Soldering & Surface Mount Technology

Papers
(The TQCC of Soldering & Surface Mount Technology is 4. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-12-01 to 2025-12-01.)
ArticleCitations
Interfacial reactions in the Sn-9.0 wt.% Zn/Cu-Ti alloy (C1990 HP) couple32
The impact of intermetallic compound on microstructure, mechanical characteristics, and thermal behavior of the melt-spun Bi-Ag high-temperature lead-free solder30
Advancing packaging technology: computational fluid dynamics modeling for capillary underfill encapsulant in multi-chip heterogenous packages22
Introduction of non-linear fracture mechanics in the modelling of a flip-chip component under drop impact20
Exploring porosity effects of on mechanical behavior of sintered nanosilver for double-sided cooling packaging of high-power devices: a multiscale modeling14
Microstructural and compositional evolution of SAC305/TiN composite solder under thermal stressing11
Inhibition mechanism of palladium on intermetallic compounds in Au–Al bonding under high temperature storage11
Effect of isothermal storage on the microstructure and grain orientation of Cu/Cu3Sn/Cu solder joint10
Optimizing stencil printing parameters for multiple quality characteristics and diverse packages using a hybrid neural network and linear programming approach10
Improved performance and long-term reliability of copper paste in electronic packaging by adding copper-coated Si particles10
Chip warpage and stress analysis in power modules of different substrate configurations9
Effect of PVD-coated wall aperture roughness on the life span of fine-pitch stencil printing9
Effects of Ni addition on wettability and interfacial microstructure of Sn-0.7Cu-xNi solder alloy9
Influence of doping Si 3 N 4 nanoparticles on the properties and microstructure of Sn58Bi solder f8
Study on temperature cycling reliability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag/Cu micro solder joints7
Development of holmium doped eutectic Sn-Ag lead-free solder for electronic packaging7
A temperature control method of hot-bar soldering based on extended Kalman filter6
Warpage optimization of memory-computing integrated chiplets with 2.5D packaging subjected to electrical-thermal-vibration multistress coupling6
Formation and growth mechanism of thin Cu6Sn5 films in Sn/Cu and Sn-0.1AlN/Cu structures using laser heating6
An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model6
Image segmentation on void regional formation in the flip-chip underfilling process by comparing YOLO and mask RCNN6
Investigation of moisture-induced crack propagation in the soft-termination multi-layer ceramic capacitor during thermal reflow process6
The preparation and wettability of the Sn-9Zn-2.5Bi-1.5In solder paste for SMT process and high shear ball performance5
Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review5
Solder void size reduction in semiconductor package by vacuum reflow and pressure cure processes5
Role of Cu percentage in the Sn-xCu alloy on the mechanical performance at Sn-xCu/ENIG interface produced by laser soldering5
Microstructure, interface and shear strength on Sn-based solder joints induced from the change on solder size4
A review: effect of copper percentage solder alloy after laser soldering4
A 3D coaxial transition with continuous ground wall fabricated by a 12-inch wafer-level packaging method for radio frequency applications4
Reliability analysis of TSV silicon perforated structures under thermal cyclic loading4
Numerical modelling of the delamination in multi-layered ceramic capacitor during the thermal reflow process4
Analysis of micromorphological evolution of lead-free solder joints under random vibration4
Study on reaction behavior of Sn37Pb/Ni- x Cu solid-liquid interface and mechanical properties of soldered joints4
Numerical simulation and multi objectives optimization of fillet height in reinforced SAC305 solder joints for ultrafine capacitor assemblies4
Comparative study of machine learning method and response surface methodology in BGA solder joint parameter optimization4
Numerical investigation of thermal fatigue crack growth behavior in SAC305 BGA solder joints4
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