Soldering & Surface Mount Technology

Papers
(The median citation count of Soldering & Surface Mount Technology is 1. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-05-01 to 2025-05-01.)
ArticleCitations
Interfacial reactions in the Sn-9.0 wt.% Zn/Cu-Ti alloy (C1990 HP) couple140
The impact of intermetallic compound on microstructure, mechanical characteristics, and thermal behavior of the melt-spun Bi-Ag high-temperature lead-free solder40
Exploring porosity effects of on mechanical behavior of sintered nanosilver for double-sided cooling packaging of high-power devices: a multiscale modeling30
Introduction of non-linear fracture mechanics in the modelling of a flip-chip component under drop impact19
Advancing packaging technology: computational fluid dynamics modeling for capillary underfill encapsulant in multi-chip heterogenous packages13
Inhibition mechanism of palladium on intermetallic compounds in Au–Al bonding under high temperature storage13
Microstructural and compositional evolution of SAC305/TiN composite solder under thermal stressing11
Detection of solder paste defects with an optimization‐based deep learning model using image processing techniques9
Effect of different soldering temperatures on the properties of COB light source8
Electronic component detection based on image sample generation8
Effect of isothermal storage on the microstructure and grain orientation of Cu/Cu3Sn/Cu solder joint8
Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) joints7
Effects of Ni addition on wettability and interfacial microstructure of Sn-0.7Cu-xNi solder alloy7
Improved performance and long-term reliability of copper paste in electronic packaging by adding copper-coated Si particles6
Chip warpage and stress analysis in power modules of different substrate configurations6
Effect of PVD-coated wall aperture roughness on the life span of fine-pitch stencil printing6
Impact of different aging conditions on the IMC layer growth and shear strength of Ni-modified MWCNTs reinforced Sn-Ag-Cu composite solder5
Warpage optimization of memory-computing integrated chiplets with 2.5D packaging subjected to electrical-thermal-vibration multistress coupling5
Development of holmium doped eutectic Sn-Ag lead-free solder for electronic packaging5
Influence of doping Si3N4 nanoparticles on the properties and microstructure of Sn58Bi solder for connecting Cu substrate5
An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model5
Study on temperature cycling reliability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag/Cu micro solder joints5
Investigation of moisture-induced crack propagation in the soft-termination multi-layer ceramic capacitor during thermal reflow process5
Role of Cu percentage in the Sn-xCu alloy on the mechanical performance at Sn-xCu/ENIG interface produced by laser soldering4
Formation and growth mechanism of thin Cu6Sn5 films in Sn/Cu and Sn-0.1AlN/Cu structures using laser heating4
Defect patterns study of pick-and-place machine using automated optical inspection data4
Microstructures evolution and growth kinetics of intermetallic compounds in Cu/Sn/Cu system during ultrasonic soldering process4
Image segmentation on void regional formation in the flip-chip underfilling process by comparing YOLO and mask RCNN4
Solder void size reduction in semiconductor package by vacuum reflow and pressure cure processes4
Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review4
A temperature control method of hot-bar soldering based on extended Kalman filter4
The preparation and wettability of the Sn-9Zn-2.5Bi-1.5In solder paste for SMT process and high shear ball performance3
Study on reaction behavior of Sn37Pb/Ni-xCu solid-liquid interface and mechanical properties of soldered joints3
Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrate3
A study on the effects of electrical and thermal stresses on void formation and migration lifetime of Sn3.0Ag0.5Cu solder joints3
Numerical modelling of the delamination in multi-layered ceramic capacitor during the thermal reflow process3
A review: effect of copper percentage solder alloy after laser soldering3
A 3D coaxial transition with continuous ground wall fabricated by a 12-inch wafer-level packaging method for radio frequency applications2
Design criteria for pad and stencil with high pick-and-Place yield2
Investigation of solder beading phenomenon under surface-mounted electrolytic capacitors2
Effect of the solder conductive particles and substrate widths on the current carrying capability for flex-on-board (FOB) assembly2
Numerical investigation of thermal fatigue crack growth behavior in SAC305 BGA solder joints2
Micromechanical response of SAC305 solder alloy under gamma radiation via nanoindentation approach2
Model updating of a temperature field simulation of a printed circuit board assembly based on the Kriging model2
Investigation of the thermal properties, microstructure, and mechanical properties of Sn-3Ag-3Sb-xIn lead-free solder alloys2
Comparative study of machine learning method and response surface methodology in BGA solder joint parameter optimization2
Statistical-based simulation and reflow profile optimization for improving self-alignment performance − an experimental study2
Investigation of the mechanical properties of lead-free Sn-58Bi solder alloy with cobalt addition through flux doping2
Effect of Cu, Ni, Ag addition on creeping properties of Sn5Sb-0.5Cu-0.1Ni-0.5Ag for high temperature packaging2
Influence of the soldering paste type on optical and thermal parameters of LED modules2
Influence of aging temperature on the properties of Cu/(SAC0307 powder +Zn-particles)/Al joints ultrasonic-assisted soldered at low temperature1
Mesoscopically understanding stress distribution and sensitivity in layered-porous sintered silver for high-power electronics1
Wettability and microstructure transformations of YAG ceramic brazing to kovar alloy with AgCuTi filler alloy1
Effects of soldering temperatures and composition on the microstructures and shear properties of Sn58Bi-xSAC0307/ENIG solder joints1
Electric current stressing enhanced damping properties in Sn5Sb solder1
The influence of SACX0307-ZnO nanocomposite solder alloys on the optical and thermal properties of power LEDs1
Effect of adding Ni nanoparticles on the melting characteristics, mechanical properties and intermetallic compound growth of Sn58Bi solder1
Surface energetic-based analytical filling time model for flip-chip underfill process1
Optimisation of electroless nickel electroless palladium immersion silver (ENEPImAg) surface finish parameters using the Taguchi method for enhanced solder joint reliability1
Mechanical, photoelectric and thermal reliability of SAC307 solder joints with Ni-decorated MWCNTs for flip-chip LED package component during aging1
Influence of annealing temperature on 3D surface stereometric analysis in C-Ni films1
Deep learning and analytical study of void regional formation in flip-chip underfilling process1
Low-cycle fatigue life assessment of SAC solder alloy through a FEM-data driven machine learning approach1
Effect of external static magnetic field on the particle distribution, the metallurgical process and the microhardness of Sn3.5Ag solder with magnetic Ni particles1
Effect of different beam distances in laser soldering process: a numerical and experimental study1
Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test1
Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphere1
Experiments on the effect of sintering pressure on the creep response of sintered silver material1
Guest editorial: 24th international conference on electronic packaging technology1
Thermal aging effects on the properties of the Cu/(SAC0307 powder + Zn-particles)/Cu joint ultrasonic-assisted soldered at low-temperature1
The research on the application of self-propagating interconnection technology in silicon optical transceiver module for aerospace1
Effect of microwave operating power and reflow time on the microstructure and tensile properties of Sn–3.0Ag–0.5Cu/Cu solder joints1
Effect of sintering temperature on ratcheting-fatigue behavior of nanosilver sintered lap shear joint1
A study on the thermomechanical response of various die attach metallic materials of power electronics1
Local solidification thermal parameters affecting the eutectic extent in Sn-Cu and Sn-Bi solder alloys1
Effect of Si3N4 nanowires doping on microstructure and properties of Sn58Bi solder for Cu bonding1
ZnO nanoparticles and compositional dependence of structural, thermal, mechanical and electrical properties of eutectic SAC355 lead-free solder1
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