OOIR: Observatory of International Research

Papers

(The median citation count of IEEE Transactions on Device and Materials Reliability is 0. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-05-01 to 2025-05-01.)

Article	Citations
[Front cover]	48
Special Issue on Semiconductor Design for Manufacturing (DFM)Joint Call for Papers	40
IEEE Robert Bosch Micro and Nano Electro Mechanical Systems Award	37
From Mega to nano: Beyond one Century of Vacuum Electronics	26
CD-DFT: A Current-Difference Design-for-Testability to Detect Short Defects of STT-MRAM Under Process Variations	25
A Modified Bypass Circuit for Improved Reliability of PV Module Validated With Real-Time Data	22
Investigation of the Interaction Effect Between the Microstructure Evolution and the Thermo-Mechanical Behavior of Cu-Filled Through Silicon Via	22
Mission Profile-Based Hotspot Temperature and Lifespan Estimation of DC-Link Capacitors Used in Automotive Traction Inverters	22
Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part I—Initial Characterization	20
FEA-Dominant Reliability and Lifetime Model of Double-Sided Cooling SiC Power Module	19
IEEE Transactions on Device and Materials Reliabilityinformation for authors	18
Guidelines for the Design of Random Telegraph Noise-Based True Random Number Generators	18
IEEE Transactions on Device and Materials Reliability Publication Information	17
Device Screening Strategy for Suppressing Current Imbalance in Parallel-Connected SiC MOSFETs	17
IEEE Transactions on Device and Materials Reliability Publication Information	16
Machine Learning Approach for Prediction of Point Defect Effect in FinFET	16
Workload-Aware Electromigration Analysis in Emerging Spintronic Memory Arrays	15
Implication of Self-Heating Effect on Device Reliability Characterization of Multi-Finger n-MOSFETs on 22FDSOI	14
Modeling Analysis of BTI-Driven Degradation of a Ring Oscillator Designed in a 28-nm CMOS Technology	13
A DLTS Study on Deep Trench Processing-Induced Trap States in Silicon Photodiodes	12
Study of TID Radiation Effects on the Breakdown Voltage of Buried P-Pillar SOI LDMOSFETs	12
Research of Single-Event Burnout in P-NiO/n-Ga₂O₃ Heterojunction Diode	12
On the Distribution of Single Defect Threshold Voltage Shifts in SiON Transistors	12
Unveiling the Degradation Mechanism of Polymer-Based Thermal Interface Materials Under Thermo-Oxidative Condition	12
Improving Breakdown Voltage in AlGaN/GaN Metal-Insulator-Semiconductor HEMTs Through Electric-Field Dispersion Layer Material Selection	11

Thermal Effect on Carbon Nanotube Fiber High-Ampacity Conductors at High Frequencies	11
Mitigation Technique for Single Event Transient via Pulse Quenching	11
Fault Modeling and Test Algorithm Development Framework for Gate-All-Around SRAMs	10
IEEE Transactions on Device and Materials Reliability Publication Information	10
Member Get-A-Member (MGM) Program	10
Introducing IEEE Collabratec	10
Failure Mechanism and Predictive Modeling for Microbump Interconnects Drop Life Under Diverse Impact Angles in Advanced Packaging	10
Table of Contents	10
TechRxiv: Share Your Preprint Research with the World!	10
Simulation Study of Stress Effect on Performance and Design Methodology of Proposed Si/SiGe Integrated Bragg Grating Filter	10
Revealing the Impact of Gate Area Scaling on Charge Trapping Employing SiO₂Transistors	10
Impact of Bias Temperature Stress on IGZO/Ni/IGZO Steep Subthreshold Vertical Current Driver Fabricated at Room Temperature	10
IEEE Transactions on Device and Materials Reliability Publication Information	9
Reliability and Characterization of Nanosilver Joints Prepared by a Time-Reduced Sintering Process	9
A Novel Dual-Mode Dual Trench MOSFET With Self-Adjustable Field Plate for Low EMI Noise and High Dynamic Avalanche Robustness	9
