IEEE Transactions on Device and Materials Reliability

Papers
(The median citation count of IEEE Transactions on Device and Materials Reliability is 0. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2020-11-01 to 2024-11-01.)
ArticleCitations
Critical Insights Into Fast Charging Techniques for Lithium-Ion Batteries in Electric Vehicles48
Quadruple and Sextuple Cross-Coupled SRAM Cell Designs With Optimized Overhead for Reliable Applications37
Design Optimization of Three-Stacked Nanosheet FET From Self-Heating Effects Perspective36
Schottky Gate Induced Threshold Voltage Instabilities in p-GaN Gate AlGaN/GaN HEMTs31
High-Performance Radiation-Hardened Spintronic Retention Latch and Flip-Flop for Highly Reliable Processors24
Design of High-Speed Low Variation Static Noise Margin Ternary S-RAM Cells23
A β-Ga₂O₃ MESFET to Amend the Carrier Distribution by Using a Tunnel Diode20
Single-Event Multiple Effect Tolerant RHBD14T SRAM Cell Design for Space Applications19
LED Lifetime Prediction Under Thermal-Electrical Stress18
Low Conductance State Drift Characterization and Mitigation in Resistive Switching Memories (RRAM) for Artificial Neural Networks18
Short Circuit Detection and Fault Current Limiting Method for IGBTs17
ESD Protection Designs: Topical Overview and Perspective15
Soft-Error-Aware SRAM for Terrestrial Applications15
TCAD Based Investigation of Single Event Transient Effect in Double Channel AlGaN/GaN HEMT14
Aging Diagnosis of Bond Wire Using On-State Drain-Source Voltage Separation for SiC MOSFET14
Reliability Analysis of Power Components in Restructured DC/DC Converters13
CMOS Reliability From Past to Future: A Survey of Requirements, Trends, and Prediction Methods13
Time and Temperature Dependence of Copper Protrusion in Metallized Through-Glass Vias (TGVs) Fabricated in Fused Silica Substrate13
Machine Learning Approach for Prediction of Point Defect Effect in FinFET13
MOZART+: Masking Outputs With Zeros for Improved Architectural Robustness and Testing of DNN Accelerators13
A Gate-Grounded NMOS-Based Dual-Directional ESD Protection With High Holding Voltage for 12V Application13
Monitoring Initial Solder Layer Degradation in a Multichip IGBT Module via Combined TSEPs12
Investigation of Self-Heating Effect in Tree-FETs by Interbridging Stacked Nanosheets: A Reliability Perspective12
A Physics-Based Single Event Transient Pulse Width Model for CMOS VLSI Circuits12
Effect of Wiring Density and Pillar Structure on Chip Packaging Interaction for Mixed-Signal Cu Low k Chips11
Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part I—Initial Characterization11
A 10T Soft-Error-Immune SRAM With Multi-Node Upset Recovery for Low-Power Space Applications11
Solder Joint Reliability Assessment and Pad Size Studies of FO-WLP With Glass Substrate11
Next-Generation High-Density PCB Development by Fan-Out RDL Technology10
Elimination of Thermo-Mechanically Driven Circumferential Crack Formation in Copper Through-Glass via Substrate10
Accelerated Degradation of IGBTs Due to High Gate Voltage at Various Temperature Environments10
Device Screening Strategy for Suppressing Current Imbalance in Parallel-Connected SiC MOSFETs10
Reliability and Performance Analysis of Logic-in-Memory Based Binarized Neural Networks10
Copper Trace Fatigue Life Modeling for Rigid Electronic Assemblies10
Design of Compact Reliable Energy Efficient Read Disturb Free 17T CNFET Ternary S-RAM Cell10
Reliable and Radiation-Hardened Push-Pull pFlash Cell for Reconfigured FPGAs9
Hot Carrier Degradation in MOSFETs at Cryogenic Temperatures Down to 4.2 K9
A Soft Error Detection and Recovery Flip-Flop for Aggressive Designs With High-Performance9
CMOS-Compatible Ex-Situ Incorporated Junctionless Enhancement-Mode Thin Polysilicon Film FET pH Sensor9
Design, Fabrication and Characterization of Single-Crystalline Graphene gNEMS ESD Switches for Future ICs9
