Microelectronics International

(The median citation count of Microelectronics International is 0. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2020-02-01 to 2024-02-01.)
Additive manufacturing revolution in ceramic microsystems16
The interfacial reliability of through-glass vias for 2.5D integrated circuits12
MEMS piezoresistive pressure sensor with patterned thinning of diaphragm9
Properties of glass/epoxy sandwich structure for electronic boards7
Integration of perovskite Pb[Zr0.35Ti0.65]O3/HfO2 ferroelectric-dielectric composite film on Si substrate7
Atomic layer deposition of TiO2 blocking layers for dye-sensitized solar cells6
A novel miniaturized Koch-Minkowski hybrid fractal antenna5
Implementation of capacitance as simultaneous sensing and actuating tool in tapered microelectrode arrays for dielectrophoresis-on-a-chip application5
Compact dual-mode microstrip bandpass filter based on slotted square patch resonator4
An efficient design of dual-axis MEMS accelerometer considering microfabrication process limitations and operating environment variations4
Preliminary dielectrophoresis study: Manipulation of protein albumin and electrical quantification by using cyclic voltammetry technique3
Fabrication of fluorine and silver co-doped ZnO photodetector using modified hydrothermal method3
Optimization of flexible printed circuit board’s cooling with air flow and thermal effects using response surface methodology3
A fault-tolerant design for a digital comparator based on nano-scale quantum-dotcellular automata3
Effects of V/III ratio of InGaN quantum well at high growth temperature for near ultraviolet light emitting diodes3
Dynamic dielectric properties characterization of tapered dielectrophoresis microelectrodes for selective detection and rapid manipulation of cells3
High-transconductance silicon carbide nanowire-based field-effect transistor (SiC-NWFET) for high-temperature applications3
Recent progress on bumpless Cu/SiO2 hybrid bonding for 3D heterogeneous integration3
Novel implementation of 3D multiplexers in nano magnetic logic technology2
Effects of three-step magnesium doping in p-GaN layer on the properties of InGaN-based light-emitting diode2
Data acquisition and processing circuit for high-temperature logging up to 200°C2
Improving the electromagnetic compatibility of electronic products by using response surface methodology and artificial neural network2
A fully matched dual stage CMOS power amplifier with integrated passive linearizer attaining 23 db gain, 40% PAE and 28 DBM OIP32
Investigations of temperature sensor embedded into PCB2
Fabrication and characterization of mixed thin-/thick-film thermoelectric microgenerator based on constantan/chromium and silver arms2
Fabrication of UV ZnO NRS photodetector based on seeded silicon substrate via the drop-casting technique2
Two-step flash sintering of (Mg1/3Ta2/3)0.01Ti0.99O2 giant dielectric ceramics2
Influence of selected factors on parameters of a cooling system with a Peltier module and forced air flow2
Influence of copper pillar bump structure on flip chip packaging during reflow soldering: a numerical approach2
Willemite with Li2CO3 as a sintering aid for LTCC microwave substrates2
Multilayer ferrite inductors for the use at high temperatures2
N-face GaN substrate roughening for improved performance GaN-on-GaN LED2
Influence of different etching methods on the structural properties of porous silicon2
Effect of alloy particle size and stencil aperture shape on solder printing quality2
A 1-mm2 CMOS-pipelined ADC with integrated folded cascode operational amplifier2
Microstructure and properties of ZnO-Bi2O3-based varistor ceramics via flash sintering1
Thermal performance and fatigue life prediction of POP stacked chip assembly under thermal cycling load1
Influence of Ag particle shape on mechanical and thermal properties of TIM joints1
The role of growth temperature on the indium incorporation process for the MOCVD growth of InGaN/GaN heterostructures1
Effects of 60Co γ ray radiation on the transmission characteristics of interconnection structures for 3D packaging1
Effects of interface cracks on reliability of surface mount technology interconnection in service environment1
Cylindrical conformal wideband antenna with enhancement of gain using integrated parasitic triangular shaped elements for WiMAX application1
Real-time contact angle’s measurement of molten solder balls in laboratory conditions1
An improved parallel five-level reinjection CSC for self-commutation of thyristor converter1
Optimization of 1-µm gate length InGaAs-InAlAs pHEMT1
Improvement of inter layer dielectric crack for LQFP C90FG wafer technology devices in copper wire bonding process1
Computer‐aided selective production of low-resistance NiP and NiCuP layers1
Advanced utilization of 3D digital image correlation for thermal and impact reliabilities of electronics components1
Effect of nucleation layer thickness on reducing dislocation density in AlN layer for AlGaN-based UVC LED1
Defected microstrip structure-based near-end and far-end crosstalk mitigation in high-speed PCBs for mixed signals1
Improvement of c-axis (002) AlN crystal plane by temperature assisted HiPIMS technique1
Adapting M2 silicon half-wafers processing on industrial-scale equipment dedicated to 4″ solar technology1
Effects of indium composition on the surface morphological and optical properties of InGaN/GaN heterostructures1
Influence of extended surface area of heatsink on heat transfer: design and analysis0