Impact of Pulse Voltage Stress on the Reliability of Ferroelectric Thin-Film Transistor	9
IEEE Transactions on Device and Materials Reliability Information for Authors	9
A New SiC Quasi MOSFET for Ultra-Low Specific On-Resistance and Improved Reliability	9
Degradation Behavior and Mechanism of SONOS FLASH by Total Ionization Dose Effects	9
Predicting Failure Distributions of SRAM Arrays by Using Extreme Value Statistic, Bit Cell Simulation, and Machine Learning	9
Effects of Temperature and Bias Voltage on Electron Transport Properties in GaN High-Electron-Mobility Transistors	8
Design, Fabrication and Characterization of Single-Crystalline Graphene gNEMS ESD Switches for Future ICs	8
TechRxiv: Share Your Preprint Research with the World!	8
Designing and Reliability Analysis of Radiation Hardened Stacked Gate Junctionless FinFET and CMOS Inverter	8
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Semiconductor Device Modeling for Circuit and System Design	8
An Analytical Model of Read-Disturb Failure Time in a Post-Cycling Resistive Switching Memory	8
Call for Nominations Editor-in-Chief IEEE Transactions on Device and Materials Reliability	8
Plasma Induced Charging Damage Causing MOS Device Reliability Lifetime Degradation Originating From Well Charging of a Technology With Deep Trench Isolation	8
From Mega to nano: Beyond one Century of Vacuum Electronics	8
Erratum to “Reliability Characterization of a Low-k Dielectric Using Magnetoresistance as a Diagnostic Tool”	8
Blank Page	8
Temperature-Dependent Study of Large-Signal Reliability of p-FET-Based Power Amplifier for mmWave Applications	8
[Blank page]	7
Negative Bias-Temperature Instabilities and Low-Frequency Noise in Ge FinFETs	7
Negative Bias Temperature Instability in Top-Gated Carbon Nanotube Thin Film Transistors With Y₂O₃ Gate Dielectric	7
Reliability of VO textsubscript 2-Based mmWave Switches Under 100 Million Thermal Cycles	7
A Consistent Analytical Method to Assess Reliability of Redundant Safety Instrumented Systems	7
Impact of Hot Carrier Aging on the 1/f and Random Telegraph Noise of Short-Channel Triple-Gate Junctionless MOSFETs	7
Low Conductance State Drift Characterization and Mitigation in Resistive Switching Memories (RRAM) for Artificial Neural Networks	7
Development of Accelerated Life Testing Apparatus for Light-Emitting Diode Therapy	7
Aging and Sintered Layer Defect Detection of Discrete MOSFETs Using Frequency Domain Reflectometry Associated With Parasitic Resistance	7
Evaluations of Gate Oxide Reliability in SiC MOSFETs Under Extremely High Gate Voltage Stress	7
FPGA Assessment Methodology of Adverse X-Ray Effects on Secure Digital Circuits	7
Analysis of Floating Limiting Rings Termination Under Repetitive Avalanche Current Stress for 4H-SiC JBS Rectifiers	6
TechRxiv: Share Your Preprint Research with the World!	6
Exploiting Resistance Drift Characteristics to Improve Reliability of LDPC-Assisted Phase-Change Memory	6
Reflow Residues on Printed Circuit Board Assemblies and Interaction With Humidity	6
TechRxiv: Share Your Preprint Research with the World!	6
Blank Page	6
Influence of Critical Working Conditions on Stability of Varistor Characteristics	6

Negative Capacitance Vertical Dopingless TFET and Its Analog/RF Analysis Using Interface Trap Charges	6
Table of contents	6
IEEE Transactions on Device and MaterialsReliability publication information	6
Research of Single-Event Burnout in 1.2-kV Rated CoolSiC Trench MOSFET	6
Wide Band Gap Semiconductors for Automotive Applications	5
White X-Ray Radiation Effects in MOS Capacitors With Atomic Layer Deposited HfO₂/Al₂O₃ and Al₂O₃/HfO₂/Al₂O₃ Gate	5
