Journal of Thermal Science and Engineering Applications

Papers
(The H4-Index of Journal of Thermal Science and Engineering Applications is 13. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2020-11-01 to 2024-11-01.)
ArticleCitations
Temperature of Grinding Carbide With Castor Oil-Based MoS2 Nanofluid Minimum Quantity Lubrication83
Heat Transfer and Second Law Analysis of Ethylene Glycol-Based Ternary Hybrid Nanofluid Under Laminar Flow50
Dynamics of Activation Energy and Nonlinear Mixed Convection in Darcy-Forchheimer Radiated Flow of Carreau Nanofluid Near Stagnation Point Region42
Numerical Simulation of Nonlinear Thermal Radiation on the 3D Flow of a Couple Stress Casson Nanofluid Due to a Stretching Sheet36
Spectral Simulation to Investigate the Effects of Active Passive Controls of Nanoparticles on the Radiative Nanofluidic Transport Over a Spinning Disk27
Numerical Survey on Performance of Hybrid NePCM for Cooling of Electronics: Effect of Heat Source Position and Heat Sink Inclination27
Analysis of Thermal Creep Effects on Fluid Flow and Heat Transfer in a Microchannel Gas Heating26
Numerical Development of a Coupled One-Dimensional/Three-Dimensional Computational Fluid Dynamics Method for Thermal Analysis With Flow Maldistribution18
Numerical and Experimental Investigation of Melting of Paraffin in a Hemicylindrical Capsule18
Heat Transfer Enhancement From Inline and Staggered Arrays of Cylinders in a Heat Exchanger Using Alumina–Water Nanofluid18
Drying Kinetics and Performance Analysis of Thermal Storage-Based Hybrid Greenhouse Dryer for Uniform Drying of Tomato Flakes17
Macroscale Modeling of Solid–Liquid Phase Change in Metal Foam/Paraffin Composite: Effects of Paraffin Density Treatment, Thermal Dispersion, and Interstitial Heat Transfer16
Active Cooling System for Downhole Electronics in High-Temperature Environments13
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