Soldering & Surface Mount Technology

Papers
(The H4-Index of Soldering & Surface Mount Technology is 9. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-10-01 to 2025-10-01.)
ArticleCitations
The impact of intermetallic compound on microstructure, mechanical characteristics, and thermal behavior of the melt-spun Bi-Ag high-temperature lead-free solder30
Interfacial reactions in the Sn-9.0 wt.% Zn/Cu-Ti alloy (C1990 HP) couple26
Advancing packaging technology: computational fluid dynamics modeling for capillary underfill encapsulant in multi-chip heterogenous packages21
Introduction of non-linear fracture mechanics in the modelling of a flip-chip component under drop impact17
Exploring porosity effects of on mechanical behavior of sintered nanosilver for double-sided cooling packaging of high-power devices: a multiscale modeling14
Microstructural and compositional evolution of SAC305/TiN composite solder under thermal stressing10
Inhibition mechanism of palladium on intermetallic compounds in Au–Al bonding under high temperature storage10
Improved performance and long-term reliability of copper paste in electronic packaging by adding copper-coated Si particles9
Effects of Ni addition on wettability and interfacial microstructure of Sn-0.7Cu-xNi solder alloy9
Chip warpage and stress analysis in power modules of different substrate configurations9
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