OOIR: Observatory of International Research

Papers

(The TQCC of Journal of Electronic Packaging is 3. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-05-01 to 2026-05-01.)

Article	Citations
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs	57
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components	37
From Design of Experiments to Neural Network Models for Predicting Sintered Nano-Silver Joints Degradation Under Thermal Shocks	29
Multiphysics Coupling in IGBT Modules: A Review	23
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis	22
Evaluation of phase transformation on boron decorated Sn-1.5Ag-0.7 Cu joined Cu pillar for packaging connection	19
Tonal and Broadband Noise-Reducing Heat Sinks Using Long-Neck Helmholtz Resonator Arrays and Corrugated Periodic Cellular Materials	19
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits	18
Hybrid Bonding for Ultra-High-Density Interconnect	18
Converging Jet Impingement for Enhanced Liquid Cooling	18
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation	14
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling	13
Performance and Reliability Comparison of Thermoformed, Screen-Printed Structures on Polycarbonate and High-Impact Polystyrene Substrates Under Sustained High Temperatures for In-Mold Electronics	12
Advanced IGBT Module Design for Enhanced Overcurrent Capability Using Phase Change Materials	11
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?	11
Three Decades of Thermal Management Research at DARPA	10
Optimization of Micropillars Electroplating Bonding Processes and Additives	10
Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications	9
Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm	9
Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging	8
Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks	8
Effect of Dispensing Type on Void Formation Using Convolutional Neural Network	8
Failure Mechanisms Driven Reliability Models for Power Electronics: A Review	7
Special Section on InterPACK2021	7
Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948]	7

Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems	7
Optimal Design of Thermal Cycling Reliability for Plastic Ball Grid Array Assembly Via Finite Element Method and Taguchi Method	6
Uncertainty Quantification for Compressible Micro-Interconnects in Replaceable Integrated Chiplet Assembly Under Hypergravity	6
Aging Effects on SAC305 Solder Joints: Correlating IMC Evolution, Hardness, and Drop-Shock Performance in ENIG and Immersion Tin Finishes	6
Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging	6
Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films	6
Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform	6
Epoxy Molding Compound for Electronic Packaging: Impact of Inorganic Filler Type and Geometry	6
Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics	5
High-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire-Polydimethylsiloxane Composite Thermal Interface Materials Tape	5
A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers	5
Effective Constitutive Relations for Sintered Nano Copper Joints	5
Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope	5
Additively Printed Circuit Performance of Thermoformed In-Mold Electronics for Automotive Applications	5
Heat Dissipation Design Based on Topology Optimization and Auxiliary Materials	5
Analysis and Modeling of a SiC Based Buck Converter and Its Effects in an Electric Vehicle Application	5
Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate	5
Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints	4
Stencil-Assisted Electrospray Deposition of Silver Films on Insulators for EMI Shielding	4
Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions	4
The Impact of Die Tilt on the Reliability of Packages With Dies Bonded to Substrates Using Silver Sintered Material	4
Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation	4
High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology	4
Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis	4
Convection Cooling of Power Electronics Operating in Deep-Space	4
Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging	4
Liquid to Liquid In-Row Coolant Distribution Unit Characterization for High Power Data Center	4
Special Section on Silicon-Package-Rack-Data Center Thermal Management: Challenges, Opportunities, and Solutions	3
Investigation of the High-Vacuum Au/Si Eutectic Wafer Bonding Process for MEMS Resonators	3
Transient Liquid Phase Bond Acceleration Using Copper Nanowires	3
Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics	3
Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core	3
First-Principles Computational Prediction of Doping to Improve the Properties of Ag/Ni	3
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes	3
Special Issue on InterPACK2023	3
Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink	3
Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics	3
Feasibility Study of Implementing a Hybrid Single- and Two-Phase Cooler for High Power Density Power Electronics	3
Review on Fan-Out Packaging of Light-Emitting Diodes: Process Route, Manufacturing Reliability, and Performance Optimization	3
HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions	3
Microbead Encapsulation for Protection of Electronic Components	3
A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique	3
A Kriging Surrogate Model for Ball Grid Array Electronic Packaging With Stochastic Material and Geometrical Parameters	3
A Review of the Cu Chemical Mechanical Planarization Process in Hybrid Bonding Technology	3
Reviewer's Recognition	3