OOIR: Observatory of International Research

Papers

(The TQCC of Journal of Electronic Packaging is 4. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-08-01 to 2026-08-01.)

Article	Citations
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components	67
Multiphysics Coupling in IGBT Modules: A Review	49
From Design of Experiments to Neural Network Models for Predicting Sintered Nanosilver Joints Degradation Under Thermal Shocks	33
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis	31
Evaluation of phase transformation on boron decorated Sn-1.5Ag-0.7 Cu joined Cu pillar for packaging connection	26
Converging Jet Impingement for Enhanced Liquid Cooling	23
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling	21
Tonal and Broadband Noise-Reducing Heat Sinks Using Long-Neck Helmholtz Resonator Arrays and Corrugated Periodic Cellular Materials	19
Hybrid Bonding for Ultra-High-Density Interconnect	19
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation	17
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?	13
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits	13
Challenges In Co-Packaging Of SI-III/V Components In Silicon Photonics	12
Optimization of Micropillars Electroplating Bonding Processes and Additives	11
Advanced IGBT Module Design for Enhanced Overcurrent Capability Using Phase Change Materials	11
Performance and Reliability Comparison of Thermoformed, Screen-Printed Structures on Polycarbonate and High-Impact Polystyrene Substrates Under Sustained High Temperatures for In-Mold Electronics	11
Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm	10
Three Decades of Thermal Management Research at DARPA	10
Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications	10
Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks	9
Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging	9
Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948]	9
Effect of Dispensing Type on Void Formation Using Convolutional Neural Network	9
Failure Mechanisms Driven Reliability Models for Power Electronics: A Review	8
Special Section on InterPACK2021	8

Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems	8
Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform	8
Uncertainty Quantification for Compressible Micro-Interconnects in Replaceable Integrated Chiplet Assembly Under Hypergravity	7
Optimal Design of Thermal Cycling Reliability for Plastic Ball Grid Array Assembly Via Finite Element Method and Taguchi Method	7
Epoxy Molding Compound for Electronic Packaging: Impact of Inorganic Filler Type and Geometry	7
Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging	7
Aging Effects on SAC305 Solder Joints: Correlating Intermetallic Compound Evolution, Hardness, and Drop-Shock Performance in ENIG and Immersion Tin Finishes	7
Analysis and Modeling of a SiC Based Buck Converter and Its Effects in an Electric Vehicle Application	6
Effective Constitutive Relations for Sintered Nano Copper Joints	6
The Impact of Die Tilt on the Reliability of Packages With Dies Bonded to Substrates Using Silver Sintered Material	6
Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films	6
Heat Dissipation Design Based on Topology Optimization and Auxiliary Materials	6
Convection Cooling of Power Electronics Operating in Deep-Space	6
Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics	6
Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate	6
Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope	6
Stencil-Assisted Electrospray Deposition of Silver Films on Insulators for Electromagnetic Interference Shielding	5
Additively Printed Circuit Performance of Thermoformed In-Mold Electronics for Automotive Applications	5
Development Toward Low-Temperature Cofired Ceramic Electric Propulsion System With Demonstration of Plasma Generation	5
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes	5
A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers	5
High-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire-Polydimethylsiloxane Composite Thermal Interface Materials Tape	5
Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints	5
High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology	4
Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions	4
A Kriging Surrogate Model for Ball Grid Array Electronic Packaging With Stochastic Material and Geometrical Parameters	4
Transient Liquid Phase Bond Acceleration Using Copper Nanowires	4
Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics	4
Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging	4
Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core	4
Feasibility Study of Implementing a Hybrid Single- and Two-Phase Cooler for High Power Density Power Electronics	4
Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation	4
Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis	4
A Review of the Cu Chemical Mechanical Planarization Process in Hybrid Bonding Technology	4
Liquid to Liquid In-Row Coolant Distribution Unit Characterization for High Power Data Center	4
Reviewer's Recognition	4