Journal of Electronic Packaging

Papers
(The TQCC of Journal of Electronic Packaging is 4. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2020-07-01 to 2024-07-01.)
ArticleCitations
Spray Cooling on Enhanced Surfaces: A Review of the Progress and Mechanisms61
Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging42
Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions33
State of the Art of Lead-Free Solder Joint Reliability29
A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling27
A Review On Transient Thermal Management of Electronic Devices27
Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors15
Underfill Flow in Flip-Chip Encapsulation Process: A Review15
High-Performance Planar Thermal Diode With Wickless Components14
Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks13
High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days13
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis12
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs12
Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization11
Modular Heat Sinks for Enhanced Thermal Management of Electronics11
Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap11
Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics10
Study of a Lab-Scale Organic Rankine Cycle for the Ultra-Low-Temperature Waste Heat Recovery Associated With Data Centers10
Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods9
Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model9
Failure Mechanisms Driven Reliability Models for Power Electronics: A Review9
Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid9
Flow-Controlled Spray Cooling Approaches for Dynamic Thermal Management9
The Doping Dependence of the Thermal Conductivity of Bulk Gallium Nitride Substrates9
Role of Nominal Stress State on Cyclic Fatigue Durability of SAC305 Grain-Scale Solder Joints9
Improving Ambient Contrast Ratio and Color Uniformity of Mini Full Color Light-Emitting Diodes Using an SiO2/Graphite Bilayered Packaging Structure8
Fatigue Life of Sn3.0Ag0.5Cu Solder Alloy Under Combined Cyclic Shear and Constant Tensile/Compressive Loads8
Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers7
Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities7
Numerical Study of Large Footprint (24 × 24 mm2) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers7
Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers7
Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink7
Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling7
Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology7
Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging7
Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches7
Fabrication and Reliability Assessment of Cu Pillar Microbumps With Printed Polymer Cores7
Reduced Order Design Optimization of Liquid Cooled Heat Sinks6
Recent Developments in Air Pumps for Thermal Management of Electronics6
Process Capability of Aerosol-Jet Additive Processes for Long-Runs Up to 10-Hours6
Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review6
Numerical Modeling of the Wave Soldering Process and Experimental Validation5
Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds5
Effect of Different Solder Volumes on the Laser Soldering Process: Numerical and Experimental Investigation5
Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review5
Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module5
Strength and Isothermal Fatigue Resistance of SnBi/SnAgCu Joints Reflowed at Low Temperatures5
Evolution of Anand Parameters With Elevated Temperature Aging for SnAgCu Lead-free Alloys5
Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging5
A New Structure of Ceramic Substrate to Reduce the Critical Electric Field in High Voltage Power Modules4
Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling4
Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model4
A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique4
Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature4
Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging4
Design of Microfabricated Mechanically Interlocking Metamaterials for Reworkable Heterogeneous Integration4
Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization4
Scattering Nanoparticles-Induced Reflection Effect for Enhancing Optical Efficiency of Inverted Quantum Dots-Light-Emitting Diodes Combined With the Centrifugation Technique4
Heat Transfer Enhancement Through Array Jet Impingement on Strategically Placed High Porosity High Pore-Density Thin Copper Foams4
Effective Constitutive Relations for Sintered Nano Copper Joints4
A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging4
Parametric Effects of Heater Size, Contact Angle, and Surrounding Vessel Size on Pool Boiling Critical Heat Flux From Horizontal Surfaces4
0.024996995925903