Correlation of Radiation-Induced Interface Traps With Band Edge Energy Through Band Structure-Based Analysis of Electrostatics of UTB SOI Devices	5
Lateral and Vertical Gate Oxide Stacking Impact on Noise Margins and Delays for the 8T SRAM Designed With Source Pocket Engineered GaSb/Si Heterojunction Vertical TFET: A Reliability Study	5
Systematic Reliability Evaluation of FPGA Implemented CNN Accelerators	5
Call for Nominations for Editor-in-Chief IEEE Transactions on Semiconductor Manufacturing	5
IEEE Transactions on Device and Materials Reliability Information for Authors	5
Introducing IEEE Collabratec	5
Irradiation-Induced Degradation of Surface Acoustic Wave Devices Fabricated on Bulk AlN	5
Comprehensive Study on Trap-Induced Bias Instability via High-Pressure D ₂ and N ₂ Annealing	5
Design of Highly Reliable 14T and 16T SRAM Cells Combined With Layout Harden Technique	5
Memristive Switching Behavior of MoO3 Decorated PSi Heterostructure and Impact of Temperature on Device Reliability	5
Comprehensive TCAD-Based Single Event Effect Study of TFET-Based 1T DRAM and Crossbar Memory Array	5
Metallization Reliability of GaN-Based High-Voltage Light-Emitting Diodes	5
IEEE Transactions on Device and Materials Reliability Publication Information	5
Degradation Mapping and Impact of Device Dimension on IGZO TFTs BTI	5
Trap Location and Stress Degradation Analysis of GaN High Electron Mobility Transistors Based on the Transient Current Method	5
Table of Contents	5
Call for Nominations for Editor-in-Chief	5
Radiation Hardened SOI LDMOS With Dual P-Type Layers Shielding Irradiation Charge Field	5
An Effective Method to Identify Microarchitectural Vulnerabilities in GPUs	4
Failure Mechanisms of Fluorine-Doped Tin Oxide Thin Films in Glass and Reliability Tests	4
Modeling Degradation Kinetics of FAPbI3 Perovskite Solar Cells: Impact of Microstructural and Optoelectronic Defects	4
IEEE Transactions on Device and MaterialsReliability publication information	4
Power Durability Enhancement and Failure Analysis of TC-SAW Filter With Ti/Cu/Ti/Cu/Ti Electrodes	4
New Total-Ionizing-Dose Resistant Data Storing Technique for NAND Flash Memory	4
ESR Modeling for Atmospheric Corrosion Behavior of Metallized Film Capacitors	4
IEEE Transactions on Device and Materials Reliability information for authors	4
Soft-Error-Aware SRAM for Terrestrial Applications	4
Single-Event Burnout Hardening 4H-SiC UMOSFET Structure	4
Call for Papers for a Special Issue of IEEE Journal of the Electron Devices Society on "Materials, processing and integration for neuromorphic devices and in-memory computing"	4
Characterization and Analysis of Hot Carrier Degradation Under DC and Large-Signal RF Stress in a PDSOI Floating-Body NFET-Based Power Amplifier Cell Under WiFi Operating Conditions	4
Front Cover	4
IEEE Transactions on Device and Materials Reliability Information for Authors	4
Effect of Aging Temperature on the Fatigue Resistance and Shear Strength of SAC305 Solder Joints	4
Characterization, Analysis, and Modeling of Long-Term RF Reliability and Degradation of SiGe HBTs for High Power Density Applications	4
2023 Index IEEE Transactions on Device and Materials Reliability Vol. 23	4
Prediction of Crack Initiation at Die Corner of Molded Underfill Flip-Chip Packages Under Thermal Load by New Criteria	4
Correlation of HCD and Percolation Paths in FinFETs: Study of RDF and MGG Impacts Through 3-D Particle-Based Simulation	4
Failure Mechanism of Aluminum Diffusion in Low-Voltage Trench MOSFET With High Cell Density	3
Call for Papers for a Special Issue of IEEE Journal of the Electron Devices Society on "Materials, processing and integration for neuromorphic devices and in-memory computing"	3
Improvement of Encapsulation Technique of Organic Photovoltaics by UV-Curable Adhesive	3
