OOIR: Observatory of International Research

Papers

(The median citation count of Journal of Electronic Packaging is 1. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-08-01 to 2026-08-01.)

Article	Citations
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components	67
Multiphysics Coupling in IGBT Modules: A Review	49
From Design of Experiments to Neural Network Models for Predicting Sintered Nanosilver Joints Degradation Under Thermal Shocks	33
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis	31
Evaluation of phase transformation on boron decorated Sn-1.5Ag-0.7 Cu joined Cu pillar for packaging connection	26
Converging Jet Impingement for Enhanced Liquid Cooling	23
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling	21
Tonal and Broadband Noise-Reducing Heat Sinks Using Long-Neck Helmholtz Resonator Arrays and Corrugated Periodic Cellular Materials	19
Hybrid Bonding for Ultra-High-Density Interconnect	19
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation	17
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?	13
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits	13
Challenges In Co-Packaging Of SI-III/V Components In Silicon Photonics	12
Optimization of Micropillars Electroplating Bonding Processes and Additives	11
Advanced IGBT Module Design for Enhanced Overcurrent Capability Using Phase Change Materials	11
Performance and Reliability Comparison of Thermoformed, Screen-Printed Structures on Polycarbonate and High-Impact Polystyrene Substrates Under Sustained High Temperatures for In-Mold Electronics	11
Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm	10
Three Decades of Thermal Management Research at DARPA	10
Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications	10
Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks	9
Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging	9
Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948]	9
Effect of Dispensing Type on Void Formation Using Convolutional Neural Network	9
Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems	8
Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform	8

Failure Mechanisms Driven Reliability Models for Power Electronics: A Review	8
Special Section on InterPACK2021	8
Uncertainty Quantification for Compressible Micro-Interconnects in Replaceable Integrated Chiplet Assembly Under Hypergravity	7
Optimal Design of Thermal Cycling Reliability for Plastic Ball Grid Array Assembly Via Finite Element Method and Taguchi Method	7
Epoxy Molding Compound for Electronic Packaging: Impact of Inorganic Filler Type and Geometry	7
Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging	7
Aging Effects on SAC305 Solder Joints: Correlating Intermetallic Compound Evolution, Hardness, and Drop-Shock Performance in ENIG and Immersion Tin Finishes	7
Analysis and Modeling of a SiC Based Buck Converter and Its Effects in an Electric Vehicle Application	6
Effective Constitutive Relations for Sintered Nano Copper Joints	6
The Impact of Die Tilt on the Reliability of Packages With Dies Bonded to Substrates Using Silver Sintered Material	6
Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films	6
Heat Dissipation Design Based on Topology Optimization and Auxiliary Materials	6
Convection Cooling of Power Electronics Operating in Deep-Space	6
Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics	6
Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate	6
Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope	6
Stencil-Assisted Electrospray Deposition of Silver Films on Insulators for Electromagnetic Interference Shielding	5
Additively Printed Circuit Performance of Thermoformed In-Mold Electronics for Automotive Applications	5
Development Toward Low-Temperature Cofired Ceramic Electric Propulsion System With Demonstration of Plasma Generation	5
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes	5
A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers	5
High-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire-Polydimethylsiloxane Composite Thermal Interface Materials Tape	5
Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints	5
A Kriging Surrogate Model for Ball Grid Array Electronic Packaging With Stochastic Material and Geometrical Parameters	4
Transient Liquid Phase Bond Acceleration Using Copper Nanowires	4
Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics	4
Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging	4
Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core	4
Feasibility Study of Implementing a Hybrid Single- and Two-Phase Cooler for High Power Density Power Electronics	4
Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation	4
Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis	4
A Review of the Cu Chemical Mechanical Planarization Process in Hybrid Bonding Technology	4
Liquid to Liquid In-Row Coolant Distribution Unit Characterization for High Power Data Center	4
Reviewer's Recognition	4
High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology	4
Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions	4
Propensity for Pad Cratering Evaluation in Board Resin and Board-Resin/Glass Interface Under Assembly and Rework	3
Special Issue on InterPACK2023	3
Investigation of the High-Vacuum Au/Si Eutectic Wafer Bonding Process for MEMS Resonators	3
First-Principles Computational Prediction of Doping to Improve the Properties of Ag/Ni	3
Surrogate Modeling for Creep Strain-Based Fatigue Prediction of a Ball Grid Array Component	3
Hybrid Substrates for Heterogeneous Integration	3
Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning	3
Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics	3
A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique	3
Microbead Encapsulation for Protection of Electronic Components	3
Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits	3
Interfacial Fracture Caused by Electromigration at Copper Interconnects	3
Numerical Study of Large Footprint (24 × 24 mm2) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers	3
Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers	3

