OOIR: Observatory of International Research

Papers

(The median citation count of Microelectronics International is 1. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2020-07-01 to 2024-07-01.)

Article	Citations
The interfacial reliability of through-glass vias for 2.5D integrated circuits	14
Recent progress on bumpless Cu/SiO₂ hybrid bonding for 3D heterogeneous integration	6
Implementation of capacitance as simultaneous sensing and actuating tool in tapered microelectrode arrays for dielectrophoresis-on-a-chip application	6
A novel miniaturized Koch-Minkowski hybrid fractal antenna	5
An efficient design of dual-axis MEMS accelerometer considering microfabrication process limitations and operating environment variations	5
High-transconductance silicon carbide nanowire-based field-effect transistor (SiC-NWFET) for high-temperature applications	5
Compact dual-mode microstrip bandpass filter based on slotted square patch resonator	5
Dynamic dielectric properties characterization of tapered dielectrophoresis microelectrodes for selective detection and rapid manipulation of cells	4
N-face GaN substrate roughening for improved performance GaN-on-GaN LED	4
Fabrication of fluorine and silver co-doped ZnO photodetector using modified hydrothermal method	4
Preliminary dielectrophoresis study: Manipulation of protein albumin and electrical quantification by using cyclic voltammetry technique	4
A fault-tolerant design for a digital comparator based on nano-scale quantum-dotcellular automata	3
Two-step flash sintering of (Mg_1/3Ta_2/3)_0.01Ti_0.99O₂ giant dielectric ceramics	3
Effect of alloy particle size and stencil aperture shape on solder printing quality	3
Effects of V/III ratio of InGaN quantum well at high growth temperature for near ultraviolet light emitting diodes	3
Influence of different etching methods on the structural properties of porous silicon	3
Investigations of temperature sensor embedded into PCB	3
Optimization of flexible printed circuit board’s cooling with air flow and thermal effects using response surface methodology	3
Real-time contact angle’s measurement of molten solder balls in laboratory conditions	3
Identification of printed circuit boards mechanical properties using response surface methods	2
Synthesis and characterization of ZnO based varistor ceramics: effect of sintering temperatures	2
Influence of Ag particle shape on mechanical and thermal properties of TIM joints	2
A fully matched dual stage CMOS power amplifier with integrated passive linearizer attaining 23 db gain, 40% PAE and 28 DBM OIP3	2
Effects of three-step magnesium doping in p-GaN layer on the properties of InGaN-based light-emitting diode	2
Improvement of inter layer dielectric crack for LQFP C90FG wafer technology devices in copper wire bonding process	2

Fabrication of UV ZnO NRS photodetector based on seeded silicon substrate via the drop-casting technique	2
Influence of selected factors on parameters of a cooling system with a Peltier module and forced air flow	2
Influence of copper pillar bump structure on flip chip packaging during reflow soldering: a numerical approach	2
Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees	2
A DFT+U study of structural, electronic and optical properties of Ag- and Cu-doped ZnO	2
Advanced utilization of 3D digital image correlation for thermal and impact reliabilities of electronics components	2
Cylindrical conformal wideband antenna with enhancement of gain using integrated parasitic triangular shaped elements for WiMAX application	2
Improving the electromagnetic compatibility of electronic products by using response surface methodology and artificial neural network	2
A 1-mm² CMOS-pipelined ADC with integrated folded cascode operational amplifier	2
Novel implementation of 3D multiplexers in nano magnetic logic technology	2
Optimization of 1-µm gate length InGaAs-InAlAs pHEMT	1
Comparative study on solid-solid interfacial reaction and bonding property of Sn-Ag-Cu/Ni-P joints by laser and reflow soldering	1
Investigation on the new reliability issues of PCB in 5G millimeter wave application	1
Effects of interface cracks on reliability of surface mount technology interconnection in service environment	1
Effects of ⁶⁰Co γ ray radiation on the transmission characteristics of interconnection structures for 3D packaging	1
Effect of nucleation layer thickness on reducing dislocation density in AlN layer for AlGaN-based UVC LED	1
Design and implementation of miniaturized tri-band microwave bandpass filter	1
An improved parallel five-level reinjection CSC for self-commutation of thyristor converter	1
The advanced leadless leadframe package and its characteristics	1
Influence of extended surface area of heatsink on heat transfer: design and analysis	1
The role of growth temperature on the indium incorporation process for the MOCVD growth of InGaN/GaN heterostructures	1
Effect of reflow temperature and solder size on Cu-Ni cross-interaction in the Cu/Sn/Ni micro solder joints	1
Design, integration and implementation of crypto cores in an SoC environment	1
Microstructure and properties of ZnO-Bi₂O₃-based varistor ceramics via flash sintering	1
Thermal performance and fatigue life prediction of POP stacked chip assembly under thermal cycling load	1
The preparation of anisotropic conductive paste and its application in FOB interconnection	1
Improvement of c-axis (002) AlN crystal plane by temperature assisted HiPIMS technique	1
Surface quality prediction and lapping process optimisation on the fixed-abrasive lapping plate of sapphire wafers	1
Adapting M2 silicon half-wafers processing on industrial-scale equipment dedicated to 4″ solar technology	1
Effects of indium composition on the surface morphological and optical properties of InGaN/GaN heterostructures	1
Computer‐aided selective production of low-resistance NiP and NiCuP layers	1
Improving displacement of silicon V-shaped electrothermal microactuator using platinum sputter deposition process	1
Defected microstrip structure-based near-end and far-end crosstalk mitigation in high-speed PCBs for mixed signals	1
Radiation-hardened flip-flop for single event upset tolerance	1