Novel ESD Compact Modeling Methodology Using Machine Learning Techniques for Snapback and Non-Snapback ESD Devices9
A New Scheme of the Low-Cost Multiple-Node-Upset-Tolerant Latch9
A Gated-Diode ESD SCR-Incorporated BJT for Reversed Floating P⁺ Junction Modulation8
Self-Heating and Reliability-Aware “Intrinsic” Safe Operating Area of Wide Bandgap Semiconductors—An Analytical Approach8
Effect of Titanium-Polymer Interactions on Adhesion of Polymer-Copper Redistribution Layers in Advanced Packaging8
A Novel DTSCR With Embedded MOS and Island Diodes for ESD Protection of High-Speed ICs8
Trap-Assisted and Stress Induced Safe Operating Area Limits of AlGaN/GaN HEMTs8
Impact of Hot Carrier Aging on the 1/f and Random Telegraph Noise of Short-Channel Triple-Gate Junctionless MOSFETs8
Impact of Gamma-Ray Radiation on DC and RF Performance of 10-nm Bulk N-Channel FinFETs7
The Novel Structure to Enhancement Ion /Ioff Ratio Based on Field Effect Diode7
Accelerated Stress Tests and Statistical Reliability Analysis of Metal-Oxide/GaN Nanostructured Sensor Devices7
Review of Double-Sided Cooling Power Modules for Driving Electric Vehicles7
Using the Octagonal Layout Style for MOSFETs to Boost the Device Matching in Ionizing Radiation Environments7
Study of TID Radiation Effects on the Breakdown Voltage of Buried P-Pillar SOI LDMOSFETs7
Reliability of VO textsubscript 2-Based mmWave Switches Under 100 Million Thermal Cycles7
Single Event Transient (SET) Mitigation Circuits With Immune Leaf Nodes7
Layout-Dominated Dynamic Imbalanced Current Analysis and Its Suppression Strategy of Parallel SiC MOSFETs7
Proton-Induced Effect on AlGaN/GaN HEMTs After Hydrogen Treatment7
Access Region Stack Engineering for Mitigation of Degradation in AlGaN/GaN HEMTs With Field Plate6
Aging Monitoring Method of Bond Wires-Based on Phase-Frequency Characteristics of Differential Mode Conducted Interference Signal for IGBT Module6
Implication of Self-Heating Effect on Device Reliability Characterization of Multi-Finger n-MOSFETs on 22FDSOI6
Impact of Interface Layer on Device Characteristics of Si:HfO2-Based FeFET’s6
BTI and Soft-Error Tolerant Voltage Bootstrapped Schmitt Trigger Circuit6
Improving Breakdown Voltage in AlGaN/GaN Metal-Insulator-Semiconductor HEMTs Through Electric-Field Dispersion Layer Material Selection6
Simulation Study of High-Speed Ge Photodetector Dark and Light Current Degradation6
Qualitative and Quantitative Diagnostic Device for Detecting Defects in Crystalline Silicon PV Cells6
STATE: A Test Structure for Rapid and Reliable Prediction of Resistive RAM Endurance6
High Pressure Deuterium Annealing for Improved Immunity Against Stress-Induced Threshold Voltage Degradation6
Stress Analysis and Characterization of PECVD Oxide/Nitride Multi-Layered Films After Thermal Cycling6
On-Chip Adaptive VDD Scaled Architecture of Reliable SRAM Cell With Improved Soft Error Tolerance5
An Effective Method to Identify Microarchitectural Vulnerabilities in GPUs5
Effect of Aging Temperature on the Fatigue Resistance and Shear Strength of SAC305 Solder Joints5
Simulation Study of Single-Event Burnout Reliability for 1.7-kV 4H-SiC VDMOSFET5
Hybrid Multi-Graphene/Si Avalanche Transit Time <h-ATT> Terahertz Power Oscillator: Theoretical Reliability and Experimental Feasibility Studies5
CD-DFT: A Current-Difference Design-for-Testability to Detect Short Defects of STT-MRAM Under Process Variations5
The Influence of N-Type Buried Layer on SCR ESD Protection Devices5
Strain—Engineered Asymmetrical Si/Si1–xGex IR-Photo-Detector: Theoretical Reliability and Experimental Feasibility Studies5
Single-Event Burnout Hardening 4H-SiC UMOSFET Structure5
LED Reliability Assessment Using a Novel Monte Carlo-Based Algorithm5
Workload-Aware Electromigration Analysis in Emerging Spintronic Memory Arrays5
Impact of Self-Heating on Linearity Performance of In0.53Ga0.47As-Based Gate-All-Around MOSFETs5
Optimization Techniques for Reliable Low Leakage GNRFET-Based 9T SRAM5
Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part II—Reliability5
Optimization of Dual Field Plate AlGaN/GaN HEMTs Using Artificial Neural Networks and Particle Swarm Optimization Algorithm5
Impact of Structural and Process Variations on the Time-Dependent OFF-State Breakdown of p-GaN Power HEMTs5
On the Distribution of Single Defect Threshold Voltage Shifts in SiON Transistors5
Reliability Test of 21% Efficient Flexible Perovskite Solar Cell Under Concave, Convex and Sinusoidal Bending5
Probing the Atomic-Scale Mechanisms of Time-Dependent Dielectric Breakdown in Si/SiO2 MOSFETs (June 2022)5
Electrochemical Migration of Immersion Silver Plated Printed Circuit Boards Contaminated by Dust Solution4
Effect of Capped Cu Layer on Protrusion Behaviors of Through Silicon via Copper (TSV-Cu) Under Double Annealing Conditions: Comparative Study4
High Precision IGBT Health Evaluation Method: Extreme Learning Machine Optimized by Improved Krill Herd Algorithm4
Failure Analysis and Performance Improvement of Phase Change Memory Based on Ge2Sb2Te54
Electromigration Performance Improvement of Metal Heaters for Si Photonic Ring Modulators4
A Modified Bypass Circuit for Improved Reliability of PV Module Validated With Real-Time Data4
Investigation of the Interaction Effect Between the Microstructure Evolution and the Thermo-Mechanical Behavior of Cu-Filled Through Silicon Via4
Mechanisms of Step-Stress Degradation in Carbon-Doped 0.15-μm AlGaN/GaN HEMTs for Power RF Applications4
Mechanism Analysis and Thermal Damage Prediction of High-Power Microwave Radiated CMOS Circuits4
Probing Interface Trapping Characteristics of Au/β-Ga2O3 Schottky Barrier Diode on Si (100)4
Low-Leakage and Variable V HOLD Power Clamp for Wide Stress Time Range From ESD to Surge Test4
Irradiation-Induced Degradation of Surface Acoustic Wave Devices Fabricated on Bulk AlN4
Research of Single-Event Burnout in 1.2-kV Rated CoolSiC Trench MOSFET4
Negative-Bias Temperature Instability of p-GaN Gate GaN-on-Si Power Devices4
Negative Bias-Temperature Instabilities and Low-Frequency Noise in Ge FinFETs4
Effects of Temperature and Bias Voltage on Electron Transport Properties in GaN High-Electron-Mobility Transistors4
Reliability Characterization and Failure Prediction of 3D TLC SSDs in Large-Scale Storage Systems4
Mono-Energetic Proton Induced Damages in SiC Power MOSFETs4
Reliability and Characterization of Nanosilver Joints Prepared by a Time-Reduced Sintering Process4
Categorization of PBTI Mechanisms on 4H-SiC MOSFETs by the Stress Gate Voltage and Channel Plane Orientation4
Metallic Ratio Equivalent-Time Sampling and Application to TDC Linearity Calibration4
Modeling Analysis of BTI-Driven Degradation of a Ring Oscillator Designed in a 28-nm CMOS Technology4
Reflow Residues on Printed Circuit Board Assemblies and Interaction With Humidity4
ESD Stress Effect on Failure Mechanisms in GaN-on-Si Power Device4
Reliable Circuit Design Using a Fast Incremental-Based Gate Sizing Under Process Variation4
Investigating 3D NAND Flash Read Disturb Reliability With Extreme Value Analysis4
Low-Temperature Deuterium Annealing for the Recovery of Ionizing Radiation-Induced Damage in MOSFETs3
Characterization and Analysis of Hot Carrier Degradation Under DC and Large-Signal RF Stress in a PDSOI Floating-Body NFET-Based Power Amplifier Cell Under WiFi Operating Conditions3
Fundamentals of Circuit Failure Analysis Based on Optical Fault Isolation Techniques3
BTI-Aware Timing Reliability Improvement of Pulsed Flip-Flops in Nano-Scale CMOS Technology3
Systematic Reliability Evaluation of FPGA Implemented CNN Accelerators3
Electron Beam Induced Degradation in Electrical Characteristics of Optocoupler3
Measurements and Review of Failure Mechanisms and Reliability Constraints of 4H-SiC Power MOSFETs Under Short Circuit Events3
Self-Heating Mapping of the Experimental Device and Its Optimization in Advance Sub-5 nm Node Junctionless Multi-Nanowire FETs3
