Microelectronics International

Papers
(The TQCC of Microelectronics International is 3. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-06-01 to 2026-06-01.)
ArticleCitations
A failure location technology for SiP devices based on TDR nondestructive testing method22
Publisher’s note8
The preparation of anisotropic conductive paste and its application in FOB interconnection8
Strengthening mechanisms of Cu/SACZ/Al micro-connection joints with solid-state bonding8
Magnetic alignment technology for wafer bonding7
Real-time contact angle’s measurement of molten solder balls in laboratory conditions7
Facile ligand-exchange strategy to promote low-temperature nano-sintering of oleylamine-capped Ag nanoparticles6
Atomic structure for AlN grown on different plane orientation of sapphire via numerical study6
Comparative reliability evaluation of lightweight transmission systems for far-sea offshore wind power5
Quasi-elliptic band pass filter using resonators based on coupling theory for ultra-wide band applications5
A modal analysis based optimal mounting support locations of a printed circuit board5
Study of the electronic transport performance of ZnO-SiO2 film: the construction of grain boundary barrier5
Improving displacement of silicon V-shaped electrothermal microactuator using platinum sputter deposition process5
Online electrochemical impedance spectroscopy measurement for lithium-ion batteries based on real-time operating data of interface converters4
W-band antenna in package module with hybrid glass-compound WLFO process4
Influence of Ag particle shape on mechanical and thermal properties of TIM joints4
Transient stability enhancement strategy of grid-forming inverter based on adaptive q-axis voltage feedback4
Extreme temperature thermal shock induced microstructure degradation and shear property deterioration of Sn3.0Ag0.5Cu/Cu solder joints4
3-pass and 5-pass laser grooving & die strength characterization for reinforced internal low-k 55nm node wafer structure via heat-treatment process4
RETRACTED: Packaging design and thermal analysis for 1 mm2 high power VCSEL4
Effects of interface cracks on reliability of surface mount technology interconnection in service environment4
Fabrication of fluorine and silver co-doped ZnO photodetector using modified hydrothermal method3
Effect of reflow temperature and solder size on Cu-Ni cross-interaction in the Cu/Sn/Ni micro solder joints3
Guest editorial: Heterogeneous integration and chiplets interconnection3
Publisher’s note3
Experimental study on the fracture behavior variation of the Au stud bump bonding with different high temperature storage times3
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