OOIR: Observatory of International Research

Papers

(The median citation count of Microelectronics International is 0. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2020-03-01 to 2024-03-01.)

Article	Citations
Additive manufacturing revolution in ceramic microsystems	16
The interfacial reliability of through-glass vias for 2.5D integrated circuits	12
MEMS piezoresistive pressure sensor with patterned thinning of diaphragm	9
Properties of glass/epoxy sandwich structure for electronic boards	7
Integration of perovskite Pb[Zr_0.35Ti_0.65]O₃/HfO₂ ferroelectric-dielectric composite film on Si substrate	7
Atomic layer deposition of TiO₂ blocking layers for dye-sensitized solar cells	6
Recent progress on bumpless Cu/SiO₂ hybrid bonding for 3D heterogeneous integration	5
Implementation of capacitance as simultaneous sensing and actuating tool in tapered microelectrode arrays for dielectrophoresis-on-a-chip application	5
A novel miniaturized Koch-Minkowski hybrid fractal antenna	5
Compact dual-mode microstrip bandpass filter based on slotted square patch resonator	4
An efficient design of dual-axis MEMS accelerometer considering microfabrication process limitations and operating environment variations	4
High-transconductance silicon carbide nanowire-based field-effect transistor (SiC-NWFET) for high-temperature applications	4
A fault-tolerant design for a digital comparator based on nano-scale quantum-dotcellular automata	3
Effects of V/III ratio of InGaN quantum well at high growth temperature for near ultraviolet light emitting diodes	3
Preliminary dielectrophoresis study: Manipulation of protein albumin and electrical quantification by using cyclic voltammetry technique	3
Multilayer ferrite inductors for the use at high temperatures	3
Optimization of flexible printed circuit board’s cooling with air flow and thermal effects using response surface methodology	3
Investigations of temperature sensor embedded into PCB	3
Fabrication of fluorine and silver co-doped ZnO photodetector using modified hydrothermal method	3
Dynamic dielectric properties characterization of tapered dielectrophoresis microelectrodes for selective detection and rapid manipulation of cells	3
Effects of three-step magnesium doping in p-GaN layer on the properties of InGaN-based light-emitting diode	2
Fabrication of UV ZnO NRS photodetector based on seeded silicon substrate via the drop-casting technique	2
Data acquisition and processing circuit for high-temperature logging up to 200°C	2
Influence of selected factors on parameters of a cooling system with a Peltier module and forced air flow	2
A fully matched dual stage CMOS power amplifier with integrated passive linearizer attaining 23 db gain, 40% PAE and 28 DBM OIP3	2

Willemite with Li₂CO₃ as a sintering aid for LTCC microwave substrates	2
Fabrication and characterization of mixed thin-/thick-film thermoelectric microgenerator based on constantan/chromium and silver arms	2
Cylindrical conformal wideband antenna with enhancement of gain using integrated parasitic triangular shaped elements for WiMAX application	2
N-face GaN substrate roughening for improved performance GaN-on-GaN LED	2
Improving the electromagnetic compatibility of electronic products by using response surface methodology and artificial neural network	2
Influence of copper pillar bump structure on flip chip packaging during reflow soldering: a numerical approach	2
Novel implementation of 3D multiplexers in nano magnetic logic technology	2
Improvement of inter layer dielectric crack for LQFP C90FG wafer technology devices in copper wire bonding process	2
Two-step flash sintering of (Mg_1/3Ta_2/3)_0.01Ti_0.99O₂ giant dielectric ceramics	2
Influence of different etching methods on the structural properties of porous silicon	2
Effect of alloy particle size and stencil aperture shape on solder printing quality	2
A 1-mm² CMOS-pipelined ADC with integrated folded cascode operational amplifier	2
Optimization of 1-µm gate length InGaAs-InAlAs pHEMT	1
Comparative study on solid-solid interfacial reaction and bonding property of Sn-Ag-Cu/Ni-P joints by laser and reflow soldering	1
Effects of indium composition on the surface morphological and optical properties of InGaN/GaN heterostructures	1
Effects of interface cracks on reliability of surface mount technology interconnection in service environment	1
Effect of nucleation layer thickness on reducing dislocation density in AlN layer for AlGaN-based UVC LED	1
Defected microstrip structure-based near-end and far-end crosstalk mitigation in high-speed PCBs for mixed signals	1
Influence of extended surface area of heatsink on heat transfer: design and analysis	1
The role of growth temperature on the indium incorporation process for the MOCVD growth of InGaN/GaN heterostructures	1
Effects of ⁶⁰Co γ ray radiation on the transmission characteristics of interconnection structures for 3D packaging	1
Advanced utilization of 3D digital image correlation for thermal and impact reliabilities of electronics components	1
Thermal performance and fatigue life prediction of POP stacked chip assembly under thermal cycling load	1
Influence of Ag particle shape on mechanical and thermal properties of TIM joints	1
Improvement of c-axis (002) AlN crystal plane by temperature assisted HiPIMS technique	1
Adapting M2 silicon half-wafers processing on industrial-scale equipment dedicated to 4″ solar technology	1
Computer‐aided selective production of low-resistance NiP and NiCuP layers	1
Microstructure and properties of ZnO-Bi₂O₃-based varistor ceramics via flash sintering	1
Real-time contact angle’s measurement of molten solder balls in laboratory conditions	1
An improved parallel five-level reinjection CSC for self-commutation of thyristor converter	1
The advanced leadless leadframe package and its characteristics	0
Preparation and characterization of doped LiZn_0.92Cu_0.08PO₄ ceramic for microwave and millimeter-wave substrates	0
A DFT+U study of structural, electronic and optical properties of Ag- and Cu-doped ZnO	0
Structural analysis of paper substrate for flexible microfluidics device application	0
Guest editorial: Heterogeneous integration and chiplets interconnection	0
Radiation-hardened flip-flop for single event upset tolerance	0
Guest editorial: emerging technologies for highly-reliable power electronic systems in miniaturized electronic devices	0
Design of UWB MIMO antenna using lean wearable textile substrate for reduced SAR	0
Identification of printed circuit boards mechanical properties using response surface methods	0
Enhancement of luminous flux of InGaAlP-based low-power SMD LEDs using substrates with different thermal resistances	0
W-band antenna in package module with hybrid glass-compound WLFO process	0
Structural and mechanical properties of a-axis AlN thin films growth using reactive RF magnetron sputtering plasma	0
DC-port voltage balance strategy for three-phase cascaded H-bridge rectifier based on logic combination modulation	0
Miniaturized bandwidth reconfigurable microwave bandpass filter	0
Design of radio frequency power amplifier for 2.45 GHz IoT application using 0.18 µm CMOS technology	0
Double-sided silicon vias (DSSVs) interconnection for large-sized interposer fabrication	0
A chemosensitive based ammonia gas sensor with PANI/PEO- ZnO nanofiber composites sensing layer	0
Magnetic alignment technology for wafer bonding	0
A novel S-shaped frequency and pattern reconfigurable patch antenna for 4G LTE, WLAN/Wi-Max application	0
Field effect transistor with thin AlOxNy film as gate dielectric	0

