OOIR: Observatory of International Research

Papers

(The TQCC of Soldering & Surface Mount Technology is 3. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-08-01 to 2026-08-01.)

Article	Citations
Study of the bonding force at the Au-Ag bump/TiW interface in wire bonding	65
Effects of Sn grain orientation and microbump geometry on thermomigration failure in microbump joints	19
Interfacial reactions in the Sn-9.0 wt.% Zn/Cu-Ti alloy (C1990 HP) couple	16
Comparative study of tensile creep behaviour of lead-free solder alloys and conventional Sn–Pb solder	15
Introduction of non-linear fracture mechanics in the modelling of a flip-chip component under drop impact	13
Reworkable epoxy underfills with optimized curing and flow behavior for advanced electronic packaging	12
Advancing packaging technology: computational fluid dynamics modeling for capillary underfill encapsulant in multi-chip heterogenous packages	11
Exploring porosity effects of on mechanical behavior of sintered nanosilver for double-sided cooling packaging of high-power devices: a multiscale modeling	10
Chip warpage and stress analysis in power modules of different substrate configurations	9
Optimizing stencil printing parameters for multiple quality characteristics and diverse packages using a hybrid neural network and linear programming approach	9
Inhibition mechanism of palladium on intermetallic compounds in Au–Al bonding under high temperature storage	9
Improved performance and long-term reliability of copper paste in electronic packaging by adding copper-coated Si particles	9
A comparative study of the mechanical properties of sintered submicron and micron Cu	8
Effects of Ni addition on wettability and interfacial microstructure of Sn-0.7Cu-xNi solder alloy	8
Investigation of moisture-induced crack propagation in the soft-termination multi-layer ceramic capacitor during thermal reflow process	7
A comparative study of conventional reflow and microwave hybrid heating reflow of Sn-3.0Ag-0.5Cu/Cu solder joints	7
Influence of doping Si ₃ N ₄ nanoparticles on the properties and microstructure of Sn58Bi solder f	7
AI-Driven cross-scale modeling for SiP thermo-mechanical simulation	7
Effect of PVD-coated wall aperture roughness on the life span of fine-pitch stencil printing	7
Warpage optimization of memory-computing integrated chiplets with 2.5D packaging subjected to electrical-thermal-vibration multistress coupling	6
L-shaped epoxy reinforcement optimization for vibration reliability of microspring array pins in aerospace large-scale integrated circuits	6
A temperature control method of hot-bar soldering based on extended Kalman filter	5
Image segmentation on void regional formation in the flip-chip underfilling process by comparing YOLO and mask RCNN	5
Study on the interfacial reactions between In-Ag alloys and electroless nickel-immersion gold metallization	5
Reliability analysis of TSV silicon perforated structures under thermal cyclic loading	4

Microstructure, interface and shear strength on Sn-based solder joints induced from the change on solder size	4
Role of Cu percentage in the Sn-xCu alloy on the mechanical performance at Sn-xCu/ENIG interface produced by laser soldering	4
Numerical modelling of the delamination in multi-layered ceramic capacitor during the thermal reflow process	4
Study on reaction behavior of Sn37Pb/Ni- x Cu solid-liquid interface and mechanical properties of soldered joints	4
Multi-parameter synergistic optimization and sintering densification of EHD-printed silver nanoparticle ink on alumina ceramic substrates	4
A review: effect of copper percentage solder alloy after laser soldering	4
Formation and growth mechanism of thin Cu₆Sn₅ films in Sn/Cu and Sn-0.1AlN/Cu structures using laser heating	4
Directional transfer and low-temperature interconnect packaging of nano metal materials	3
Numerical investigation of thermal fatigue crack growth behavior in SAC305 BGA solder joints	3
A review of development and applications of SiC power devices in packaging and interconnect technology	3
Effect of the solder conductive particles and substrate widths on the current carrying capability for flex-on-board (FOB) assembly	3
Numerical simulation and multi objectives optimization of fillet height in reinforced SAC305 solder joints for ultrafine capacitor assemblies	3
Machine learning in solder joint engineering: a review of microstructure informatics, reliability prediction, and accelerated design	3
Comparative study of machine learning method and response surface methodology in BGA solder joint parameter optimization	3
Investigation of the mechanical properties of lead-free Sn-58Bi solder alloy with cobalt addition through flux doping	3
A 3D coaxial transition with continuous ground wall fabricated by a 12-inch wafer-level packaging method for radio frequency applications	3
The preparation and wettability of the Sn-9Zn-2.5Bi-1.5In solder paste for SMT process and high shear ball performance	3
Simulation and structural optimization of key structural mechanical properties of TR modules with quasi-coaxial structure under high-impact loads	3
Analysis of micromorphological evolution of lead-free solder joints under random vibration	3
Investigation of the thermal properties, microstructure, and mechanical properties of Sn-3Ag-3Sb- x In lead-free solder alloys	3