IEEE Transactions on Semiconductor Manufacturing

Papers
(The median citation count of IEEE Transactions on Semiconductor Manufacturing is 0. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-05-01 to 2025-05-01.)
ArticleCitations
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Semiconductor Device Modeling for Circuit and System Design"48
IEEE Transactions on Semiconductor Manufacturing Publication Information41
Investigations of Fast Vacuum Pump-Down Processes Between Parallel Isothermal Disks40
Minimization of Particle Deposition on Wafers Caused by the Pressure Change in the Vacuum Chamber Through a Pressure Control Regulation Process33
Fabrication of Porous Cu-Sn Microbumps for Low Temperature Cu-Cu Bonding33
Guest Editorial Special Section on the 2022 SEMI Advanced Semiconductor Manufacturing Conference33
Call for Papers for IEEE Transactions on Materials for Electron Devices28
Adaptive Weight Tuning of EWMA Controller via Model-Free Deep Reinforcement Learning28
Defect Reduction And Line Width Roughness Improvement By Using A Post Precoat Treatment In Waferless Chamber Conditioning28
Machine Learning-Based Process-Level Fault Detection and Part-Level Fault Classification in Semiconductor Etch Equipment28
Table of contents27
IEEE Transactions on Semiconductor Manufacturing publication information25
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications"21
Nondestructive Detection of Buried and Latent Defects by Negative Mode E-Beam Inspection20
The Effect of Purge Flow Rate and Wafer Arrangement on Humidity Invasion Into a Loaded Front Opening Unified Pod (FOUP)19
A Comparative Study on Velocity Fields, Humidity and Oxygen Concentration in a Front Opening Unified Pod (FOUP) During Purge19
A Yield Prediction Method Based on Nonparametric Statistical and Comparison With a Networks Method18
Level Set Simulation on Single Wafer Wet Processing Improvement18
TCAD-Enabled Machine Learning—An Efficient Framework to Build Highly Accurate and Reliable Models for Semiconductor Technology Development and Fabrication17
Advanced Process Control System for Trench Shape of Power Devices16
Semi-Supervised Learning for Simultaneous Location Detection and Classification of Mixed-Type Defect Patterns in Wafer Bin Maps16
Hotspot Prediction: SEM Image Generation With Potential Lithography Hotspots15
Single-Mask Fabrication of Sharp SiOx Nanocones15
The Mechanism of an Etching-Back to Reduce the Density of Cone Defect in STI During the Manufacturing14
Editorial14
Computational Study of Chemical Uniformity Impacts on Electrodeposition13
TestDNA-E: Wafer Defect Signature for Pattern Recognition by Ensemble Learning13
In-Situ Plasma Monitoring Using Multiple Plasma Information in SiO2 Etch Process12
IEEE Transactions on Semiconductor Manufacturing Publication Information12
Machine Learning-Based Detection Method for Wafer Test Induced Defects12
Test Structure for Measuring the Selectivity in XeF2 and HF Vapour Etch Processes12
Blank Page12
DPFEE-Net: Enhancing Wafer Defect Classification Through Dual-Path Neural Architecture11
Wafer Bin Map Recognition With Autoencoder-Based Data Augmentation in Semiconductor Assembly Process10
Correlation Between Trench Angle and Wafer Warpage in Trench Field Plate Power MOSFETs and its Application to Quality Control10
Blank Page10
A Warpage Prediction Model for Trench Field-Plate Power MOSFET in 300mm-Diameter Process9
2021 Index IEEE Transactions on Semiconductor Manufacturing Vol. 349
Automatic Classification of C-SAM Voids for Root Cause Identification of Bonding Yield Degradation9
IEEE Transactions on Semiconductor Manufacturing Publication Information9
Source Pad Design Tradeoffs for a Power TrenchFET9
Deep Learning Approach to Inverse Grain Pattern of Nanosized Metal Gate for Multichannel Gate-All-Around Silicon Nanosheet MOSFETs8
