IEEE Transactions on Device and Materials Reliability

Papers
(The TQCC of IEEE Transactions on Device and Materials Reliability is 4. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-08-01 to 2026-08-01.)
ArticleCitations
Special Issue on Semiconductor Design for Manufacturing (DFM)Joint Call for Papers62
Editorial38
Location-Aware Error Correction for Mitigating the Impact of Interconnects on STT-MRAM Reliability36
A Modified Bypass Circuit for Improved Reliability of PV Module Validated With Real-Time Data33
On the Response Time Constant of Interface Defects in Accumulation33
Design and Reliability Assessment of a Reconfigurable Tunneling Device for Ultra Low-Power Applications27
Guidelines for the Design of Random Telegraph Noise-Based True Random Number Generators24
FEA-Dominant Reliability and Lifetime Model of Double-Sided Cooling SiC Power Module22
Package-Level Electro-Thermal Simulation With Transient Thermal Resistance Model for Surge Stress Failure Analysis of SiC MOSFET22
Sintered Silver-Based Direct-Cooled IGBTs With High Output Power and Thermal Reliability22
Mission Profile-Based Hotspot Temperature and Lifespan Estimation of DC-Link Capacitors Used in Automotive Traction Inverters20
IEEE Transactions on Device and Materials Reliability Publication Information19
IEEE Transactions on Device and Materials Reliability Publication Information19
Reliability of Advanced Nodes19
Research of Single-Event Burnout in P-NiO/n-Ga 2 O 3 Heterojunction Diode16
Stability in Electroluminescence From Ag-NSi Schottky Junction LED: Role of Ambient Oxidation16
Table of Contents16
Influence of Gate Insulator Modulation on the Electrical and Material Properties of Dual-Gate InGaZnO Thin-Film Transistors16
A DLTS Study on Deep Trench Processing-Induced Trap States in Silicon Photodiodes16
Implication of Self-Heating Effect on Device Reliability Characterization of Multi-Finger n-MOSFETs on 22FDSOI16
Unveiling the Degradation Mechanism of Polymer-Based Thermal Interface Materials Under Thermo-Oxidative Condition16
Modeling Analysis of BTI-Driven Degradation of a Ring Oscillator Designed in a 28-nm CMOS Technology15
Single-Event Effects Induced by Monoenergetic Fast Neutrons in Silicon Power UMOSFETs14
IEEE Transactions on Device and Materials Reliability Publication Information14
Fault Modeling and Test Algorithm Development Framework for Gate-All-Around SRAMs14
Research on the degradation mechanism of Stacked Aluminum Polymer Capacitors in Humid Environments13
Lifetime Prediction of IGBT by BPNN Based on Improved Dung Beetle Optimization Algorithm13
IEEE Transactions on Device and Materials Reliability Publication Information13
Insights Into the Effects of Interface Trap Charges on Electrostatic-Based Magnesium Silicide Tunneling Interface13
Effects of Electrolyte Volume on Electrochemical Migration of Tin in Water Drop Test13
Failure Mechanism and Predictive Modeling for Microbump Interconnects Drop Life Under Diverse Impact Angles in Advanced Packaging12
Impact of Substrate Connection on Dynamic-R ON Drift of 650 V Normally-Off Monolithic Bidirectional AlGaN/GaN HEMT12
Degradation Analysis of 14 nm SOI FinFETs by Influence of Hot Carrier Injection and Self-Heating Synergistic Effects12
Table of Contents12
A Page–Sector Joint Degradation-Reliability Error Analysis Model for High-Density NAND Flash12
A Novel Dual-Mode Dual Trench MOSFET With Self-Adjustable Field Plate for Low EMI Noise and High Dynamic Avalanche Robustness11
TechRxiv: Share Your Preprint Research with the World!11
IEEE Transactions on Device and Materials Reliability Publication Information11
Introducing IEEE Collabratec11
A New SiC Quasi MOSFET for Ultra-Low Specific On-Resistance and Improved Reliability11
Revealing the Impact of Gate Area Scaling on Charge Trapping Employing SiO2Transistors11
Non-Traditional Operational Mechanisms of NbO x -Based Threshold Switching Devices Used on On-Chip ESD Protection11
Member Get-A-Member (MGM) Program11
