IEEE Transactions on Semiconductor Manufacturing

Papers
(The TQCC of IEEE Transactions on Semiconductor Manufacturing is 3. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-01-01 to 2025-01-01.)
ArticleCitations
Table of Contents47
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on New simulation methodologies for next-generation TCAD tools37
A Novel Foundry Yield Model Using Critical Area Analysis34
Leveraging Machine Learning for Capacity and Cost on a Complex Toolset: A Case Study28
Table of Contents27
Preparation and Application of Sol-Gel Polishing Pad for Polishing CVD Single Crystal Diamond at High Speed27
Guest Editorial Special Section on the 2022 SEMI Advanced Semiconductor Manufacturing Conference24
IEEE Transactions on Semiconductor Manufacturing Information for Authors24
Table of Contents23
IEEE Transactions on Semiconductor Manufacturing Publication Information22
BCICTS 2023 Call for Papers22
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Semiconductor Device Modeling for Circuit and System Design"21
A Hybrid Method of Frequency and Spatial Domain Techniques for TFT-LCD Circuits Defect Detection20
Wafer Lot Assignment for Parallel-Producing Tools Based on Heuristic Clustering Algorithm18
Multiobjective Order Promising for Outsourcing Supply Network of IC Design Houses17
Boundless Engineering for Yield to Cope With the Complexity of High-Volume Manufacturing17
Edge Effects of an Eddy-Current Thickness Sensor During Chemical Mechanical Polishing16
Supply Chain Planning for IC Design House Back-End Production Network With Turnkey Service15
Joint Dynamic Dispatching and Preventive Maintenance for Unrelated Parallel Machines With Equipment Health Considerations14
Watermark Detection in CMOS Image Sensors Using Cosine-Convolutional Semantic Networks14
IEEE Transactions on Semiconductor Manufacturing Publication Information13
Influence and Suppression of Harmful Effects Due to By-Product in CVD Reactor for 4H-SiC Epitaxy12
Dynamic Down-Selection of Measurement Markers for Optimized Robust Control of Overlay Errors in Photolithography Processes12
IEEE Transactions on Semiconductor Manufacturing Information for Authors12
Call for Papers for RFIC 202312
ℓ₁ Trend Filtering-Based Change Point Detection for Pumping Line Balance of Deposition Equipment11
IEEE Transactions on Semiconductor Manufacturing publication information11
IEEE Transactions on Semiconductor Manufacturing Information for Authors11
2021 EDS Education Award Call for Nominations11
Automatic Defect Detection in Epitaxial Layers by Micro Photoluminescence Imaging11
Study on Measurement Method of Microscopic ζ Potential11
IEEE Transactions on Semiconductor Manufacturing Publication Information10
Minimization of Particle Deposition on Wafers Caused by the Pressure Change in the Vacuum Chamber Through a Pressure Control Regulation Process10
Front Cover10
Bayesian Nonparametric Classification for Incomplete Data With a High Missing Rate: an Application to Semiconductor Manufacturing Data10
3-D NAND Oxide/Nitride Tier Stack Thickness and Zonal Measurements With Infrared Metrology9
Chamber and Recipe-Independent FDC Indicator in High-Mix Semiconductor Manufacturing9
Observation and Suppression of Growth Pits Formed on 4H-SiC Epitaxial Films Grown Using Halide Chemical Vapor Deposition Process9
A Study on the Improvement of Safety and Efficiency of Clean Rooms in Semiconductor Factories Through Real Fire Experiments9
Defect Localization Approach for Wafer-to-Wafer Hybrid Bonding Interconnects9
Adaptive Cautious Regularized Run-to-Run Controller for Lithography Process8
Shear Force Classification Before Wire Bonding Based on Probe Mark 2-D Images Using Machine Learning Methods8
Adaptive Weight Tuning of EWMA Controller via Model-Free Deep Reinforcement Learning8
Investigations of Fast Vacuum Pump-Down Processes Between Parallel Isothermal Disks7
Process Optimization and Modeling of the Silicon Growth in Trichlorosilane-Hydrogen Gas Mixture in a Planetary CVD Reactor7
Self-Assured Deep Learning With Minimum Pre-Labeled Data for Wafer Pattern Classification7
Double Coating Process Using the Single Photoresist and the Thickness Prediction7
Effect of SiO2 Interfacial Layer Reduction on MFSFET With 5 nm-Thick Ferroelectric Nondoped HfO2 by Deposition Rate Control7
Methodology for Important Sensor Screening for Fault Detection and Classification in Semiconductor Manufacturing7
Parametric Optimization for Moisture Infiltration Prevention Into a FOUP (Front Opening Unified Pod)7
A Novel Multiscale Residual Aggregation Network-Based Image Super-Resolution Algorithm for Semiconductor Defect Inspection7
Blank Page6
