OOIR: Observatory of International Research

Papers

(The median citation count of IEEE Transactions on Device and Materials Reliability is 0. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-09-01 to 2025-09-01.)

Article	Citations
Special Issue on Semiconductor Design for Manufacturing (DFM)Joint Call for Papers	50
From Mega to nano: Beyond one Century of Vacuum Electronics	48
CD-DFT: A Current-Difference Design-for-Testability to Detect Short Defects of STT-MRAM Under Process Variations	34
Investigation of the Interaction Effect Between the Microstructure Evolution and the Thermo-Mechanical Behavior of Cu-Filled Through Silicon Via	27
Mission Profile-Based Hotspot Temperature and Lifespan Estimation of DC-Link Capacitors Used in Automotive Traction Inverters	25
Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part I—Initial Characterization	24
A Modified Bypass Circuit for Improved Reliability of PV Module Validated With Real-Time Data	22
Sintered Silver Based Direct-Cooled IGBTs With High Output Power and Thermal Reliability	22
Guidelines for the Design of Random Telegraph Noise-Based True Random Number Generators	22
FEA-Dominant Reliability and Lifetime Model of Double-Sided Cooling SiC Power Module	21
IEEE Transactions on Device and Materials Reliability Publication Information	20
A DLTS Study on Deep Trench Processing-Induced Trap States in Silicon Photodiodes	20
Reliability of Advanced Nodes	18
IEEE Transactions on Device and Materials Reliability Publication Information	17
Unveiling the Degradation Mechanism of Polymer-Based Thermal Interface Materials Under Thermo-Oxidative Condition	16
Implication of Self-Heating Effect on Device Reliability Characterization of Multi-Finger n-MOSFETs on 22FDSOI	15
Research of Single-Event Burnout in P-NiO/n-Ga₂O₃ Heterojunction Diode	15
Modeling Analysis of BTI-Driven Degradation of a Ring Oscillator Designed in a 28-nm CMOS Technology	15
Mitigation Technique for Single Event Transient via Pulse Quenching	14
Lifetime Prediction of IGBT by BPNN Based on Improved Dung Beetle Optimization Algorithm	14
Failure Mechanism and Predictive Modeling for Microbump Interconnects Drop Life Under Diverse Impact Angles in Advanced Packaging	14
Device Screening Strategy for Suppressing Current Imbalance in Parallel-Connected SiC MOSFETs	14
Simulation Study of Stress Effect on Performance and Design Methodology of Proposed Si/SiGe Integrated Bragg Grating Filter	13
Thermal Effect on Carbon Nanotube Fiber High-Ampacity Conductors at High Frequencies	13
Single-Event Effects Induced by Monoenergetic Fast Neutrons in Silicon Power UMOSFETs	13

Fault Modeling and Test Algorithm Development Framework for Gate-All-Around SRAMs	13
Study of TID Radiation Effects on the Breakdown Voltage of Buried P-Pillar SOI LDMOSFETs	13
IEEE Transactions on Device and Materials Reliability Publication Information	13
Member Get-A-Member (MGM) Program	12
Degradation Analysis of 14 nm SOI FinFETs by Influence of Hot Carrier Injection and Self-Heating Synergistic Effects	12
TechRxiv: Share Your Preprint Research with the World!	12
Table of Contents	12
Revealing the Impact of Gate Area Scaling on Charge Trapping Employing SiO₂Transistors	12
Improving Breakdown Voltage in AlGaN/GaN Metal-Insulator-Semiconductor HEMTs Through Electric-Field Dispersion Layer Material Selection	12
Introducing IEEE Collabratec	12
Study of Trap Influence on Threshold Voltage of SiC MOSFET Based on Transient Current Method	11
IEEE Transactions on Device and Materials Reliability Information for Authors	11
A Novel Dual-Mode Dual Trench MOSFET With Self-Adjustable Field Plate for Low EMI Noise and High Dynamic Avalanche Robustness	11
A New SiC Quasi MOSFET for Ultra-Low Specific On-Resistance and Improved Reliability	11
Reliability and Characterization of Nanosilver Joints Prepared by a Time-Reduced Sintering Process	10
