OOIR: Observatory of International Research

Papers

(The TQCC of Journal of Electronic Packaging is 4. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-05-01 to 2025-05-01.)

Article	Citations
Multiphysics Coupling in IGBT Modules: A Review	97
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs	40
Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer	25
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components	25
Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics	19
Hybrid Bonding for Ultra-High-Density Interconnect	18
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis	16
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling	16
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation	15
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits	15
A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling	14
Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model	13
Converging Jet Impingement for Enhanced Liquid Cooling	13
Optimization of Micropillars Electroplating Bonding Processes and Additives	11
Special Issue Dedicated to Professor Avram Bar-Cohen	11
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?	11
Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current	11
Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications	10
Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks	10
Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948]	10
Effect of Dispensing Type on Void Formation Using Convolutional Neural Network	9
Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm	9
Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling	8
Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control	8
Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging	8

Special Section on InterPACK2021	8
Failure Mechanisms Driven Reliability Models for Power Electronics: A Review	8
Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform	8
Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems	8
Underfill Flow in Flip-Chip Encapsulation Process: A Review	7
Optimal Design of Thermal Cycling Reliability for Plastic Ball Grid Array Assembly Via Finite Element Method and Taguchi Method	7
Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Sign	7
High-Performance Planar Thermal Diode With Wickless Components	7
Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging	7
Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model	6
A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification	6
Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints	6
Effective Constitutive Relations for Sintered Nano Copper Joints	6
Convection Cooling of Power Electronics Operating in Deep-Space	5
Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics	5
Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films	5
Heat Dissipation Design Based on Topology Optimization and Auxiliary Materials	5
A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers	5
Analysis and Modeling of a SiC Based Buck Converter and Its Effects in an Electric Vehicle Application	5
High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology	4
Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling	4
Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation	4
Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis	4
Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes	4
Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope	4
Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate	4
Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging	4
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes	4
Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies	4
Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds	4
Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics	4
Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages	4
Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions	4