OOIR: Observatory of International Research

Papers

(The TQCC of IEEE Transactions on Semiconductor Manufacturing is 3. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-06-01 to 2025-06-01.)

Article	Citations
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Semiconductor Device Modeling for Circuit and System Design"	48
IEEE Transactions on Semiconductor Manufacturing Publication Information	41
Investigations of Fast Vacuum Pump-Down Processes Between Parallel Isothermal Disks	36
Minimization of Particle Deposition on Wafers Caused by the Pressure Change in the Vacuum Chamber Through a Pressure Control Regulation Process	34
Guest Editorial Special Section on the 2022 SEMI Advanced Semiconductor Manufacturing Conference	33
Call for Nominations for Editor-in-Chief: IEEE Electron Device Letters	33
Defect Reduction And Line Width Roughness Improvement By Using A Post Precoat Treatment In Waferless Chamber Conditioning	30
Fabrication of Porous Cu–Sn Microbumps for Low-Temperature Cu–Cu Bonding	30
Adaptive Weight Tuning of EWMA Controller via Model-Free Deep Reinforcement Learning	30
Machine Learning-Based Process-Level Fault Detection and Part-Level Fault Classification in Semiconductor Etch Equipment	28
Call for Papers for IEEE Transactions on Materials for Electron Devices	25
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications"	22
Nondestructive Detection of Buried and Latent Defects by Negative Mode E-Beam Inspection	22
TestDNA-E: Wafer Defect Signature for Pattern Recognition by Ensemble Learning	21
Computational Study of Chemical Uniformity Impacts on Electrodeposition	21
The Effect of Purge Flow Rate and Wafer Arrangement on Humidity Invasion Into a Loaded Front Opening Unified Pod (FOUP)	19
A Comparative Study on Velocity Fields, Humidity and Oxygen Concentration in a Front Opening Unified Pod (FOUP) During Purge	19
Level Set Simulation on Single Wafer Wet Processing Improvement	19
A Yield Prediction Method Based on Nonparametric Statistical and Comparison With a Networks Method	18
TCAD-Enabled Machine Learning—An Efficient Framework to Build Highly Accurate and Reliable Models for Semiconductor Technology Development and Fabrication	16
Advanced Process Control System for Trench Shape of Power Devices	16
Editorial	15
Single-Mask Fabrication of Sharp SiO_x Nanocones	15
Semi-Supervised Learning for Simultaneous Location Detection and Classification of Mixed-Type Defect Patterns in Wafer Bin Maps	14
The Mechanism of an Etching-Back to Reduce the Density of Cone Defect in STI During the Manufacturing	14