Effect of different temperature distribution on multi-stack BGA package	0
An investigation of physical properties and photovoltaic performance of methylammonium lead-tin iodide (CH₃NH₃Sn₁-xPbxI₃) solar cells	0
Experimental study on the fracture behavior variation of the Au stud bump bonding with different high temperature storage times	0
Model of boron diffusion in silicon used for solar cell fabrication based on boric acid solutions	0
An ultrawideband Koch fractal patch antenna	0
The preparation of anisotropic conductive paste and its application in FOB interconnection	0
Guest editorial	0
Design and implementation of miniaturized tri-band microwave bandpass filter	0
Effect of reflow temperature and solder size on Cu-Ni cross-interaction in the Cu/Sn/Ni micro solder joints	0
Improving displacement of silicon V-shaped electrothermal microactuator using platinum sputter deposition process	0
Synthesis and characterization of ZnO based varistor ceramics: effect of sintering temperatures	0
Quasi-elliptic band pass filter using resonators based on coupling theory for ultra-wide band applications	0
A monopole polarisation diversity antenna for high density packaging MIMO applications	0
Guest editorial	0
Reduction of the warping of a silicon wafer coated with two thin layers by minimal geometric modifications	0
Key techniques of ultra-low-power ADC and miniaturized RF transceiver circuits for 4G/LTE applications	0
Surface quality prediction and lapping process optimisation on the fixed-abrasive lapping plate of sapphire wafers	0
Facile ligand-exchange strategy to promote low-temperature nano-sintering of oleylamine-capped Ag nanoparticles	0
Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees	0
A 1.8 V high-speed 8-bit hybrid DAC with integrated rail-to-rail buffer amplifier in CMOS 180 nm	0
A chemosensitive-based ammonia gas sensor with PANI/PEO–ZnO nanofiber composites sensing layer	0
Packaging design and thermal analysis for 1 mm² high power VCSEL	0
A modal analysis based optimal mounting support locations of a printed circuit board	0
On the methodology of calculating volume charge density in a MIFGMOS substrate using Poisson’s equation	0
Development and post-dicing wet release of MEMS magnetometer: an approach	0
A failure location technology for SiP devices based on TDR nondestructive testing method	0
A high performance RC-INV triggering SCR under 0.25 µm process	0
A chopper amplifier with a pseudo MOS resistor-based tunable bandwidth for EEG applications	0
Reliability evaluation on SRG with full-bridge power converter considering thermal stress	0
Investigation on the new reliability issues of PCB in 5G millimeter wave application	0
Design, integration and implementation of crypto cores in an SoC environment	0
Bipolar power converter and control of switched reluctance generator system for renewable energy storage	0
Polyimide substrate textured by copper-seeding technique for enhanced light absorption in flexible black silicon	0
CVD processed ZnO thin film as solid thermal interface material in electronic devices: thermal and optical performance of LED	0
Au-coated Ag alloy bonding wires with enhanced oxidation resistance for electronic packaging applications	0
Study on electronic transport performance of Ag-ZnO film by photoassisted conductive atomic force microscopy	0
Atomic structure for AlN grown on different plane orientation of sapphire via numerical study	0
A numerical investigation on the influence of full vs perimeter arrays on the mechanical reliability of electronic assemblies under vibration	0
Small ozone generator fabricated from low-temperature co-fired ceramics	0