Soldering & Surface Mount Technology

Papers
(The H4-Index of Soldering & Surface Mount Technology is 7. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-02-01 to 2025-02-01.)
ArticleCitations
Interfacial IMC growth behavior of Sn-3Ag-3Sb-xIn solder on Cu substrate125
Damping properties of Sn58Bi and Sn3.0Ag0.5Cu solders with different thicknesses and preparation directions40
Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test24
Design criteria for pad and stencil with high pick-and-Place yield15
Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review11
Study of mechanical properties of indium-based solder alloys for cryogenic applications9
The impact of intermetallic compound on microstructure, mechanical characteristics, and thermal behavior of the melt-spun Bi-Ag high-temperature lead-free solder8
Temperature and current density prediction in solder joints using artificial neural network method7
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