Journal of Electronic Packaging

Papers
(The H4-Index of Journal of Electronic Packaging is 12. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-08-01 to 2026-08-01.)
ArticleCitations
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components67
Multiphysics Coupling in IGBT Modules: A Review49
From Design of Experiments to Neural Network Models for Predicting Sintered Nanosilver Joints Degradation Under Thermal Shocks33
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis31
Evaluation of phase transformation on boron decorated Sn-1.5Ag-0.7 Cu joined Cu pillar for packaging connection26
Converging Jet Impingement for Enhanced Liquid Cooling23
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling21
Hybrid Bonding for Ultra-High-Density Interconnect19
Tonal and Broadband Noise-Reducing Heat Sinks Using Long-Neck Helmholtz Resonator Arrays and Corrugated Periodic Cellular Materials19
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation17
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits13
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?13
Challenges In Co-Packaging Of SI-III/V Components In Silicon Photonics12
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