Defect-Free and Annealing Influences in P3HT Organic Field-Effect Transistor Performance3
Designing and Reliability Analysis of Radiation Hardened Stacked Gate Junctionless FinFET and CMOS Inverter3
Development of Accelerated Life Testing Apparatus for Light-Emitting Diode Therapy3
Lightweight Read Reference Voltage Calibration Strategy for Improving 3-D TLC NAND Flash Memory Reliability3
Impedance Investigation of MIFM Ferroelectric Tunnel Junction Using a Comprehensive Small-Signal Model3
Immediate Read-After-Write Capability in p-Type Ferroelectric Field-Effect Transistors and Its Evolution With Fatigue Cycling3
Mitigation Technique for Single Event Transient via Pulse Quenching3
Exploiting Resistance Drift Characteristics to Improve Reliability of LDPC-Assisted Phase-Change Memory3
Reliability Challenges in Advanced 3D Technologies: The Case of Through Silicon Vias and SiCN–SiCN Wafer-to-Wafer Hybrid-Bonding Technologies3
Reliability Characterization of a Low-k Dielectric Using Magnetoresistance as a Diagnostic Tool3
Effect of Crack Evolution on the Resistance and Current Density of the Al Metallization in the IGBT Module During Power Cycling3
Correction Masking: A Technique to Implement Efficient SET Tolerant Error Correction Decoders3
Combined Methodology for Accurate Evaluation of Distance and Direction of Chromaticity Shifts in LED Reliability Tests3
Power Durability Enhancement and Failure Analysis of TC-SAW Filter With Ti/Cu/Ti/Cu/Ti Electrodes3
A Comprehensive Study of Total Ionizing Dose Effect on the Electrical Performance of the GaN MIS-HEMT3
A Nonvolatile Multilevel Data Storage Memory Based on Two-Dimensional Materials for Aerospace Applications3
Reliability and Process Scalability of TiO2/Porous Silicon-Based Broadband Photodetectors3
Plasma Charging Damage in HK-First and HK-Last RMG NMOS Devices3
Time-Dependent Dielectric Breakdown in 45-nm PD-SOI N-Channel FETs at Cryogenic Temperatures for Quantum Computing Applications3
Life Cycle Assessment of a Lead-Free Cesium Titanium (IV) Single and Mixed Halide Perovskite Solar Cell Based 1 m² PV Module3
Plasma Induced Charging Damage Causing MOS Device Reliability Lifetime Degradation Originating From Well Charging of a Technology With Deep Trench Isolation2
Simultaneous and Sequential Triggering in Multi-Finger Floating-Base SCRs Depending on TLP Pulse Rise Time2
On-Chip Heater Design and Control Methodology for Reliability Testing Applications Requiring Over 300°C Local Temperatures2
Transient Overshoot Voltages During VF-TLP Pulses for Bipolar Devices in the Presence of Lowly Doped Regions2
A Novel Lifetime Estimation Method and Structural Optimization Design for Film Capacitors in EVs Considering Material Aging and Power Losses2
Lateral and Vertical Gate Oxide Stacking Impact on Noise Margins and Delays for the 8T SRAM Designed With Source Pocket Engineered GaSb/Si Heterojunction Vertical TFET: A Reliability Study2
A 16nm All-Digital Hardware Monitor for Evaluating Electromigration Effects in Signal Interconnects Through Bit-Error-Rate Tracking2
A Thermal Circuit Representing Frequency Dependent Dynamic Heating Between Electron and Lattice in SOI-FinFET2
Popcorning Failures in Polymer and MnO2 Tantalum Capacitors2
SOI FinFET Design Optimization for Radiation Hardening and Performance Enhancement2
Process-Voltage-Temperature Variations Assessment in Energy-Aware Resistive RAM-Based FPGAs2
Stress-Induced Transistor Degradation Studied by an Indentation Approach2
A New SiC Quasi MOSFET for Ultra-Low Specific On-Resistance and Improved Reliability2
4H-SiC Trench Gate Lateral MOSFET With Dual Source Trenches for Improved Performance and Reliability2
Effect of Hydrogen Molecule Release on NBTI by Low-Temperature Pre-Treatment in P-Channel Power VDMOS Transistors2
Thermal Effect on Carbon Nanotube Fiber High-Ampacity Conductors at High Frequencies2
