OOIR: Observatory of International Research

Papers

(The median citation count of Soldering & Surface Mount Technology is 1. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2020-11-01 to 2024-11-01.)

Article	Citations
Detection of solder paste defects with an optimization‐based deep learning model using image processing techniques	116
Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) joints	40
An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model	24
Effect of TiO₂ nanoparticles on the microstructure, mechanical and thermal properties of rapid quenching SAC355 lead-free solder alloy	12
Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review	11
Effect of Zn-powder content on the property of Cu/SAC0307 powder/Cu joint under ultrasonic assisted at low temperature	10
Effect of microwave operating power and reflow time on the microstructure and tensile properties of Sn–3.0Ag–0.5Cu/Cu solder joints	8
Development of holmium doped eutectic Sn-Ag lead-free solder for electronic packaging	8
Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a novel energy based modeling	7
Thermal-mechanical reliability analysis of WLP with fine-pitch copper post bumps	7
Micromechanical response of SAC305 solder alloy under gamma radiation via nanoindentation approach	7
Study of mechanical properties of indium-based solder alloys for cryogenic applications	6
Solder void size reduction in semiconductor package by vacuum reflow and pressure cure processes	5
Effects of Sn-Ag-x leveling layers on the microstructure and mechanical properties of SnBi low-temperature solder joints	5
A study on the effects of electrical and thermal stresses on void formation and migration lifetime of Sn3.0Ag0.5Cu solder joints	5
Microstructure evolution and shear strength of full Cu₃Sn- microporous copper composite joint by thermo-compression bonding	4
Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems	4
Reflow profiling with the aid of machine learning models	4
Numerical modelling of the delamination in multi-layered ceramic capacitor during the thermal reflow process	4
Model updating of a temperature field simulation of a printed circuit board assembly based on the Kriging model	3
Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrate	3
Role of Cu percentage in the Sn-xCu alloy on the mechanical performance at Sn-xCu/ENIG interface produced by laser soldering	3
Life prediction in c-Si solar cell interconnections under in-situ thermal cycling in Kumasi in Ghana	3
Predictive model of the solder paste stencil printing process by response surface methodology	3
Optimized cerium addition for microstructure and mechanical properties of SAC305	3

Local solidification thermal parameters affecting the eutectic extent in Sn-Cu and Sn-Bi solder alloys	3
Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphere	3
Effect of Si₃N₄ nanowires doping on microstructure and properties of Sn58Bi solder for Cu bonding	3
The influence of SACX0307-ZnO nanocomposite solder alloys on the optical and thermal properties of power LEDs	3
Mechanical, photoelectric and thermal reliability of SAC307 solder joints with Ni-decorated MWCNTs for flip-chip LED package component during aging	3
ZnO nanoparticles and compositional dependence of structural, thermal, mechanical and electrical properties of eutectic SAC355 lead-free solder	3
Numerical evaluation of the mechanical response of Sn-Ag-Cu lead-free solders of various silver contents	3
Effect of the IMC layer geometry on a solder joint thermomechanical behavior	2
Drop and impact reliability investigation of BGA and LGA interconnects	2
Influence of aging temperature on the properties of Cu/(SAC0307 powder +Zn-particles)/Al joints ultrasonic-assisted soldered at low temperature	2
An investigation on mechanical random vibration fatigue damage of solder joints in electronic systems	2
Surface energetic-based analytical filling time model for flip-chip underfill process	2
The impact of intermetallic compound on microstructure, mechanical characteristics, and thermal behavior of the melt-spun Bi-Ag high-temperature lead-free solder	2
Influence of moisture concentration and hydrophobic material on induced stress in FCBGA package under reflow	2
Property of Sn-37Pb solder bumps with different diameter during thermal shock	2
Anand constitutive modeling of multilayer Silver-Tin transient liquid phase foils using tensile and creep testing	2
Reliability analysis of SnAgCu lead-free solder thermal interface materials in microelectronics	2
Defect patterns study of pick-and-place machine using automated optical inspection data	2
Wetting kinetics, spreading phenomena and interfacial reaction of Sn-15Bi-xZn solders on Cu substrate at different temperatures	2
Experimental measurements of the shear force on surface mount components simulating the wave soldering process	2
Influence of bonding temperature on the properties of Cu/(SAC mixed powder)/Al joints under ultrasonic-assisted	2
Influence of ultrasounds on interfacial microstructures of Cu-Sn solder joints	2
Effect of rotating magnetic field on the microstructure and properties of Sn-Ag-Sb lead-free solder alloys	2
Useful lifetime estimation of solder joints in power semiconductors employed in current source and voltage source inverters	2
Influence of the soldering paste type on optical and thermal parameters of LED modules	1
Thermal and mechanical analysis of low-temperature and low-pressure silver-based sintered thermal joints	1
Investigation of moisture-induced crack propagation in the soft-termination multi-layer ceramic capacitor during thermal reflow process	1
Study on temperature cycling reliability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag/Cu micro solder joints	1
Influence of doping Si₃N₄ nanoparticles on the properties and microstructure of Sn58Bi solder for connecting Cu substrate	1
A review: effect of copper percentage solder alloy after laser soldering	1
Effect of isothermal storage on the microstructure and grain orientation of Cu/Cu₃Sn/Cu solder joint	1
Introduction of non-linear fracture mechanics in the modelling of a flip-chip component under drop impact	1
Effect of Cu, Ni, Ag addition on creeping properties of Sn5Sb-0.5Cu-0.1Ni-0.5Ag for high temperature packaging	1
Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test	1
Investigation of ultrasound-assisted soldering of SiC ceramics by using Zn-Al-In solder for high-temperature applications	1
Interfacial reaction between Ni particle reinforcements and liquid Sn-based eutectic solders	1
Investigating the impact of different solder alloy materials during laser soldering process	1
Parameter optimization for surface mounter using a self-alignment prediction model	1
Numerical investigation of thermal fatigue crack growth behavior in SAC305 BGA solder joints	1
Electronic component detection based on image sample generation	1
Electrical, morphological, optical and mathematical simulations equations studies in CAZO, CZO, AZO and ZNO films	1
Microstructures evolution and growth kinetics of intermetallic compounds in Cu/Sn/Cu system during ultrasonic soldering process	1
Simulation of jet printing of solder paste for surface mounted technology	1
Interfacial behavior and mechanism of brazed diamond with CeO₂-added Ni-Cr filler alloy: a combined first-principles and experimental study	1
Impact of different aging conditions on the IMC layer growth and shear strength of Ni-modified MWCNTs reinforced Sn-Ag-Cu composite solder	1
Microstructural and mechanical evolution of sintered nano-silver joints on bare copper substrates during high-temperature storage	1
Accurate composition dependent thermo mechanical lifetime estimation of hour glass type solder joint in electronic assemblies	1
Impact of thermal interface material on luminous flux curve of InGaAlP low-power light-emitting diodes	1
Effect of different soldering temperatures on the properties of COB light source	1
Low-cycle fatigue life assessment of SAC solder alloy through a FEM-data driven machine learning approach	1

Flow behavior during solder/Cu column friction plunge micro-welding