OOIR: Observatory of International Research

Papers

(The median citation count of Journal of Electronic Packaging is 1. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-12-01 to 2025-12-01.)

Article	Citations
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components	42
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs	31
Multiphysics Coupling in IGBT Modules: A Review	22
Converging Jet Impingement for Enhanced Liquid Cooling	20
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling	19
Tonal and Broadband Noise-Reducing Heat Sinks Using Long-Neck Helmholtz Resonator Arrays and Corrugated Periodic Cellular Materials	18
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis	17
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits	16
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation	15
Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics	13
Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current	12
Hybrid Bonding for Ultra-High-Density Interconnect	12
Performance and Reliability Comparison of Thermoformed, Screen-Printed Structures on Polycarbonate and High-Impact Polystyrene Substrates Under Sustained High Temperatures for In-Mold Electronics	10
Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model	10
Advanced IGBT Module Design for Enhanced Overcurrent Capability Using Phase Change Materials	10
Three Decades of Thermal Management Research at DARPA	10
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?	10
Optimization of Micropillars Electroplating Bonding Processes and Additives	9
Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems	9
Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm	8
Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks	8
Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948]	8
Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications	8
Effect of Dispensing Type on Void Formation Using Convolutional Neural Network	7
Failure Mechanisms Driven Reliability Models for Power Electronics: A Review	7

Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging	7
A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification	6
Optimal Design of Thermal Cycling Reliability for Plastic Ball Grid Array Assembly Via Finite Element Method and Taguchi Method	6
Uncertainty quantification for compressible micro-interconnects in replaceable integrated chiplet assembly under hypergravity	6
Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics	6
Special Section on InterPACK2021	6
Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging	6
Analysis and Modeling of a SiC Based Buck Converter and Its Effects in an Electric Vehicle Application	6
Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform	6
Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints	6
Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate	5
Effective Constitutive Relations for Sintered Nano Copper Joints	5
The Impact of Die Tilt on the Reliability of Packages With Dies Bonded to Substrates Using Silver Sintered Material	5
Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope	5
Heat Dissipation Design Based on Topology Optimization and Auxiliary Materials	5
A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers	5
Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling	5
Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films	5
A Kriging Surrogate Model for Ball Grid Array Electronic Packaging With Stochastic Material and Geometrical Parameters	4
Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis	4
Additively Printed Circuit Performance of Thermoformed In-Mold Electronics for Automotive Applications	4
High-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire (Cunws)-Polydimethylsiloxane (Pdms) Composite Thermal Interface Materials (Tims) Tape	4
Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging	4
Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation	4
Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints	4
Convection Cooling of Power Electronics Operating in Deep-Space	4
A Review of the Cu Chemical Mechanical Planarization Process in Hybrid Bonding Technology	4
Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature	3
Reviewer's Recognition	3
Special Issue on InterPACK2023	3
HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions	3
Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core	3
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes	3
Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions	3
Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink	3
Transient Liquid Phase Bond Acceleration Using Copper Nanowires	3
Liquid to Liquid In-Row Coolant Distribution Unit Characterization for High Power Data Center	3
Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics	3
Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics	3
Effect of U-Flex-to-Install and Dynamic U-Flexing on Li-Ion Battery State of Health Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates, and Temperatures	3
Microbead Encapsulation for Protection of Electronic Components	3
Review on Fan-Out Packaging of Light-Emitting Diodes: Process Route, Manufacturing Reliability, and Performance Optimization	3
High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology	3
Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes	3
Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics	3
Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning	2
Special Issue on InterPACK2020	2
On the Assumption Used for the Time-Dependent Warpage Analysis of Encapsulated Semiconductor Packages	2
Surrogate Modeling for Creep Strain-Based Fatigue Prediction of a Ball Grid Array Component	2
Numerical Study of Large Footprint (24 × 24 mm2) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers	2

A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots	2
Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies	2
Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits	2
Investigation of the high-vacuum Au/Si eutectic wafer bonding process for MEMS resonators	2
Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning	2
Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing	2
Interfacial Fracture Caused by Electromigration at Copper Interconnects	2
Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology	2
Hybrid Substrates for Heterogeneous Integration	2
A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique	2
Acoustic Characterization of Integrated Circuits During Operation	2
Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers	2
Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection	2
Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink	2
Bio-Analysis of Cross-Mixed Coolants in High-Powered Liquid-Cooled Data Center	2
High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors	2
Machine Learning Analysis of Autonomous Vehicle Sensors Under Extreme Conditions in Alaska	1
Thermomechanical Characterization and Geometric Optimization of Multi-Layer Cantilever Probe Card Needles for Wafer Testing	1
Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter	1
Thermal Spreading Resistance of Surface Adjacent Localized Heating-Induced Size Effects in Semiconductors	1
Mandrel Bend Test of Screen-Printed Silver Conductors	1
Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft	1
Advancing in Data Centers Thermal Management: Experimental Assessment of Two-Phase Liquid Cooling Technology	1
Thermal Management of 3D Chips and Monolithic Integrated Circuits Using Phase Change Materials - Si/Cu Composites	1
Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging	1
Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module	1
Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities	1
Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics	1
Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation	1
Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling	1
Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches	1
Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks	1
Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic Packaging	1
Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink	1
Characterization of Fatigue Performance for Bulk Epoxy Molding Compound in Sustained High Temperature Exposure up to 1 Year Aging	1
Mitigation of Boiling-Induced Thermal Degradation Using Microporous Nickel Inverse Opals Structures	1
Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition	1
Numerical and Experimental Investigation of Effects of Porous Layer on Cooling of Electronic Components	1
Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals	1
Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids	1
Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat	1
Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method	1
Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level Cooling	1
A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip Warpage	1
Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading	1
Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator	1
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability	1
Electrothermal Analysis of System in Package for Aerospace Application	1
Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications	1
ThermoDynaSMT: A Physics-Informed Machine Learning Model for Component Displacement in Surface Mount Technology	1
Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging	1