Journal of Electronic Packaging

Papers
(The H4-Index of Journal of Electronic Packaging is 12. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-06-01 to 2026-06-01.)
ArticleCitations
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs57
From Design of Experiments to Neural Network Models for Predicting Sintered Nano-Silver Joints Degradation Under Thermal Shocks42
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components31
Multiphysics Coupling in IGBT Modules: A Review25
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis23
Evaluation of phase transformation on boron decorated Sn-1.5Ag-0.7 Cu joined Cu pillar for packaging connection22
Tonal and Broadband Noise-Reducing Heat Sinks Using Long-Neck Helmholtz Resonator Arrays and Corrugated Periodic Cellular Materials21
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation19
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits18
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling15
Converging Jet Impingement for Enhanced Liquid Cooling13
Hybrid Bonding for Ultra-High-Density Interconnect12
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