Compact Modeling of Process Variation and Reliability Predictions for Nanosheet Gate-All-Around FET	10
Analysis of Trapping Mechanisms and Capacitance Dispersion in Double-π Gate AlGaN/GaN HEMTs Under High-Temperature Conditions	10
A Lifetime Prediction Method of IGBT Based on Phased Nonlinear Wiener Process	10
Degradation Behavior and Mechanism of SONOS FLASH by Total Ionization Dose Effects	10
Predicting Failure Distributions of SRAM Arrays by Using Extreme Value Statistic, Bit Cell Simulation, and Machine Learning	10
IEEE Transactions on Device and Materials Reliability Publication Information	10
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Semiconductor Device Modeling for Circuit and System Design	10
From Mega to nano: Beyond one Century of Vacuum Electronics	9
Effects of Temperature and Bias Voltage on Electron Transport Properties in GaN High-Electron-Mobility Transistors	9
TechRxiv: Share Your Preprint Research with the World!	9
Aging-Induced Mg Cluster Observation in GaN-Based Lasers by Atom Probe Tomography	9
Design, Fabrication and Characterization of Single-Crystalline Graphene gNEMS ESD Switches for Future ICs	9
Erratum to “Reliability Characterization of a Low-k Dielectric Using Magnetoresistance as a Diagnostic Tool”	9
Call for Nominations Editor-in-Chief IEEE Transactions on Device and Materials Reliability	9
Reliability of VO textsubscript 2-Based mmWave Switches Under 100 Million Thermal Cycles	9
An Analytical Model of Read-Disturb Failure Time in a Post-Cycling Resistive Switching Memory	9
Temperature-Dependent Study of Large-Signal Reliability of p-FET-Based Power Amplifier for mmWave Applications	9
Blank Page	9
Aging and Sintered Layer Defect Detection of Discrete MOSFETs Using Frequency Domain Reflectometry Associated With Parasitic Resistance	8
Designing and Reliability Analysis of Radiation Hardened Stacked Gate Junctionless FinFET and CMOS Inverter	8
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A Consistent Analytical Method to Assess Reliability of Redundant Safety Instrumented Systems	8
Impact of Hot Carrier Aging on the 1/f and Random Telegraph Noise of Short-Channel Triple-Gate Junctionless MOSFETs	8
Exploring the Optimal Solution for Graphene-Based Microstrip Line Attenuators	8
Development of Accelerated Life Testing Apparatus for Light-Emitting Diode Therapy	8
Open Model Interface Assisted NBTI-Aware Design With Dual-Vth Logic Synthesis Strategy for Reliability Improvement	8
Negative Bias-Temperature Instabilities and Low-Frequency Noise in Ge FinFETs	8
Evaluations of Gate Oxide Reliability in SiC MOSFETs Under Extremely High Gate Voltage Stress	8
Table of Contents	8
Impact of Pulse Voltage Stress on the Reliability of Ferroelectric Thin-Film Transistor	8
Plasma Induced Charging Damage Causing MOS Device Reliability Lifetime Degradation Originating From Well Charging of a Technology With Deep Trench Isolation	8
FPGA Assessment Methodology of Adverse X-Ray Effects on Secure Digital Circuits	8
Reflow Residues on Printed Circuit Board Assemblies and Interaction With Humidity	7
Exploiting Resistance Drift Characteristics to Improve Reliability of LDPC-Assisted Phase-Change Memory	7
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Influence of Critical Working Conditions on Stability of Varistor Characteristics	7
TechRxiv: Share Your Preprint Research with the World!	7
Negative Bias Temperature Instability in Top-Gated Carbon Nanotube Thin Film Transistors With Y₂O₃ Gate Dielectric	7
Proton Irradiation Effects on Single Event Burnout in AlGaN/GaN HEMTs	7
Analysis of Floating Limiting Rings Termination Under Repetitive Avalanche Current Stress for 4H-SiC JBS Rectifiers	7
IEEE Transactions on Device and MaterialsReliability publication information	7
Low Conductance State Drift Characterization and Mitigation in Resistive Switching Memories (RRAM) for Artificial Neural Networks	7
IEEE Transactions on Device and Materials Reliability Publication Information	6
