IEEE Transactions on Semiconductor Manufacturing

Papers
(The TQCC of IEEE Transactions on Semiconductor Manufacturing is 2. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-02-01 to 2025-02-01.)
ArticleCitations
Table of Contents47
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on New simulation methodologies for next-generation TCAD tools37
A Novel Foundry Yield Model Using Critical Area Analysis34
Leveraging Machine Learning for Capacity and Cost on a Complex Toolset: A Case Study28
Table of Contents27
Preparation and Application of Sol-Gel Polishing Pad for Polishing CVD Single Crystal Diamond at High Speed27
Guest Editorial Special Section on the 2022 SEMI Advanced Semiconductor Manufacturing Conference24
IEEE Transactions on Semiconductor Manufacturing Information for Authors24
Table of Contents23
BCICTS 2023 Call for Papers22
IEEE Transactions on Semiconductor Manufacturing Publication Information22
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Semiconductor Device Modeling for Circuit and System Design"21
A Hybrid Method of Frequency and Spatial Domain Techniques for TFT-LCD Circuits Defect Detection20
Wafer Lot Assignment for Parallel-Producing Tools Based on Heuristic Clustering Algorithm18
Boundless Engineering for Yield to Cope With the Complexity of High-Volume Manufacturing17
Multiobjective Order Promising for Outsourcing Supply Network of IC Design Houses17
Edge Effects of an Eddy-Current Thickness Sensor During Chemical Mechanical Polishing16
Supply Chain Planning for IC Design House Back-End Production Network With Turnkey Service15
Watermark Detection in CMOS Image Sensors Using Cosine-Convolutional Semantic Networks14
Joint Dynamic Dispatching and Preventive Maintenance for Unrelated Parallel Machines With Equipment Health Considerations14
IEEE Transactions on Semiconductor Manufacturing Publication Information13
Influence and Suppression of Harmful Effects Due to By-Product in CVD Reactor for 4H-SiC Epitaxy12
Dynamic Down-Selection of Measurement Markers for Optimized Robust Control of Overlay Errors in Photolithography Processes12
IEEE Transactions on Semiconductor Manufacturing Information for Authors12
Call for Papers for RFIC 202312
ℓ₁ Trend Filtering-Based Change Point Detection for Pumping Line Balance of Deposition Equipment11
IEEE Transactions on Semiconductor Manufacturing publication information11
IEEE Transactions on Semiconductor Manufacturing Information for Authors11
2021 EDS Education Award Call for Nominations11
Automatic Defect Detection in Epitaxial Layers by Micro Photoluminescence Imaging11
Study on Measurement Method of Microscopic ζ Potential11
IEEE Transactions on Semiconductor Manufacturing Publication Information10
Minimization of Particle Deposition on Wafers Caused by the Pressure Change in the Vacuum Chamber Through a Pressure Control Regulation Process10
Front Cover10
Bayesian Nonparametric Classification for Incomplete Data With a High Missing Rate: an Application to Semiconductor Manufacturing Data10
3-D NAND Oxide/Nitride Tier Stack Thickness and Zonal Measurements With Infrared Metrology9
Chamber and Recipe-Independent FDC Indicator in High-Mix Semiconductor Manufacturing9
Observation and Suppression of Growth Pits Formed on 4H-SiC Epitaxial Films Grown Using Halide Chemical Vapor Deposition Process9
A Study on the Improvement of Safety and Efficiency of Clean Rooms in Semiconductor Factories Through Real Fire Experiments9
Defect Localization Approach for Wafer-to-Wafer Hybrid Bonding Interconnects9
Adaptive Weight Tuning of EWMA Controller via Model-Free Deep Reinforcement Learning8
Adaptive Cautious Regularized Run-to-Run Controller for Lithography Process8
Shear Force Classification Before Wire Bonding Based on Probe Mark 2-D Images Using Machine Learning Methods8
Methodology for Important Sensor Screening for Fault Detection and Classification in Semiconductor Manufacturing7
Parametric Optimization for Moisture Infiltration Prevention Into a FOUP (Front Opening Unified Pod)7
A Novel Multiscale Residual Aggregation Network-Based Image Super-Resolution Algorithm for Semiconductor Defect Inspection7
Investigations of Fast Vacuum Pump-Down Processes Between Parallel Isothermal Disks7
Process Optimization and Modeling of the Silicon Growth in Trichlorosilane-Hydrogen Gas Mixture in a Planetary CVD Reactor7
