Microelectronics International

Papers
(The TQCC of Microelectronics International is 2. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2020-07-01 to 2024-07-01.)
ArticleCitations
The interfacial reliability of through-glass vias for 2.5D integrated circuits14
Recent progress on bumpless Cu/SiO2 hybrid bonding for 3D heterogeneous integration6
Implementation of capacitance as simultaneous sensing and actuating tool in tapered microelectrode arrays for dielectrophoresis-on-a-chip application6
High-transconductance silicon carbide nanowire-based field-effect transistor (SiC-NWFET) for high-temperature applications5
Compact dual-mode microstrip bandpass filter based on slotted square patch resonator5
A novel miniaturized Koch-Minkowski hybrid fractal antenna5
An efficient design of dual-axis MEMS accelerometer considering microfabrication process limitations and operating environment variations5
N-face GaN substrate roughening for improved performance GaN-on-GaN LED4
Fabrication of fluorine and silver co-doped ZnO photodetector using modified hydrothermal method4
Preliminary dielectrophoresis study: Manipulation of protein albumin and electrical quantification by using cyclic voltammetry technique4
Dynamic dielectric properties characterization of tapered dielectrophoresis microelectrodes for selective detection and rapid manipulation of cells4
Optimization of flexible printed circuit board’s cooling with air flow and thermal effects using response surface methodology3
Real-time contact angle’s measurement of molten solder balls in laboratory conditions3
A fault-tolerant design for a digital comparator based on nano-scale quantum-dotcellular automata3
Two-step flash sintering of (Mg1/3Ta2/3)0.01Ti0.99O2 giant dielectric ceramics3
Effect of alloy particle size and stencil aperture shape on solder printing quality3
Effects of V/III ratio of InGaN quantum well at high growth temperature for near ultraviolet light emitting diodes3
Influence of different etching methods on the structural properties of porous silicon3
Investigations of temperature sensor embedded into PCB3
Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees2
A DFT+U study of structural, electronic and optical properties of Ag- and Cu-doped ZnO2
Advanced utilization of 3D digital image correlation for thermal and impact reliabilities of electronics components2
Cylindrical conformal wideband antenna with enhancement of gain using integrated parasitic triangular shaped elements for WiMAX application2
Improving the electromagnetic compatibility of electronic products by using response surface methodology and artificial neural network2
A 1-mm2 CMOS-pipelined ADC with integrated folded cascode operational amplifier2
Novel implementation of 3D multiplexers in nano magnetic logic technology2
Identification of printed circuit boards mechanical properties using response surface methods2
Synthesis and characterization of ZnO based varistor ceramics: effect of sintering temperatures2
Influence of Ag particle shape on mechanical and thermal properties of TIM joints2
A fully matched dual stage CMOS power amplifier with integrated passive linearizer attaining 23 db gain, 40% PAE and 28 DBM OIP32
Effects of three-step magnesium doping in p-GaN layer on the properties of InGaN-based light-emitting diode2
Improvement of inter layer dielectric crack for LQFP C90FG wafer technology devices in copper wire bonding process2
Fabrication of UV ZnO NRS photodetector based on seeded silicon substrate via the drop-casting technique2
Influence of selected factors on parameters of a cooling system with a Peltier module and forced air flow2
Influence of copper pillar bump structure on flip chip packaging during reflow soldering: a numerical approach2
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