Soldering & Surface Mount Technology

Papers
(The H4-Index of Soldering & Surface Mount Technology is 8. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2020-04-01 to 2024-04-01.)
ArticleCitations
Detection of solder paste defects with an optimization‐based deep learning model using image processing techniques88
Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) joints38
An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model20
Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition10
Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review9
Effect of microwave operating power and reflow time on the microstructure and tensile properties of Sn–3.0Ag–0.5Cu/Cu solder joints8
Effect of Zn-powder content on the property of Cu/SAC0307 powder/Cu joint under ultrasonic assisted at low temperature8
The formation of intermetallic layer structure of SAC405/Cu and SAC405/ENImAg solder joint interfaces8
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