Soldering & Surface Mount Technology

Papers
(The median citation count of Soldering & Surface Mount Technology is 1. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2020-03-01 to 2024-03-01.)
ArticleCitations
Detection of solder paste defects with an optimization‐based deep learning model using image processing techniques84
Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) joints38
An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model18
Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition10
Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review9
Effect of microwave operating power and reflow time on the microstructure and tensile properties of Sn–3.0Ag–0.5Cu/Cu solder joints8
The formation of intermetallic layer structure of SAC405/Cu and SAC405/ENImAg solder joint interfaces8
Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a novel energy based modeling7
The influence of soldering process parameters on the optical and thermal properties of power LEDs7
Development of holmium doped eutectic Sn-Ag lead-free solder for electronic packaging7
Effect of Zn-powder content on the property of Cu/SAC0307 powder/Cu joint under ultrasonic assisted at low temperature7
Effect of TiO2 nanoparticles on the microstructure, mechanical and thermal properties of rapid quenching SAC355 lead-free solder alloy6
Thermal-mechanical reliability analysis of WLP with fine-pitch copper post bumps6
Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces5
The effect of Bi addition on the electrical and microstructural properties of SAC405 soldered structure5
Influence of aging on microstructure and hardness of lead-free solder alloys5
Low-voiding solder pastes in LED assembly5
Application of multi-quality parameter design in the optimization of underfilling process – a case study of a vehicle electronic module5
Selective etching and hardness properties of quenched SAC305 solder joints5
Solder void size reduction in semiconductor package by vacuum reflow and pressure cure processes4
Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems4
Study of mechanical properties of indium-based solder alloys for cryogenic applications4
Optimized cerium addition for microstructure and mechanical properties of SAC3053
Performance of 96.5Sn–3Ag–0.5Cu/fullerene composite solder under isothermal ageing and high-current stressing3
Spatial analysis of underfill flow in flip-chip encapsulation3
Model updating of a temperature field simulation of a printed circuit board assembly based on the Kriging model3
Effects of Sn-Ag-x leveling layers on the microstructure and mechanical properties of SnBi low-temperature solder joints3
Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrate3
Life prediction in c-Si solar cell interconnections under in-situ thermal cycling in Kumasi in Ghana3
Micromechanical response of SAC305 solder alloy under gamma radiation via nanoindentation approach3
Effect of different thermocouple constructions on heat-level vapour phase soldering profiles3
Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphere3
Mechanical reliability of self-aligned chip assembly after reflow soldering process3
Microstructure evolution and shear strength of full Cu3Sn- microporous copper composite joint by thermo-compression bonding2
Mechanical, photoelectric and thermal reliability of SAC307 solder joints with Ni-decorated MWCNTs for flip-chip LED package component during aging2
Reflow profiling with the aid of machine learning models2
Local solidification thermal parameters affecting the eutectic extent in Sn-Cu and Sn-Bi solder alloys2
Useful lifetime estimation of solder joints in power semiconductors employed in current source and voltage source inverters2
Effect of Si3N4 nanowires doping on microstructure and properties of Sn58Bi solder for Cu bonding2
Experimental measurements of the shear force on surface mount components simulating the wave soldering process2
Influence of ultrasounds on interfacial microstructures of Cu-Sn solder joints2
An investigation on mechanical random vibration fatigue damage of solder joints in electronic systems2
Reliability analysis of SnAgCu lead-free solder thermal interface materials in microelectronics2
Surface energetic-based analytical filling time model for flip-chip underfill process2
The impact of intermetallic compound on microstructure, mechanical characteristics, and thermal behavior of the melt-spun Bi-Ag high-temperature lead-free solder2
The influence of SACX0307-ZnO nanocomposite solder alloys on the optical and thermal properties of power LEDs2
Property of Sn-37Pb solder bumps with different diameter during thermal shock2
Numerical modelling of the delamination in multi-layered ceramic capacitor during the thermal reflow process2
Structural characterization of inkjet printed capacitor layers in various technological conditions2
A study on the effects of electrical and thermal stresses on void formation and migration lifetime of Sn3.0Ag0.5Cu solder joints2
Defect patterns study of pick-and-place machine using automated optical inspection data2
Effect of Sb additions on the creep behaviour of low temperature lead-free Sn–8Zn–3Bi solder alloy2
Impact of convection on thermographic analysis of silver based thermal joints1
Reliability assessment of ball grid array joints under combined application of thermal and power cycling: solder geometry effect1
Microstructures evolution and growth kinetics of intermetallic compounds in Cu/Sn/Cu system during ultrasonic soldering process1
Effect of Cu, Ni, Ag addition on creeping properties of Sn5Sb-0.5Cu-0.1Ni-0.5Ag for high temperature packaging1
Effect of the IMC layer geometry on a solder joint thermomechanical behavior1
Automatic optical inspection system for IC solder joint based on local-to-global ensemble learning1
Parameter optimization for surface mounter using a self-alignment prediction model1
Impact of thermal interface material on luminous flux curve of InGaAlP low-power light-emitting diodes1
Effect of isothermal storage on the microstructure and grain orientation of Cu/Cu3Sn/Cu solder joint1
Effect of rotating magnetic field on the microstructure and properties of Sn-Ag-Sb lead-free solder alloys1
Influence of the soldering paste type on optical and thermal parameters of LED modules1
Influence of moisture concentration and hydrophobic material on induced stress in FCBGA package under reflow1
Investigation of ultrasound-assisted soldering of SiC ceramics by using Zn-Al-In solder for high-temperature applications1
Accurate composition dependent thermo mechanical lifetime estimation of hour glass type solder joint in electronic assemblies1
Effect of different soldering temperatures on the properties of COB light source1
ZnO nanoparticles and compositional dependence of structural, thermal, mechanical and electrical properties of eutectic SAC355 lead-free solder1
Numerical evaluation of the mechanical response of Sn-Ag-Cu lead-free solders of various silver contents1
Impact of different aging conditions on the IMC layer growth and shear strength of Ni-modified MWCNTs reinforced Sn-Ag-Cu composite solder1
Predictive model of the solder paste stencil printing process by response surface methodology1
Influence of bonding temperature on the properties of Cu/(SAC mixed powder)/Al joints under ultrasonic-assisted1
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