IEEE Transactions on Semiconductor Manufacturing

Papers
(The TQCC of IEEE Transactions on Semiconductor Manufacturing is 3. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-05-01 to 2025-05-01.)
ArticleCitations
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Semiconductor Device Modeling for Circuit and System Design"48
IEEE Transactions on Semiconductor Manufacturing Publication Information41
Investigations of Fast Vacuum Pump-Down Processes Between Parallel Isothermal Disks40
Guest Editorial Special Section on the 2022 SEMI Advanced Semiconductor Manufacturing Conference33
Minimization of Particle Deposition on Wafers Caused by the Pressure Change in the Vacuum Chamber Through a Pressure Control Regulation Process33
Fabrication of Porous Cu-Sn Microbumps for Low Temperature Cu-Cu Bonding33
Machine Learning-Based Process-Level Fault Detection and Part-Level Fault Classification in Semiconductor Etch Equipment28
Call for Papers for IEEE Transactions on Materials for Electron Devices28
Adaptive Weight Tuning of EWMA Controller via Model-Free Deep Reinforcement Learning28
Defect Reduction And Line Width Roughness Improvement By Using A Post Precoat Treatment In Waferless Chamber Conditioning28
Table of contents27
IEEE Transactions on Semiconductor Manufacturing publication information25
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications"21
Nondestructive Detection of Buried and Latent Defects by Negative Mode E-Beam Inspection20
The Effect of Purge Flow Rate and Wafer Arrangement on Humidity Invasion Into a Loaded Front Opening Unified Pod (FOUP)19
A Comparative Study on Velocity Fields, Humidity and Oxygen Concentration in a Front Opening Unified Pod (FOUP) During Purge19
Level Set Simulation on Single Wafer Wet Processing Improvement18
A Yield Prediction Method Based on Nonparametric Statistical and Comparison With a Networks Method18
TCAD-Enabled Machine Learning—An Efficient Framework to Build Highly Accurate and Reliable Models for Semiconductor Technology Development and Fabrication17
Semi-Supervised Learning for Simultaneous Location Detection and Classification of Mixed-Type Defect Patterns in Wafer Bin Maps16
Advanced Process Control System for Trench Shape of Power Devices16
Single-Mask Fabrication of Sharp SiOx Nanocones15
Hotspot Prediction: SEM Image Generation With Potential Lithography Hotspots15
The Mechanism of an Etching-Back to Reduce the Density of Cone Defect in STI During the Manufacturing14
Editorial14
TestDNA-E: Wafer Defect Signature for Pattern Recognition by Ensemble Learning13
Computational Study of Chemical Uniformity Impacts on Electrodeposition13
Test Structure for Measuring the Selectivity in XeF2 and HF Vapour Etch Processes12
Blank Page12
In-Situ Plasma Monitoring Using Multiple Plasma Information in SiO2 Etch Process12
IEEE Transactions on Semiconductor Manufacturing Publication Information12
Machine Learning-Based Detection Method for Wafer Test Induced Defects12
DPFEE-Net: Enhancing Wafer Defect Classification Through Dual-Path Neural Architecture11
Correlation Between Trench Angle and Wafer Warpage in Trench Field Plate Power MOSFETs and its Application to Quality Control10
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Wafer Bin Map Recognition With Autoencoder-Based Data Augmentation in Semiconductor Assembly Process10
IEEE Transactions on Semiconductor Manufacturing Publication Information9
Source Pad Design Tradeoffs for a Power TrenchFET9
A Warpage Prediction Model for Trench Field-Plate Power MOSFET in 300mm-Diameter Process9
2021 Index IEEE Transactions on Semiconductor Manufacturing Vol. 349
Automatic Classification of C-SAM Voids for Root Cause Identification of Bonding Yield Degradation9
IEEE Transactions on Semiconductor Manufacturing Publication Information8
Systematic Search for Stabilizing Dopants in ZrO₂ and HfO₂ Using First-Principles Calculations8
Deep Learning Approach to Inverse Grain Pattern of Nanosized Metal Gate for Multichannel Gate-All-Around Silicon Nanosheet MOSFETs8
Optimization and Application of TiO2 Hollow Microsphere Modified Scattering Layer for the Photovoltaic Conversion Efficiency of Dye-Sensitized Solar Cell8
Streamlining Semiconductor Manufacturing of 200 mm and 300 mm Wafers: A Longitudinal Case Study on the Lot-to-Order-Matching Process8
2023 Index IEEE Transactions on Semiconductor Manufacturing Vol. 368
Commonality Analysis for Detecting Failures Caused by Inspection Tools in Semiconductor Manufacturing Processes8
Wafer Dicing Vibration Investigation on Novel Wafer Mounting Techniques7
IEEE Transactions on Semiconductor Manufacturing Publication Information7
Recognition and Classification of Mixed Defect Pattern Wafer Map Based on Multi-Path DCNN7
Wafer Reflectance Prediction for Complex Etching Process Based on K-Means Clustering and Neural Network7
Front Cover7
Perspectives on Black Silicon in Semiconductor Manufacturing: Experimental Comparison of Plasma Etching, MACE, and Fs-Laser Etching7
Research Toward Wafer-Scale 3D Integration of InP Membrane Photonics With InP Electronics7
IEEE Transactions on Semiconductor Manufacturing CALL FOR PAPERS for Special Issue on "Process-Level Machine Learning Applications in Semiconductor Manufacturing"7
Deep Clustering and Regression Ensemble Network for Lot Cycle Time Prediction in Semiconductor Wafer Fabrication7
IEEE EDS Robert Bosch Micro and Nano Electro Mechanical Systems Award: Call for Nominations7