Special Section on Silicon-Package-Rack-Data Center Thermal Management: Challenges, Opportunities, and Solutions	3
Review on Fan-Out Packaging of Light-Emitting Diodes: Process Route, Manufacturing Reliability, and Performance Optimization	3
Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink	3
HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions	3
Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning	3
Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection	3
Analysis of Multifinger GaN HEMTs Using Gate Resistance Thermometry, Raman Thermometry, and Infrared Thermal Microscopy	3
Acoustic Characterization of Integrated Circuits During Operation	3
Effect of Bending Deformation on Damage of Ag Nanoparticle Lines Under Electrical Loading	2
Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks	2
Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies	2
Bio-Analysis of Cross-Mixed Coolants in High-Powered Liquid-Cooled Data Center	2
Advances in the Reduction of the Warpage for Flip Chip Packages	2
A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots	2
Thermal Management of Three-Dimensional Chips and Monolithic Integrated Circuits Using Phase Change Materials–Si/Cu Composites	2
Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink	2
Experimental Characterization of Geysering Instabilities in a Small-Scale Closed Loop Thermosyphon	2
Characterization of Fatigue Performance for Bulk Epoxy Molding Compound in Sustained High Temperature Exposure Up to 1 Year Aging	2
Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic Packaging	2
Advancing in Data Centers Thermal Management: Experimental Assessment of Two-Phase Liquid Cooling Technology	2
On the Assumption Used for the Time-Dependent Warpage Analysis of Encapsulated Semiconductor Packages	2
Novel Method for Power Consumption-Based Temperature Sensing in System on Chip Device	2
Multi-Illumination Feature Enhancement for Robust Ball Grid Array Defect Detection and Explainable Attention Alignment	2
Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft	2
Application of Laser Assisted Soldering for Replacing Massive Reflow in Solder Ball Mounting Process	1
Investigating the Impact of Dynamic Excitation and Boundary Conditions on the Fatigue Life of Board-Level Electronic Packages	1
The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch	1
Experimental Investigation of In-Plane Thermal Isolation Strategies for 2.5D Silicon-Based Integration Systems	1
Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model	1
Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications	1
Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals	1
Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module	1
Machine Learning Analysis of Autonomous Vehicle Sensors Under Extreme Conditions in Alaska	1
Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition	1
Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging	1
Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method	1
Thermal Spreading Resistance of Surface Adjacent Localized Heating-Induced Size Effects in Semiconductors	1
Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling	1
Surge Current Capability of Dual-Chip Packaged SiC Schottky Barrier Diodes	1
Special Issue on InterPACK2022	1
Multi-Objective Optimization of an Embedded Jet Microchannel Heat Sink for Thermal Management of High-Heat-Flux Artificial Intelligence Chips With Multiple Hotspots	1
Multiphysics-Constrained Optimization of an Axial-Flux Consequent-Pole Motor for Electronics Cooling Systems	1
ThermoDynaSMT: A Physics-Informed Machine Learning Model for Component Displacement in Surface Mount Technology	1
Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter	1
Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics	1
Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches	1
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability	1
Mandrel Bend Test of Screen-Printed Silver Conductors	1
A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip Warpage	1
Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging	1
Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life	1
Characterization of a Rack-Level Thermosyphon-Based Cooling System	1
Submillimeter Reflector for Edge-Emitting Laser Package	1
Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level Cooling	1
Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities	1
Numerical and Experimental Investigation of Effects of Porous Layer on Cooling of Electronic Components	1
Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids	1
Study On the Reliability of Lead-Free Solder Joint Assemblies Under Combined Effects of Vibrations and Extended High-Temperature Exposure	1
Mitigation of Boiling-Induced Thermal Degradation Using Microporous Nickel Inverse Opals Structures	1
Thermomechanical Characterization and Geometric Optimization of Multi-Layer Cantilever Probe Card Needles for Wafer Testing	1
Using Data Center Waste Heat for Hydrogen Production	1