CVD processed ZnO thin film as solid thermal interface material in electronic devices: thermal and optical performance of LED0
A monopole polarisation diversity antenna for high density packaging MIMO applications0
Surface quality prediction and lapping process optimisation on the fixed-abrasive lapping plate of sapphire wafers0
Small ozone generator fabricated from low-temperature co-fired ceramics0
Effect of different temperature distribution on multi-stack BGA package0
Guest editorial: Heterogeneous integration and chiplets interconnection0
A 1.8 V high-speed 8-bit hybrid DAC with integrated rail-to-rail buffer amplifier in CMOS 180 nm0
Development and post-dicing wet release of MEMS magnetometer: an approach0
Packaging design and thermal analysis for 1 mm2 high power VCSEL0
Comparative study on solid-solid interfacial reaction and bonding property of Sn-Ag-Cu/Ni-P joints by laser and reflow soldering0
On the methodology of calculating volume charge density in a MIFGMOS substrate using Poisson’s equation0
Identification of printed circuit boards mechanical properties using response surface methods0
A failure location technology for SiP devices based on TDR nondestructive testing method0
Enhancement of luminous flux of InGaAlP-based low-power SMD LEDs using substrates with different thermal resistances0
W-band antenna in package module with hybrid glass-compound WLFO process0
Reliability evaluation on SRG with full-bridge power converter considering thermal stress0
Structural and mechanical properties of a-axis AlN thin films growth using reactive RF magnetron sputtering plasma0
Polyimide substrate textured by copper-seeding technique for enhanced light absorption in flexible black silicon0
Reduction of the warping of a silicon wafer coated with two thin layers by minimal geometric modifications0
Double-sided silicon vias (DSSVs) interconnection for large-sized interposer fabrication0
Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees0
Miniaturized bandwidth reconfigurable microwave bandpass filter0
Magnetic alignment technology for wafer bonding0
A numerical investigation on the influence of full vs perimeter arrays on the mechanical reliability of electronic assemblies under vibration0
Field effect transistor with thin AlOxNy film as gate dielectric0
A chemosensitive-based ammonia gas sensor with PANI/PEO–ZnO nanofiber composites sensing layer0
An ultrawideband Koch fractal patch antenna0
Preparation and characterization of doped LiZn0.92Cu0.08PO4 ceramic for microwave and millimeter-wave substrates0
Guest editorial: emerging technologies for highly-reliable power electronic systems in miniaturized electronic devices0
Structural analysis of paper substrate for flexible microfluidics device application0
A high performance RC-INV triggering SCR under 0.25 µm process0
Radiation-hardened flip-flop for single event upset tolerance0
DC-port voltage balance strategy for three-phase cascaded H-bridge rectifier based on logic combination modulation0
Effect of reflow temperature and solder size on Cu-Ni cross-interaction in the Cu/Sn/Ni micro solder joints0
Design of UWB MIMO antenna using lean wearable textile substrate for reduced SAR0
Improving displacement of silicon V-shaped electrothermal microactuator using platinum sputter deposition process0
Bipolar power converter and control of switched reluctance generator system for renewable energy storage0
Synthesis and characterization of ZnO based varistor ceramics: effect of sintering temperatures0
Design of radio frequency power amplifier for 2.45 GHz IoT application using 0.18 µm CMOS technology0
A chemosensitive based ammonia gas sensor with PANI/PEO- ZnO nanofiber composites sensing layer0
Key techniques of ultra-low-power ADC and miniaturized RF transceiver circuits for 4G/LTE applications0
The advanced leadless leadframe package and its characteristics0
Guest editorial0
Facile ligand-exchange strategy to promote low-temperature nano-sintering of oleylamine-capped Ag nanoparticles0
Study on electronic transport performance of Ag-ZnO film by photoassisted conductive atomic force microscopy0
Atomic structure for AlN grown on different plane orientation of sapphire via numerical study0
A DFT+U study of structural, electronic and optical properties of Ag- and Cu-doped ZnO0
A modal analysis based optimal mounting support locations of a printed circuit board0
An investigation of physical properties and photovoltaic performance of methylammonium lead-tin iodide (CH3NH3Sn1-xPbxI3) solar cells0
Guest editorial0
Model of boron diffusion in silicon used for solar cell fabrication based on boric acid solutions0
Experimental study on the fracture behavior variation of the Au stud bump bonding with different high temperature storage times0
The preparation of anisotropic conductive paste and its application in FOB interconnection0
A chopper amplifier with a pseudo MOS resistor-based tunable bandwidth for EEG applications0
Investigation on the new reliability issues of PCB in 5G millimeter wave application0
Design and implementation of miniaturized tri-band microwave bandpass filter0
Design, integration and implementation of crypto cores in an SoC environment0
Quasi-elliptic band pass filter using resonators based on coupling theory for ultra-wide band applications0
A novel S-shaped frequency and pattern reconfigurable patch antenna for 4G LTE, WLAN/Wi-Max application0
Au-coated Ag alloy bonding wires with enhanced oxidation resistance for electronic packaging applications0