Journal of Electronic Packaging

Papers
(The median citation count of Journal of Electronic Packaging is 1. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-05-01 to 2026-05-01.)
ArticleCitations
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs57
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components37
From Design of Experiments to Neural Network Models for Predicting Sintered Nano-Silver Joints Degradation Under Thermal Shocks29
Multiphysics Coupling in IGBT Modules: A Review23
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis22
Evaluation of phase transformation on boron decorated Sn-1.5Ag-0.7 Cu joined Cu pillar for packaging connection19
Tonal and Broadband Noise-Reducing Heat Sinks Using Long-Neck Helmholtz Resonator Arrays and Corrugated Periodic Cellular Materials19
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits18
Hybrid Bonding for Ultra-High-Density Interconnect18
Converging Jet Impingement for Enhanced Liquid Cooling18
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation14
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling13
Performance and Reliability Comparison of Thermoformed, Screen-Printed Structures on Polycarbonate and High-Impact Polystyrene Substrates Under Sustained High Temperatures for In-Mold Electronics12
Advanced IGBT Module Design for Enhanced Overcurrent Capability Using Phase Change Materials11
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?11
Three Decades of Thermal Management Research at DARPA10
Optimization of Micropillars Electroplating Bonding Processes and Additives10
Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications9
Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm9
Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging8
Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks8
Effect of Dispensing Type on Void Formation Using Convolutional Neural Network8
Special Section on InterPACK20217
Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948]7
Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems7
Failure Mechanisms Driven Reliability Models for Power Electronics: A Review7
Uncertainty Quantification for Compressible Micro-Interconnects in Replaceable Integrated Chiplet Assembly Under Hypergravity6
Aging Effects on SAC305 Solder Joints: Correlating IMC Evolution, Hardness, and Drop-Shock Performance in ENIG and Immersion Tin Finishes6
Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging6
Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films6
Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform6
Epoxy Molding Compound for Electronic Packaging: Impact of Inorganic Filler Type and Geometry6
Optimal Design of Thermal Cycling Reliability for Plastic Ball Grid Array Assembly Via Finite Element Method and Taguchi Method6
Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics5
High-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire-Polydimethylsiloxane Composite Thermal Interface Materials Tape5
A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers5
Effective Constitutive Relations for Sintered Nano Copper Joints5
Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope5
Additively Printed Circuit Performance of Thermoformed In-Mold Electronics for Automotive Applications5
Heat Dissipation Design Based on Topology Optimization and Auxiliary Materials5
Analysis and Modeling of a SiC Based Buck Converter and Its Effects in an Electric Vehicle Application5
Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate5
Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints4
Stencil-Assisted Electrospray Deposition of Silver Films on Insulators for EMI Shielding4
Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions4
The Impact of Die Tilt on the Reliability of Packages With Dies Bonded to Substrates Using Silver Sintered Material4
Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation4
High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology4
Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis4
Convection Cooling of Power Electronics Operating in Deep-Space4
Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging4
Liquid to Liquid In-Row Coolant Distribution Unit Characterization for High Power Data Center4
Transient Liquid Phase Bond Acceleration Using Copper Nanowires3
Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics3
Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core3
First-Principles Computational Prediction of Doping to Improve the Properties of Ag/Ni3
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes3
Special Issue on InterPACK20233
Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink3
Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics3
Feasibility Study of Implementing a Hybrid Single- and Two-Phase Cooler for High Power Density Power Electronics3
Review on Fan-Out Packaging of Light-Emitting Diodes: Process Route, Manufacturing Reliability, and Performance Optimization3
HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions3
Microbead Encapsulation for Protection of Electronic Components3
A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique3
A Kriging Surrogate Model for Ball Grid Array Electronic Packaging With Stochastic Material and Geometrical Parameters3
A Review of the Cu Chemical Mechanical Planarization Process in Hybrid Bonding Technology3
Reviewer's Recognition3
Special Section on Silicon-Package-Rack-Data Center Thermal Management: Challenges, Opportunities, and Solutions3
Investigation of the High-Vacuum Au/Si Eutectic Wafer Bonding Process for MEMS Resonators3
Surrogate Modeling for Creep Strain-Based Fatigue Prediction of a Ball Grid Array Component2
Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning2
Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink2
Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink2
Bio-Analysis of Cross-Mixed Coolants in High-Powered Liquid-Cooled Data Center2
Hybrid Substrates for Heterogeneous Integration2
Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits2
Propensity for Pad Cratering Evaluation in Board Resin and Board-Resin/Glass Interface Under Assembly and Rework2
Interfacial Fracture Caused by Electromigration at Copper Interconnects2
Numerical Study of Large Footprint (24 × 24 mm2) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers2
Experimental Characterization of Geysering Instabilities in a Small-Scale Closed Loop Thermosyphon2
Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies2
Acoustic Characterization of Integrated Circuits During Operation2
Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers2
On the Assumption Used for the Time-Dependent Warpage Analysis of Encapsulated Semiconductor Packages2
A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots2
Advancing in Data Centers Thermal Management: Experimental Assessment of Two-Phase Liquid Cooling Technology2
Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic Packaging2
Characterization of Fatigue Performance for Bulk Epoxy Molding Compound in Sustained High Temperature Exposure Up to 1 Year Aging2
Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection2
Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning2
Study On The Reliability of Lead-Free Solder Joint Assemblies Under Combined Effects of Vibrations & Extended High-Temperature Exposure1
Mitigation of Boiling-Induced Thermal Degradation Using Microporous Nickel Inverse Opals Structures1
Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition1
Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics1
Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module1
Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids1
Investigating the Impact of Dynamic Excitation and Boundary Conditions on the Fatigue Life of Board-Level Electronic Packages1
Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat1
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability1
Electrothermal Analysis of System in Package for Aerospace Application1
Thermal Spreading Resistance of Surface Adjacent Localized Heating-Induced Size Effects in Semiconductors1
Effect Of Bending Deformation on Damage of Ag Nanoparticle Lines Under Electrical Loading1
A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip Warpage1
Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches1
Numerical and Experimental Investigation of Effects of Porous Layer on Cooling of Electronic Components1
Application of Laser Assisted Soldering for Replacing Massive Reflow in SBM Process1
Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level Cooling1
Machine Learning Analysis of Autonomous Vehicle Sensors Under Extreme Conditions in Alaska1
Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging1
Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals1
Thermomechanical Characterization and Geometric Optimization of Multi-Layer Cantilever Probe Card Needles for Wafer Testing1
Mandrel Bend Test of Screen-Printed Silver Conductors1
Thermal Management of Three-Dimensional Chips and Monolithic Integrated Circuits Using Phase Change Materials–Si/Cu Composites1
Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft1
Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter1
Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model1
ThermoDynaSMT: A Physics-Informed Machine Learning Model for Component Displacement in Surface Mount Technology1
Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging1
Surge Current Capability of Dual-Chip Packaged SiC Schottky Barrier Diodes1
Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities1
Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling1
Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method1
Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks1
Advances in the Reduction of the Warpage for Flip Chip Packages1
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