Electrical Switching Safe Operation Area on GaN Bidirectional Switches Under Hard-Switching Conditions by Multiple Pulse Test11
Study of Trap Influence on Threshold Voltage of SiC MOSFET Based on Transient Current Method11
Predicting Failure Distributions of SRAM Arrays by Using Extreme Value Statistic, Bit Cell Simulation, and Machine Learning10
Avalanche Failure Mechanisms of 1200-V/40-A 4H-SiC Junction Barrier Schottky Diodes With Various Epilayer Defects10
Compact Modeling of Process Variation and Reliability Predictions for Nanosheet Gate-All-Around FET10
Reliability Analysis of IGZO Thin-Film Transistor for Wearable Biosensing Applications10
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Semiconductor Device Modeling for Circuit and System Design10
IEEE Transactions on Device and Materials Reliability Information for Authors10
TechRxiv: Share Your Preprint Research with the World!10
Call for Nominations Editor-in-Chief IEEE Transactions on Device and Materials Reliability10
A Lifetime Prediction Method of IGBT Based on Phased Nonlinear Wiener Process10
Analysis of Trapping Mechanisms and Capacitance Dispersion in Double-π Gate AlGaN/GaN HEMTs Under High-Temperature Conditions10
Aging-Induced Mg Cluster Observation in GaN-Based Lasers by Atom Probe Tomography9
Open Model Interface Assisted NBTI-Aware Design With Dual-V th Logic Synthesis Strategy for Reliability Improvement9
Plasma Induced Charging Damage Causing MOS Device Reliability Lifetime Degradation Originating From Well Charging of a Technology With Deep Trench Isolation9
Blank Page9
Designing and Reliability Analysis of Radiation Hardened Stacked Gate Junctionless FinFET and CMOS Inverter9
Temperature-Dependent Study of Large-Signal Reliability of p-FET-Based Power Amplifier for mmWave Applications9
Degradation Behavior and Mechanism of SONOS FLASH by Total Ionization Dose Effects9
Impact of Pulse Voltage Stress on the Reliability of Ferroelectric Thin-Film Transistor9
NAVIgator under Fire: Characterizing Voltage Limits and Soft Error Resilience of AMD NAVI GPUs9
FPGA Assessment Methodology of Adverse X-Ray Effects on Secure Digital Circuits8
Aging and Sintered Layer Defect Detection of Discrete MOSFETs Using Frequency Domain Reflectometry Associated With Parasitic Resistance8
A Consistent Analytical Method to Assess Reliability of Redundant Safety Instrumented Systems8
Table of Contents8
Negative Bias-Temperature Instabilities and Low-Frequency Noise in Ge FinFETs8
TCAD Investigation on a Novel SiC Trench MOSFET With Integrated N + -PolySi/SiC Heterojunction Diode for Improved Third-Quadrant and High-Temperature8
Reliability of VO textsubscript 2-Based mmWave Switches Under 100 Million Thermal Cycles8
SiC MOSFET Gate-Oxide and SiC/SiO 2 Interface Defect Charge Movement Based on the Hi-Lo C ISS8
Design of Robust SRAM Cell With Enhanced Soft-Error Hardening for Radiation-Prone Applications8
Evaluations of Gate Oxide Reliability in SiC MOSFETs Under Extremely High Gate Voltage Stress7
Semi-Empirical Modeling of Hot Carrier Degradation in 12-nm FinFET LDMOS Devices7
Degradation Mechanism of 4H-SiC MOSFET under 10 MeV Proton Irradiation7
Exploring the Optimal Solution for Graphene-Based Microstrip Line Attenuators7
Mitigating the Process Variations in Negative Capacitance Junctionless Device and Circuit7
Blank Page7
Negative Bias Temperature Instability in Top-Gated Carbon Nanotube Thin Film Transistors With Y2O3 Gate Dielectric7
Proton Irradiation Effects on Single Event Burnout in AlGaN/GaN HEMTs7
Low Conductance State Drift Characterization and Mitigation in Resistive Switching Memories (RRAM) for Artificial Neural Networks7
TechRxiv: Share Your Preprint Research with the World!6
Analytical Model for Cu Interconnect Lifetimes Under Combined Thermomigration and Electromigration Stress6
Error-Corrected RRAM-Based Compute-in-Memory Accelerator Using Voltage-Clamp Current Mirror6
Effects of Electron Irradiation and Thermal Cycling on Electrical Properties of SiC MOSFET6
Key Factors Affecting Dynamic Reliability in GaN HEMTs and How Can They Be Mitigated?6