Self-Assured Deep Learning With Minimum Pre-Labeled Data for Wafer Pattern Classification7
Double Coating Process Using the Single Photoresist and the Thickness Prediction7
Effect of SiO2 Interfacial Layer Reduction on MFSFET With 5 nm-Thick Ferroelectric Nondoped HfO2 by Deposition Rate Control7
Blank Page6
Modular Fluid Delivery System Architectures Drive Configurability Options, Enhance Semiconductor Manufacturing Equipment Productivity, and Improve Process Performance6
Planned Maintenance Schedule Update Method for Predictive Maintenance of Semiconductor Plasma Etcher6
Table of Contents6
Machine Learning-Based Process-Level Fault Detection and Part-Level Fault Classification in Semiconductor Etch Equipment5
Quantitative Comparison of Simulation and Experiment Enabling a Lithography Digital Twin5
Improving the Reliability of Through Silicon Vias: Reducing Copper Protrusion by Artificial Defect Manipulation and Annealing5
Feature Extraction From Diffraction Images Using a Spatial Light Modulator in Scatterometry5
A Modified Lasso Model for Yield Analysis Considering the Interaction Effect in a Multistage Manufacturing Line5
Integrated Electrochemical Technology for Efficient Metal Recovery in Semiconductor Wastewater5
A Lightweight Chip-Scale Chemical Mechanical Polishing Model Based on Polynomial Network5
Significant Lifetime Improvement of Negative Bias Thermal Instability by Plasma Enhanced Atomic Layer Deposition SiN in Stress Memorization Technique5
Elimination of Si-C Defect on Wafer Surface in High-Temperature SPM Process Through Nitrogen Purge in 300-mm Single-Wafer Chamber5
Why Contour Averaging Works for SEM Metrology: Analysis and Validation5
Quantitative 3-D Flow Visualization of Conventional Purge Flow Within a Front Opening Unified Pod (FOUP)5
Call for Nominations for Editor-in-Chief: IEEE Transactions on Semiconductor Manufacturing4
Overlay Measurement Algorithm for Moiré Targets Using Frequency Analysis4
Gas-Delivery Fluid-Mechanical Timescales in Semiconductor Manufacturing4
Automated Visual Inspection of Defects in Transparent Display Layers Using Light-Field 3-D Imaging4
IEEE Transactions on Semiconductor Manufacturing Information for Authors4
IEEE Transactions on Semiconductor Manufacturing Information for Authors4
Reducing Datacenter Compute Carbon Footprint by Harnessing the Power of Specialization: Principles, Metrics, Challenges and Opportunities4
Photoresist Spray Coating on Silicon Wafers With Acoustic Resonance Atomization4
Front Cover4
Efficient and Refined Deep Convolutional Features Network for the Crack Segmentation of Solar Cell Electroluminescence Images4
An Advanced Finite Element Model for BiCMOS Process Oriented Ultra-Thin Wafer Deformation4
Machine Learning on Multiplexed Optical Metrology Pattern Shift Response Targets to Predict Electrical Properties4
SWaCo: Safe Wafer Bin Map Classification With Self-Supervised Contrastive Learning4
Advanced Process Control System for Trench Shape of Power Devices4
Front Cover4
A Numerical Study on the Effects of Purge and Air Curtain Flow Rates on Humidity Invasion Into a Front Opening Unified Pod (FOUP)4
Prevention of Moisture Invasion by Flow Isolation Device (FID) for Mask Automatic Storage System (Stocker Room) in a Semiconductor Fabrication Plant (Fab)4
Quality-Oriented Statistical Process Control Utilizing Bayesian Modeling4
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "From Mega to nano: Beyond one Century of Vacuum Electronics"4
IEEE Transactions on Semiconductor Manufacturing Information for Authors4
Fabrication of Porous Cu-Sn Microbumps for Low Temperature Cu-Cu Bonding4
Table of Contents3
Effective Variational-Autoencoder-Based Generative Models for Highly Imbalanced Fault Detection Data in Semiconductor Manufacturing3
TCAD-Enabled Machine Learning—An Efficient Framework to Build Highly Accurate and Reliable Models for Semiconductor Technology Development and Fabrication3
Editorial3
Call for Papers for IEEE Transactions on Materials for Electron Devices3
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications"3
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Solid-State Image Sensors"3
The Effect of Si Surface Flattening Process on the MISFET With High-k HfNx Multilayer Gate Dielectrics3
