OOIR: Observatory of International Research

Papers

(The TQCC of Journal of Electronic Packaging is 4. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-01-01 to 2026-01-01.)

Article	Citations
Multiphysics Coupling in IGBT Modules: A Review	47
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components	34
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs	23
Converging Jet Impingement for Enhanced Liquid Cooling	22
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling	19
Tonal and Broadband Noise-Reducing Heat Sinks Using Long-Neck Helmholtz Resonator Arrays and Corrugated Periodic Cellular Materials	18
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation	17
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis	16
Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics	15
Hybrid Bonding for Ultra-High-Density Interconnect	14
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits	13
Evaluation of phase transformation on boron decorated Sn-1.5Ag-0.7 Cu joined Cu pillar for packaging connection	12
Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current	11
Optimization of Micropillars Electroplating Bonding Processes and Additives	10
Performance and Reliability Comparison of Thermoformed, Screen-Printed Structures on Polycarbonate and High-Impact Polystyrene Substrates Under Sustained High Temperatures for In-Mold Electronics	10
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?	10
Three Decades of Thermal Management Research at DARPA	10
Advanced IGBT Module Design for Enhanced Overcurrent Capability Using Phase Change Materials	10
Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948]	9
Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems	9
Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications	9
Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm	8
Effect of Dispensing Type on Void Formation Using Convolutional Neural Network	8
Failure Mechanisms Driven Reliability Models for Power Electronics: A Review	8
Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging	7

Special Section on InterPACK2021	7
Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks	7
Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform	6
Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints	6
Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging	6
Heat Dissipation Design Based on Topology Optimization and Auxiliary Materials	6
A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification	6
Optimal Design of Thermal Cycling Reliability for Plastic Ball Grid Array Assembly Via Finite Element Method and Taguchi Method	6
Analysis and Modeling of a SiC Based Buck Converter and Its Effects in an Electric Vehicle Application	6
Uncertainty Quantification for Compressible Micro-Interconnects in Replaceable Integrated Chiplet Assembly Under Hypergravity	6
Effective Constitutive Relations for Sintered Nano Copper Joints	5
Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate	5
Convection Cooling of Power Electronics Operating in Deep-Space	5
Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films	5
Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics	5
A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers	5
Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope	5
The Impact of Die Tilt on the Reliability of Packages With Dies Bonded to Substrates Using Silver Sintered Material	5
High-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire (Cunws)-Polydimethylsiloxane (Pdms) Composite Thermal Interface Materials (Tims) Tape	4
Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints	4
Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation	4
Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core	4
Additively Printed Circuit Performance of Thermoformed In-Mold Electronics for Automotive Applications	4
Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging	4
Liquid to Liquid In-Row Coolant Distribution Unit Characterization for High Power Data Center	4
Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes	4
A Review of the Cu Chemical Mechanical Planarization Process in Hybrid Bonding Technology	4
Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions	4
Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis	4
Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics	4
High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology	4