Soldering & Surface Mount Technology

Papers
(The median citation count of Soldering & Surface Mount Technology is 1. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-09-01 to 2025-09-01.)
ArticleCitations
Interfacial reactions in the Sn-9.0 wt.% Zn/Cu-Ti alloy (C1990 HP) couple43
The impact of intermetallic compound on microstructure, mechanical characteristics, and thermal behavior of the melt-spun Bi-Ag high-temperature lead-free solder30
Exploring porosity effects of on mechanical behavior of sintered nanosilver for double-sided cooling packaging of high-power devices: a multiscale modeling24
Advancing packaging technology: computational fluid dynamics modeling for capillary underfill encapsulant in multi-chip heterogenous packages19
Introduction of non-linear fracture mechanics in the modelling of a flip-chip component under drop impact15
Microstructural and compositional evolution of SAC305/TiN composite solder under thermal stressing13
Inhibition mechanism of palladium on intermetallic compounds in Au–Al bonding under high temperature storage10
Improved performance and long-term reliability of copper paste in electronic packaging by adding copper-coated Si particles10
Chip warpage and stress analysis in power modules of different substrate configurations9
Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) joints9
Effects of Ni addition on wettability and interfacial microstructure of Sn-0.7Cu-xNi solder alloy9
Development of holmium doped eutectic Sn-Ag lead-free solder for electronic packaging7
Effect of isothermal storage on the microstructure and grain orientation of Cu/Cu3Sn/Cu solder joint7
Influence of doping Si3N4 nanoparticles on the properties and microstructure of Sn58Bi solder for connecting Cu substrate6
Effect of PVD-coated wall aperture roughness on the life span of fine-pitch stencil printing6
Investigation of moisture-induced crack propagation in the soft-termination multi-layer ceramic capacitor during thermal reflow process6
Study on temperature cycling reliability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag/Cu micro solder joints6
An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model6
Solder void size reduction in semiconductor package by vacuum reflow and pressure cure processes5
Image segmentation on void regional formation in the flip-chip underfilling process by comparing YOLO and mask RCNN5
Warpage optimization of memory-computing integrated chiplets with 2.5D packaging subjected to electrical-thermal-vibration multistress coupling5
Formation and growth mechanism of thin Cu6Sn5 films in Sn/Cu and Sn-0.1AlN/Cu structures using laser heating5
A temperature control method of hot-bar soldering based on extended Kalman filter5
Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review5
Impact of different aging conditions on the IMC layer growth and shear strength of Ni-modified MWCNTs reinforced Sn-Ag-Cu composite solder5
The preparation and wettability of the Sn-9Zn-2.5Bi-1.5In solder paste for SMT process and high shear ball performance4
Microstructure, interface and shear strength on Sn-based solder joints induced from the change on solder size4
Study on reaction behavior of Sn37Pb/Ni-xCu solid-liquid interface and mechanical properties of soldered joints4
Role of Cu percentage in the Sn-xCu alloy on the mechanical performance at Sn-xCu/ENIG interface produced by laser soldering4
A review: effect of copper percentage solder alloy after laser soldering4
Comparative study of machine learning method and response surface methodology in BGA solder joint parameter optimization4
A study on the effects of electrical and thermal stresses on void formation and migration lifetime of Sn3.0Ag0.5Cu solder joints4
Numerical investigation of thermal fatigue crack growth behavior in SAC305 BGA solder joints4
Numerical modelling of the delamination in multi-layered ceramic capacitor during the thermal reflow process4
A 3D coaxial transition with continuous ground wall fabricated by a 12-inch wafer-level packaging method for radio frequency applications3
Analysis of micromorphological evolution of lead-free solder joints under random vibration3
Investigation of the mechanical properties of lead-free Sn-58Bi solder alloy with cobalt addition through flux doping3
Micromechanical response of SAC305 solder alloy under gamma radiation via nanoindentation approach3
Effect of Cu, Ni, Ag addition on creeping properties of Sn5Sb-0.5Cu-0.1Ni-0.5Ag for high temperature packaging3
