Journal of Electronic Packaging

Papers
(The H4-Index of Journal of Electronic Packaging is 13. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-05-01 to 2025-05-01.)
ArticleCitations
Multiphysics Coupling in IGBT Modules: A Review97
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs40
Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer25
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components25
Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics19
Hybrid Bonding for Ultra-High-Density Interconnect18
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling16
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis16
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation15
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits15
A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling14
Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model13
Converging Jet Impingement for Enhanced Liquid Cooling13
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