OOIR: Observatory of International Research

Papers

(The TQCC of IEEE Transactions on Device and Materials Reliability is 4. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-05-01 to 2025-05-01.)

Article	Citations
[Front cover]	48
Special Issue on Semiconductor Design for Manufacturing (DFM)Joint Call for Papers	40
IEEE Robert Bosch Micro and Nano Electro Mechanical Systems Award	37
From Mega to nano: Beyond one Century of Vacuum Electronics	26
CD-DFT: A Current-Difference Design-for-Testability to Detect Short Defects of STT-MRAM Under Process Variations	25
Investigation of the Interaction Effect Between the Microstructure Evolution and the Thermo-Mechanical Behavior of Cu-Filled Through Silicon Via	22
Mission Profile-Based Hotspot Temperature and Lifespan Estimation of DC-Link Capacitors Used in Automotive Traction Inverters	22
A Modified Bypass Circuit for Improved Reliability of PV Module Validated With Real-Time Data	22
Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part I—Initial Characterization	20
FEA-Dominant Reliability and Lifetime Model of Double-Sided Cooling SiC Power Module	19
IEEE Transactions on Device and Materials Reliabilityinformation for authors	18
Guidelines for the Design of Random Telegraph Noise-Based True Random Number Generators	18
Device Screening Strategy for Suppressing Current Imbalance in Parallel-Connected SiC MOSFETs	17
IEEE Transactions on Device and Materials Reliability Publication Information	17
Machine Learning Approach for Prediction of Point Defect Effect in FinFET	16
IEEE Transactions on Device and Materials Reliability Publication Information	16
Workload-Aware Electromigration Analysis in Emerging Spintronic Memory Arrays	15
Implication of Self-Heating Effect on Device Reliability Characterization of Multi-Finger n-MOSFETs on 22FDSOI	14
Modeling Analysis of BTI-Driven Degradation of a Ring Oscillator Designed in a 28-nm CMOS Technology	13
Study of TID Radiation Effects on the Breakdown Voltage of Buried P-Pillar SOI LDMOSFETs	12
Research of Single-Event Burnout in P-NiO/n-Ga₂O₃ Heterojunction Diode	12
On the Distribution of Single Defect Threshold Voltage Shifts in SiON Transistors	12
Unveiling the Degradation Mechanism of Polymer-Based Thermal Interface Materials Under Thermo-Oxidative Condition	12
A DLTS Study on Deep Trench Processing-Induced Trap States in Silicon Photodiodes	12
Thermal Effect on Carbon Nanotube Fiber High-Ampacity Conductors at High Frequencies	11