Modular Fluid Delivery System Architectures Drive Configurability Options, Enhance Semiconductor Manufacturing Equipment Productivity, and Improve Process Performance6
Planned Maintenance Schedule Update Method for Predictive Maintenance of Semiconductor Plasma Etcher6
Table of Contents6
A Modified Lasso Model for Yield Analysis Considering the Interaction Effect in a Multistage Manufacturing Line5
Quantitative 3-D Flow Visualization of Conventional Purge Flow Within a Front Opening Unified Pod (FOUP)5
A Lightweight Chip-Scale Chemical Mechanical Polishing Model Based on Polynomial Network5
Reducing Datacenter Compute Carbon Footprint by Harnessing the Power of Specialization: Principles, Metrics, Challenges and Opportunities5
Elimination of Si-C Defect on Wafer Surface in High-Temperature SPM Process Through Nitrogen Purge in 300-mm Single-Wafer Chamber5
Machine Learning-Based Process-Level Fault Detection and Part-Level Fault Classification in Semiconductor Etch Equipment5
Feature Extraction From Diffraction Images Using a Spatial Light Modulator in Scatterometry5
Significant Lifetime Improvement of Negative Bias Thermal Instability by Plasma Enhanced Atomic Layer Deposition SiN in Stress Memorization Technique5
Quantitative Comparison of Simulation and Experiment Enabling a Lithography Digital Twin5
Improving the Reliability of Through Silicon Vias: Reducing Copper Protrusion by Artificial Defect Manipulation and Annealing5
Why Contour Averaging Works for SEM Metrology: Analysis and Validation5
Automated Visual Inspection of Defects in Transparent Display Layers Using Light-Field 3-D Imaging4
Efficient and Refined Deep Convolutional Features Network for the Crack Segmentation of Solar Cell Electroluminescence Images4
Photoresist Spray Coating on Silicon Wafers With Acoustic Resonance Atomization4
Overlay Measurement Algorithm for Moiré Targets Using Frequency Analysis4
Gas-Delivery Fluid-Mechanical Timescales in Semiconductor Manufacturing4
IEEE Transactions on Semiconductor Manufacturing Information for Authors4
Effective Variational-Autoencoder-Based Generative Models for Highly Imbalanced Fault Detection Data in Semiconductor Manufacturing4
Quality-Oriented Statistical Process Control Utilizing Bayesian Modeling4
CMP Process Optimization Engineering by Machine Learning4
Front Cover4
A Yield Prediction Method Based on Nonparametric Statistical and Comparison With a Networks Method4
Prevention of Moisture Invasion by Flow Isolation Device (FID) for Mask Automatic Storage System (Stocker Room) in a Semiconductor Fabrication Plant (Fab)4
Call for Nominations for Editor-in-Chief: IEEE Transactions on Semiconductor Manufacturing4
IEEE Transactions on Semiconductor Manufacturing Information for Authors4
A Hierarchical Spatial-Test Attention Network for Explainable Multiple Wafer Bin Maps Classification4
Improving Liquid Film Thickness Uniformity of Semiconductor Etching Equipment Using Flow Field Visualization and CFD Simulation4
Advanced Process Control System for Trench Shape of Power Devices4
Front Cover4
A Numerical Study on the Effects of Purge and Air Curtain Flow Rates on Humidity Invasion Into a Front Opening Unified Pod (FOUP)4
Machine Learning on Multiplexed Optical Metrology Pattern Shift Response Targets to Predict Electrical Properties4
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on New simulation methodologies for next-generation TCAD tools4
Machine Learning Models for Edge Placement Error Based Etch Bias3
Investigation of Variation in On-Si On-Wafer TRL Calibration in Sub-THz3
Interface Characteristics, Erosion Behavior, and Thermal Shock Resistance of Al–Ta Alloy Coatings Produced by Arc Spraying3
Table of contents3
Editorial3
Editorial3
Level Set Simulation on Single Wafer Wet Processing Improvement3
Editorial3
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications"3
The Effect of Purge Flow Rate and Wafer Arrangement on Humidity Invasion Into a Loaded Front Opening Unified Pod (FOUP)3
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Solid-State Image Sensors"3
The Effect of Si Surface Flattening Process on the MISFET With High-k HfNx Multilayer Gate Dielectrics3
Regularized Recursive Solutions for Prediction of Aberrations Associated With Projection Optics3
Call for Papers for IEEE Transactions on Materials for Electron Devices3
IEEE Transactions on Semiconductor Manufacturing Publication Information3
Table of Contents3
Hotspot Prediction: SEM Image Generation With Potential Lithography Hotspots3
IEEE Transactions on Semiconductor Manufacturing publication information3
Table of Contents3
Table of contents3
TCAD-Enabled Machine Learning—An Efficient Framework to Build Highly Accurate and Reliable Models for Semiconductor Technology Development and Fabrication3
0.85911893844604