Journal of Electronic Packaging

Papers
(The H4-Index of Journal of Electronic Packaging is 12. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-05-01 to 2026-05-01.)
ArticleCitations
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs57
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components37
From Design of Experiments to Neural Network Models for Predicting Sintered Nano-Silver Joints Degradation Under Thermal Shocks29
Multiphysics Coupling in IGBT Modules: A Review23
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis22
Evaluation of phase transformation on boron decorated Sn-1.5Ag-0.7 Cu joined Cu pillar for packaging connection19
Tonal and Broadband Noise-Reducing Heat Sinks Using Long-Neck Helmholtz Resonator Arrays and Corrugated Periodic Cellular Materials19
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits18
Hybrid Bonding for Ultra-High-Density Interconnect18
Converging Jet Impingement for Enhanced Liquid Cooling18
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation14
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling13
Performance and Reliability Comparison of Thermoformed, Screen-Printed Structures on Polycarbonate and High-Impact Polystyrene Substrates Under Sustained High Temperatures for In-Mold Electronics12
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