OOIR: Observatory of International Research

Papers

(The median citation count of Journal of Electronic Packaging is 1. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-05-01 to 2025-05-01.)

Article	Citations
Multiphysics Coupling in IGBT Modules: A Review	97
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs	40
Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer	25
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components	25
Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics	19
Hybrid Bonding for Ultra-High-Density Interconnect	18
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis	16
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling	16
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation	15
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits	15
A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling	14
Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model	13
Converging Jet Impingement for Enhanced Liquid Cooling	13
Optimization of Micropillars Electroplating Bonding Processes and Additives	11
Special Issue Dedicated to Professor Avram Bar-Cohen	11
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?	11
Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current	11
Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications	10
Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks	10
Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948]	10
Effect of Dispensing Type on Void Formation Using Convolutional Neural Network	9
Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm	9
Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling	8
Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control	8
Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging	8

Special Section on InterPACK2021	8
Failure Mechanisms Driven Reliability Models for Power Electronics: A Review	8
Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform	8
Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems	8
Underfill Flow in Flip-Chip Encapsulation Process: A Review	7
Optimal Design of Thermal Cycling Reliability for Plastic Ball Grid Array Assembly Via Finite Element Method and Taguchi Method	7
Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Sign	7
High-Performance Planar Thermal Diode With Wickless Components	7
Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging	7
Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model	6
A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification	6
Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints	6
Effective Constitutive Relations for Sintered Nano Copper Joints	6
Convection Cooling of Power Electronics Operating in Deep-Space	5
Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics	5
Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films	5
Heat Dissipation Design Based on Topology Optimization and Auxiliary Materials	5
A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers	5
Analysis and Modeling of a SiC Based Buck Converter and Its Effects in an Electric Vehicle Application	5
High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology	4
Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling	4
Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation	4
Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis	4
Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes	4
Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope	4
Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate	4
Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging	4
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes	4
Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies	4
Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds	4
Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics	4
Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages	4
Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions	4
Special Issue on InterPACK2023	3
Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core	3
Reviewer's Recognition	3
Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics	3
A Kriging Surrogate Model for Ball Grid Array Electronic Packaging With Stochastic Material and Geometrical Parameters	3
Effect of Wavy Wall and Plate Bifurcations on Heat Transfer Enhancement in Microchannel	3
Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits	3
Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink	3
Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints	3
Effect of U-Flex-to-Install and Dynamic U-Flexing on Li-Ion Battery State of Health Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates, and Temperatures	3
Transient Liquid Phase Bond Acceleration Using Copper Nanowires	3
Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature	3
Role of Nominal Stress State on Cyclic Fatigue Durability of SAC305 Grain-Scale Solder Joints	3
Microbead Encapsulation for Protection of Electronic Components	3
Special Issue on InterPACK2020	3
A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique	3
Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics	3

HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions	3
Improving Ambient Contrast Ratio and Color Uniformity of Mini Full Color Light-Emitting Diodes Using an SiO2/Graphite Bilayered Packaging Structure	3
High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days	3
Surrogate Modeling for Creep Strain-Based Fatigue Prediction of a Ball Grid Array Component	3
Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading	2
Acoustic Characterization of Integrated Circuits During Operation	2
Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic Packaging	2
Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing	2
Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies	2
Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning	2
Evaluation of phase transformation on boron decorated Sn-1.5Ag-0.7 Cu joined Cu pillar for packaging connection	2
Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink	2
Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink	2
Interfacial Fracture Caused by Electromigration at Copper Interconnects	2
A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots	2
Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning	2
System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile	2
Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors	2
Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package	2
High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors	2
Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator	2
A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics	2
Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers	2
Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation	2
Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology	2
Validation of the Critical Strain-Based Methodology for Evaluating the Mechanical Safety of Ball Grid Array Solder Joints in a Launch Random Vibration Environment	2
Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers	2
Hybrid Substrates for Heterogeneous Integration	2
Numerical Study of Large Footprint (24 × 24 mm2) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers	2
Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level Cooling	1
Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling	1
Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches	1
Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling	1
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability	1
Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks	1
Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft	1
Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids	1
Liquid-Cooled Heat Sink Optimization for Thermal Imbalance Mitigation in Wide-Bandgap Power Modules	1
Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications	1
Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics	1
A Hybrid Antenna in Package Solution Using FOWLP Technology	1
Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities	1
Optimized Design of Various Ag Decorated Sn-xAg-Cu0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging	1
Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals	1
Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method	1
Micro Solder Joint Reliability and Warpage Investigations of Extremely Thin Double-Layered Stacked-Chip Packaging	1
Recent Developments in Air Pumps for Thermal Management of Electronics	1
Machine Learning Analysis of Autonomous Vehicle Sensors Under Extreme Conditions in Alaska	1
Application of Shape Factor to Mechanical Behavior of Thermal Interface Pads and Putties	1
Submillimeter Reflector for Edge-Emitting Laser Package	1
Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model	1
Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers	1
Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging	1
Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation	1
Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat	1
Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging	1
Electrothermal Analysis of System in Package for Aerospace Application	1
Thermal Spreading Resistance of Surface Adjacent Localized Heating-Induced Size Effects in Semiconductors	1
Mandrel Bend Test of Screen-Printed Silver Conductors	1
A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip Warpage	1
Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter	1
Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition	1
Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module	1
Characterization of a Rack-Level Thermosyphon-Based Cooling System	1