Robustness of Pentacene:MoS₂:ZnO Ternary Blend for Optoelectronic Devices	3
Table of Contents	3
Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part II—Reliability	3
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Bandgap Semiconductor Devices for RF and Power Applications"	3
An Efficient Dynamic Threshold Voltage Detection Scheme for Improving 3-D NAND Flash Reliability	3
Member Get-A-Member (MGM) Program	3
Optimization Techniques for Reliable Low Leakage GNRFET-Based 9T SRAM	3
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Semiconductor Device Modeling for Circuit and System Design	3
Reliability Characterization and Failure Prediction of 3D TLC SSDs in Large-Scale Storage Systems	3
Analysis of the Degradation of Depletion-Mode GaN High-Electron-Mobility Transistors Under Reverse Pulse Electrical Stress Using the Voltage-Transient Method	3
Aging Reliability Compact Modeling of Trap Effects in Power GaN HEMTs	3
All-Regions Damage Extraction Method for SiC IGBTs Based on C-V Curves	3
[Blank page]	3
Self-Heating Mapping of the Experimental Device and Its Optimization in Advance Sub-5 nm Node Junctionless Multi-Nanowire FETs	3
Reliability Characterization of a Low-k Dielectric Using Magnetoresistance as a Diagnostic Tool	3
Reliability Analysis of GaAs-PIN Limiter Under Ultra-Wideband Pulse Radiation	3
EXT-TAURUM P2T: An Extended Secure CAN-FD Architecture for Road Vehicles	3
IEEE EDS Lester F. Eastman Award	3
Exploring Non-TAP Interfaces for Efficient and Secure Access to IJTAG Network	3
Microstructural Evolution of Gate Oxide in SiC power MOSFETs under Heavy-Ion Irradiation	3
Study on Electromagnetic Pulse Damage of 22nm FDSOI in Radiation Environment	3
A Low Cost Triple-Node-Upset Self-Recoverable Latch Design for Nanoscale CMOS	3
Eight-Level/Cell Storage by Tuning the Spatial Distribution of Dielectrics in a Tri-Layer ReRAM Cell: Electrical Characteristics and Reliability	2
Thermal Runaway in Thin Film PV: temperature profile modeling	2
Reliability and Optimization Simulation Study of Zero-Temperature-Delay Point in Digital Circuits for Advanced Technology	2
2024 Index IEEE Transactions on Device and Materials Reliability Vol. 24	2
Design and Fabrication of FS-IGBTs With Enhanced Ruggedness and the Influence of Circuit Parameters on Short-Circuit	2
Research on the Mechanism of Electrical Erosion Accelerating Failure in High-Current Pulse Thyristor-Based Switches	2
Reliability Test of 21% Efficient Flexible Perovskite Solar Cell Under Concave, Convex and Sinusoidal Bending	2
Table of Contents	2
Comparative Analysis of SGTMOS Degradation Under Repeated Off-State Avalanche and Short Circuit Current Pulses	2
Predicting the Degradation and Recovery Trends of the Photovoltaic Efficiency of Sb₂Se₃ Antimony Solar Cells	2
Aging Monitoring Method of Bond Wires-Based on Phase-Frequency Characteristics of Differential Mode Conducted Interference Signal for IGBT Module	2
Special Issue on Intelligent Sensor Systems for the IEEE Journal of Electron Devices	2

SafeDE: A Low-Cost Hardware Solution to Enforce Diverse Redundancy in Multicores	2
Monitoring Initial Solder Layer Degradation in a Multichip IGBT Module via Combined TSEPs	2
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Cause Analysis on the Abnormal Failure of SiC Power Modules During the HV-H³TRB Tests	2
Drain Extended MOS Body Region Engineering for Switching Reliability Under Unclamped Inductive Load Conditions	2
Investigation on Traps Dynamics & Negative Bias Stress in D-Mode GaN-on-Si Power MIS HEMTs Under High-Temperature	2
A 10T Soft-Error-Immune SRAM With Multi-Node Upset Recovery for Low-Power Space Applications	2
A Novel Lifetime Estimation Method and Structural Optimization Design for Film Capacitors in EVs Considering Material Aging and Power Losses	2
