IEEE Transactions on Semiconductor Manufacturing

Papers
(The TQCC of IEEE Transactions on Semiconductor Manufacturing is 3. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-09-01 to 2025-09-01.)
ArticleCitations
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Semiconductor Device Modeling for Circuit and System Design"43
IEEE Transactions on Semiconductor Manufacturing Publication Information39
Investigations of Fast Vacuum Pump-Down Processes Between Parallel Isothermal Disks38
Minimization of Particle Deposition on Wafers Caused by the Pressure Change in the Vacuum Chamber Through a Pressure Control Regulation Process34
Guest Editorial Special Section on the 2022 SEMI Advanced Semiconductor Manufacturing Conference33
Call for Nominations for Editor-in-Chief: IEEE Electron Device Letters32
Adaptive Weight Tuning of EWMA Controller via Model-Free Deep Reinforcement Learning31
Fabrication of Porous Cu–Sn Microbumps for Low-Temperature Cu–Cu Bonding31
Fast and High-Precision Temperature Control in Semiconductor Vertical Furnace via Iterative Experiments27
Machine Learning-Based Process-Level Fault Detection and Part-Level Fault Classification in Semiconductor Etch Equipment23
Defect Reduction and Line Width Roughness Improvement by Using a Post Precoat Treatment in Waferless Chamber Conditioning23
Call for Papers for IEEE Transactions on Materials for Electron Devices22
Nondestructive Detection of Buried and Latent Defects by Negative Mode E-Beam Inspection22
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications"22
Computational Study of Chemical Uniformity Impacts on Electrodeposition20
TCAD-Enabled Machine Learning—An Efficient Framework to Build Highly Accurate and Reliable Models for Semiconductor Technology Development and Fabrication19
The Effect of Purge Flow Rate and Wafer Arrangement on Humidity Invasion Into a Loaded Front Opening Unified Pod (FOUP)18
Level Set Simulation on Single Wafer Wet Processing Improvement16
A Yield Prediction Method Based on Nonparametric Statistical and Comparison With a Networks Method16
Advanced Process Control System for Trench Shape of Power Devices15
Single-Mask Fabrication of Sharp SiOx Nanocones14
Editorial14
TestDNA-E: Wafer Defect Signature for Pattern Recognition by Ensemble Learning13
Grain Morphology Effects on Void Formation and Electromigration-Induced Failure in Copper Interconnects13
A Comparative Study on Velocity Fields, Humidity and Oxygen Concentration in a Front Opening Unified Pod (FOUP) During Purge13
The Mechanism of an Etching-Back to Reduce the Density of Cone Defect in STI During the Manufacturing12
Synthesis of Critical Patterns for Lithography Optimizations through Machine Learning12
Hotspot Prediction: SEM Image Generation With Potential Lithography Hotspots12
IEEE Transactions on Semiconductor Manufacturing Publication Information10
Semi-Supervised Learning for Simultaneous Location Detection and Classification of Mixed-Type Defect Patterns in Wafer Bin Maps10
A Warpage Prediction Model for Trench Field-Plate Power MOSFET in 300mm-Diameter Process9
Blank Page9
DPFEE-Net: Enhancing Wafer Defect Classification Through Dual-Path Neural Architecture9
Automatic Classification of C-SAM Voids for Root Cause Identification of Bonding Yield Degradation9
Blank Page9
Source Pad Design Tradeoffs for a Power TrenchFET9
Wafer Bin Map Recognition With Autoencoder-Based Data Augmentation in Semiconductor Assembly Process9
A Self-Powered Wireless Sensing Circuitry for On-Wafer In-Situ EUV Detection8
IEEE Transactions on Semiconductor Manufacturing Publication Information8
Integration Challenges on 300-mm High Resistivity Silicon Substrates8
Physics-Informed Machine Learning-Based Edge Detection for SEM Images8
In-Situ Plasma Monitoring Using Multiple Plasma Information in SiO₂ Etch Process8
2021 Index IEEE Transactions on Semiconductor Manufacturing Vol. 348
IEEE Transactions on Semiconductor Manufacturing Publication Information7
Systematic Search for Stabilizing Dopants in ZrO₂ and HfO₂ Using First-Principles Calculations7
IEEE Transactions on Semiconductor Manufacturing Publication Information7
IEEE EDS Robert Bosch Micro and Nano Electro Mechanical Systems Award: Call for Nominations7
2023 Index IEEE Transactions on Semiconductor Manufacturing Vol. 367
Wafer Dicing Vibration Investigation on Novel Wafer Mounting Techniques7
Deep Learning Approach to Inverse Grain Pattern of Nanosized Metal Gate for Multichannel Gate-All-Around Silicon Nanosheet MOSFETs7
Streamlining Semiconductor Manufacturing of 200 mm and 300 mm Wafers: A Longitudinal Case Study on the Lot-to-Order-Matching Process7
Journal of Lightwave Technology Special Issue on: OFS-297
Optimization and Application of TiO2 Hollow Microsphere Modified Scattering Layer for the Photovoltaic Conversion Efficiency of Dye-Sensitized Solar Cell7
Commonality Analysis for Detecting Failures Caused by Inspection Tools in Semiconductor Manufacturing Processes6
Evaluation of Thick Silicon Nitride Film Properties at 300 mm Scale for High-Q Photonic Devices6
Guest Editorial Process-Level Machine Learning Applications in Semiconductor Manufacturing6
A Real-Time Monitoring Framework for Wafer Fabrication Processes With Run-to-Run Variations6
Data-Driven Production Planning Models for Wafer Fabs: An Exploratory Study6
Table of Contents6
Perspectives on Black Silicon in Semiconductor Manufacturing: Experimental Comparison of Plasma Etching, MACE, and Fs-Laser Etching6