Mitigation Technique for Single Event Transient via Pulse Quenching	11
Improving Breakdown Voltage in AlGaN/GaN Metal-Insulator-Semiconductor HEMTs Through Electric-Field Dispersion Layer Material Selection	11
Table of Contents	10
TechRxiv: Share Your Preprint Research with the World!	10
Simulation Study of Stress Effect on Performance and Design Methodology of Proposed Si/SiGe Integrated Bragg Grating Filter	10
Revealing the Impact of Gate Area Scaling on Charge Trapping Employing SiO₂Transistors	10
Impact of Bias Temperature Stress on IGZO/Ni/IGZO Steep Subthreshold Vertical Current Driver Fabricated at Room Temperature	10
Fault Modeling and Test Algorithm Development Framework for Gate-All-Around SRAMs	10
IEEE Transactions on Device and Materials Reliability Publication Information	10
Member Get-A-Member (MGM) Program	10
Introducing IEEE Collabratec	10
Failure Mechanism and Predictive Modeling for Microbump Interconnects Drop Life Under Diverse Impact Angles in Advanced Packaging	10
Impact of Pulse Voltage Stress on the Reliability of Ferroelectric Thin-Film Transistor	9
IEEE Transactions on Device and Materials Reliability Information for Authors	9
A New SiC Quasi MOSFET for Ultra-Low Specific On-Resistance and Improved Reliability	9
Degradation Behavior and Mechanism of SONOS FLASH by Total Ionization Dose Effects	9
Predicting Failure Distributions of SRAM Arrays by Using Extreme Value Statistic, Bit Cell Simulation, and Machine Learning	9
IEEE Transactions on Device and Materials Reliability Publication Information	9
Reliability and Characterization of Nanosilver Joints Prepared by a Time-Reduced Sintering Process	9
A Novel Dual-Mode Dual Trench MOSFET With Self-Adjustable Field Plate for Low EMI Noise and High Dynamic Avalanche Robustness	9
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Semiconductor Device Modeling for Circuit and System Design	8
An Analytical Model of Read-Disturb Failure Time in a Post-Cycling Resistive Switching Memory	8
Call for Nominations Editor-in-Chief IEEE Transactions on Device and Materials Reliability	8
Plasma Induced Charging Damage Causing MOS Device Reliability Lifetime Degradation Originating From Well Charging of a Technology With Deep Trench Isolation	8
From Mega to nano: Beyond one Century of Vacuum Electronics	8
Erratum to “Reliability Characterization of a Low-k Dielectric Using Magnetoresistance as a Diagnostic Tool”	8
Blank Page	8
Temperature-Dependent Study of Large-Signal Reliability of p-FET-Based Power Amplifier for mmWave Applications	8
Effects of Temperature and Bias Voltage on Electron Transport Properties in GaN High-Electron-Mobility Transistors	8
Design, Fabrication and Characterization of Single-Crystalline Graphene gNEMS ESD Switches for Future ICs	8
TechRxiv: Share Your Preprint Research with the World!	8
Designing and Reliability Analysis of Radiation Hardened Stacked Gate Junctionless FinFET and CMOS Inverter	8
A Consistent Analytical Method to Assess Reliability of Redundant Safety Instrumented Systems	7
Impact of Hot Carrier Aging on the 1/f and Random Telegraph Noise of Short-Channel Triple-Gate Junctionless MOSFETs	7
Low Conductance State Drift Characterization and Mitigation in Resistive Switching Memories (RRAM) for Artificial Neural Networks	7
Development of Accelerated Life Testing Apparatus for Light-Emitting Diode Therapy	7
Aging and Sintered Layer Defect Detection of Discrete MOSFETs Using Frequency Domain Reflectometry Associated With Parasitic Resistance	7
Evaluations of Gate Oxide Reliability in SiC MOSFETs Under Extremely High Gate Voltage Stress	7
FPGA Assessment Methodology of Adverse X-Ray Effects on Secure Digital Circuits	7
[Blank page]	7
Negative Bias-Temperature Instabilities and Low-Frequency Noise in Ge FinFETs	7
Negative Bias Temperature Instability in Top-Gated Carbon Nanotube Thin Film Transistors With Y₂O₃ Gate Dielectric	7
Reliability of VO textsubscript 2-Based mmWave Switches Under 100 Million Thermal Cycles	7
TechRxiv: Share Your Preprint Research with the World!	6
Blank Page	6
Influence of Critical Working Conditions on Stability of Varistor Characteristics	6
Negative Capacitance Vertical Dopingless TFET and Its Analog/RF Analysis Using Interface Trap Charges	6
Table of contents	6
IEEE Transactions on Device and MaterialsReliability publication information	6
Research of Single-Event Burnout in 1.2-kV Rated CoolSiC Trench MOSFET	6

