OOIR: Observatory of International Research

Papers

(The TQCC of Journal of Electronic Packaging is 4. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2020-11-01 to 2024-11-01.)

Article	Citations
Spray Cooling on Enhanced Surfaces: A Review of the Progress and Mechanisms	70
Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging	48
Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions	34
A Review On Transient Thermal Management of Electronic Devices	30
A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling	28
Underfill Flow in Flip-Chip Encapsulation Process: A Review	18
Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors	16
High-Performance Planar Thermal Diode With Wickless Components	15
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs	15
High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days	13
Failure Mechanisms Driven Reliability Models for Power Electronics: A Review	12
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis	12
Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics	12
Flow-Controlled Spray Cooling Approaches for Dynamic Thermal Management	11
Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap	11
Modular Heat Sinks for Enhanced Thermal Management of Electronics	11
Role of Nominal Stress State on Cyclic Fatigue Durability of SAC305 Grain-Scale Solder Joints	10
Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods	10
Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid	10
Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model	9
Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches	9
Improving Ambient Contrast Ratio and Color Uniformity of Mini Full Color Light-Emitting Diodes Using an SiO2/Graphite Bilayered Packaging Structure	8
Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging	8
Fabrication and Reliability Assessment of Cu Pillar Microbumps With Printed Polymer Cores	8
Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review	7

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers	7
Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging	7
Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology	7
Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities	7
Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling	7
Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers	7
Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink	7
Numerical Study of Large Footprint (24 × 24 mm2) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers	7
Reduced Order Design Optimization of Liquid Cooled Heat Sinks	6
Numerical Modeling of the Wave Soldering Process and Experimental Validation	6
Effect of Different Solder Volumes on the Laser Soldering Process: Numerical and Experimental Investigation	6
Recent Developments in Air Pumps for Thermal Management of Electronics	6
Design of Microfabricated Mechanically Interlocking Metamaterials for Reworkable Heterogeneous Integration	5
Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review	5
Heat Transfer Enhancement Through Array Jet Impingement on Strategically Placed High Porosity High Pore-Density Thin Copper Foams	5
High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors	5
Strength and Isothermal Fatigue Resistance of SnBi/SnAgCu Joints Reflowed at Low Temperatures	5
Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds	5
A New Structure of Ceramic Substrate to Reduce the Critical Electric Field in High Voltage Power Modules	5
Surrogate Modeling for Creep Strain-Based Fatigue Prediction of a Ball Grid Array Component	5
Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module	5
Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging	5
Effective Constitutive Relations for Sintered Nano Copper Joints	4
Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model	4
Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging	4
Parametric Effects of Heater Size, Contact Angle, and Surrounding Vessel Size on Pool Boiling Critical Heat Flux From Horizontal Surfaces	4
Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging	4
Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization	4
Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature	4
Assembly Reliability and Molding Material Comparison of Miniature Integrated High Power Module With Insulated Metal Substrate	4
Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling	4
A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging	4
A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique	4
A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling	4