Journal of Electronic Packaging

Papers
(The H4-Index of Journal of Electronic Packaging is 13. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2020-03-01 to 2024-03-01.)
ArticleCitations
Spray Cooling on Enhanced Surfaces: A Review of the Progress and Mechanisms45
Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging34
Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging31
Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions27
A System to Package Perspective on Transient Thermal Management of Electronics24
State of the Art of Lead-Free Solder Joint Reliability24
A Review On Transient Thermal Management of Electronic Devices23
A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling23
Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules16
Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling15
Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs14
Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics14
Underfill Flow in Flip-Chip Encapsulation Process: A Review13
0.021129846572876