Wide Band Gap Semiconductors for Automotive Applications	6
Negative Capacitance Vertical Dopingless TFET and Its Analog/RF Analysis Using Interface Trap Charges	6
Effects of Electron Irradiation and Thermal Cycling on Electrical Properties of SiC MOSFET	6
Call for Nominations for Editor-in-Chief	6
Radiation Hardened SOI LDMOS With Dual P-Type Layers Shielding Irradiation Charge Field	6
Lifetime Prediction Method For IGBT Modules Under Combined Power Cycling–Vibration Conditions	6
IEEE Transactions on Device and Materials Reliability Information for Authors	6
Call for Nominations for Editor-in-Chief IEEE Electron Device Letters	6
Call for Nominations for Editor-in-Chief IEEE Transactions on Semiconductor Manufacturing	6
Introducing IEEE Collabratec	6
Research of Single-Event Burnout in 1.2-kV Rated CoolSiC Trench MOSFET	6
Comprehensive TCAD-Based Single Event Effect Study of TFET-Based 1T DRAM and Crossbar Memory Array	5
White X-Ray Radiation Effects in MOS Capacitors With Atomic Layer Deposited HfO₂/Al₂O₃ and Al₂O₃/HfO₂/Al₂O₃ Gate	5
Metallization Reliability of GaN-Based High-Voltage Light-Emitting Diodes	5
Design of Highly Reliable 14T and 16T SRAM Cells Combined With Layout Harden Technique	5
Table of Contents	5
Correlation of Radiation-Induced Interface Traps With Band Edge Energy Through Band Structure-Based Analysis of Electrostatics of UTB SOI Devices	5
Degradation Mapping and Impact of Device Dimension on IGZO TFTs BTI	5
Lateral and Vertical Gate Oxide Stacking Impact on Noise Margins and Delays for the 8T SRAM Designed With Source Pocket Engineered GaSb/Si Heterojunction Vertical TFET: A Reliability Study	5
Influence of Phase Coarsening on Inhomogeneous Deformation and Fracture Behavior in Sn–Bi Solder Interconnects	5
Analysis of Multicrystalline Si Solar Cell Degradation Due To Reverse Bias and High Temperature Aging	5
Comprehensive Study on Trap-Induced Bias Instability via High-Pressure D ₂ and N ₂ Annealing	5
Trap Location and Stress Degradation Analysis of GaN High Electron Mobility Transistors Based on the Transient Current Method	5
Systematic Reliability Evaluation of FPGA Implemented CNN Accelerators	5
Memristive Switching Behavior of MoO₃ Decorated PSi Heterostructure and Impact of Temperature on Device Reliability	5
Irradiation-Induced Degradation of Surface Acoustic Wave Devices Fabricated on Bulk AlN	5
DAAS: Differential Aging-Aware STA for Precise Timing Closure With Reduced Design Margin	4
2023 Index IEEE Transactions on Device and Materials Reliability Vol. 23	4
Front Cover	4
IEEE Transactions on Device and Materials Reliability information for authors	4
Single-Event Burnout Hardening 4H-SiC UMOSFET Structure	4
Soft-Error-Aware SRAM for Terrestrial Applications	4
Power Durability Enhancement and Failure Analysis of TC-SAW Filter With Ti/Cu/Ti/Cu/Ti Electrodes	4
Correlation of HCD and Percolation Paths in FinFETs: Study of RDF and MGG Impacts Through 3-D Particle-Based Simulation	4
Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part II—Reliability	4
Call for Papers for a Special Issue of IEEE Journal of the Electron Devices Society on "Materials, processing and integration for neuromorphic devices and in-memory computing"	4
Characterization, Analysis, and Modeling of Long-Term RF Reliability and Degradation of SiGe HBTs for High Power Density Applications	4
Failure Mechanisms of Fluorine-Doped Tin Oxide Thin Films in Glass and Reliability Tests	4
Effect of Aging Temperature on the Fatigue Resistance and Shear Strength of SAC305 Solder Joints	4
An Effective Method to Identify Microarchitectural Vulnerabilities in GPUs	4
Modeling Degradation Kinetics of FAPbI₃ Perovskite Solar Cells: Impact of Microstructural and Optoelectronic Defects	4
Prediction of Crack Initiation at Die Corner of Molded Underfill Flip-Chip Packages Under Thermal Load by New Criteria	4
IEEE Transactions on Device and MaterialsReliability publication information	4