Analysis of Floating Limiting Rings Termination Under Repetitive Avalanche Current Stress for 4H-SiC JBS Rectifiers	6
TechRxiv: Share Your Preprint Research with the World!	6
Exploiting Resistance Drift Characteristics to Improve Reliability of LDPC-Assisted Phase-Change Memory	6
Reflow Residues on Printed Circuit Board Assemblies and Interaction With Humidity	6
Call for Nominations for Editor-in-Chief IEEE Transactions on Semiconductor Manufacturing	5
Comprehensive Study on Trap-Induced Bias Instability via High-Pressure D ₂ and N ₂ Annealing	5
IEEE Transactions on Device and Materials Reliability Information for Authors	5
Design of Highly Reliable 14T and 16T SRAM Cells Combined With Layout Harden Technique	5
Introducing IEEE Collabratec	5
Memristive Switching Behavior of MoO3 Decorated PSi Heterostructure and Impact of Temperature on Device Reliability	5
Irradiation-Induced Degradation of Surface Acoustic Wave Devices Fabricated on Bulk AlN	5
Comprehensive TCAD-Based Single Event Effect Study of TFET-Based 1T DRAM and Crossbar Memory Array	5
Degradation Mapping and Impact of Device Dimension on IGZO TFTs BTI	5
Metallization Reliability of GaN-Based High-Voltage Light-Emitting Diodes	5
Trap Location and Stress Degradation Analysis of GaN High Electron Mobility Transistors Based on the Transient Current Method	5
IEEE Transactions on Device and Materials Reliability Publication Information	5
Table of Contents	5
Call for Nominations for Editor-in-Chief	5
Radiation Hardened SOI LDMOS With Dual P-Type Layers Shielding Irradiation Charge Field	5
Correlation of Radiation-Induced Interface Traps With Band Edge Energy Through Band Structure-Based Analysis of Electrostatics of UTB SOI Devices	5
Wide Band Gap Semiconductors for Automotive Applications	5
Lateral and Vertical Gate Oxide Stacking Impact on Noise Margins and Delays for the 8T SRAM Designed With Source Pocket Engineered GaSb/Si Heterojunction Vertical TFET: A Reliability Study	5
White X-Ray Radiation Effects in MOS Capacitors With Atomic Layer Deposited HfO₂/Al₂O₃ and Al₂O₃/HfO₂/Al₂O₃ Gate	5
Systematic Reliability Evaluation of FPGA Implemented CNN Accelerators	5
IEEE Transactions on Device and MaterialsReliability publication information	4
Power Durability Enhancement and Failure Analysis of TC-SAW Filter With Ti/Cu/Ti/Cu/Ti Electrodes	4
New Total-Ionizing-Dose Resistant Data Storing Technique for NAND Flash Memory	4
ESR Modeling for Atmospheric Corrosion Behavior of Metallized Film Capacitors	4
IEEE Transactions on Device and Materials Reliability information for authors	4
Soft-Error-Aware SRAM for Terrestrial Applications	4
Single-Event Burnout Hardening 4H-SiC UMOSFET Structure	4
Call for Papers for a Special Issue of IEEE Journal of the Electron Devices Society on "Materials, processing and integration for neuromorphic devices and in-memory computing"	4
Characterization and Analysis of Hot Carrier Degradation Under DC and Large-Signal RF Stress in a PDSOI Floating-Body NFET-Based Power Amplifier Cell Under WiFi Operating Conditions	4
Front Cover	4
IEEE Transactions on Device and Materials Reliability Information for Authors	4
Effect of Aging Temperature on the Fatigue Resistance and Shear Strength of SAC305 Solder Joints	4
Characterization, Analysis, and Modeling of Long-Term RF Reliability and Degradation of SiGe HBTs for High Power Density Applications	4
2023 Index IEEE Transactions on Device and Materials Reliability Vol. 23	4
Prediction of Crack Initiation at Die Corner of Molded Underfill Flip-Chip Packages Under Thermal Load by New Criteria	4
Correlation of HCD and Percolation Paths in FinFETs: Study of RDF and MGG Impacts Through 3-D Particle-Based Simulation	4
An Effective Method to Identify Microarchitectural Vulnerabilities in GPUs	4
Failure Mechanisms of Fluorine-Doped Tin Oxide Thin Films in Glass and Reliability Tests	4
Modeling Degradation Kinetics of FAPbI3 Perovskite Solar Cells: Impact of Microstructural and Optoelectronic Defects	4