Simulation Study of Single-Event Burnout Reliability for 1.7-kV 4H-SiC VDMOSFET	2
Effect of Titanium-Polymer Interactions on Adhesion of Polymer-Copper Redistribution Layers in Advanced Packaging	1
Moisture Dependent Degradation Rate of Silicone in LED Optical Housing Material—Ab-Initio Modelling	1
Improving Single-Event Effect Performance of SiC MOSFET by Excess Hole Extraction	1
Blank Page	1
Exploration of the exciting world of multifunctional oxide-based electronic devices: from material to system-level applications	1
Life Cycle Assessment of a Lead-Free Cesium Titanium (IV) Single and Mixed Halide Perovskite Solar Cell Based 1 m² PV Module	1
2021 IEEE EDS Early Career Award	1
Bridging the Data Gap in Photovoltaics with Synthetic Data Generation	1
Effect of Wiring Density and Pillar Structure on Chip Packaging Interaction for Mixed-Signal Cu Low k Chips	1
IEEE Transactions on Device and Materials Reliability Publication Information	1
Table of Contents	1
Correction Masking: A Technique to Implement Efficient SET Tolerant Error Correction Decoders	1
IEEE Transactions on Device and Materials Reliability Information for Authors	1
Blank Page	1
Power Cycling Modeling and Lifetime Evaluation of SiC Power MOSFET Module Using a Modified Physical Lifetime Model	1
Reliability Analysis of Storage Systems With Partially Repairable Devices	1
Radiation Hardened Domino Logic-Based Schmitt Trigger Circuit With Improved Noise Immunity	1
The Failure Mechanism of Internal Circuit During ESD Striking a Power to Another Power	1
Unveiling T_max Inside GaN HEMT Based X-Band Low-Noise Amplifier by Correlating Thermal Simulations and IR Thermographic Measurements	1
Special Issue on Semiconductor Design for Manufacturing (DFM)Joint Call for Papers	1
An Improved Thermal Network Model of Press-Pack IGBT Modules Considering Contact Surface Damage	1
2022 Index IEEE Transactions on Device and Materials Reliability Vol. 22	1
Investigating the Arc-Shaped Kink Drain Voltage of Drain Current With Capacitance-Voltage Measurement Method in GaN HEMTs	1
Next-Generation High-Density PCB Development by Fan-Out RDL Technology	1
A Gate-Level SER Estimation Tool With Event-Driven Dynamic Timing and SET Height Consideration	1
BTI-Aware Timing Reliability Improvement of Pulsed Flip-Flops in Nano-Scale CMOS Technology	1
Multiple Phase Change Materials Integrated Into Power Module for Normal and High Current Reliability Enhancement	1
A Low-Area Overhead and Low-Delay Triple-Node-Upset Self-Recoverable Design Based on Stacked Transistors	1
Investigation of Switching Characteristics Degradation of GaN HEMT Under Power Cycling Aging	1
The Achievement of Pulse Laser Deposited Amorphous p-Type N-Doped Ga2O3 for Applying in Thin Film Transistor and Homojunction Diode	1
Table of Contents	1
Effect of Large Amplitude Thermal Cycles on Power Assemblies Based on Ceramic Heat Sink and Multilayer Pressureless Silver Sintering	1
Die-Attach Influence on Thermal/Electrical Parameters of GaN RF Device	1
AdAM: Adaptive Approximate Multiplier for Fault Tolerance in DNN Accelerators	1
Special Issue on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFTS 2023) in the IEEE Transactions on Device and Materials Reliability	1
Thermal Stress Impact on Electrical Conductivity and Microstructure of Thin Aluminum Films Deposited on Polyethylene Terephthalate Substrates	1
Mechanisms of Step-Stress Degradation in Carbon-Doped 0.15-μm AlGaN/GaN HEMTs for Power RF Applications	1
An Aging Small-Signal Equivalent Circuit Modeling Method for InP HBT	1
Mechanism and Quantitative Modeling of the SRAM Soft Error Induced by Space Electrostatic Discharge	1
