Soldering & Surface Mount Technology

Papers
(The TQCC of Soldering & Surface Mount Technology is 3. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-05-01 to 2025-05-01.)
ArticleCitations
Interfacial reactions in the Sn-9.0 wt.% Zn/Cu-Ti alloy (C1990 HP) couple140
The impact of intermetallic compound on microstructure, mechanical characteristics, and thermal behavior of the melt-spun Bi-Ag high-temperature lead-free solder40
Exploring porosity effects of on mechanical behavior of sintered nanosilver for double-sided cooling packaging of high-power devices: a multiscale modeling30
Introduction of non-linear fracture mechanics in the modelling of a flip-chip component under drop impact19
Inhibition mechanism of palladium on intermetallic compounds in Au–Al bonding under high temperature storage13
Advancing packaging technology: computational fluid dynamics modeling for capillary underfill encapsulant in multi-chip heterogenous packages13
Microstructural and compositional evolution of SAC305/TiN composite solder under thermal stressing11
Detection of solder paste defects with an optimization‐based deep learning model using image processing techniques9
Electronic component detection based on image sample generation8
Effect of isothermal storage on the microstructure and grain orientation of Cu/Cu3Sn/Cu solder joint8
Effect of different soldering temperatures on the properties of COB light source8
Effects of Ni addition on wettability and interfacial microstructure of Sn-0.7Cu-xNi solder alloy7
Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) joints7
Chip warpage and stress analysis in power modules of different substrate configurations6
Effect of PVD-coated wall aperture roughness on the life span of fine-pitch stencil printing6
Improved performance and long-term reliability of copper paste in electronic packaging by adding copper-coated Si particles6
An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model5
Study on temperature cycling reliability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag/Cu micro solder joints5
Investigation of moisture-induced crack propagation in the soft-termination multi-layer ceramic capacitor during thermal reflow process5
Impact of different aging conditions on the IMC layer growth and shear strength of Ni-modified MWCNTs reinforced Sn-Ag-Cu composite solder5
Warpage optimization of memory-computing integrated chiplets with 2.5D packaging subjected to electrical-thermal-vibration multistress coupling5
Development of holmium doped eutectic Sn-Ag lead-free solder for electronic packaging5
Influence of doping Si3N4 nanoparticles on the properties and microstructure of Sn58Bi solder for connecting Cu substrate5
Defect patterns study of pick-and-place machine using automated optical inspection data4
Microstructures evolution and growth kinetics of intermetallic compounds in Cu/Sn/Cu system during ultrasonic soldering process4
Image segmentation on void regional formation in the flip-chip underfilling process by comparing YOLO and mask RCNN4
Solder void size reduction in semiconductor package by vacuum reflow and pressure cure processes4
Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review4
A temperature control method of hot-bar soldering based on extended Kalman filter4
Role of Cu percentage in the Sn-xCu alloy on the mechanical performance at Sn-xCu/ENIG interface produced by laser soldering4
Formation and growth mechanism of thin Cu6Sn5 films in Sn/Cu and Sn-0.1AlN/Cu structures using laser heating4
Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrate3
A study on the effects of electrical and thermal stresses on void formation and migration lifetime of Sn3.0Ag0.5Cu solder joints3
Numerical modelling of the delamination in multi-layered ceramic capacitor during the thermal reflow process3
A review: effect of copper percentage solder alloy after laser soldering3
The preparation and wettability of the Sn-9Zn-2.5Bi-1.5In solder paste for SMT process and high shear ball performance3
Study on reaction behavior of Sn37Pb/Ni-xCu solid-liquid interface and mechanical properties of soldered joints3
0.10458612442017