OOIR: Observatory of International Research

Papers

(The median citation count of Journal of Electronic Packaging is 1. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2020-11-01 to 2024-11-01.)

Article	Citations
Spray Cooling on Enhanced Surfaces: A Review of the Progress and Mechanisms	70
Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging	48
Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions	34
A Review On Transient Thermal Management of Electronic Devices	30
A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling	28
Underfill Flow in Flip-Chip Encapsulation Process: A Review	18
Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors	16
High-Performance Planar Thermal Diode With Wickless Components	15
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs	15
High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days	13
Failure Mechanisms Driven Reliability Models for Power Electronics: A Review	12
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis	12
Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics	12
Flow-Controlled Spray Cooling Approaches for Dynamic Thermal Management	11
Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap	11
Modular Heat Sinks for Enhanced Thermal Management of Electronics	11
Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods	10
Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid	10
Role of Nominal Stress State on Cyclic Fatigue Durability of SAC305 Grain-Scale Solder Joints	10
Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches	9
Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model	9
Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging	8
Fabrication and Reliability Assessment of Cu Pillar Microbumps With Printed Polymer Cores	8
Improving Ambient Contrast Ratio and Color Uniformity of Mini Full Color Light-Emitting Diodes Using an SiO2/Graphite Bilayered Packaging Structure	8
Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology	7

Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities	7
Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling	7
Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers	7
Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink	7
Numerical Study of Large Footprint (24 × 24 mm2) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers	7
Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review	7
Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers	7
Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging	7
Reduced Order Design Optimization of Liquid Cooled Heat Sinks	6
Numerical Modeling of the Wave Soldering Process and Experimental Validation	6
Effect of Different Solder Volumes on the Laser Soldering Process: Numerical and Experimental Investigation	6
Recent Developments in Air Pumps for Thermal Management of Electronics	6
Design of Microfabricated Mechanically Interlocking Metamaterials for Reworkable Heterogeneous Integration	5
Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review	5
Heat Transfer Enhancement Through Array Jet Impingement on Strategically Placed High Porosity High Pore-Density Thin Copper Foams	5
High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors	5
Strength and Isothermal Fatigue Resistance of SnBi/SnAgCu Joints Reflowed at Low Temperatures	5
Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds	5
A New Structure of Ceramic Substrate to Reduce the Critical Electric Field in High Voltage Power Modules	5
Surrogate Modeling for Creep Strain-Based Fatigue Prediction of a Ball Grid Array Component	5
Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module	5
Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging	5
Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging	4
Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization	4
Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature	4
Assembly Reliability and Molding Material Comparison of Miniature Integrated High Power Module With Insulated Metal Substrate	4
Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling	4
A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging	4
A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique	4
A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling	4
Effective Constitutive Relations for Sintered Nano Copper Joints	4
Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model	4
Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging	4
Parametric Effects of Heater Size, Contact Angle, and Surrounding Vessel Size on Pool Boiling Critical Heat Flux From Horizontal Surfaces	4
Liquid-Cooled Heat Sink Optimization for Thermal Imbalance Mitigation in Wide-Bandgap Power Modules	3
Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control	3
Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging	3
Influence of Laser Soldering Temperatures on Through-Hole Component	3
Design and Fabrication of Leadless Package Structure for Pressure Sensors	3
Hybrid Substrates for Heterogeneous Integration	3
Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation	3
A Reduced Model Based on Proper Generalized Decomposition for the Fast Analysis of IGBT Power Modules Lifetime	3
Micro Solder Joint Reliability and Warpage Investigations of Extremely Thin Double-Layered Stacked-Chip Packaging	3
Effect of Hexagonal-Boron Nitride/Epoxy and BNNS/Epoxy Composite Materials on the Reliability of Flip Chip	3
Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator	3
A Hybrid Antenna in Package Solution Using FOWLP Technology	3
Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics	3
Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages	3
A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics	3
Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation	3

Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints	3
Effect of Wavy Wall and Plate Bifurcations on Heat Transfer Enhancement in Microchannel	3
Geometric Nonlinear Effect on Biaxial Bending Strength of Thin Silicon Die in the Ball-on-Ring Test	3
Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes	3
Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations	3
Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology	3
Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals	3
Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation	3
Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling	3
Experimental and Numerical Investigation of Electromigration Behavior of Printed Silver Wire Under High Current Density	2
Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life	2
Effect of Heating Power on Ball Grid Array Thermal Shock Reliability for a Fanout Package	2
Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks	2
Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading	2
Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices	2
Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package	2
Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions	2
Electrothermal Analysis of System in Package for Aerospace Application	2
The Effect of Uneven Heating on the Flow Distribution Between Parallel Microchannels Undergoing Boiling	2
Study of Different Dispensing Patterns of No-Flow Underfill Using Numerical and Experimental Methods	2
Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model	2
HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions	2
Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies	2
Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds	2
Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages	2
Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Sign	2
Validation of the Critical Strain-Based Methodology for Evaluating the Mechanical Safety of Ball Grid Array Solder Joints in a Launch Random Vibration Environment	2
Mandrel Bend Test of Screen-Printed Silver Conductors	2
The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification Methods	2
A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the Ball-on-Ring and PoEF Tests	2
Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer	2
Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics	2
Interfacial Fracture Caused by Electromigration at Copper Interconnects	2
Peak Temperature Mitigation of a Multimicrochannel Evaporator Under Transient Heat Loads	2
Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate	1
Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing	1
Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer	1
Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package	1
A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip Warpage	1
Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging	1
An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging	1
Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology	1
Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics	1
Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes	1
Optimized Design of Various Ag Decorated Sn-xAg-Cu0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging	1
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components	1
Coupled Electrical–Thermal–Fluidic Multi-Physics Analysis of Through Silicon Via Pin Fin Microchannel in the Three-Dimensional Integrated Circuit	1
Process-Recipe Development for Printing of Multilayer Circuitry With Z-Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias	1
Optimal Design of Thermal Cycling Reliability for Plastic Ball Grid Array Assembly Via Finite Element Method and Taguchi Method	1
Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications	1
Improving Ambient Contrast Ratio of Display Device at Oblique Angle Using a Fe3O4-Magnetic Particle Chained Pillar Array Structure	1
Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink	1
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling	1
Microstructure and Properties of Nb Nanoparticles Reinforced Sn–0.7Cu Solder Alloy	1
Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling	1
Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint	1
Application of Shape Factor to Mechanical Behavior of Thermal Interface Pads and Putties	1
A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification	1
Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits	1
Multifunctional Magnetic Nanocomposite Encapsulant for Electromagnetic Interference Shielding in Power Electronics	1
Remaining Useful Life Estimation and Prognostication of SAC305 Printed Circuit Boards for Dynamic Conditions of Temperature and Vibration Loads	1
Design, Fabrication, and Testing of a Novel Design for Flexible Light-Emitting Diode Signage Modules	1
Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current	1
Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat	1