Soldering & Surface Mount Technology

Papers
(The TQCC of Soldering & Surface Mount Technology is 2. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-02-01 to 2025-02-01.)
ArticleCitations
Interfacial IMC growth behavior of Sn-3Ag-3Sb-xIn solder on Cu substrate125
Damping properties of Sn58Bi and Sn3.0Ag0.5Cu solders with different thicknesses and preparation directions40
Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test24
Design criteria for pad and stencil with high pick-and-Place yield15
Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review11
Study of mechanical properties of indium-based solder alloys for cryogenic applications9
The impact of intermetallic compound on microstructure, mechanical characteristics, and thermal behavior of the melt-spun Bi-Ag high-temperature lead-free solder8
Temperature and current density prediction in solder joints using artificial neural network method7
Properties of Cu/SAC0307 mixed solder balls/Cu joints with different Zn-particles content at low-temperature under ultrasonic assisted6
A temperature control method of hot-bar soldering based on extended Kalman filter6
Interfacial reactions in the Sn-9.0 wt.% Zn/Cu-Ti alloy (C1990 HP) couple5
Numerical modeling and optimization of fillet height of reinforced SAC305 solder joint in an ultra-fine capacitor assembly5
Investigation of the mechanical properties of lead-free Sn-58Bi solder alloy with cobalt addition through flux doping5
Influence of the soldering paste type on optical and thermal parameters of LED modules5
Effect of Cu, Ni, Ag addition on creeping properties of Sn5Sb-0.5Cu-0.1Ni-0.5Ag for high temperature packaging4
Simulation of jet printing of solder paste for surface mounted technology4
Image segmentation on void regional formation in the flip-chip underfilling process by comparing YOLO and mask RCNN4
Investigation of the thermal properties, microstructure, and mechanical properties of Sn-3Ag-3Sb-xIn lead-free solder alloys4
Numerical evaluation of the mechanical response of Sn-Ag-Cu lead-free solders of various silver contents4
Effect of Si3N4 nanowires doping on microstructure and properties of Sn58Bi solder for Cu bonding3
Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems3
Effect of the solder conductive particles and substrate widths on the current carrying capability for flex-on-board (FOB) assembly3
Formation and growth mechanism of thin Cu6Sn5 films in Sn/Cu and Sn-0.1AlN/Cu structures using laser heating3
Advancing packaging technology: computational fluid dynamics modeling for capillary underfill encapsulant in multi-chip heterogenous packages3
Exploring porosity effects of on mechanical behavior of sintered nanosilver for double-sided cooling packaging of high-power devices: a multiscale modeling3
Solder void size reduction in semiconductor package by vacuum reflow and pressure cure processes3
Robust vision detection of pipeline solder joints3
Microstructures evolution and growth kinetics of intermetallic compounds in Cu/Sn/Cu system during ultrasonic soldering process3
Role of Cu percentage in the Sn-xCu alloy on the mechanical performance at Sn-xCu/ENIG interface produced by laser soldering3
Introduction of non-linear fracture mechanics in the modelling of a flip-chip component under drop impact2
Effect of rotating magnetic field on the microstructure and properties of Sn-Ag-Sb lead-free solder alloys2
Microstructural and compositional evolution of SAC305/TiN composite solder under thermal stressing2
Defect patterns study of pick-and-place machine using automated optical inspection data2
Cu3Sn-microporous copper composite joint for high-temperature die-attach applications2
ZnO nanoparticles and compositional dependence of structural, thermal, mechanical and electrical properties of eutectic SAC355 lead-free solder2
Local solidification thermal parameters affecting the eutectic extent in Sn-Cu and Sn-Bi solder alloys2
Improvement of SAC0307/Cu column friction plunge micro-welding quality by static constraint2
Data-driven electronic packaging structure inverse design with an adaptive surrogate model2
Statistical-based simulation and reflow profile optimization for improving self-alignment performance − an experimental study2
Flow behavior during solder/Cu column friction plunge micro-welding2
Investigation of solder beading phenomenon under surface-mounted electrolytic capacitors2
Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphere2
Surface energetic-based analytical filling time model for flip-chip underfill process2
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