OOIR: Observatory of International Research

Papers

(The median citation count of Journal of Electronic Packaging is 2. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2020-04-01 to 2024-04-01.)

Article	Citations
Spray Cooling on Enhanced Surfaces: A Review of the Progress and Mechanisms	53
Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging	37
Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging	34
Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions	27
State of the Art of Lead-Free Solder Joint Reliability	26
A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling	24
A Review On Transient Thermal Management of Electronic Devices	24
A System to Package Perspective on Transient Thermal Management of Electronics	24
Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules	16
Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling	15
Underfill Flow in Flip-Chip Encapsulation Process: A Review	14
A Hybrid Finite Element Modeling: Artificial Neural Network Approach for Predicting Solder Joint Fatigue Life in Wafer-Level Chip Scale Packages	14
Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs	14
Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics	14
High-Performance Planar Thermal Diode With Wickless Components	13
Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks	12
High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days	11
Modular Heat Sinks for Enhanced Thermal Management of Electronics	11
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis	11
Fatigue Properties and Microstructure of SnAgCu Bi-Based Solder Joint	10
Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors	10
Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization	10
Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap	10
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs	9
The Doping Dependence of the Thermal Conductivity of Bulk Gallium Nitride Substrates	9

Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods	9
Role of Nominal Stress State on Cyclic Fatigue Durability of SAC305 Grain-Scale Solder Joints	9
Comparative Study on Power Module Architectures for Modularity and Scalability	8
Study of a Lab-Scale Organic Rankine Cycle for the Ultra-Low-Temperature Waste Heat Recovery Associated With Data Centers	8
Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid	8
Thermomechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis	8
Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model	8
High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100 °C	8
Failure Mechanisms Driven Reliability Models for Power Electronics: A Review	7
Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers	7
Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications	7
Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics	7
Improving Ambient Contrast Ratio and Color Uniformity of Mini Full Color Light-Emitting Diodes Using an SiO2/Graphite Bilayered Packaging Structure	7
Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits	7
Fatigue Life of Sn3.0Ag0.5Cu Solder Alloy Under Combined Cyclic Shear and Constant Tensile/Compressive Loads	7
Nearly Efficiency-Droop-Free AlGaN-Based Deep-Ultraviolet Light-Emitting Diode Without Electron-Blocking Layer	7
Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers	7
System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials	7
Fabrication and Reliability Assessment of Cu Pillar Microbumps With Printed Polymer Cores	7
A New Correlation for Subcooled Flow Boiling Heat Transfer in a Vertical Narrow Microchannel	6
Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging	6
Flow-Controlled Spray Cooling Approaches for Dynamic Thermal Management	6
Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology	6
Multiscale Evaporation Rate Measurement Using Microlaser-Induced Fluorescence	6
Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches	6
Thermal Performance of Metal Foam Heat Sink With Pin Fins for Nonuniform Heat Flux Electronics Cooling	6
Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink	6
Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities	6
Recent Developments in Air Pumps for Thermal Management of Electronics	5
Interfacial Behavior of Flux Residues and Its Impact on Copper/Underfill Adhesion in Microelectronic Packaging	5
Numerical Study of Large Footprint (24 × 24 mm2) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers	5
Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review	5
Process Capability of Aerosol-Jet Additive Processes for Long-Runs Up to 10-Hours	5
Additively Printed Multilayer Substrate Using Aerosol-Jet Technique	5
Numerical Modeling of the Wave Soldering Process and Experimental Validation	5
Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink	5
Thermal Analysis and Optimization of Light-Emitting Diodes Filament Lamp	4
Strength and Isothermal Fatigue Resistance of SnBi/SnAgCu Joints Reflowed at Low Temperatures	4
Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model	4
Parametric Effects of Heater Size, Contact Angle, and Surrounding Vessel Size on Pool Boiling Critical Heat Flux From Horizontal Surfaces	4
Scattering Nanoparticles-Induced Reflection Effect for Enhancing Optical Efficiency of Inverted Quantum Dots-Light-Emitting Diodes Combined With the Centrifugation Technique	4
Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging	4
Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling	4
Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization	4
A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging	4
Reduced Order Design Optimization of Liquid Cooled Heat Sinks	4
A New Structure of Ceramic Substrate to Reduce the Critical Electric Field in High Voltage Power Modules	4
Evolution of Anand Parameters With Elevated Temperature Aging for SnAgCu Lead-free Alloys	4
Electro-Thermal Codesign Methodology of an On-Board Electric Vehicle Charger	4
Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review	4