Radiation Hardened SOI LDMOS With Dual P-Type Layers Shielding Irradiation Charge Field6
An Efficient Modeling Approach for Electrothermal Migration Analysis of On-Chip Interconnects6
Research of Single-Event Burnout in 1.2-kV Rated CoolSiC Trench MOSFET6
Lifetime Prediction Method for IGBT Modules Under Combined Power Cycling–Vibration Conditions6
Analysis and Structural Mitigation of Trapping-State-Trap Induced Drain Leakage Current in Buried-Channel-Array Transistor6
Negative Capacitance Vertical Dopingless TFET and Its Analog/RF Analysis Using Interface Trap Charges6
IEEE Transactions on Device and Materials Reliability Publication Information6
Call for Nominations for Editor-in-Chief IEEE Electron Device Letters6
High Gate Reliability and Breakdown Voltage p-GaN HEMTs Based on Post-Annealing-Free Oxygen Plasma Treatment6
Investigation of Electrical Breakdown in AlGaN/GaN/AlN HEMTs Through Nanoscale Analysis and Physics-Based Modeling6
Influence of Critical Working Conditions on Stability of Varistor Characteristics6
Call for Nominations for Editor-in-Chief IEEE Transactions on Semiconductor Manufacturing6
White X-Ray Radiation Effects in MOS Capacitors With Atomic Layer Deposited HfO2/Al2O3 and Al2O3/HfO2/Al2O3 Gate5
Memristive Switching Behavior of MoO3 Decorated PSi Heterostructure and Impact of Temperature on Device Reliability5
Comprehensive Study on Trap-Induced Bias Instability via High-Pressure D 2 and N 2 Annealing5
Comparison of Different Input Data for the Prediction of LED Solder Joints Using Artificial Neural Networks5
IEEE Transactions on Device and Materials Reliability Information for Authors5
Degradation Mapping and Impact of Device Dimension on IGZO TFTs BTI5
Influence of Phase Coarsening on Inhomogeneous Deformation and Fracture Behavior in Sn–Bi Solder Interconnects5
Correlation of Radiation-Induced Interface Traps With Band Edge Energy Through Band Structure-Based Analysis of Electrostatics of UTB SOI Devices5
SafeHDC: Concurrent Uncertainty and Fault Detection in Hyperdimensional Computing5
Design of Highly Reliable 14T and 16T SRAM Cells Combined With Layout Harden Technique5
Call for Nominations for Editor-in-Chief5
Comprehensive TCAD-Based Single Event Effect Study of TFET-Based 1T DRAM and Crossbar Memory Array5
Irradiation-Induced Degradation of Surface Acoustic Wave Devices Fabricated on Bulk AlN5
Digital Probing of Activation Energy for Evaluating Reliability in 2-D and 3-D NAND Flash Memory5
A Highly Reliable Dual-Node-Upset-Tolerant 20T Radiation Hardened SRAM Cell for Aerospace Applications5
Wide Band Gap Semiconductors for Automotive Applications5
Experimental Study on Failure Mechanism of 4H-SiC MOSFETs Under Unclamped Inductive Switching (UIS) Stress Conditions4
Table of Contents4
Modeling and Evaluation of Single Event Effects on Hafnia-Based FeRAM4
DAAS: Differential Aging-Aware STA for Precise Timing Closure With Reduced Design Margin4
Reliability of Advanced Nodes4
Metastable Operating Stability of Perovskite/Silicon Tandem Solar Cell Modules4
Trap Location and Stress Degradation Analysis of GaN High Electron Mobility Transistors Based on the Transient Current Method4
IEEE Transactions on Device and Materials Reliability Information for Authors4
ESR Modeling for Atmospheric Corrosion Behavior of Metallized Film Capacitors4
Fe-Related Trapping and Detrapping Dynamics in AlGaN/GaN HEMTs Inspected by Drain Current Transient (DCT) Spectroscopy4
Analysis of Multicrystalline Si Solar Cell Degradation Due to Reverse Bias and High Temperature Aging4
Systematic Reliability Evaluation of FPGA Implemented CNN Accelerators4
Failure Mechanisms of Fluorine-Doped Tin Oxide Thin Films in Glass and Reliability Tests4
Modeling Degradation Kinetics of FAPbI₃ Perovskite Solar Cells: Impact of Microstructural and Optoelectronic Defects4
Fast Heater‑Based NBTI Resolves the Reverse Antenna Effect in PID‑Degraded High‑k and SiO 2 pMOSFETs4
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