Optimization and Application of TiO2 Hollow Microsphere Modified Scattering Layer for the Photovoltaic Conversion Efficiency of Dye-Sensitized Solar Cell8
Streamlining Semiconductor Manufacturing of 200 mm and 300 mm Wafers: A Longitudinal Case Study on the Lot-to-Order-Matching Process8
2023 Index IEEE Transactions on Semiconductor Manufacturing Vol. 368
Commonality Analysis for Detecting Failures Caused by Inspection Tools in Semiconductor Manufacturing Processes8
IEEE Transactions on Semiconductor Manufacturing Publication Information8
Systematic Search for Stabilizing Dopants in ZrO₂ and HfO₂ Using First-Principles Calculations8
Perspectives on Black Silicon in Semiconductor Manufacturing: Experimental Comparison of Plasma Etching, MACE, and Fs-Laser Etching7
Research Toward Wafer-Scale 3D Integration of InP Membrane Photonics With InP Electronics7
IEEE Transactions on Semiconductor Manufacturing CALL FOR PAPERS for Special Issue on "Process-Level Machine Learning Applications in Semiconductor Manufacturing"7
Deep Clustering and Regression Ensemble Network for Lot Cycle Time Prediction in Semiconductor Wafer Fabrication7
IEEE EDS Robert Bosch Micro and Nano Electro Mechanical Systems Award: Call for Nominations7
A Graph-Theoretic Approach for Spatial Filtering and Its Impact on Mixed-Type Spatial Pattern Recognition in Wafer Bin Maps7
Table of Contents7
Rapid Resolution of Parametric Failures in the Process Development Period by Integrating Device Physics and Big Data7
Wafer Dicing Vibration Investigation on Novel Wafer Mounting Techniques7
IEEE Transactions on Semiconductor Manufacturing Publication Information7
Recognition and Classification of Mixed Defect Pattern Wafer Map Based on Multi-Path DCNN7
Wafer Reflectance Prediction for Complex Etching Process Based on K-Means Clustering and Neural Network7
Front Cover7
Table of Contents6
A Real-Time Monitoring Framework for Wafer Fabrication Processes With Run-to-Run Variations6
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications"6
Defect Detection of Photovoltaic Panels to Suppress Endogenous Shift Phenomenon6
Nitrogen-Doped Czochralski Silicon Wafers as Materials for Conventional and Scaled Insulated Gate Bipolar Transistors6
Data-Driven Production Planning Models for Wafer Fabs: An Exploratory Study6
Advances in the Thermal Study of Polymers for Microelectronics Using the Thermally Induced Curvature Approach6
Guest Editorial Process-Level Machine Learning Applications in Semiconductor Manufacturing6
RA-UNet: A New Deep Learning Segmentation Method for Semiconductor Wafer Defect Analysis on Fine-Grained Scanning Electron Microscope (SEM) Images6
Minimizing Convolutional Neural Network Training Data With Proper Data Augmentation for Inline Defect Classification5
Automatic Pico Laser Trimming System for Silicon MEMS Resonant Devices Based on Image Recognition5
Unrelated Parallel Machine Photolithography Scheduling Problem With Dual Resource Constraints5
New Process Integration of Sequential Phosphorus-Doped Silicon for Trench Field Plate Power MOSFETs5
Call for Nominations: 2024 EDS Early Career Award5
Editorial5
Anomaly Detection in Batch Manufacturing Processes Using Localized Reconstruction Errors From 1-D Convolutional AutoEncoders5
IEEE Transactions on Semiconductor Manufacturing Publication Information5
BCICTS 2023 Call for Papers5
Call for Papers 6th IEEE Electron Devices Technology and Manufacturing (EDTM) Conference5
Fabrication of On-Silicon Aperture Coupled Patch Antenna Through Micromachining and Cu-Cu Thermocompression Bonding5
Semantic Context Information Modeling With Neural Networks in Customer Order Behavior Classification5
Manufacturing of 3D Helical Microswimmer by AFM Micromanipulation for Microfluidic Applications5
