IEEE Transactions on Device and Materials Reliability

Papers
(The H4-Index of IEEE Transactions on Device and Materials Reliability is 18. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-06-01 to 2026-06-01.)
ArticleCitations
From Mega to nano: Beyond one Century of Vacuum Electronics59
Special Issue on Semiconductor Design for Manufacturing (DFM)Joint Call for Papers56
Editorial35
Location-Aware Error Correction for Mitigating the Impact of Interconnects on STT-MRAM Reliability32
Guidelines for the Design of Random Telegraph Noise-Based True Random Number Generators32
Sintered Silver-Based Direct-Cooled IGBTs With High Output Power and Thermal Reliability30
Package-Level Electro-Thermal Simulation With Transient Thermal Resistance Model for Surge Stress Failure Analysis of SiC MOSFET29
On the Response Time Constant of Interface Defects in Accumulation26
Investigation of the Interaction Effect Between the Microstructure Evolution and the Thermo-Mechanical Behavior of Cu-Filled Through Silicon Via23
Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part I—Initial Characterization22
A Modified Bypass Circuit for Improved Reliability of PV Module Validated With Real-Time Data22
Mission Profile-Based Hotspot Temperature and Lifespan Estimation of DC-Link Capacitors Used in Automotive Traction Inverters22
IEEE Transactions on Device and Materials Reliability Publication Information20
FEA-Dominant Reliability and Lifetime Model of Double-Sided Cooling SiC Power Module20
IEEE Transactions on Device and Materials Reliability Publication Information19
Implication of Self-Heating Effect on Device Reliability Characterization of Multi-Finger n-MOSFETs on 22FDSOI18
Modeling Analysis of BTI-Driven Degradation of a Ring Oscillator Designed in a 28-nm CMOS Technology18
Reliability of Advanced Nodes18
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