Hotspot Prediction: SEM Image Generation With Potential Lithography Hotspots	13
IEEE Transactions on Semiconductor Manufacturing Publication Information	13
In-Situ Plasma Monitoring Using Multiple Plasma Information in SiO2 Etch Process	12
DPFEE-Net: Enhancing Wafer Defect Classification Through Dual-Path Neural Architecture	12
Blank Page	12
Test Structure for Measuring the Selectivity in XeF₂ and HF Vapour Etch Processes	12
Correlation Between Trench Angle and Wafer Warpage in Trench Field Plate Power MOSFETs and its Application to Quality Control	11
Wafer Bin Map Recognition With Autoencoder-Based Data Augmentation in Semiconductor Assembly Process	11
Blank Page	11
Source Pad Design Tradeoffs for a Power TrenchFET	10
Automatic Classification of C-SAM Voids for Root Cause Identification of Bonding Yield Degradation	10
Integration Challenges on 300mm High Resistivity Silicon Substrates	9
IEEE Transactions on Semiconductor Manufacturing Publication Information	9
IEEE Transactions on Semiconductor Manufacturing Publication Information	9
A Warpage Prediction Model for Trench Field-Plate Power MOSFET in 300mm-Diameter Process	9
2021 Index IEEE Transactions on Semiconductor Manufacturing Vol. 34	9
Wafer Dicing Vibration Investigation on Novel Wafer Mounting Techniques	8
Streamlining Semiconductor Manufacturing of 200 mm and 300 mm Wafers: A Longitudinal Case Study on the Lot-to-Order-Matching Process	8
Systematic Search for Stabilizing Dopants in ZrO₂ and HfO₂ Using First-Principles Calculations	8
2023 Index IEEE Transactions on Semiconductor Manufacturing Vol. 36	8
Commonality Analysis for Detecting Failures Caused by Inspection Tools in Semiconductor Manufacturing Processes	8
IEEE EDS Robert Bosch Micro and Nano Electro Mechanical Systems Award: Call for Nominations	7
Recognition and Classification of Mixed Defect Pattern Wafer Map Based on Multi-Path DCNN	7
Front Cover	7
Perspectives on Black Silicon in Semiconductor Manufacturing: Experimental Comparison of Plasma Etching, MACE, and Fs-Laser Etching	7
IEEE Transactions on Semiconductor Manufacturing Publication Information	7
Table of Contents	7
Journal of Lightwave Technology Special Issue on: OFS-29	7
Research Toward Wafer-Scale 3D Integration of InP Membrane Photonics With InP Electronics	7
Optimization and Application of TiO₂ Hollow Microsphere Modified Scattering Layer for the Photovoltaic Conversion Efficiency of Dye-Sensitized Solar Cell	7
Deep Learning Approach to Inverse Grain Pattern of Nanosized Metal Gate for Multichannel Gate-All-Around Silicon Nanosheet MOSFETs	7
Defect Detection of Photovoltaic Panels to Suppress Endogenous Shift Phenomenon	6
A Real-Time Monitoring Framework for Wafer Fabrication Processes With Run-to-Run Variations	6
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications"	6
Rapid Resolution of Parametric Failures in the Process Development Period by Integrating Device Physics and Big Data	6
Data-Driven Production Planning Models for Wafer Fabs: An Exploratory Study	6
Deep Clustering and Regression Ensemble Network for Lot Cycle Time Prediction in Semiconductor Wafer Fabrication	6
RA-UNet: A New Deep Learning Segmentation Method for Semiconductor Wafer Defect Analysis on Fine-Grained Scanning Electron Microscope (SEM) Images	6
Guest Editorial Process-Level Machine Learning Applications in Semiconductor Manufacturing	6
Advances in the Thermal Study of Polymers for Microelectronics Using the Thermally Induced Curvature Approach	6
Nitrogen-Doped Czochralski Silicon Wafers as Materials for Conventional and Scaled Insulated Gate Bipolar Transistors	6
Anomaly Detection in Batch Manufacturing Processes Using Localized Reconstruction Errors From 1-D Convolutional AutoEncoders	5
New Process Integration of Sequential Phosphorus-Doped Silicon for Trench Field Plate Power MOSFETs	5
Automatic Pico Laser Trimming System for Silicon MEMS Resonant Devices Based on Image Recognition	5
Call for Papers 6th IEEE Electron Devices Technology and Manufacturing (EDTM) Conference	5
Unrelated Parallel Machine Photolithography Scheduling Problem With Dual Resource Constraints	5
BCICTS 2023 Call for Papers	5
Shear Force Classification Before Wire Bonding Based on Probe Mark 2-D Images Using Machine Learning Methods	5
Why Contour Averaging Works for SEM Metrology: Analysis and Validation	5
Call for Nominations: 2024 EDS Early Career Award	5