Simulation Study of Stress Effect on Performance and Design Methodology of Proposed Si/SiGe Integrated Bragg Grating Filter2
Various Reliability Investigations of Low Temperature Polycrystalline Silicon Tunnel Field-Effect Thin-Film Transistor2
Linking the Intrinsic Electrical Response of Ferroelectric Devices to Material Properties by Means of Impedance Spectroscopy2
An Analytical Model of Read-Disturb Failure Time in a Post-Cycling Resistive Switching Memory2
A Low-Area Overhead and Low-Delay Triple-Node-Upset Self-Recoverable Design Based on Stacked Transistors2
Correlation of HCD and Percolation Paths in FinFETs: Study of RDF and MGG Impacts Through 3-D Particle-Based Simulation2
Development of Diamond Device-Level Heat Spreader for the Advancement of GaN HEMT Power and RF Electronics2
Power Cycling Modeling and Lifetime Evaluation of SiC Power MOSFET Module Using a Modified Physical Lifetime Model2
SafeDE: A Low-Cost Hardware Solution to Enforce Diverse Redundancy in Multicores2
Comprehensive Study on Trap-Induced Bias Instability via High-Pressure D 2 and N 2 Annealing2
Analysis of Floating Limiting Rings Termination Under Repetitive Avalanche Current Stress for 4H-SiC JBS Rectifiers2
Analysis of Hump Effect Induced by Positive Bias Temperature Instability in the Local Oxidation of Silicon n-MOSFETs2
FEA-Dominant Reliability and Lifetime Model of Double-Sided Cooling SiC Power Module1
Micromechanical Adhesion Experiments and Simulation on Cu-Damascene Processed Test Devices1
Comparative Analysis of PEDOT and ITO Under Thermal Bending and Cycling Stresses: Implications for Flexible Solar Cells1
Effect of Dummy Gate Bias on Breakdown Voltage and Gate Charge of a Novel In0.53Ga0.47As/InP Trench-Gate Pentode Power Device1
Strain Modulated Asymmetrical Si/SiGe Superlattice p+-i-n+ Switches for MMW Low-Loss Secure Communication Systems1
Failure Mechanism and Predictive Modeling for Microbump Interconnects Drop Life Under Diverse Impact Angles in Advanced Packaging1
Frequency Dependent Degradation and Failure of Flexible a-InGaZnO Thin-Film Transistors Under Dynamic Stretch Stress1
Drain Extended MOS Body Region Engineering for Switching Reliability Under Unclamped Inductive Load Conditions1
Eight-Level/Cell Storage by Tuning the Spatial Distribution of Dielectrics in a Tri-Layer ReRAM Cell: Electrical Characteristics and Reliability1
An Improved Thermal Network Model of Press-Pack IGBT Modules Considering Contact Surface Damage1
Investigation of Quantization Effects on RTS Due to Oxide Traps Induced by Channel Hot-Carrier-Stressing in pMOSFETs1
Effect of Ambient on the Field Emission Induced-Damage in Dielectric-Less MEMS Capacitive Structures1
Systematic Unsupervised Recycled Field-Programmable Gate Array Detection1
Failure Mechanism of Aluminum Diffusion in Low-Voltage Trench MOSFET With High Cell Density1
Unveiling Tmax Inside GaN HEMT Based X-Band Low-Noise Amplifier by Correlating Thermal Simulations and IR Thermographic Measurements1
Total Ionizing Dose (TID) Impact on Basic Amplifier Stages1
Investigation of the Long-Term Reliability of a Velostat-Based Flexible Pressure Sensor Array for 210 Days1
New Total-Ionizing-Dose Resistant Data Storing Technique for NAND Flash Memory1
Revealing the Impact of Gate Area Scaling on Charge Trapping Employing SiO2Transistors1
Moisture Dependent Degradation Rate of Silicone in LED Optical Housing Material—Ab-Initio Modelling1
ESR Modeling for Atmospheric Corrosion Behavior of Metallized Film Capacitors1
Electro-Mechanical Properties of Molybdenum Thin Film on Polyethylene Terephthalate Subjected to Tensile Stress1
Thermal Runaway in Thin Film PV: temperature profile modeling1
Degradation Mapping and Impact of Device Dimension on IGZO TFTs BTI1
Single Pulse Charge Pumping Technique Improvement for Interface-States Profiling in the Channel of MOSFET Devices1
Identification of Multiple Failure Mechanisms for Device Reliability Using Differential Evolution1