A Graph-Theoretic Approach for Spatial Filtering and Its Impact on Mixed-Type Spatial Pattern Recognition in Wafer Bin Maps7
Table of Contents7
Rapid Resolution of Parametric Failures in the Process Development Period by Integrating Device Physics and Big Data7
Data-Driven Production Planning Models for Wafer Fabs: An Exploratory Study6
Advances in the Thermal Study of Polymers for Microelectronics Using the Thermally Induced Curvature Approach6
Guest Editorial Process-Level Machine Learning Applications in Semiconductor Manufacturing6
RA-UNet: A New Deep Learning Segmentation Method for Semiconductor Wafer Defect Analysis on Fine-Grained Scanning Electron Microscope (SEM) Images6
Table of Contents6
A Real-Time Monitoring Framework for Wafer Fabrication Processes With Run-to-Run Variations6
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications"6
Defect Detection of Photovoltaic Panels to Suppress Endogenous Shift Phenomenon6
Nitrogen-Doped Czochralski Silicon Wafers as Materials for Conventional and Scaled Insulated Gate Bipolar Transistors6
Call for Papers 6th IEEE Electron Devices Technology and Manufacturing (EDTM) Conference5
Fabrication of On-Silicon Aperture Coupled Patch Antenna Through Micromachining and Cu-Cu Thermocompression Bonding5
Semantic Context Information Modeling With Neural Networks in Customer Order Behavior Classification5
Manufacturing of 3D Helical Microswimmer by AFM Micromanipulation for Microfluidic Applications5
Adaptive Cautious Regularized Run-to-Run Controller for Lithography Process5
Minimizing Convolutional Neural Network Training Data With Proper Data Augmentation for Inline Defect Classification5
Automatic Pico Laser Trimming System for Silicon MEMS Resonant Devices Based on Image Recognition5
Unrelated Parallel Machine Photolithography Scheduling Problem With Dual Resource Constraints5
New Process Integration of Sequential Phosphorus-Doped Silicon for Trench Field Plate Power MOSFETs5
Call for Nominations: 2024 EDS Early Career Award5
Editorial5
Anomaly Detection in Batch Manufacturing Processes Using Localized Reconstruction Errors From 1-D Convolutional AutoEncoders5
IEEE Transactions on Semiconductor Manufacturing Publication Information5
BCICTS 2023 Call for Papers5
IEEE Transactions on Semiconductor Manufacturing Information for Authors4
Table of contents4
DSH to Extend-DSH: Chip-Level Chemical Mechanical Planarization (CMP) Model Upgrade Based on Decoupling Regression Strategy4
Why Contour Averaging Works for SEM Metrology: Analysis and Validation4
Shear Force Classification Before Wire Bonding Based on Probe Mark 2-D Images Using Machine Learning Methods4
Prevention of Moisture Invasion by Flow Isolation Device (FID) for Mask Automatic Storage System (Stocker Room) in a Semiconductor Fabrication Plant (Fab)4
Table of Contents4
Deep Learning-Based Multi-Horizon Forecasting for Automated Material Handling System Throughput in Semiconductor Fab4
Guest Editorial Special Section on Sustainability4
Double Coating Process Using the Single Photoresist and the Thickness Prediction4
Defect Localization Approach for Wafer-to-Wafer Hybrid Bonding Interconnects4
A Modified Lasso Model for Yield Analysis Considering the Interaction Effect in a Multistage Manufacturing Line4
Overlay Measurement Algorithm for Moiré Targets Using Frequency Analysis4
Editorial4
Coherent Fourier Scatterometry for Detection of Killer Defects on Silicon Carbide Samples4
Integrated Electrochemical Technology for Efficient Metal Recovery in Semiconductor Wastewater4
Quantitative 3-D Flow Visualization of Conventional Purge Flow Within a Front Opening Unified Pod (FOUP)4
A Novel Foundry Yield Model Using Critical Area Analysis4
Multiobjective Order Promising for Outsourcing Supply Network of IC Design Houses4
TechRxiv: Share Your Preprint Research With the World!3
IEEE Transactions on Semiconductor Manufacturing Information for Authors3
Quality-Oriented Statistical Process Control Utilizing Bayesian Modeling3
Geometry-Based Curvilinear Mask Process Correction for Enhanced Pattern Fidelity, Contrast, and Manufacturability3
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on New simulation methodologies for next-generation TCAD tools3
Real-Time Change Detection for Automated Test Socket Inspection Using Advanced Computer Vision and Machine Learning3
Performance Evaluation of Supervised Learning Model Based on Functional Data Analysis and Summary Statistics3
Development of SiGe Indentation Process Control for Gate-All-Around FET Technology Enablement3
Editorial3
Blank page3
A Self-Test Method of Structural Failures of Uncooled Infrared Focal Plane Array3
A Diffusion-Model-Based Methodology for Virtual Silicon Data Generation3
Practical Reinforcement Learning for Adaptive Photolithography Scheduler in Mass Production3
Understanding and Improving Virtual Metrology Systems Using Bayesian Methods3
Efficient and Refined Deep Convolutional Features Network for the Crack Segmentation of Solar Cell Electroluminescence Images3
Chemical Mechanical Polishing of Single-Crystalline Diamond Epitaxial Layers for Electronics Applications3
Density-Based Spatial Clustering of Applications With Noise (DBSCAN) for Probe Card Production for Advanced Quality Control of Wafer Probing Test3
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Comparative Study of Nondestructive Mapping of Conformal-Coating Thickness on Microelectronics by Terahertz Time-of-Flight Tomography3
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