Table of Contents	5
Fabrication of On-Silicon Aperture Coupled Patch Antenna Through Micromachining and Cu-Cu Thermocompression Bonding	5
IEEE Transactions on Semiconductor Manufacturing Publication Information	5
Double Coating Process Using the Single Photoresist and the Thickness Prediction	5
Multiobjective Order Promising for Outsourcing Supply Network of IC Design Houses	5
Quantitative 3-D Flow Visualization of Conventional Purge Flow Within a Front Opening Unified Pod (FOUP)	5
Semantic Context Information Modeling With Neural Networks in Customer Order Behavior Classification	5
Minimizing Convolutional Neural Network Training Data With Proper Data Augmentation for Inline Defect Classification	5
Editorial	5
Manufacturing of 3D Helical Microswimmer by AFM Micromanipulation for Microfluidic Applications	5
A Modified Lasso Model for Yield Analysis Considering the Interaction Effect in a Multistage Manufacturing Line	5
Overlay Measurement Algorithm for Moiré Targets Using Frequency Analysis	5
Table of contents	4
A Novel Foundry Yield Model Using Critical Area Analysis	4
Integrated Electrochemical Technology for Efficient Metal Recovery in Semiconductor Wastewater	4
Guest Editorial Special Section on Sustainability	4
Chemical Mechanical Polishing of Single-Crystalline Diamond Epitaxial Layers for Electronics Applications	4
Efficient and Refined Deep Convolutional Features Network for the Crack Segmentation of Solar Cell Electroluminescence Images	4
TechRxiv: Share Your Preprint Research With the World!	4
Editorial	4
DSH to Extend-DSH: Chip-Level Chemical Mechanical Planarization (CMP) Model Upgrade Based on Decoupling Regression Strategy	4
Prevention of Moisture Invasion by Flow Isolation Device (FID) for Mask Automatic Storage System (Stocker Room) in a Semiconductor Fabrication Plant (Fab)	4
IEEE Transactions on Semiconductor Manufacturing Information for Authors	4
Guest Editorial Introduction to the Joint Special Issue on Semiconductor Design for Manufacturing (DFM)	4
Coherent Fourier Scatterometry for Detection of Killer Defects on Silicon Carbide Samples	4
Quality-Oriented Statistical Process Control Utilizing Bayesian Modeling	4
Table of Contents	4
Defect Localization Approach for Wafer-to-Wafer Hybrid Bonding Interconnects	4
Adaptive Cautious Regularized Run-to-Run Controller for Lithography Process	4
Deep Learning-Based Multi-Horizon Forecasting for Automated Material Handling System Throughput in Semiconductor Fab	4
Surface Reconstruction for Enhancing the Overlay Modeling Optimization Procedure in Photolithography Processes	4
IEEE Transactions on Semiconductor Manufacturing Information for Authors	4
Effects of the Applied Power of Remote Plasma System With Green Alternative Chamber Cleaning Gas of Carbonyl Fluoride	3
Blank page	3
Guest Editorial Special Section on the IEEE 33rd International Conference on Microelectronic Test Structures (ICMTS)	3
Editorial	3
Blank Page	3
Density-Based Spatial Clustering of Applications With Noise (DBSCAN) for Probe Card Production for Advanced Quality Control of Wafer Probing Test	3
Blank page	3
Understanding and Improving Virtual Metrology Systems Using Bayesian Methods	3
Real-Time Change Detection for Automated Test Socket Inspection Using Advanced Computer Vision and Machine Learning	3
Front Cover	3
An Autoencoder-Based Approach for Fault Detection in Multi-Stage Manufacturing: A Sputter Deposition and Rapid Thermal Processing Case Study	3
Comprehensive Study of the Impact of LWR on Device Performance in VLSI Technology	3
Comparative Study of Nondestructive Mapping of Conformal-Coating Thickness on Microelectronics by Terahertz Time-of-Flight Tomography	3
Editorial	3
Performance Evaluation of Supervised Learning Model Based on Functional Data Analysis and Summary Statistics	3
A Diffusion-Model-Based Methodology for Virtual Silicon Data Generation	3
Practical Reinforcement Learning for Adaptive Photolithography Scheduler in Mass Production	3
Sustainable Technologies for Responsible Products and a More Sustainable Future	3
IEEE Transactions on Semiconductor Manufacturing Information for Authors	3
Data Visualization of Anomaly Detection in Semiconductor Processing Tools	3
Model-Based OPC With Adaptive PID Control Through Reinforcement Learning	3
A Self-Test Method of Structural Failures of Uncooled Infrared Focal Plane Array	3
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on New simulation methodologies for next-generation TCAD tools	3
Geometry-Based Curvilinear Mask Process Correction for Enhanced Pattern Fidelity, Contrast, and Manufacturability	3
Development of SiGe Indentation Process Control for Gate-All-Around FET Technology Enablement	3