Assembly Reliability and Molding Material Comparison of Miniature Integrated High Power Module With Insulated Metal Substrate	4
Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module	4
An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient Information Technology Loads	3
A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling	3
Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging	3
Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation	3
A Reduced Model Based on Proper Generalized Decomposition for the Fast Analysis of IGBT Power Modules Lifetime	3
Effect of Wavy Wall and Plate Bifurcations on Heat Transfer Enhancement in Microchannel	3
Detection of Sealant Delamination in Integrated Circuit Package Using Nondestructive Evaluation	3
An Overview of Thermal and Mechanical Design, Control, and Testing of the World's Most Powerful and Fastest Supercomputer	3
Heat Transfer Enhancement Through Array Jet Impingement on Strategically Placed High Porosity High Pore-Density Thin Copper Foams	3
Review of Methodologies for Structural Integrity Evaluation of Power Modules	3
Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa	3
Experimental and Computational Investigations of the Thermal Environment in a Small Operational Data Center for Potential Energy Efficiency Improvements	3
Principal Component Analysis and Independent Component Analysis-Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads	3
Lifetime Model for the Fatigue Fracture in Cu/Al2O3/Cu Composites: Experimental Validation of a Substantial Lifetime Enhancement by Cu Step Etching	3
Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling	3
Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling	3
Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control	3
A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique	3
Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds	3
A Hybrid Antenna in Package Solution Using FOWLP Technology	3
Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology	3
Design and Fabrication of Leadless Package Structure for Pressure Sensors	3
Design of Microfabricated Mechanically Interlocking Metamaterials for Reworkable Heterogeneous Integration	3
Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation	3
Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging	3
Micro Solder Joint Reliability and Warpage Investigations of Extremely Thin Double-Layered Stacked-Chip Packaging	3
An Investigation Into the Optothermal Behavior of a High Power Red Light Emitting Diode: Impact of an Optical Path	3
Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator	3
Effect of Different Solder Volumes on the Laser Soldering Process: Numerical and Experimental Investigation	2
Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics	2
Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics	2
Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds	2
Electrothermal Analysis of System in Package for Aerospace Application	2
The Optical Properties of Dual-Wavelength InxGa1−xN/GaN Nanorods for Wide-Spectrum Light-Emitting Diodes	2
Study of Different Dispensing Patterns of No-Flow Underfill Using Numerical and Experimental Methods	2
Development and Application of a Thin Flat Heat Pipe Design Optimization Tool for Small Satellite Systems	2
Effect of Hexagonal-Boron Nitride/Epoxy and BNNS/Epoxy Composite Materials on the Reliability of Flip Chip	2
Numerical Modeling and Simulation of a Volumetric Resistance Blower Using Porous Rotor	2
Development of a Precise and Cost-Effective Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center Utiliz	2
Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages	2
Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations	2
Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm2) Power Electr	2
Effective Constitutive Relations for Sintered Nano Copper Joints	2
Aging and Fatigue of Aerosol Jet-Printed Nano-Ag Traces on Flexible Substrate	2
Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufactur	2
The Effect of Uneven Heating on the Flow Distribution Between Parallel Microchannels Undergoing Boiling	2
Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature	2
Liquid-Cooled Heat Sink Optimization for Thermal Imbalance Mitigation in Wide-Bandgap Power Modules	2
Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading	2
Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices	2
Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes	2
High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors	2
Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging	2
A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics	2
Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints	2
A Statistical Study to Evaluate the Performance of Liquid Cooling Garments Considering Thermal Comfort	2
High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting	2
Surrogate Modeling for Creep Strain-Based Fatigue Prediction of a Ball Grid Array Component	2
Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks	2
Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model	2
Geometric Nonlinear Effect on Biaxial Bending Strength of Thin Silicon Die in the Ball-on-Ring Test	2
Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging	2