IEEE Transactions on Device and Materials Reliability Information for Authors	4
Metastable Operating Stability of Perovskite/Silicon Tandem Solar Cell Module	4
ESR Modeling for Atmospheric Corrosion Behavior of Metallized Film Capacitors	4
Fe-Related Trapping and Detrapping Dynamics in AlGaN/GaN HEMTs Inspected by Drain Current Transient (DCT) Spectroscopy	4
Characterization and Analysis of Hot Carrier Degradation Under DC and Large-Signal RF Stress in a PDSOI Floating-Body NFET-Based Power Amplifier Cell Under WiFi Operating Conditions	3
Study on Electromagnetic Pulse Damage of 22nm FDSOI in Radiation Environment	3
All-Regions Damage Extraction Method for SiC IGBTs Based on C-V Curves	3
Member Get-A-Member (MGM) Program	3
Reliability Characterization of a Low-k Dielectric Using Magnetoresistance as a Diagnostic Tool	3
Call for Papers for a Special Issue of IEEE Journal of the Electron Devices Society on "Materials, processing and integration for neuromorphic devices and in-memory computing"	3
Statistical Model and Transistor Size Effect of Hot Carrier Injection for Stability Reinforced SRAM Physically Unclonable Function	3
Robustness of Pentacene:MoS₂:ZnO Ternary Blend for Optoelectronic Devices	3
QRAM4Space: Dual-Node Radiation-Tolerant Quadruple SRAM for Space Systems	3
Weak Snapback Silicon Controlled Rectifier ESD Device With Double Snapback Characteristics	3
Microstructural Evolution of Gate Oxide in SiC Power MOSFETs Under Heavy-Ion Irradiation	3
Aging Reliability Compact Modeling of Trap Effects in Power GaN HEMTs	3
Failure Mechanism of Aluminum Diffusion in Low-Voltage Trench MOSFET With High Cell Density	3
Sensitivity of Logic Cells to Laser Fault Injections: An Overview of Experimental Results for IHP Technologies	3
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Semiconductor Device Modeling for Circuit and System Design	3
Exploring Non-TAP Interfaces for Efficient and Secure Access to IJTAG Network	3
Table of Contents	3
Analysis of the Degradation of Depletion-Mode GaN High-Electron-Mobility Transistors Under Reverse Pulse Electrical Stress Using the Voltage-Transient Method	3
New Total-Ionizing-Dose Resistant Data Storing Technique for NAND Flash Memory	3
Reliability Analysis of GaAs-PIN Limiter Under Ultra-Wideband Pulse Radiation	3
A Low Cost Triple-Node-Upset Self-Recoverable Latch Design for Nanoscale CMOS	3
Improvement of Encapsulation Technique of Organic Photovoltaics by UV-Curable Adhesive	3
Board Level-Component Solder Joints Normalized Crack Severity Index of Solid-State Drive With Different Reliability Temperature Cycle Test Profiles	3
An Efficient Dynamic Threshold Voltage Detection Scheme for Improving 3-D NAND Flash Reliability	3
EXT-TAURUM P2T: An Extended Secure CAN-FD Architecture for Road Vehicles	3

Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Bandgap Semiconductor Devices for RF and Power Applications"	3
Monitoring Initial Solder Layer Degradation in a Multichip IGBT Module via Combined TSEPs	2
Study on the Effect of Cu Buffer and Cu-wire Bonds on SiC Device Performance	2
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Optimization Techniques for Reliable Low Leakage GNRFET-Based 9T SRAM	2
Thermal Runaway in Thin Film PV: temperature profile modeling	2
Special Issue on Intelligent Sensor Systems for the IEEE Journal of Electron Devices	2
Design and Fabrication of FS-IGBTs With Enhanced Ruggedness and the Influence of Circuit Parameters on Short-Circuit	2
2024 Index IEEE Transactions on Device and Materials Reliability Vol. 24	2
Aging Monitoring Method of Bond Wires-Based on Phase-Frequency Characteristics of Differential Mode Conducted Interference Signal for IGBT Module	2
Research on the Mechanism of Electrical Erosion Accelerating Failure in High-Current Pulse Thyristor-Based Switches	2
Reliability Test of 21% Efficient Flexible Perovskite Solar Cell Under Concave, Convex and Sinusoidal Bending	2
