Microelectronics International

Papers
(The TQCC of Microelectronics International is 2. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2020-02-01 to 2024-02-01.)
ArticleCitations
Additive manufacturing revolution in ceramic microsystems16
The interfacial reliability of through-glass vias for 2.5D integrated circuits12
MEMS piezoresistive pressure sensor with patterned thinning of diaphragm9
Properties of glass/epoxy sandwich structure for electronic boards7
Integration of perovskite Pb[Zr0.35Ti0.65]O3/HfO2 ferroelectric-dielectric composite film on Si substrate7
Atomic layer deposition of TiO2 blocking layers for dye-sensitized solar cells6
A novel miniaturized Koch-Minkowski hybrid fractal antenna5
Implementation of capacitance as simultaneous sensing and actuating tool in tapered microelectrode arrays for dielectrophoresis-on-a-chip application5
An efficient design of dual-axis MEMS accelerometer considering microfabrication process limitations and operating environment variations4
Compact dual-mode microstrip bandpass filter based on slotted square patch resonator4
High-transconductance silicon carbide nanowire-based field-effect transistor (SiC-NWFET) for high-temperature applications3
Recent progress on bumpless Cu/SiO2 hybrid bonding for 3D heterogeneous integration3
Preliminary dielectrophoresis study: Manipulation of protein albumin and electrical quantification by using cyclic voltammetry technique3
Fabrication of fluorine and silver co-doped ZnO photodetector using modified hydrothermal method3
Optimization of flexible printed circuit board’s cooling with air flow and thermal effects using response surface methodology3
A fault-tolerant design for a digital comparator based on nano-scale quantum-dotcellular automata3
Effects of V/III ratio of InGaN quantum well at high growth temperature for near ultraviolet light emitting diodes3
Dynamic dielectric properties characterization of tapered dielectrophoresis microelectrodes for selective detection and rapid manipulation of cells3
Willemite with Li2CO3 as a sintering aid for LTCC microwave substrates2
Multilayer ferrite inductors for the use at high temperatures2
N-face GaN substrate roughening for improved performance GaN-on-GaN LED2
Influence of different etching methods on the structural properties of porous silicon2
Effect of alloy particle size and stencil aperture shape on solder printing quality2
A 1-mm2 CMOS-pipelined ADC with integrated folded cascode operational amplifier2
Novel implementation of 3D multiplexers in nano magnetic logic technology2
Effects of three-step magnesium doping in p-GaN layer on the properties of InGaN-based light-emitting diode2
Data acquisition and processing circuit for high-temperature logging up to 200°C2
Improving the electromagnetic compatibility of electronic products by using response surface methodology and artificial neural network2
A fully matched dual stage CMOS power amplifier with integrated passive linearizer attaining 23 db gain, 40% PAE and 28 DBM OIP32
Investigations of temperature sensor embedded into PCB2
Fabrication and characterization of mixed thin-/thick-film thermoelectric microgenerator based on constantan/chromium and silver arms2
Fabrication of UV ZnO NRS photodetector based on seeded silicon substrate via the drop-casting technique2
Two-step flash sintering of (Mg1/3Ta2/3)0.01Ti0.99O2 giant dielectric ceramics2
Influence of selected factors on parameters of a cooling system with a Peltier module and forced air flow2
Influence of copper pillar bump structure on flip chip packaging during reflow soldering: a numerical approach2
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