Soldering & Surface Mount Technology

Papers
(The TQCC of Soldering & Surface Mount Technology is 3. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2020-11-01 to 2024-11-01.)
ArticleCitations
Detection of solder paste defects with an optimization‐based deep learning model using image processing techniques116
Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) joints40
An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model24
Effect of TiO2 nanoparticles on the microstructure, mechanical and thermal properties of rapid quenching SAC355 lead-free solder alloy12
Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review11
Effect of Zn-powder content on the property of Cu/SAC0307 powder/Cu joint under ultrasonic assisted at low temperature10
Effect of microwave operating power and reflow time on the microstructure and tensile properties of Sn–3.0Ag–0.5Cu/Cu solder joints8
Development of holmium doped eutectic Sn-Ag lead-free solder for electronic packaging8
Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a novel energy based modeling7
Thermal-mechanical reliability analysis of WLP with fine-pitch copper post bumps7
Micromechanical response of SAC305 solder alloy under gamma radiation via nanoindentation approach7
Study of mechanical properties of indium-based solder alloys for cryogenic applications6
Solder void size reduction in semiconductor package by vacuum reflow and pressure cure processes5
Effects of Sn-Ag-x leveling layers on the microstructure and mechanical properties of SnBi low-temperature solder joints5
A study on the effects of electrical and thermal stresses on void formation and migration lifetime of Sn3.0Ag0.5Cu solder joints5
Microstructure evolution and shear strength of full Cu3Sn- microporous copper composite joint by thermo-compression bonding4
Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems4
Reflow profiling with the aid of machine learning models4
Numerical modelling of the delamination in multi-layered ceramic capacitor during the thermal reflow process4
Model updating of a temperature field simulation of a printed circuit board assembly based on the Kriging model3
Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrate3
Role of Cu percentage in the Sn-xCu alloy on the mechanical performance at Sn-xCu/ENIG interface produced by laser soldering3
Life prediction in c-Si solar cell interconnections under in-situ thermal cycling in Kumasi in Ghana3
Predictive model of the solder paste stencil printing process by response surface methodology3
Optimized cerium addition for microstructure and mechanical properties of SAC3053
Local solidification thermal parameters affecting the eutectic extent in Sn-Cu and Sn-Bi solder alloys3
Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphere3
Effect of Si3N4 nanowires doping on microstructure and properties of Sn58Bi solder for Cu bonding3
The influence of SACX0307-ZnO nanocomposite solder alloys on the optical and thermal properties of power LEDs3
Mechanical, photoelectric and thermal reliability of SAC307 solder joints with Ni-decorated MWCNTs for flip-chip LED package component during aging3
ZnO nanoparticles and compositional dependence of structural, thermal, mechanical and electrical properties of eutectic SAC355 lead-free solder3
Numerical evaluation of the mechanical response of Sn-Ag-Cu lead-free solders of various silver contents3
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