OOIR: Observatory of International Research

Papers

(The median citation count of Journal of Electronic Packaging is 1. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-09-01 to 2025-09-01.)

Article	Citations
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs	33
Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer	25
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components	21
Multiphysics Coupling in IGBT Modules: A Review	20
A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling	18
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis	18
Hybrid Bonding for Ultra-High-Density Interconnect	17
Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics	17
Converging Jet Impingement for Enhanced Liquid Cooling	14
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling	14
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation	14
Tonal and Broadband Noise-Reducing Heat Sinks Using Long-Neck Helmholtz Resonator Arrays and Corrugated Periodic Cellular Materials	12
Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model	11
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits	11
Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current	10
Special Issue Dedicated to Professor Avram Bar-Cohen	10
Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948]	9
Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks	9
Optimization of Micropillars Electroplating Bonding Processes and Additives	9
Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems	9
Performance and Reliability Comparison of Thermoformed, Screen-Printed Structures on Polycarbonate and High Impact Polystyrene Substrates Under Sustained High Temperatures for In-Mold Electronics	9
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?	9
Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications	9
Three Decades of Thermal Management Research at DARPA	9
High-Performance Planar Thermal Diode With Wickless Components	8

Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging	8
Failure Mechanisms Driven Reliability Models for Power Electronics: A Review	8
Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm	8
Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform	8
Effect of Dispensing Type on Void Formation Using Convolutional Neural Network	8
Special Section on InterPACK2021	7
Optimal Design of Thermal Cycling Reliability for Plastic Ball Grid Array Assembly Via Finite Element Method and Taguchi Method	7
Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging	7
Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling	7
Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics	6
A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers	6
Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films	6
Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints	6
Effective Constitutive Relations for Sintered Nano Copper Joints	6
Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model	6
A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification	6
Analysis and Modeling of a SiC Based Buck Converter and Its Effects in an Electric Vehicle Application	6
Heat Dissipation Design Based on Topology Optimization and Auxiliary Materials	6
Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope	5
The Impact of Die Tilt on the Reliability of Packages With Dies Bonded to Substrates Using Silver Sintered Material	5
Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds	5
Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions	5
Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate	5
Convection Cooling of Power Electronics Operating in Deep-Space	5
Liquid To Liquid In-Row Coolant Distribution Unit Characterization For High Power Data Center	5
High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology	5
Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling	5
Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics	5
A Kriging Surrogate Model for Ball Grid Array Electronic Packaging With Stochastic Material and Geometrical Parameters	5
Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints	5
A Review of the Cu Chemical Mechanical Planarization Process in Hybrid Bonding Technology	4
Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies	4
Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics	4
Reviewer's Recognition	4
Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation	4
Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis	4
Effect of U-Flex-to-Install and Dynamic U-Flexing on Li-Ion Battery State of Health Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates, and Temperatures	4
HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions	4
Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core	4
Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging	4
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes	4
Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics	4
Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes	4
Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning	3
Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature	3
Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink	3
Effect of Wavy Wall and Plate Bifurcations on Heat Transfer Enhancement in Microchannel	3
System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile	3
A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics	3
Surrogate Modeling for Creep Strain-Based Fatigue Prediction of a Ball Grid Array Component	3

High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days	3
Special Issue on InterPACK2023	3
Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits	3
Special Issue on InterPACK2020	3
Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning	3
Interfacial Fracture Caused by Electromigration at Copper Interconnects	3
Transient Liquid Phase Bond Acceleration Using Copper Nanowires	3
Microbead Encapsulation for Protection of Electronic Components	3
A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique	3
Role of Nominal Stress State on Cyclic Fatigue Durability of SAC305 Grain-Scale Solder Joints	3
Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers	3
Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation	3
Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing	3
Mandrel Bend Test of Screen-Printed Silver Conductors	2
Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers	2
High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors	2
Acoustic Characterization of Integrated Circuits During Operation	2
On the Assumption Used for the Time-Dependent Warpage Analysis of Encapsulated Semiconductor Packages	2
Advancing In Data Centers Thermal Management: Experimental Assessment of Two-Phase Liquid Cooling Technology	2
Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft	2
Thermal Spreading Resistance of Surface Adjacent Localized Heating-Induced Size Effects in Semiconductors	2
Electrothermal Analysis of System in Package for Aerospace Application	2
Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink	2
Bio-Analysis Of Cross-Mixed Coolants In High Powered Liquid Cooled Data Center	2
A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots	2
Numerical Study of Large Footprint (24 × 24 mm2) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers	2
Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors	2
Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology	2
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability	2
Recent Developments in Air Pumps for Thermal Management of Electronics	2
Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks	2
Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic Packaging	2
Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink	2
Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies	2
Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection	2
Hybrid Substrates for Heterogeneous Integration	2
Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator	2
Application of Shape Factor to Mechanical Behavior of Thermal Interface Pads and Putties	2
A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip Warpage	2
Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading	2
Characterization of a Rack-Level Thermosyphon-Based Cooling System	1
Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition	1
Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level Cooling	1
Machine Learning Analysis of Autonomous Vehicle Sensors Under Extreme Conditions in Alaska	1
Mitigation of Boiling-Induced Thermal Degradation using Microporous Nickel Inverse Opals Structures	1
Optimized Design of Various Ag Decorated Sn-xAg-Cu0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging	1
Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics	1
Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling	1
High Gain Compact Antenna-in-Package Solution Using Like Mushroom Electromagnetic Band Gap for Industrial, Scientific, and Medical Band	1
Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications	1
Coupled Electrical–Thermal–Fluidic Multi-Physics Analysis of Through Silicon Via Pin Fin Microchannel in the Three-Dimensional Integrated Circuit	1
Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications	1
Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model	1
Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities	1
Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter	1
Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat	1
Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling	1
Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging	1
Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches	1
Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module	1
Special Issue on InterPACK2022	1
The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch	1
Submillimeter Reflector for Edge-Emitting Laser Package	1
Liquid-Cooled Heat Sink Optimization for Thermal Imbalance Mitigation in Wide-Bandgap Power Modules	1
Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review	1
Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging	1
Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals	1
Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids	1
Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation	1
Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method	1
Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers	1
A Hybrid Antenna in Package Solution Using FOWLP Technology	1
Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life	1
Multifunctional Magnetic Nanocomposite Encapsulant for Electromagnetic Interference Shielding in Power Electronics	1