Eight-Level/Cell Storage by Tuning the Spatial Distribution of Dielectrics in a Tri-Layer ReRAM Cell: Electrical Characteristics and Reliability	2
Self-Heating Mapping of the Experimental Device and Its Optimization in Advance Sub-5 nm Node Junctionless Multi-Nanowire FETs	2
Comparative Analysis of SGTMOS Degradation Under Repeated Off-State Avalanche and Short Circuit Current Pulses	2
SafeDE: A Low-Cost Hardware Solution to Enforce Diverse Redundancy in Multicores	2
A Novel Lifetime Estimation Method and Structural Optimization Design for Film Capacitors in EVs Considering Material Aging and Power Losses	2
Predicting the Degradation and Recovery Trends of the Photovoltaic Efficiency of Sb₂Se₃ Antimony Solar Cells	2
Effect of Gamma Radiation on Static DC, Reliability, and RF Performance of Submicron GaN-on-Si RF MIS-HEMTs With In Situ SiN	2
Cause Analysis on the Abnormal Failure of SiC Power Modules During the HV-H³TRB Tests	2
Table of Contents	2
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Drain Extended MOS Body Region Engineering for Switching Reliability Under Unclamped Inductive Load Conditions	2
A 10T Soft-Error-Immune SRAM With Multi-Node Upset Recovery for Low-Power Space Applications	2
Simulation Study of Single-Event Burnout Reliability for 1.7-kV 4H-SiC VDMOSFET	2
Reliability and Optimization Simulation Study of Zero-Temperature-Delay Point in Digital Circuits for Advanced Technology	2
Moisture Dependent Degradation Rate of Silicone in LED Optical Housing Material—Ab-Initio Modelling	1
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Exploration of the exciting world of multifunctional oxide-based electronic devices: from material to system-level applications	1
A Low-Area Overhead and Low-Delay Triple-Node-Upset Self-Recoverable Design Based on Stacked Transistors	1
2022 Index IEEE Transactions on Device and Materials Reliability Vol. 22	1
On-Chip Heater Design and Control Methodology for Reliability Testing Applications Requiring Over 300°C Local Temperatures	1
Mechanisms of Step-Stress Degradation in Carbon-Doped 0.15-μm AlGaN/GaN HEMTs for Power RF Applications	1
Effect of Titanium-Polymer Interactions on Adhesion of Polymer-Copper Redistribution Layers in Advanced Packaging	1
Special Issue on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFTS 2023) in the IEEE Transactions on Device and Materials Reliability	1
BTI-Aware Timing Reliability Improvement of Pulsed Flip-Flops in Nano-Scale CMOS Technology	1
Investigating the Arc-Shaped Kink Drain Voltage of Drain Current With Capacitance-Voltage Measurement Method in GaN HEMTs	1
Effect of Wiring Density and Pillar Structure on Chip Packaging Interaction for Mixed-Signal Cu Low k Chips	1
Improving Single-Event Effect Performance of SiC MOSFET by Excess Hole Extraction	1
Mechanism and Quantitative Modeling of the SRAM Soft Error Induced by Space Electrostatic Discharge	1
Assessing the Reliability of DRAM CMOS Periphery: Comparing AC and DC conditions for BTI and TDDB	1
Investigation of Switching Characteristics Degradation of GaN HEMT Under Power Cycling Aging	1
IEEE Transactions on Device and Materials Reliability Information for Authors	1
Investigation on Traps Dynamics & Negative Bias Stress in D-Mode GaN-on-Si Power MIS HEMTs Under High-Temperature	1
IEEE Transactions on Device and Materials Reliability Publication Information	1
Next-Generation High-Density PCB Development by Fan-Out RDL Technology	1
Die-Attach Influence on Thermal/Electrical Parameters of GaN RF Device	1
The Failure Mechanism of Internal Circuit During ESD Striking a Power to Another Power	1
Unveiling T_max Inside GaN HEMT Based X-Band Low-Noise Amplifier by Correlating Thermal Simulations and IR Thermographic Measurements	1
Multiple Phase Change Materials Integrated Into Power Module for Normal and High Current Reliability Enhancement	1
