IEEE Transactions on Device and Materials Reliability

Papers
(The H4-Index of IEEE Transactions on Device and Materials Reliability is 15. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-07-01 to 2025-07-01.)
ArticleCitations
Special Issue on Semiconductor Design for Manufacturing (DFM)Joint Call for Papers49
From Mega to nano: Beyond one Century of Vacuum Electronics46
CD-DFT: A Current-Difference Design-for-Testability to Detect Short Defects of STT-MRAM Under Process Variations31
Investigation of the Interaction Effect Between the Microstructure Evolution and the Thermo-Mechanical Behavior of Cu-Filled Through Silicon Via25
Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part I—Initial Characterization24
A Modified Bypass Circuit for Improved Reliability of PV Module Validated With Real-Time Data22
Mission Profile-Based Hotspot Temperature and Lifespan Estimation of DC-Link Capacitors Used in Automotive Traction Inverters22
FEA-Dominant Reliability and Lifetime Model of Double-Sided Cooling SiC Power Module20
Guidelines for the Design of Random Telegraph Noise-Based True Random Number Generators19
IEEE Transactions on Device and Materials Reliability Publication Information18
Reliability of Advanced Nodes18
A DLTS Study on Deep Trench Processing-Induced Trap States in Silicon Photodiodes18
Device Screening Strategy for Suppressing Current Imbalance in Parallel-Connected SiC MOSFETs18
IEEE Transactions on Device and Materials Reliability Publication Information16
Unveiling the Degradation Mechanism of Polymer-Based Thermal Interface Materials Under Thermo-Oxidative Condition15
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