OOIR: Observatory of International Research

Papers

(The TQCC of Soldering & Surface Mount Technology is 3. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-05-01 to 2025-05-01.)

Article	Citations
Interfacial reactions in the Sn-9.0 wt.% Zn/Cu-Ti alloy (C1990 HP) couple	140
The impact of intermetallic compound on microstructure, mechanical characteristics, and thermal behavior of the melt-spun Bi-Ag high-temperature lead-free solder	40
Exploring porosity effects of on mechanical behavior of sintered nanosilver for double-sided cooling packaging of high-power devices: a multiscale modeling	30
Introduction of non-linear fracture mechanics in the modelling of a flip-chip component under drop impact	19
Inhibition mechanism of palladium on intermetallic compounds in Au–Al bonding under high temperature storage	13
Advancing packaging technology: computational fluid dynamics modeling for capillary underfill encapsulant in multi-chip heterogenous packages	13
Microstructural and compositional evolution of SAC305/TiN composite solder under thermal stressing	11
Detection of solder paste defects with an optimization‐based deep learning model using image processing techniques	9
Electronic component detection based on image sample generation	8
Effect of isothermal storage on the microstructure and grain orientation of Cu/Cu₃Sn/Cu solder joint	8
Effect of different soldering temperatures on the properties of COB light source	8
Effects of Ni addition on wettability and interfacial microstructure of Sn-0.7Cu-xNi solder alloy	7
Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) joints	7
Chip warpage and stress analysis in power modules of different substrate configurations	6
Effect of PVD-coated wall aperture roughness on the life span of fine-pitch stencil printing	6
Improved performance and long-term reliability of copper paste in electronic packaging by adding copper-coated Si particles	6
An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model	5
Study on temperature cycling reliability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag/Cu micro solder joints	5
Investigation of moisture-induced crack propagation in the soft-termination multi-layer ceramic capacitor during thermal reflow process	5
Impact of different aging conditions on the IMC layer growth and shear strength of Ni-modified MWCNTs reinforced Sn-Ag-Cu composite solder	5
Warpage optimization of memory-computing integrated chiplets with 2.5D packaging subjected to electrical-thermal-vibration multistress coupling	5
Development of holmium doped eutectic Sn-Ag lead-free solder for electronic packaging	5
Influence of doping Si₃N₄ nanoparticles on the properties and microstructure of Sn58Bi solder for connecting Cu substrate	5
Defect patterns study of pick-and-place machine using automated optical inspection data	4
Microstructures evolution and growth kinetics of intermetallic compounds in Cu/Sn/Cu system during ultrasonic soldering process	4

Image segmentation on void regional formation in the flip-chip underfilling process by comparing YOLO and mask RCNN	4
Solder void size reduction in semiconductor package by vacuum reflow and pressure cure processes	4
Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review	4
A temperature control method of hot-bar soldering based on extended Kalman filter	4
Role of Cu percentage in the Sn-xCu alloy on the mechanical performance at Sn-xCu/ENIG interface produced by laser soldering	4
Formation and growth mechanism of thin Cu₆Sn₅ films in Sn/Cu and Sn-0.1AlN/Cu structures using laser heating	4
Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrate	3
A study on the effects of electrical and thermal stresses on void formation and migration lifetime of Sn3.0Ag0.5Cu solder joints	3
Numerical modelling of the delamination in multi-layered ceramic capacitor during the thermal reflow process	3
A review: effect of copper percentage solder alloy after laser soldering	3
The preparation and wettability of the Sn-9Zn-2.5Bi-1.5In solder paste for SMT process and high shear ball performance	3
Study on reaction behavior of Sn37Pb/Ni-xCu solid-liquid interface and mechanical properties of soldered joints	3