OOIR: Observatory of International Research

Papers

(The TQCC of Microelectronics International is 2. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-02-01 to 2025-02-01.)

Article	Citations
A failure location technology for SiP devices based on TDR nondestructive testing method	6
On the methodology of calculating volume charge density in a MIFGMOS substrate using Poisson’s equation	6
Reliability evaluation on SRG with full-bridge power converter considering thermal stress	6
Influence of copper pillar bump structure on flip chip packaging during reflow soldering: a numerical approach	5
An improved parallel five-level reinjection CSC for self-commutation of thyristor converter	5
Design of UWB MIMO antenna using lean wearable textile substrate for reduced SAR	5
The preparation of anisotropic conductive paste and its application in FOB interconnection	4
A fully matched dual stage CMOS power amplifier with integrated passive linearizer attaining 23 db gain, 40% PAE and 28 DBM OIP3	4
Model of boron diffusion in silicon used for solar cell fabrication based on boric acid solutions	4
Packaging design and thermal analysis for 1 mm² high power VCSEL	3
Preliminary dielectrophoresis study: Manipulation of protein albumin and electrical quantification by using cyclic voltammetry technique	3
Design and implementation of miniaturized tri-band microwave bandpass filter	3
Structural analysis of paper substrate for flexible microfluidics device application	3
Magnetic alignment technology for wafer bonding	3
Effect of alloy particle size and stencil aperture shape on solder printing quality	3
An investigation of physical properties and photovoltaic performance of methylammonium lead-tin iodide (CH₃NH₃Sn₁-xPbxI₃) solar cells	3
Strengthening mechanisms of Cu/SACZ/Al micro-connection joints with solid-state bonding	3
Radiation-hardened flip-flop for single event upset tolerance	3
A 1.8 V high-speed 8-bit hybrid DAC with integrated rail-to-rail buffer amplifier in CMOS 180 nm	2
Influence of selected factors on parameters of a cooling system with a Peltier module and forced air flow	2
Facile ligand-exchange strategy to promote low-temperature nano-sintering of oleylamine-capped Ag nanoparticles	2
Key techniques of ultra-low-power ADC and miniaturized RF transceiver circuits for 4G/LTE applications	2
Design of radio frequency power amplifier for 2.45 GHz IoT application using 0.18 µm CMOS technology	2
Influence of different etching methods on the structural properties of porous silicon	2
Improving the electromagnetic compatibility of electronic products by using response surface methodology and artificial neural network	2

Atomic structure for AlN grown on different plane orientation of sapphire via numerical study	2
Influence of Ag particle shape on mechanical and thermal properties of TIM joints	2
Double-sided silicon vias (DSSVs) interconnection for large-sized interposer fabrication	2
Real-time contact angle’s measurement of molten solder balls in laboratory conditions	2
Preparation and characterization of doped LiZn_0.92Cu_0.08PO₄ ceramic for microwave and millimeter-wave substrates	2
Defected microstrip structure-based near-end and far-end crosstalk mitigation in high-speed PCBs for mixed signals	2
Deformation and crack growth in multilayered ceramic capacitor during thermal reflow process: numerical and experimental investigation	2
Retraction notice: Packaging design and thermal analysis for 1 mm² high power VCSEL	2
Guest editorial	2