PEAR: Unbalanced Inter-Page Errors Aware Read Scheme for Latency-Efficient 3-D NAND Flash1
EXT-TAURUM P2T: An Extended Secure CAN-FD Architecture for Road Vehicles1
Negative Bias Temperature Instability in Top-Gated Carbon Nanotube Thin Film Transistors With Y2O3 Gate Dielectric1
Aging and Sintered Layer Defect Detection of Discrete MOSFETs Using Frequency Domain Reflectometry Associated With Parasitic Resistance1
A Study of the Nonlinear Capacitance Variation in Inter Level Copper and Low-k Interconnect Structure1
Optimization of 3-D IC Routing Based on Thermal Equalization Analysis1
Predicting Failure Distributions of SRAM Arrays by Using Extreme Value Statistic, Bit Cell Simulation, and Machine Learning1
Integer Codes Correcting Single Errors and Detecting Burst Errors Within a Byte1
Effect of Large Amplitude Thermal Cycles on Power Assemblies Based on Ceramic Heat Sink and Multilayer Pressureless Silver Sintering1
Compact 3D Thermal Model for VLSI and ULSI Interconnect Network Reliability Verification1
Characterization, Analysis, and Modeling of Long-Term RF Reliability and Degradation of SiGe HBTs for High Power Density Applications1
Universal Dielectric Breakdown Modeling Under Off-State TDDB for Ultra-Scaled Device From 130nm to 28nm Nodes and Beyond1
The Impact of Gold Plating Process for Bonding Pads on Interconnection Quality1
LCHC-DFT: A Low-Cost High-Coverage Design-for-Testability Technique to Detect Hard-to-Detect Faults in STT-MRAMs in the Presence of Process Variations1
Thermal Stress Impact on Electrical Conductivity and Microstructure of Thin Aluminum Films Deposited on Polyethylene Terephthalate Substrates1
Destructive Testing for Reliability Analysis at High-Power Microwave in GaAs/InGaP Hetero-Junction Bipolar Transistor1
Study on Lifetime Modeling of IGBT Modules Considering Electric Frequency Influence Mechanism1
Guidelines for the Design of Random Telegraph Noise-Based True Random Number Generators1
Robustness of Pentacene:MoS2:ZnO Ternary Blend for Optoelectronic Devices1
HEMT Inspired GaN Optical Waveguides: Analysis Under Thermal Stress and Prospects1
A Comprehensive Evaluation of Time-Dependent Dielectric Breakdown of CuAl₂ on SiO₂ for Advanced Interconnect Application1
High Sensitivity Temperature Measurements to Track and Compensate Aging Effects on CMOS Amplifiers0
Editorial for December 20200
2021 IEEE EDS Early Career Award0
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Improvement of Encapsulation Technique of Organic Photovoltaics by UV-Curable Adhesive0
Utilizing Two Three-Transistor Structures for Designing Radiation Hardened Circuits0
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A Review: Breakdown Voltage Enhancement of GaN Semiconductors-Based High Electron Mobility Transistors0
Call for Papers for a Special Issue of IEEE Journal of the Electron Devices Society on "Materials, processing and integration for neuromorphic devices and in-memory computing"0
From Mega to nano: Beyond one Century of Vacuum Electronics0
Characterization of LDO Induced Increment of SEE Sensitivity for 22-nm FDSOI SRAM0
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Characterization and Modeling of Hot Carrier Degradation Under Dynamic Operation Voltage0
Extracting Total Ionizing Dose Threshold Voltage Shifts From Ring Oscillator Circuit Response0
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From Accelerated to Operating Conditions: How Trapped Charge Impacts on TDDB in SiO₂ and HfO₂ Stacks0
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Analysis of Multicrystalline Si Solar Cell Improvement Using Laser-Beam-Induced Current Technique0
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The Characteristics and Reliability With Channel Length Dependent on the Deposited Sequence of SiO₂ and Si₃N₄ as PV in LTPS TFTs0
H2C-TM: A Hybrid High Coverage Test Method for Improving the Detection of HtD Faults in STT-MRAMs0
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