Research Toward Wafer-Scale 3D Integration of InP Membrane Photonics With InP Electronics6
Advances in the Thermal Study of Polymers for Microelectronics Using the Thermally Induced Curvature Approach6
RA-UNet: A New Deep Learning Segmentation Method for Semiconductor Wafer Defect Analysis on Fine-Grained Scanning Electron Microscope (SEM) Images6
Defect Detection of Photovoltaic Panels to Suppress Endogenous Shift Phenomenon6
Front Cover6
Recognition and Classification of Mixed Defect Pattern Wafer Map Based on Multi-Path DCNN6
Nitrogen-Doped Czochralski Silicon Wafers as Materials for Conventional and Scaled Insulated Gate Bipolar Transistors6
Deep Clustering and Regression Ensemble Network for Lot Cycle Time Prediction in Semiconductor Wafer Fabrication6
Characterizing Capacitor Top Plate Bias for More Accurate Electromagnetic Simulations6
Table of Contents5
Unrelated Parallel Machine Photolithography Scheduling Problem With Dual Resource Constraints5
Quantitative 3-D Flow Visualization of Conventional Purge Flow Within a Front Opening Unified Pod (FOUP)5
A Modified Lasso Model for Yield Analysis Considering the Interaction Effect in a Multistage Manufacturing Line5
Overlay Measurement Algorithm for Moiré Targets Using Frequency Analysis5
Anomaly Detection in Batch Manufacturing Processes Using Localized Reconstruction Errors From 1-D Convolutional AutoEncoders5
Semantic Context Information Modeling With Neural Networks in Customer Order Behavior Classification5
Call for Papers 6th IEEE Electron Devices Technology and Manufacturing (EDTM) Conference5
Editorial5
BCICTS 2023 Call for Papers5
Shear Force Classification Before Wire Bonding Based on Probe Mark 2-D Images Using Machine Learning Methods5
Why Contour Averaging Works for SEM Metrology: Analysis and Validation5
IEEE Transactions on Semiconductor Manufacturing Publication Information5
Automatic Pico Laser Trimming System for Silicon MEMS Resonant Devices Based on Image Recognition5
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications"5
Fabrication of On-Silicon Aperture Coupled Patch Antenna Through Micromachining and Cu-Cu Thermocompression Bonding5
Double Coating Process Using the Single Photoresist and the Thickness Prediction5
Multiobjective Order Promising for Outsourcing Supply Network of IC Design Houses5
Prevention of Moisture Invasion by Flow Isolation Device (FID) for Mask Automatic Storage System (Stocker Room) in a Semiconductor Fabrication Plant (Fab)5
Call for Nominations: 2024 EDS Early Career Award5
Editorial4
Current Status of Bulk β-Ga2O3 and β-(AlxGa1-x)2O3 Crystal Growth4
Defect Localization Approach for Wafer-to-Wafer Hybrid Bonding Interconnects4
Table of contents4
Coherent Fourier Scatterometry for Detection of Killer Defects on Silicon Carbide Samples4
Efficient and Refined Deep Convolutional Features Network for the Crack Segmentation of Solar Cell Electroluminescence Images4
Guest Editorial Special Section on Sustainability4
Table of Contents4
Integrated Electrochemical Technology for Efficient Metal Recovery in Semiconductor Wastewater4
Unsupervised Representation Learning and Explainable Clustering for Wafer Map Pattern Analysis4
Guest Editorial Introduction to the Joint Special Issue on Semiconductor Design for Manufacturing (DFM)4
Chemical Mechanical Polishing of Single-Crystalline Diamond Epitaxial Layers for Electronics Applications4
IEEE Transactions on Semiconductor Manufacturing Information for Authors4
IEEE Transactions on Semiconductor Manufacturing Information for Authors4
Improving Endpoint Detection Sensitivity in Plasma Etching With Small Openings4
DSH to Extend-DSH: Chip-Level Chemical Mechanical Planarization (CMP) Model Upgrade Based on Decoupling Regression Strategy4
Deep Learning-Based Multi-Horizon Forecasting for Automated Material Handling System Throughput in Semiconductor Fab4
Surface Reconstruction for Enhancing the Overlay Modeling Optimization Procedure in Photolithography Processes4
TechRxiv: Share Your Preprint Research With the World!4
IEEE Transactions on Semiconductor Manufacturing Information for Authors3
Geometry-Based Curvilinear Mask Process Correction for Enhanced Pattern Fidelity, Contrast, and Manufacturability3
Performance Evaluation of Supervised Learning Model Based on Functional Data Analysis and Summary Statistics3
Blank Page3
Real-Time Change Detection for Automated Test Socket Inspection Using Advanced Computer Vision and Machine Learning3
Effects of the Applied Power of Remote Plasma System With Green Alternative Chamber Cleaning Gas of Carbonyl Fluoride3
Editorial3
Understanding and Improving Virtual Metrology Systems Using Bayesian Methods3
Density-Based Spatial Clustering of Applications With Noise (DBSCAN) for Probe Card Production for Advanced Quality Control of Wafer Probing Test3
A Diffusion-Model-Based Methodology for Virtual Silicon Data Generation3
Model-Based OPC With Adaptive PID Control Through Reinforcement Learning3
Front Cover3
Practical Reinforcement Learning for Adaptive Photolithography Scheduler in Mass Production3
Comparative Study of Nondestructive Mapping of Conformal-Coating Thickness on Microelectronics by Terahertz Time-of-Flight Tomography3
Development of SiGe Indentation Process Control for Gate-All-Around FET Technology Enablement3
Editorial3
Blank page3
Sustainable Technologies for Responsible Products and a More Sustainable Future3
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