Journal of Electronic Packaging

Papers
(The H4-Index of Journal of Electronic Packaging is 12. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-09-01 to 2025-09-01.)
ArticleCitations
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs33
Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer25
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components21
Multiphysics Coupling in IGBT Modules: A Review20
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis18
A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling18
Hybrid Bonding for Ultra-High-Density Interconnect17
Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics17
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation14
Converging Jet Impingement for Enhanced Liquid Cooling14
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling14
Tonal and Broadband Noise-Reducing Heat Sinks Using Long-Neck Helmholtz Resonator Arrays and Corrugated Periodic Cellular Materials12
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