OOIR: Observatory of International Research

Papers

(The TQCC of Microelectronics International is 3. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-05-01 to 2026-05-01.)

Article	Citations
A failure location technology for SiP devices based on TDR nondestructive testing method	22
Design and implementation of miniaturized tri-band microwave bandpass filter	8
Strengthening mechanisms of Cu/SACZ/Al micro-connection joints with solid-state bonding	8
The preparation of anisotropic conductive paste and its application in FOB interconnection	8
Publisher’s note	7
Magnetic alignment technology for wafer bonding	7
Real-time contact angle’s measurement of molten solder balls in laboratory conditions	7
Atomic structure for AlN grown on different plane orientation of sapphire via numerical study	6
Study of the electronic transport performance of ZnO-SiO₂ film: the construction of grain boundary barrier	5
A modal analysis based optimal mounting support locations of a printed circuit board	5
Quasi-elliptic band pass filter using resonators based on coupling theory for ultra-wide band applications	5
Online electrochemical impedance spectroscopy measurement for lithium-ion batteries based on real-time operating data of interface converters	5
Comparative reliability evaluation of lightweight transmission systems for far-sea offshore wind power	5
Facile ligand-exchange strategy to promote low-temperature nano-sintering of oleylamine-capped Ag nanoparticles	5
Improving displacement of silicon V-shaped electrothermal microactuator using platinum sputter deposition process	5
3-pass and 5-pass laser grooving & die strength characterization for reinforced internal low-k 55nm node wafer structure via heat-treatment process	4
W-band antenna in package module with hybrid glass-compound WLFO process	4
RETRACTED: Packaging design and thermal analysis for 1 mm2 high power VCSEL	4
Influence of different etching methods on the structural properties of porous silicon	4
Influence of Ag particle shape on mechanical and thermal properties of TIM joints	4
Transient stability enhancement strategy of grid-forming inverter based on adaptive q-axis voltage feedback	4
Extreme temperature thermal shock induced microstructure degradation and shear property deterioration of Sn3.0Ag0.5Cu/Cu solder joints	4
Effects of interface cracks on reliability of surface mount technology interconnection in service environment	3
Fabrication of fluorine and silver co-doped ZnO photodetector using modified hydrothermal method	3
Effect of reflow temperature and solder size on Cu-Ni cross-interaction in the Cu/Sn/Ni micro solder joints	3

Guest editorial: Heterogeneous integration and chiplets interconnection	3
Publisher’s note	3
Comparative study on solid-solid interfacial reaction and bonding property of Sn-Ag-Cu/Ni-P joints by laser and reflow soldering	3
Experimental study on the fracture behavior variation of the Au stud bump bonding with different high temperature storage times	3