Adaptive Cautious Regularized Run-to-Run Controller for Lithography Process5
Quantitative 3-D Flow Visualization of Conventional Purge Flow Within a Front Opening Unified Pod (FOUP)4
A Novel Foundry Yield Model Using Critical Area Analysis4
Multiobjective Order Promising for Outsourcing Supply Network of IC Design Houses4
Guest Editorial Special Section on Sustainability4
IEEE Transactions on Semiconductor Manufacturing Information for Authors4
Table of contents4
Why Contour Averaging Works for SEM Metrology: Analysis and Validation4
Shear Force Classification Before Wire Bonding Based on Probe Mark 2-D Images Using Machine Learning Methods4
Coherent Fourier Scatterometry for Detection of Killer Defects on Silicon Carbide Samples4
Prevention of Moisture Invasion by Flow Isolation Device (FID) for Mask Automatic Storage System (Stocker Room) in a Semiconductor Fabrication Plant (Fab)4
Integrated Electrochemical Technology for Efficient Metal Recovery in Semiconductor Wastewater4
Table of Contents4
Deep Learning-Based Multi-Horizon Forecasting for Automated Material Handling System Throughput in Semiconductor Fab4
Double Coating Process Using the Single Photoresist and the Thickness Prediction4
Defect Localization Approach for Wafer-to-Wafer Hybrid Bonding Interconnects4
A Modified Lasso Model for Yield Analysis Considering the Interaction Effect in a Multistage Manufacturing Line4
DSH to Extend-DSH: Chip-Level Chemical Mechanical Planarization (CMP) Model Upgrade Based on Decoupling Regression Strategy4
Overlay Measurement Algorithm for Moiré Targets Using Frequency Analysis4
Editorial4
Comparative Study of Nondestructive Mapping of Conformal-Coating Thickness on Microelectronics by Terahertz Time-of-Flight Tomography3
TechRxiv: Share Your Preprint Research With the World!3
IEEE Transactions on Semiconductor Manufacturing Information for Authors3
Quality-Oriented Statistical Process Control Utilizing Bayesian Modeling3
Geometry-Based Curvilinear Mask Process Correction for Enhanced Pattern Fidelity, Contrast, and Manufacturability3
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on New simulation methodologies for next-generation TCAD tools3
Real-Time Change Detection for Automated Test Socket Inspection Using Advanced Computer Vision and Machine Learning3
Performance Evaluation of Supervised Learning Model Based on Functional Data Analysis and Summary Statistics3
Development of SiGe Indentation Process Control for Gate-All-Around FET Technology Enablement3
Editorial3
Blank page3
A Self-Test Method of Structural Failures of Uncooled Infrared Focal Plane Array3
A Diffusion-Model-Based Methodology for Virtual Silicon Data Generation3
Practical Reinforcement Learning for Adaptive Photolithography Scheduler in Mass Production3
Understanding and Improving Virtual Metrology Systems Using Bayesian Methods3
Efficient and Refined Deep Convolutional Features Network for the Crack Segmentation of Solar Cell Electroluminescence Images3
Chemical Mechanical Polishing of Single-Crystalline Diamond Epitaxial Layers for Electronics Applications3
Density-Based Spatial Clustering of Applications With Noise (DBSCAN) for Probe Card Production for Advanced Quality Control of Wafer Probing Test3
Blank Page3
Table of Contents2
IEEE Transactions on Semiconductor Manufacturing Information for Authors2
IEEE Transactions on Semiconductor Manufacturing Information for Authors2
Simulations of Modified Shallow Water Equation and Reaction Kinetics of Poly Etching on Single Wafer Process2
Imaging of Metal Ions and Nanoparticles on Structured Silicon Surface Using Laser Ablation-Inductively Coupled Plasma-Mass Spectrometer for Contamination Control in Semiconductor Manufacturing Process2