Regularized Recursive Solutions for Prediction of Aberrations Associated With Projection Optics3
Guest Editorial Special Section on Production-Level Artificial Intelligence Applications in Semiconductor Manufacturing3
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on New simulation methodologies for next-generation TCAD tools3
Table of contents3
Editorial3
Table of Contents3
Editorial3
Automatic Defect Classification Using Semi-Supervised Learning With Defect Localization3
Table of contents3
IEEE Transactions on Semiconductor Manufacturing publication information3
Interface Characteristics, Erosion Behavior, and Thermal Shock Resistance of Al–Ta Alloy Coatings Produced by Arc Spraying3
IEEE Transactions on Semiconductor Manufacturing Publication Information3
Investigation of Variation in On-Si On-Wafer TRL Calibration in Sub-THz3
Iterative Learning-Based Predictive Control Method for Electronic Grade Silicon Single Crystal Batch Process2
Controlling Speckle Contrast Using Existing Lithographic Scanner Knobs to Explore the Impact on Line Width Roughness2
Virtual Metrology Modeling for Wafer Edges via Graph Attention Networks2
Machine Learning Models for Edge Placement Error Based Etch Bias2
Level Set Simulation on Single Wafer Wet Processing Improvement2
CMP Process Optimization Engineering by Machine Learning2
Table of Contents2
Optimization of Void Defects at TiN/Si:HfO2 Interface for 3-D Ferroelectric Memory2
Semi-Supervised Learning for Simultaneous Location Detection and Classification of Mixed-Type Defect Patterns in Wafer Bin Maps2
Hotspot Prediction: SEM Image Generation With Potential Lithography Hotspots2
A Yield Prediction Method Based on Nonparametric Statistical and Comparison With a Networks Method2
Fuzzy Selection Model for Quality-Based IC Packaging Process Outsourcers2
Improving Liquid Film Thickness Uniformity of Semiconductor Etching Equipment Using Flow Field Visualization and CFD Simulation2
Deep Learning-Based Multi-Horizon Forecasting for Automated Material Handling System Throughput in Semiconductor Fab2
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications"2
Nondestructive Detection of Buried and Latent Defects by Negative Mode E-Beam Inspection2
TestDNA-E: Wafer Defect Signature for Pattern Recognition by Ensemble Learning2
Image-Based Defect Classification for TFT-LCD Array via Convolutional Neural Network2
Improvement of Virtual Diagnostics Performance for Plasma Density in Semiconductor Etch Equipment Using Variational Auto-Encoder2
Model-Free Adaptive Iterative Learning Control Method for the Czochralski Silicon Monocrystalline Batch Process2
DSH to Extend-DSH: Chip-Level Chemical Mechanical Planarization (CMP) Model Upgrade Based on Decoupling Regression Strategy2
The Mechanism of an Etching-Back to Reduce the Density of Cone Defect in STI During the Manufacturing2
Attention Mechanism-Based Root Cause Analysis for Semiconductor Yield Enhancement Considering the Order of Manufacturing Processes2
The Effect of Purge Flow Rate and Wafer Arrangement on Humidity Invasion Into a Loaded Front Opening Unified Pod (FOUP)2
A Comparative Study on Velocity Fields, Humidity and Oxygen Concentration in a Front Opening Unified Pod (FOUP) During Purge2
Coherent Fourier Scatterometry for Detection of Killer Defects on Silicon Carbide Samples2
Investigation of the HfON Tunneling Layer of MONOS Device for Low-Voltage and High-Speed Operation Nonvolatile Memory Application2
A Hierarchical Spatial-Test Attention Network for Explainable Multiple Wafer Bin Maps Classification2
Single-Mask Fabrication of Sharp SiOx Nanocones2
Improved Color Defect Detection With Machine Learning for After Develop Inspections in Lithography2
Modeling and Optimizing the Impact of Process and Equipment Parameters in Sputtering Deposition Systems Using a Gaussian Process Machine Learning Framework2
CNNs Combined With a Conditional GAN for Mura Defect Classification in TFT-LCDs2
Computational Study of Chemical Uniformity Impacts on Electrodeposition2
Thermal and Electrical Analysis of the Electrostatic Chuck for the Etch Equipment2
Temporal Convolution-Based Long-Short Term Memory Network With Attention Mechanism for Remaining Useful Life Prediction2
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