitride for millimetre-wave radiofrequency applications219
Indium selenide wafers for 2D electronics217
A printed gallium oxide dielectric for 2D transistors210
A programmable metasurface antenna that approaches the wireless information mapping limit206
The case for silicon again203
The future of semiconductor technology shapes up197
Large spin–orbit torque in bismuthate-based heterostructures196
Neuromorphic scaling advantages for energy-efficient random walk computations187
Residue-free wafer-scale direct imprinting of two-dimensional materials185
A wearable in-sensor computing platform based on stretchable organic electrochemical transistors179
Monolithic and heterogeneous three-dimensional integration of two-dimensional materials with high-density vias179
A CMOS-integrated spintronic compute-in-memory macro for secure AI edge devices177
Twin physically unclonable functions based on aligned carbon nanotube arrays174
Laser-induced wet stability and adhesion of pure conducting polymer hydrogels165
In-sensor dynamic computing for intelligent machine vision161
Critical challenges in the development of electronics based on two-dimensional transition metal dichalcogenides161
Noise reveals single defects in boron nitride160
Biomimetic olfactory chips based on large-scale monolithically integrated nanotube sensor arrays160
Controlling qubits with cryogenic devices158
Reservoir computing with 2D materials156
Stacked single-crystalline field-effect transistors154
Reconfigurable logic-in-memory153
One-shot learning goes 3D153
Monolithic 3D stacking for neural network acceleration152
Tailoring heat flow in 2D materials152
Improved organic electrochemical transistor stability using solvent degassing and chemical doping149
Searching for MXenes149
A multifunctional display based on photo-responsive perovskite light-emitting diodes145
Scaling up superconducting quantum computers143
Stable and reliable bio-interfacing electrodes based on conductive hydrogels130
Micro light-emitting diodes129
Sideband-free space–time-coding metasurface antennas128
High-efficiency cooling via the monolithic integration of copper on electronic devices123
Hydrogen technology is unlikely to play a major role in sustainable road transport122
A spiking artificial neuron based on one diffusive memristor, one transistor and one resistor122
A self-healing electrically conductive organogel composite122
A wafer-scale van der Waals dielectric made from an inorganic molecular crystal film121
Direct bonding of gold on flexible substrates121
Reconfigurable logic-in-memory architectures based on a two-dimensional van der Waals heterostructure device118
Electrically tunable magnetic fluctuations in multilayered vanadium-doped tungsten diselenide118
Building in three dimensions116
Pixels that can focus115
A subdural chip with 65,000 channels115
MicroLEDs get in line113
Unexpected large spin currents in the normal state of an oxide superconductor113
System-level integration of 2D electronics112
An ultrathin organic–inorganic integrated device for optical biomarker monitoring112
Integrating 2D materials and metal electrodes110
AI chips that flip109
The success and failure of quantum computing start-ups109
Towards zero-power 6G communication switches using atomic sheets109
Low-loss electronics with superconducting diodes108
Rapid cryogenic characterization of 1,024 integrated silicon quantum dot devices108
Building resilience in high-tech supply chains107
Bilayer tungsten diselenide transistors with on-state currents exceeding 1.5 milliamperes per micrometre106
Van der Waals integration of high-κ perovskite oxides and two-dimensional semiconductors105
Adhesive bioelectronics for sutureless epicardial interfacing105
Three-dimensional flexible electronics using solidified liquid metal with regulated plasticity104
An n-doped capacitive transparent conductor for all-polymer electrochromic displays103
An anomalous Hall effect in altermagnetic ruthenium dioxide103
The future of electric vehicle charging infrastructure103
An inference chip in one101
Sensors that aren’t too bright101
Accelerating deep learning with precision98
Transistors pile up94
Ultrasound on the go92
Memristors level up92
Electrical control of quantum acoustics91
Scientific challenges in governing military AI90
A probe that measures more neurons across the brain90
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