Analysis of Image Hashing in Wafer Map Failure Pattern Recognition2
Editorial2
Data Visualization of Anomaly Detection in Semiconductor Processing Tools2
IEEE Transactions on Semiconductor Manufacturing Information for Authors2
Sustainable Technologies for Responsible Products and a More Sustainable Future2
Vacancy-Type Defects in HfO2 Layers and Their Role in Amorphous-to-Crystalline Transition Studied by Monoenergetic Positron Beams2
BCICTS 2022 CALL FOR PAPERS2
IEEE Transactions on Semiconductor Manufacturing Information for Authors2
Product Design Enhancement With Test Structures for Non-Contact Detection of Yield Detractors2
Editorial2
Low-Destructive Processing of Single Crystal Aluminum Nitride Based on Sol-Gel Polishing Tool2
Comprehensive Study of the Impact of LWR on Device Performance in VLSI Technology2
Enhancing Current Gain in Polysilicon Emitter Bipolar Transistors Through Emitter-Base Interface Engineering2
Blank page2
Front Cover2
Production-Level Artificial Intelligence Applications in Semiconductor Supply Chains2
Fast Optical Proximity Correction Using Graph Convolutional Network With Autoencoders2
Call for Nominations for Editor-in-Chief: IEEE Transactions on Semiconductor Manufacturing2
IEEE Transactions on Semiconductor Manufacturing publication information2
An Alternative PECVD Chamber Cleaning Gas of COF2 for Low-GWP Consideration2
Wafer Scratch Pattern Reconstruction for High Diagnosis Accuracy and Yield Optimization2
Efficient Dual-Attention-Based Knowledge Distillation Network for Unsupervised Wafer Map Anomaly Detection2
Group-Exclusive Feature Group Lasso and Applications to Automatic Sensor Selection for Virtual Metrology in Semiconductor Manufacturing2
Study on Mechanical Cleavage Mechanism of GaAs via Anisotropic Stress Field and Experiments2
Guest Editorial Special Section on the IEEE 33rd International Conference on Microelectronic Test Structures (ICMTS)2
Model-Based OPC With Adaptive PID Control Through Reinforcement Learning2
An Autoencoder-Based Approach for Fault Detection in Multi-Stage Manufacturing: A Sputter Deposition and Rapid Thermal Processing Case Study2
A Novel Multiscale Residual Aggregation Network-Based Image Super-Resolution Algorithm for Semiconductor Defect Inspection1
Application of Plasma Information-Based Virtual Metrology (PI-VM) for Etching in C₄F₈/Ar/O₂ Plasma1
Chamber and Recipe-Independent FDC Indicator in High-Mix Semiconductor Manufacturing1
ML-Guided Curvilinear OPC: Fast, Accurate, and Manufacturable Curve Correction1
Automatic Defect Classification Using Semi-Supervised Learning With Defect Localization1
On Uses of Noise Analysis for the Uncertainty Quantification of Line Edge Roughness Estimation1
Wireless Measurement of the Degradation Rates of Thin Film Bioresorbable Metals Using Reflected Impedance1
A Real-Time Automatic Structural-Loss Detection and Stopping Rule of Semiconductor Single-Crystal-Silicon-Growth <100> and <111>1
Prediction of Highly Imbalanced Semiconductor Chip-Level Defects in Module Tests Using Multimodal Fusion and Logit Adjustment1
Call for Papers for a Special Issue of IEEE Journal of the Electron Devices Society on "Materials, Processing and Integration for Neuromorphic Devices and In-Memory Computing"1
Image-Based Defect Classification for TFT-LCD Array via Convolutional Neural Network1
Pioneering Fast and Safe Low-k Silicon Dioxide Synthesis for Modern Integrated Circuits1
Significant Lifetime Improvement of Negative Bias Thermal Instability by Plasma Enhanced Atomic Layer Deposition SiN in Stress Memorization Technique1
A Case Study on Sputtered Chromium Sacrificial Layer for Ti2O3 Microstructure Fabrication1
Quantitative Comparison of Simulation and Experiment Enabling a Lithography Digital Twin1
