OOIR: Observatory of International Research

Papers

(The TQCC of Journal of Electronic Packaging is 3. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-02-01 to 2025-02-01.)

Article	Citations
A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers	79
Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds	48
A Review of Mechanism and Technology of Hybrid Bonding	34
Interfacial Fracture Caused by Electromigration at Copper Interconnects	18
Viability of Cryogenic Cooling to Reduce Processor Power Consumption	16
Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation	15
Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing	15
Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate	13
Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of Flip-Chip Packages With a Cap Using Strain Gauges	12
Forward Kinematics Analysis of High-Precision Optoelectronic Packaging Platform	12
Multiphysics Coupling in IGBT Modules: A Review	12
Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging	11
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components	11
Numerical and Experimental Investigation of a Volumetric Resistance Blower Performance and Its Optimization for Portable Computing Device Applications	10
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs	10
Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling	10
Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope	10
Optimized Design of Various Ag Decorated Sn-xAg-Cu0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging	9
Convection Cooling of Power Electronics Operating in Deep-Space	9
Hybrid Substrates for Heterogeneous Integration	8
A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics	8
Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation	7
Numerical Study of Large Footprint (24 × 24 mm2) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers	7
Acoustic Characterization of Integrated Circuits During Operation	7
Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling	7

Peak Temperature Mitigation of a Multimicrochannel Evaporator Under Transient Heat Loads	7
Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap	7
Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer	7
Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package	7
Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation	6
Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks	6
Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods	6
Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis	5
Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals	5
Special Section on Nanoscale/Microscale Energy Transport, Conversion and Storage in Electronics Packaging	5
Development of a Thermal Metrology Standard for Evaluation of Cold Plate Thermal Resistance as a Performance Metric	5
Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies	5
Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging	5
A Kriging Surrogate Model for Ball Grid Array Electronic Packaging With Stochastic Material and Geometrical Parameters	5
Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter	5
Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages	5
Performance Analysis of a Brazed Plate Heat Exchanger During Condensation of R1233zd(E)	4
Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies	4
Machine Learning Analysis of Autonomous Vehicle Sensors Under Extreme Conditions in Alaska	4
High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology	4
Effect of Cyclic Stress on Electrochemical Corrosion Behavior of SAC305 Solder	4
Reliability of State-of-Health of the Flexible Li-Ion Batteries Under Various Flexing Conditions and Calendar Aging	4
A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots	4
Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids	4
Converging Jet Impingement for Enhanced Liquid Cooling	4
Microstructure and Properties of Nb Nanoparticles Reinforced Sn–0.7Cu Solder Alloy	4
Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model	4
Hybrid Bonding for Ultra-High-Density Interconnect	3
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits	3
Influences of Small Jet-to-Wall Spacings on Heat Transfer Characteristics and Flow-Field Entrainment Effects of Microscale Jets	3
High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors	3
Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core	3
Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints	3
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling	3
Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology	3
Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions	3
Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes	3
Modular Heat Sinks for Enhanced Thermal Management of Electronics	3
Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging	3
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation	3
Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities	3
Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics	3
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis	3
Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat	3
Design and Fabrication of Leadless Package Structure for Pressure Sensors	3
Correlation Study on Voiding in Underfill of Large Quantity Ball Grid Array Chip Using Machine Learning	3
Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics	3
Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations	3
Influence of Laser Soldering Temperatures on Through-Hole Component	3
Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches	3

Effect of Different Solder Volumes on the Laser Soldering Process: Numerical and Experimental Investigation	3
Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages	3