OOIR: Observatory of International Research

Papers

(The TQCC of Microelectronics International is 2. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-05-01 to 2025-05-01.)

Article	Citations
A failure location technology for SiP devices based on TDR nondestructive testing method	11
The preparation of anisotropic conductive paste and its application in FOB interconnection	6
Strengthening mechanisms of Cu/SACZ/Al micro-connection joints with solid-state bonding	6
Design and implementation of miniaturized tri-band microwave bandpass filter	5
Influence of selected factors on parameters of a cooling system with a Peltier module and forced air flow	5
Atomic structure for AlN grown on different plane orientation of sapphire via numerical study	5
Quasi-elliptic band pass filter using resonators based on coupling theory for ultra-wide band applications	4
Real-time contact angle’s measurement of molten solder balls in laboratory conditions	4
Computer‐aided selective production of low-resistance NiP and NiCuP layers	4
Magnetic alignment technology for wafer bonding	4
Improving displacement of silicon V-shaped electrothermal microactuator using platinum sputter deposition process	4
Study of the electronic transport performance of ZnO-SiO₂ film: the construction of grain boundary barrier	4
Facile ligand-exchange strategy to promote low-temperature nano-sintering of oleylamine-capped Ag nanoparticles	4
A modal analysis based optimal mounting support locations of a printed circuit board	3
High-transconductance silicon carbide nanowire-based field-effect transistor (SiC-NWFET) for high-temperature applications	3
Influence of Ag particle shape on mechanical and thermal properties of TIM joints	3
3-pass and 5-pass laser grooving & die strength characterization for reinforced internal low-k 55nm node wafer structure via heat-treatment process	3
Packaging design and thermal analysis for 1 mm² high power VCSEL	3
Influence of copper pillar bump structure on flip chip packaging during reflow soldering: a numerical approach	3
Effects of V/III ratio of InGaN quantum well at high growth temperature for near ultraviolet light emitting diodes	3
Improvement of c-axis (002) AlN crystal plane by temperature assisted HiPIMS technique	3
Influence of different etching methods on the structural properties of porous silicon	3
Effects of interface cracks on reliability of surface mount technology interconnection in service environment	2
Guest editorial: Heterogeneous integration and chiplets interconnection	2
Identification of printed circuit boards mechanical properties using response surface methods	2

A chemosensitive-based ammonia gas sensor with PANI/PEO–ZnO nanofiber composites sensing layer	2
Model of boron diffusion in silicon used for solar cell fabrication based on boric acid solutions	2
Recent progress on bumpless Cu/SiO₂ hybrid bonding for 3D heterogeneous integration	2
W-band antenna in package module with hybrid glass-compound WLFO process	2
Effects of three-step magnesium doping in p-GaN layer on the properties of InGaN-based light-emitting diode	2
Experimental study on the fracture behavior variation of the Au stud bump bonding with different high temperature storage times	2
Effect of reflow temperature and solder size on Cu-Ni cross-interaction in the Cu/Sn/Ni micro solder joints	2
Surface quality prediction and lapping process optimisation on the fixed-abrasive lapping plate of sapphire wafers	2
Retraction notice: Packaging design and thermal analysis for 1 mm² high power VCSEL	2
Extreme temperature thermal shock induced microstructure degradation and shear property deterioration of Sn3.0Ag0.5Cu/Cu solder joints	2
Comparative study on solid-solid interfacial reaction and bonding property of Sn-Ag-Cu/Ni-P joints by laser and reflow soldering	2
Fabrication of fluorine and silver co-doped ZnO photodetector using modified hydrothermal method	2
Study on electronic transport performance of Ag-ZnO film by photoassisted conductive atomic force microscopy	2
Radiation-hardened flip-flop for single event upset tolerance	2
A monopole polarisation diversity antenna for high density packaging MIMO applications	2