Probing Interface Trapping Characteristics of Au/β-Ga₂O₃ Schottky Barrier Diode on Si (100)	1
On-Chip Heater Design and Control Methodology for Reliability Testing Applications Requiring Over 300°C Local Temperatures	1
A Thermal Circuit Representing Frequency Dependent Dynamic Heating Between Electron and Lattice in SOI-FinFET	0
Special Issue on Semiconductor Design for Manufacturing (DFM)Joint Call for Papers	0
Utilizing Two Three-Transistor Structures for Designing Radiation Hardened Circuits	0
IEEE Transactions on Device and Materials Reliability Publication Information	0
Systematic Unsupervised Recycled Field-Programmable Gate Array Detection	0
Fundamentals of Circuit Failure Analysis Based on Optical Fault Isolation Techniques	0
An Empirical Study on Fault Detection and Root Cause Analysis of Indium Tin Oxide Electrodes by Processing S-Parameter Patterns	0
IEEE Transactions on Device and Materials Reliability Information for Authors	0
Time-Dependent Dielectric Breakdown in 45-nm PD-SOI N-Channel FETs at Cryogenic Temperatures for Quantum Computing Applications	0
LED Lifetime Prediction Under Thermal-Electrical Stress	0
Evidence of Hot-Hole Induced Degradation in Lateral NDRIFT MOSFET: Characterization and TCAD Analysis	0
ESD Stress Effect on Failure Mechanisms in GaN-on-Si Power Device	0
Highly Reproducible and Reliable Methanol Sensor Based on Hydrothermally Grown TiO₂ Nanoparticles	0
Review of Double-Sided Cooling Power Modules for Driving Electric Vehicles	0
High-Performance Radiation-Hardened Spintronic Retention Latch and Flip-Flop for Highly Reliable Processors	0
Self-Heating and Reliability-Aware “Intrinsic” Safe Operating Area of Wide Bandgap Semiconductors—An Analytical Approach	0
IEEE Transactions on Device and Materials Reliability Information for Authors	0
Total Ionizing Dose (TID) Impact on Basic Amplifier Stages	0
Front Cover	0
Blank Page	0
Table of Contents	0
From Accelerated to Operating Conditions: How Trapped Charge Impacts on TDDB in SiO₂ and HfO₂ Stacks	0
TechRxiv: Share Your Preprint Research with the World!	0
4H-SiC Trench Gate Lateral MOSFET With Dual Source Trenches for Improved Performance and Reliability	0
H²C-TM: A Hybrid High Coverage Test Method for Improving the Detection of HtD Faults in STT-MRAMs	0
The Novel Structure to Enhancement I_on /I_off Ratio Based on Field Effect Diode	0
Reliability Challenges in Advanced 3D Technologies: The Case of Through Silicon Vias and SiCN–SiCN Wafer-to-Wafer Hybrid-Bonding Technologies	0
IEEE Transactions on Device and Materials Reliability Information for Authors	0
Effect of Ambient on the Field Emission Induced-Damage in Dielectric-Less MEMS Capacitive Structures	0
IEEE Transactions on Device and Materials Reliability Publication Information	0
The Influence of Bond Wire Aging on DM EMI Noise in IGBT Converters Considering High-Frequency Ringing	0
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Characterization and Modeling of Hot Carrier Degradation Under Dynamic Operation Voltage	0
Table of Contents	0
Robust System Design IEEE IOLTS 2021	0
TechRxiv: Share Your Preprint Research with the World!	0
Front Cover	0
Side-Channel Attack Resilient RHBD 12T SRAM Cell for Secure Nuclear Environment	0
IEEE Transactions on Device and Materials Reliability Publication Information	0
Strain Modulated Asymmetrical Si/SiGe Superlattice p+-i-n+ Switches for MMW Low-Loss Secure Communication Systems	0
Extracting Total Ionizing Dose Threshold Voltage Shifts From Ring Oscillator Circuit Response	0
An Equivalent Circuit Model of 12nm P-FinFET for NBTI Effect	0
Call for papers: Special issue on Solid-State Image Sensors	0
Device Reliability and Effect of Temperature on Memristors: Nanostructured V₂O₅	0
2021 EDS EDUCATION AWARD CALL FOR NOMINATIONS	0