OOIR: Observatory of International Research

Papers

(The median citation count of Microelectronics International is 1. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-05-01 to 2025-05-01.)

Article	Citations
A failure location technology for SiP devices based on TDR nondestructive testing method	11
Strengthening mechanisms of Cu/SACZ/Al micro-connection joints with solid-state bonding	6
The preparation of anisotropic conductive paste and its application in FOB interconnection	6
Influence of selected factors on parameters of a cooling system with a Peltier module and forced air flow	5
Atomic structure for AlN grown on different plane orientation of sapphire via numerical study	5
Design and implementation of miniaturized tri-band microwave bandpass filter	5
Computer‐aided selective production of low-resistance NiP and NiCuP layers	4
Magnetic alignment technology for wafer bonding	4
Improving displacement of silicon V-shaped electrothermal microactuator using platinum sputter deposition process	4
Study of the electronic transport performance of ZnO-SiO₂ film: the construction of grain boundary barrier	4
Facile ligand-exchange strategy to promote low-temperature nano-sintering of oleylamine-capped Ag nanoparticles	4
Quasi-elliptic band pass filter using resonators based on coupling theory for ultra-wide band applications	4
Real-time contact angle’s measurement of molten solder balls in laboratory conditions	4
3-pass and 5-pass laser grooving & die strength characterization for reinforced internal low-k 55nm node wafer structure via heat-treatment process	3
Packaging design and thermal analysis for 1 mm² high power VCSEL	3
Influence of copper pillar bump structure on flip chip packaging during reflow soldering: a numerical approach	3
Effects of V/III ratio of InGaN quantum well at high growth temperature for near ultraviolet light emitting diodes	3
Improvement of c-axis (002) AlN crystal plane by temperature assisted HiPIMS technique	3
Influence of different etching methods on the structural properties of porous silicon	3
A modal analysis based optimal mounting support locations of a printed circuit board	3
High-transconductance silicon carbide nanowire-based field-effect transistor (SiC-NWFET) for high-temperature applications	3
Influence of Ag particle shape on mechanical and thermal properties of TIM joints	3
A chemosensitive-based ammonia gas sensor with PANI/PEO–ZnO nanofiber composites sensing layer	2
Model of boron diffusion in silicon used for solar cell fabrication based on boric acid solutions	2
Recent progress on bumpless Cu/SiO₂ hybrid bonding for 3D heterogeneous integration	2

W-band antenna in package module with hybrid glass-compound WLFO process	2
Effects of three-step magnesium doping in p-GaN layer on the properties of InGaN-based light-emitting diode	2
Experimental study on the fracture behavior variation of the Au stud bump bonding with different high temperature storage times	2
Effect of reflow temperature and solder size on Cu-Ni cross-interaction in the Cu/Sn/Ni micro solder joints	2
Surface quality prediction and lapping process optimisation on the fixed-abrasive lapping plate of sapphire wafers	2
Retraction notice: Packaging design and thermal analysis for 1 mm² high power VCSEL	2
Extreme temperature thermal shock induced microstructure degradation and shear property deterioration of Sn3.0Ag0.5Cu/Cu solder joints	2
Comparative study on solid-solid interfacial reaction and bonding property of Sn-Ag-Cu/Ni-P joints by laser and reflow soldering	2
Fabrication of fluorine and silver co-doped ZnO photodetector using modified hydrothermal method	2
Study on electronic transport performance of Ag-ZnO film by photoassisted conductive atomic force microscopy	2
Radiation-hardened flip-flop for single event upset tolerance	2
A monopole polarisation diversity antenna for high density packaging MIMO applications	2
Effects of interface cracks on reliability of surface mount technology interconnection in service environment	2
Guest editorial: Heterogeneous integration and chiplets interconnection	2
Identification of printed circuit boards mechanical properties using response surface methods	2
Predictive maintenance for printed circuit boards using eXtreme gradient boosting	1
Fabrication of UV ZnO NRS photodetector based on seeded silicon substrate via the drop-casting technique	1
A fault-tolerant design for a digital comparator based on nano-scale quantum-dotcellular automata	1
CVD processed ZnO thin film as solid thermal interface material in electronic devices: thermal and optical performance of LED	1
A chopper amplifier with a pseudo MOS resistor-based tunable bandwidth for EEG applications	1
Microstructure and properties of ZnO-Bi₂O₃-based varistor ceramics via flash sintering	1
Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees	1
An improved parallel five-level reinjection CSC for self-commutation of thyristor converter	1
N-face GaN substrate roughening for improved performance GaN-on-GaN LED	1
Effects of indium composition on the surface morphological and optical properties of InGaN/GaN heterostructures	1
A novel miniaturized Koch-Minkowski hybrid fractal antenna	1
Simplifying finite elements analysis of four-point bending tests for flip chip microcomponents	1
A chemosensitive based ammonia gas sensor with PANI/PEO- ZnO nanofiber composites sensing layer	1
Improving the electromagnetic compatibility of electronic products by using response surface methodology and artificial neural network	1
DC-port voltage balance strategy for three-phase cascaded H-bridge rectifier based on logic combination modulation	1
Reliability evaluation on SRG with full-bridge power converter considering thermal stress	1