Nano-Scale Depth Profiles of Electrical Properties of Phosphorus Doped Silicon for Ultra-Shallow Junction Evaluation1
Joint Dynamic Dispatching and Preventive Maintenance for Unrelated Parallel Machines With Equipment Health Considerations1
Fabrication of the Highly Ordered Silicon Nanocone Array With Sub-5 nm Tip Apex by Tapered Silicon Oxide Mask1
Wafer Lot Assignment for Parallel-Producing Tools Based on Heuristic Clustering Algorithm1
High Accuracy Simulation of Silicon Oxynitride Film Grown by Plasma Enhanced Chemical Vapor Deposition1
Atomic Layer Processes for Material Growth and Etching—A Review1
A Practical Approach for Managing End-of-Life Systems in Semiconductor Manufacturing Using Health Index1
Customer Order Behavior Classification Via Convolutional Neural Networks in the Semiconductor Industry1
Yield Methodology and Heater Process Variation in Phase Change Memory (PCM) Technology for Analog Computing1
Applying Data Augmentation and Mask R-CNN-Based Instance Segmentation Method for Mixed-Type Wafer Maps Defect Patterns Classification1
Improvement of Multi-Lines Bridge Defect Classification by Hierarchical Architecture in Artificial Intelligence Automatic Defect Classification1
Blank Page1
Improved Color Defect Detection With Machine Learning for After Develop Inspections in Lithography1
IEEE Transactions on Semiconductor Manufacturing Information for Authors1
Call for Papers for a Special Issue of IEEE Journal of the Electron Devices Society on "Materials, Processing and Integration for Neuromorphic Devices and In-Memory Computing"1
IEEE Transactions on Semiconductor Manufacturing Information for Authors1
Process Control in Semiconductor Manufacturing Based on Deep Distributional Soft Actor–Critic Reinforcement Learning1
Observation and Suppression of Growth Pits Formed on 4H-SiC Epitaxial Films Grown Using Halide Chemical Vapor Deposition Process1
Eco-Friendly Dry-Cleaning and Diagnostics of Silicon Dioxide Deposition Chamber1
Automatic Defect Detection in Epitaxial Layers by Micro Photoluminescence Imaging1
E-Test Validation of Space Error Budget and Metrology1
Optical Proximity Correction Using Bidirectional Recurrent Neural Network With Attention Mechanism1
Correlated Bayesian Co-Training for Virtual Metrology1
3-D NAND Oxide/Nitride Tier Stack Thickness and Zonal Measurements With Infrared Metrology1
Integrated Scheduling of Jobs, Tools, Machines, and Two Different Set of Transbots1
Front Cover1
The Research on Screening Method to Reduce Chip Test Escapes by Using Multi-Correlation Analysis of Parameters1
A Hierarchical Spatial-Test Attention Network for Explainable Multiple Wafer Bin Maps Classification1
Iterative Learning-Based Predictive Control Method for Electronic Grade Silicon Single Crystal Batch Process1
Modeling and Designing a GaN-Growth Reactor With Halogen-Free Vapor Phase Epitaxy: NH3 Decomposition at the Catalytic Surface of Components to Replicate Parasitic Polycrystal Formation1
Optimization of Void Defects at TiN/Si:HfO2 Interface for 3-D Ferroelectric Memory1
Virtual Metrology for Etch Profile in Silicon Trench Etching With SF₆/O₂/Ar Plasma1
Table of Contents1
Integrated Test Pattern Extraction and Generation for Accurate Lithography Modeling1
Bayesian Nonparametric Classification for Incomplete Data With a High Missing Rate: an Application to Semiconductor Manufacturing Data0
Call for Papers for a Special Issue of IEEE Transactions on Materials for Electron Devices: "Exploration of the Exciting World of Multifunctional Oxide-Based Electronic Devices: From Material to Syste0
Comparison of Semiconductor Reverse Osmosis System Performance With Conventional and 3D Printed Feed Channels0
The Environmental Footprint of IC Production: Review, Analysis, and Lessons From Historical Trends0