Thermal Stress Impact on Electrical Conductivity and Microstructure of Thin Aluminum Films Deposited on Polyethylene Terephthalate Substrates	1
Table of Contents	1
An Aging Small-Signal Equivalent Circuit Modeling Method for InP HBT	1
Investigation of the Mechanism of Mixed-gas Plasma Modulation of Indium Oxide Thin-Film Transistor Performance	1
IEEE Transactions on Device and Materials Reliability Publication Information	1
Bridging the Data Gap in Photovoltaics with Synthetic Data Generation	1
Effect of Large Amplitude Thermal Cycles on Power Assemblies Based on Ceramic Heat Sink and Multilayer Pressureless Silver Sintering	1
Table of Contents	1
A Comprehensive Modeling Framework for Charge-Sharing and Bias-Dependent Single Event Transient Prediction in FinFETs	1
Power Cycling Modeling and Lifetime Evaluation of SiC Power MOSFET Module Using a Modified Physical Lifetime Model	1
AdAM: Adaptive Approximate Multiplier for Fault Tolerance in DNN Accelerators	1
Life Cycle Assessment of a Lead-Free Cesium Titanium (IV) Single and Mixed Halide Perovskite Solar Cell Based 1 m² PV Module	1
An Improved Thermal Network Model of Press-Pack IGBT Modules Considering Contact Surface Damage	1
The Achievement of Pulse Laser Deposited Amorphous P-Type N-Doped Ga₂O₃ for Applying in Thin Film Transistor and Homojunction Diode	1
Correction Masking: A Technique to Implement Efficient SET Tolerant Error Correction Decoders	1
Probing Interface Trapping Characteristics of Au/β-Ga₂O₃ Schottky Barrier Diode on Si (100)	1
Special Issue on Semiconductor Design for Manufacturing (DFM)Joint Call for Papers	1
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A Gate-Level SER Estimation Tool With Event-Driven Dynamic Timing and SET Height Consideration	1
A DICE Flip-Flop Design by Resetting Redundancy Hardening for Single Event Upset Tolerance	1
Radiation Hardened Domino Logic-Based Schmitt Trigger Circuit With Improved Noise Immunity	1
Special Issue on Semiconductor Design for Manufacturing (DFM)Joint Call for Papers	0
From Accelerated to Operating Conditions: How Trapped Charge Impacts on TDDB in SiO₂ and HfO₂ Stacks	0
Characterization and Modeling of Hot Carrier Degradation Under Dynamic Operation Voltage	0
An Empirical Study on Fault Detection and Root Cause Analysis of Indium Tin Oxide Electrodes by Processing S-Parameter Patterns	0
Front Cover	0
Utilizing Two Three-Transistor Structures for Designing Radiation Hardened Circuits	0
IEEE Transactions on Device and Materials Reliability Publication Information	0
Single Pulse Charge Pumping Technique Improvement for Interface-States Profiling in the Channel of MOSFET Devices	0
Electromigration Performance Improvement of Metal Heaters for Si Photonic Ring Modulators	0
IEEE Transactions on Device and Materials Reliability Information for Authors	0
Total Ionizing Dose (TID) Impact on Basic Amplifier Stages	0
Solder Dewetting and Reliability Challenges in Microbumps Due to NCF Entrapment	0
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TechRxiv: Share Your Preprint Research with the World!	0
Side-Channel Attack Resilient RHBD 12T SRAM Cell for Secure Nuclear Environment	0
A Thermal Circuit Representing Frequency Dependent Dynamic Heating Between Electron and Lattice in SOI-FinFET	0
Table of Contents	0
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Highly Reproducible and Reliable Methanol Sensor Based on Hydrothermally Grown TiO₂ Nanoparticles	0
ESD Stress Effect on Failure Mechanisms in GaN-on-Si Power Device	0
Call for papers: Special issue on Solid-State Image Sensors	0
Impact of Electro-Thermal Transport on HCI and BTI Lifetime of Twin Nanowire FETs: Different Operational Modes	0
Time-Dependent Dielectric Breakdown in 45-nm PD-SOI N-Channel FETs at Cryogenic Temperatures for Quantum Computing Applications	0
Self-Heating and Reliability-Aware “Intrinsic” Safe Operating Area of Wide Bandgap Semiconductors—An Analytical Approach	0