Journal of Electronic Packaging

Papers
(The H4-Index of Journal of Electronic Packaging is 12. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-11-01 to 2025-11-01.)
ArticleCitations
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components39
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs29
Multiphysics Coupling in IGBT Modules: A Review20
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling18
Converging Jet Impingement for Enhanced Liquid Cooling18
Tonal and Broadband Noise-Reducing Heat Sinks Using Long-Neck Helmholtz Resonator Arrays and Corrugated Periodic Cellular Materials16
Hybrid Bonding for Ultra-High-Density Interconnect15
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits15
Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics14
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis12
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation12
Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current12
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