IEEE Microwave and Wireless Components Letters

Papers
(The TQCC of IEEE Microwave and Wireless Components Letters is 16. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-08-01 to 2026-08-01.)
ArticleCitations
RF Characterization of 3-D-Printed Tunable Resonators on a Composite Substrate Infused With Magnetic Nanoparticles50
Frequency Division Multiplexer With Directional Filters in Multilayer LCP Films at - and -Band 49
A Low Complexity LUT-Based Digital Predistortion Block With New Pruning Method48
A Linearity-Enhanced 18.7–36.5-GHz LNA With 1.5–2.1-dB NF for Radar Applications43
A High Conversion Gain Frequency Doubler Using Transformer-Based Second Harmonic Feedback Technique in 28-nm CMOS43
Investigation of a Modified Flat-Roofed Sine Waveguide Slow-Wave Structure for Wideband 220-GHz TWT34
Model-Based VF Technique for Parasitic Reflections Reduction of Frequency-Domain Chipless RFID Systems34
Efficient and Compact Tri-Band Rectifier With Large Frequency Ratio for WPT33
A Millimeter-Wave Variable-Gain Power Amplifier With P₁ dB Improvement Technique in 65-nm CMOS31
A Compact 275–320-GHz Reflection-Type Phase Shifter31
A 18–44 GHz Low Noise Amplifier With Input Matching and Bandwidth Extension Techniques31
IEEE Microwave and Wireless Components Letters Publication Information31
IEEE Microwave and Wireless Components Letters Information for Authors31
A 26–31 GHz Linearized Wideband CMOS LNA Using Post-Distortion Technique31
A Broadband Rectifier With Wide Incident Angle of Incoming Waves Based on Quadrature Coupler for RF Energy Harvesting29
A Spatial Modes Filtering FETD Method Combined With Domain Decomposition for Simulating Fine Electromagnetic Structures29
Mode Composite Folded Substrate Integrated Waveguide28
IEEE Microwave and Wireless Components Letters publication information26
Filtering Power Divider With Tunable Attenuation Based on Graphene Nanoplates25
A Low Phase Noise K-Band VCO With a Threshold Voltage-Based Current Source23
A 2-Bit Voltage-Controlled Oscillator (VCO) for Multiband Wireless Applications22
Shape Modeling of Microstrip Filters Based on Convolutional Neural Network22
An E-Band High-Performance Variable Gain Low Noise Amplifier for Wireless Communications in 90-nm CMOS Process20
A 230-GHz Endfire SIS Mixer With Near Quantum-Limited Performance20
Dual-Band VCO Using High Quality Factor Two Orthogonally Located Inductors in 0.18-μm CMOS Technology19
A K-Band CMOS Standing Wave Oscillator Using Digital-Controlled Artificial Dielectric Differential Transmission Lines19
Equivalent Circuit-Based Coupling Modeling of Double Bond Ribbons Interconnection Variation in Electronic Packaging19
A 5-W GaN Doherty Amplifier for Ka-Band Satellite Downlink With 4-GHz Bandwidth and 17-dB NPR18
Vertical Waveguide-to-Microstrip Self-Diplexing Transition for Dual-Band Applications18
Dual-Band Ultrathin Polarization Converter for S-Band Microwave Transmission18
A New Explicit–Implicit Hybridizable Discontinuous Galerkin Time-Domain Method for Electromagnetics18
A Broadband 10–43-GHz High-Gain LNA MMIC Using Coupled-Line Feedback in 0.15-μm GaAs pHEMT Technology18
A Broadband Coaxial Line-to-SIW Transition Using Aperture-Coupling Method18
IEEE Microwave and Wireless Components Letters information for authors18
IEEE Microwave and Wireless Components Letters information for authors17
A 40-Gb/s Modulator Driver Using Cascade Swing Compensation in 90 nm CMOS17
Design and Analysis of a 26–34.5-GHz Power Amplifier With Balanced Mismatch Reduction and Interstage Matching17
Table of Contents17
30-GHz Low-Phase-Noise Scalable Multicore Class-F Voltage-Controlled Oscillators Using Coupled-Line-Based Synchronization Topology16
A Fully Packaged Bandpass Filter on Stripline Patch Resonator With Wide Upper Stopband16
A Circular Waveguide Dual-Mode Filter With Improved Out-of-Band Performance for Satellite Communication Systems16
Extension of Babinet Principle to Complementary Metallic Elements on the Interface of Different Substrates16
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