Design criteria for pad and stencil with high pick-and-Place yield2
Effect of the solder conductive particles and substrate widths on the current carrying capability for flex-on-board (FOB) assembly2
Effects of soldering temperatures and composition on the microstructures and shear properties of Sn58Bi-xSAC0307/ENIG solder joints2
Deep learning and analytical study of void regional formation in flip-chip underfilling process2
The research on the application of self-propagating interconnection technology in silicon optical transceiver module for aerospace2
Wettability and microstructure transformations of YAG ceramic brazing to kovar alloy with AgCuTi filler alloy2
Influence of the soldering paste type on optical and thermal parameters of LED modules2
Statistical-based simulation and reflow profile optimization for improving self-alignment performance − an experimental study2
Effect of sintering temperature on ratcheting-fatigue behavior of nanosilver sintered lap shear joint2
A study on the thermomechanical response of various die attach metallic materials of power electronics2
Mesoscopically understanding stress distribution and sensitivity in layered-porous sintered silver for high-power electronics2
Developing ILU dispensing parameter model void size predictor on asymmetrical BGA flip-chip underfilling process2
Electric current stressing enhanced damping properties in Sn5Sb solder2
Investigation of the thermal properties, microstructure, and mechanical properties of Sn-3Ag-3Sb-xIn lead-free solder alloys2
Investigation of solder beading phenomenon under surface-mounted electrolytic capacitors2
Low-cycle fatigue life assessment of SAC solder alloy through a FEM-data driven machine learning approach2
Influence of annealing temperature on 3D surface stereometric analysis in C-Ni films2
Effect of external static magnetic field on the particle distribution, the metallurgical process and the microhardness of Sn3.5Ag solder with magnetic Ni particles2
Thermal aging effects on the properties of the Cu/(SAC0307 powder + Zn-particles)/Cu joint ultrasonic-assisted soldered at low-temperature2
Mechanical, photoelectric and thermal reliability of SAC307 solder joints with Ni-decorated MWCNTs for flip-chip LED package component during aging1
Investigation of ultrasound-assisted soldering of SiC ceramics by using Zn-Al-In solder for high-temperature applications1
A study on the effect of the geometric properties and surface defects on silicon chip flexibility for wearable electronics1
Effects of soldering temperature and preheating temperature on the properties of Sn–Zn solder alloys using wave soldering1
Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphere1
Effect of different beam distances in laser soldering process: a numerical and experimental study1
Experiments on the effect of sintering pressure on the creep response of sintered silver material1
Effect of adding Ni nanoparticles on the melting characteristics, mechanical properties and intermetallic compound growth of Sn58Bi solder1
Investigating the influence of lead angle on optimising laser soldering parameters for improved pin-through-hole joint quality1
Predictive model of the solder paste stencil printing process by response surface methodology1
Microstructural and mechanical evolution of sintered nano-silver joints on bare copper substrates during high-temperature storage1
Optimisation of electroless nickel electroless palladium immersion silver (ENEPImAg) surface finish parameters using the Taguchi method for enhanced solder joint reliability1
The influence of SACX0307-ZnO nanocomposite solder alloys on the optical and thermal properties of power LEDs1
Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test1
Reflow profiling with the aid of machine learning models1
Effect of Ce and Sb doping on microstructure and thermal/mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder1
Influence of aging temperature on the properties of Cu/(SAC0307 powder +Zn-particles)/Al joints ultrasonic-assisted soldered at low temperature1
ZnO nanoparticles and compositional dependence of structural, thermal, mechanical and electrical properties of eutectic SAC355 lead-free solder1
Effect of Si3N4 nanowires doping on microstructure and properties of Sn58Bi solder for Cu bonding1
Guest editorial: 24th international conference on electronic packaging technology1
0.056727886199951