Microelectronics International

Papers
(The TQCC of Microelectronics International is 2. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2020-10-01 to 2024-10-01.)
ArticleCitations
Recent progress on bumpless Cu/SiO2 hybrid bonding for 3D heterogeneous integration6
Real-time contact angle’s measurement of molten solder balls in laboratory conditions6
High-transconductance silicon carbide nanowire-based field-effect transistor (SiC-NWFET) for high-temperature applications6
Compact dual-mode microstrip bandpass filter based on slotted square patch resonator5
An efficient design of dual-axis MEMS accelerometer considering microfabrication process limitations and operating environment variations5
A novel miniaturized Koch-Minkowski hybrid fractal antenna5
N-face GaN substrate roughening for improved performance GaN-on-GaN LED4
Preliminary dielectrophoresis study: Manipulation of protein albumin and electrical quantification by using cyclic voltammetry technique4
Fabrication of fluorine and silver co-doped ZnO photodetector using modified hydrothermal method4
The advanced leadless leadframe package and its characteristics3
Optimization of flexible printed circuit board’s cooling with air flow and thermal effects using response surface methodology3
Influence of different etching methods on the structural properties of porous silicon3
Identification of printed circuit boards mechanical properties using response surface methods3
Two-step flash sintering of (Mg1/3Ta2/3)0.01Ti0.99O2 giant dielectric ceramics3
Effect of alloy particle size and stencil aperture shape on solder printing quality3
A fault-tolerant design for a digital comparator based on nano-scale quantum-dotcellular automata3
Effects of V/III ratio of InGaN quantum well at high growth temperature for near ultraviolet light emitting diodes3
Influence of Ag particle shape on mechanical and thermal properties of TIM joints3
Improving the electromagnetic compatibility of electronic products by using response surface methodology and artificial neural network2
A fully matched dual stage CMOS power amplifier with integrated passive linearizer attaining 23 db gain, 40% PAE and 28 DBM OIP32
Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees2
A DFT+U study of structural, electronic and optical properties of Ag- and Cu-doped ZnO2
Synthesis and characterization of ZnO based varistor ceramics: effect of sintering temperatures2
Effects of interface cracks on reliability of surface mount technology interconnection in service environment2
Influence of selected factors on parameters of a cooling system with a Peltier module and forced air flow2
Influence of copper pillar bump structure on flip chip packaging during reflow soldering: a numerical approach2
Surface quality prediction and lapping process optimisation on the fixed-abrasive lapping plate of sapphire wafers2
Improvement of inter layer dielectric crack for LQFP C90FG wafer technology devices in copper wire bonding process2
Advanced utilization of 3D digital image correlation for thermal and impact reliabilities of electronics components2
Cylindrical conformal wideband antenna with enhancement of gain using integrated parasitic triangular shaped elements for WiMAX application2
The preparation of anisotropic conductive paste and its application in FOB interconnection2
Comparative study on solid-solid interfacial reaction and bonding property of Sn-Ag-Cu/Ni-P joints by laser and reflow soldering2
Effects of three-step magnesium doping in p-GaN layer on the properties of InGaN-based light-emitting diode2
Fabrication of UV ZnO NRS photodetector based on seeded silicon substrate via the drop-casting technique2
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