Soldering & Surface Mount Technology

Papers
(The H4-Index of Soldering & Surface Mount Technology is 8. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2020-11-01 to 2024-11-01.)
ArticleCitations
Detection of solder paste defects with an optimization‐based deep learning model using image processing techniques116
Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) joints40
An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model24
Effect of TiO2 nanoparticles on the microstructure, mechanical and thermal properties of rapid quenching SAC355 lead-free solder alloy12
Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review11
Effect of Zn-powder content on the property of Cu/SAC0307 powder/Cu joint under ultrasonic assisted at low temperature10
Development of holmium doped eutectic Sn-Ag lead-free solder for electronic packaging8
Effect of microwave operating power and reflow time on the microstructure and tensile properties of Sn–3.0Ag–0.5Cu/Cu solder joints8
0.049290895462036