Cross-Chamber Data Transferability Evaluation for Fault Detection and Classification in Semiconductor Manufacturing0
Two-Stage Transfer Learning for Fault Prognosis of Ion Mill Etching Process0
Novel Control Method and Applications for Negative Mode E-Beam Inspection0
A Novel Automatic Probe-to-Pad Alignment Error Correction Approach0
Impact of Annealing Temperature on MnO2 Thin Films: Morphological, Structural, and Electrical Properties0
Editorial0
An Emerging Local Annealing Method for Simultaneous Crystallization and Activation in Xtacking 3-D NAND Flash0
Equipment Condition Monitoring of Multiple Oxide-Nitride Stack Layer Deposition Process0
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "From Mega to nano: Beyond one Century of Vacuum Electronics"0
A Data-Driven Approach for Improving Energy Efficiency in a Semiconductor Manufacturing Plant0
Self-Assured Deep Learning With Minimum Pre-Labeled Data for Wafer Pattern Classification0
A Lightweight Chip-Scale Chemical Mechanical Polishing Model Based on Polynomial Network0
Capacity Estimation for Semiconductor Wafer Fabrication Facilities via an Optimization Model based on Flexible Lead Times0
Parametric Optimization for Moisture Infiltration Prevention Into a FOUP (Front Opening Unified Pod)0
A Dry Etch Approach To Reduce Roughness and Eliminate Visible Grind Marks in Silicon Wafers Post Back-Grind0
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "From Mega to nano: Beyond one Century of Vacuum Electronics"0
Identifying Good-Dice-in-Bad-Neighborhoods Using Artificial Neural Networks0
One Class Process Anomaly Detection Using Kernel Density Estimation Methods0
Adversarial Defect Detection in Semiconductor Manufacturing Process0
Characterization of Multimodal Spot Scanning Imaging System for Wafer Defect Inspection0
Shape and Roughness Extraction of Line Gratings by Small Angle X-Ray Scattering: Statistics and Simulations0
Improvement of Plasma Etching Endpoint Detection With Data-Driven Wavelength Selection and Gaussian Mixture Model0
Drop-In Test Structure to Evaluate Residual Stress in Conformally Grown Films0
Visualization and Analysis of Temporal and Steady-State Gas Concentration in Process Chamber Using 70-dB SNR 1000 fps Absorption Imaging System0
Reducing Datacenter Compute Carbon Footprint by Harnessing the Power of Specialization: Principles, Metrics, Challenges and Opportunities0
Simulation and Experimental Analysis of Contactless Chip Pickup Process Based on a Vortex Flow Gripper0
Table of Contents0
A Numerical Study on the Effects of Purge and Air Curtain Flow Rates on Humidity Invasion Into a Front Opening Unified Pod (FOUP)0
Call for Papers: Role of Solar Cells in Global Energy Transformation0
Study on Measurement Method of Microscopic ζ Potential0
On the Fly Ellipsometry Imaging for Process Deviation Detection0
Optimal Feature Selection for Defect Classification in Semiconductor Wafers0
Guest Editorial Special section on the 2023 SEMI Advanced Semiconductor Manufacturing Conference0
A Comparative Study of Semiconductor Virtual Metrology Methods and Novel Algorithmic Framework for Dynamic Sampling0
Table of contents0
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide Band Gap Semiconductors for Automotive Applications"0
Optimization of RF Frequencies in Dual-Frequency Capacitively Coupled Plasma Apparatus Using Genetic Algorithm (GA) and Plasma Simulation0
An Investigation of Edge Bead Removal Width Variability, Effects and Process Control in Photolithographic Manufacturing0
Blank Page0
Centering Sustainability in Process Development Through Improved Characterization of HFC-PFC Byproducts0
Planned Maintenance Schedule Update Method for Predictive Maintenance of Semiconductor Plasma Etcher0
IEEE Transactions on Semiconductor Manufacturing Information for Authors0
Blank Page0
0.15293478965759