Journal of Electronic Packaging

Papers
(The H4-Index of Journal of Electronic Packaging is 12. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2020-11-01 to 2024-11-01.)
ArticleCitations
Spray Cooling on Enhanced Surfaces: A Review of the Progress and Mechanisms70
Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging48
Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions34
A Review On Transient Thermal Management of Electronic Devices30
A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling28
Underfill Flow in Flip-Chip Encapsulation Process: A Review18
Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors16
High-Performance Planar Thermal Diode With Wickless Components15
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs15
High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days13
Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics12
Failure Mechanisms Driven Reliability Models for Power Electronics: A Review12
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis12
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