IEEE Transactions on Semiconductor Manufacturing

Papers
(The median citation count of IEEE Transactions on Semiconductor Manufacturing is 0. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-01-01 to 2026-01-01.)
ArticleCitations
Minimization of Particle Deposition on Wafers Caused by the Pressure Change in the Vacuum Chamber Through a Pressure Control Regulation Process45
Guest Editorial Special Section on the 2022 SEMI Advanced Semiconductor Manufacturing Conference43
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Semiconductor Device Modeling for Circuit and System Design"38
IEEE Transactions on Semiconductor Manufacturing Publication Information38
Call for Nominations for Editor-in-Chief: IEEE Electron Device Letters36
Fast and High-Precision Temperature Control in Semiconductor Vertical Furnace via Iterative Experiments36
Fabrication of Porous Cu–Sn Microbumps for Low-Temperature Cu–Cu Bonding36
Defect Reduction and Line Width Roughness Improvement by Using a Post Precoat Treatment in Waferless Chamber Conditioning35
Investigations of Fast Vacuum Pump-Down Processes Between Parallel Isothermal Disks29
Machine Learning-Based Process-Level Fault Detection and Part-Level Fault Classification in Semiconductor Etch Equipment28
Adaptive Weight Tuning of EWMA Controller via Model-Free Deep Reinforcement Learning26
Scalable Multi-Site Test Architecture for Chiplet-based Systems on ATE Platforms25
Call for Papers for IEEE Transactions on Materials for Electron Devices22
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications"22
Level Set Simulation on Single Wafer Wet Processing Improvement21
Advanced Process Control System for Trench Shape of Power Devices20
Editorial18
The Mechanism of an Etching-Back to Reduce the Density of Cone Defect in STI During the Manufacturing17
Computational Study of Chemical Uniformity Impacts on Electrodeposition17
Grain Morphology Effects on Void Formation and Electromigration-Induced Failure in Copper Interconnects15
Synthesis of Critical Patterns for Lithography Optimizations Through Machine Learning15
Nondestructive Detection of Buried and Latent Defects by Negative Mode E-Beam Inspection15
Improving RF Magnetron Sputter Parameters for a Piezoelectric AlN Thin Film Deposition15
Hotspot Prediction: SEM Image Generation With Potential Lithography Hotspots15
The Effect of Purge Flow Rate and Wafer Arrangement on Humidity Invasion Into a Loaded Front Opening Unified Pod (FOUP)14
Semi-Supervised Learning for Simultaneous Location Detection and Classification of Mixed-Type Defect Patterns in Wafer Bin Maps13
A Comparative Study on Velocity Fields, Humidity and Oxygen Concentration in a Front Opening Unified Pod (FOUP) During Purge13
TestDNA-E: Wafer Defect Signature for Pattern Recognition by Ensemble Learning12
A Yield Prediction Method Based on Nonparametric Statistical and Comparison With a Networks Method11
Single-Mask Fabrication of Sharp SiOx Nanocones11
Analyzing the Impact of Inclined Airflow Within the EFEM on the Lateral Flow Around the FOUP Using Flow Visualization Techniques11
TCAD-Enabled Machine Learning—An Efficient Framework to Build Highly Accurate and Reliable Models for Semiconductor Technology Development and Fabrication11
In-Situ Plasma Monitoring Using Multiple Plasma Information in SiO₂ Etch Process10
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Source Pad Design Tradeoffs for a Power TrenchFET10
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Automatic Classification of C-SAM Voids for Root Cause Identification of Bonding Yield Degradation10
IEEE Transactions on Semiconductor Manufacturing Publication Information10
Wafer Bin Map Recognition With Autoencoder-Based Data Augmentation in Semiconductor Assembly Process9
Physics-Informed Machine Learning-Based Edge Detection for SEM Images9
2023 Index IEEE Transactions on Semiconductor Manufacturing Vol. 369
A Self-Powered Wireless Sensing Circuitry for On-Wafer In-Situ EUV Detection9
Integration Challenges on 300-mm High Resistivity Silicon Substrates9
IEEE Transactions on Semiconductor Manufacturing Publication Information9
A Warpage Prediction Model for Trench Field-Plate Power MOSFET in 300mm-Diameter Process9
IEEE Transactions on Semiconductor Manufacturing Publication Information9
DPFEE-Net: Enhancing Wafer Defect Classification Through Dual-Path Neural Architecture9
IEEE EDS Robert Bosch Micro and Nano Electro Mechanical Systems Award: Call for Nominations8
IEEE Transactions on Semiconductor Manufacturing Publication Information8
Optimization and Application of TiO2 Hollow Microsphere Modified Scattering Layer for the Photovoltaic Conversion Efficiency of Dye-Sensitized Solar Cell8
Research Toward Wafer-Scale 3D Integration of InP Membrane Photonics With InP Electronics8
Systematic Search for Stabilizing Dopants in ZrO₂ and HfO₂ Using First-Principles Calculations8
Journal of Lightwave Technology Special Issue on: OFS-298
Recognition and Classification of Mixed Defect Pattern Wafer Map Based on Multi-Path DCNN8
Front Cover8
Wafer Dicing Vibration Investigation on Novel Wafer Mounting Techniques8
Streamlining Semiconductor Manufacturing of 200 mm and 300 mm Wafers: A Longitudinal Case Study on the Lot-to-Order-Matching Process8
Perspectives on Black Silicon in Semiconductor Manufacturing: Experimental Comparison of Plasma Etching, MACE, and Fs-Laser Etching8
Commonality Analysis for Detecting Failures Caused by Inspection Tools in Semiconductor Manufacturing Processes8
Characterizing Capacitor Top Plate Bias for More Accurate Electromagnetic Simulations7
Editorial7
New Quality Index to Improve Overlay Measurement Accuracy Based on Moiré Marks: Method for Quantifying Moiré Pattern Quality Using the Signal Shape Index7
Data-Driven Production Planning Models for Wafer Fabs: An Exploratory Study7
Deep Clustering and Regression Ensemble Network for Lot Cycle Time Prediction in Semiconductor Wafer Fabrication7
Table of Contents7
Defect Detection of Photovoltaic Panels to Suppress Endogenous Shift Phenomenon7
Evaluation of Thick Silicon Nitride Film Properties at 300 mm Scale for High-Q Photonic Devices6
Table of Contents6
IEEE Transactions on Semiconductor Manufacturing Publication Information6
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications"6
Nitrogen-Doped Czochralski Silicon Wafers as Materials for Conventional and Scaled Insulated Gate Bipolar Transistors6
Advances in the Thermal Study of Polymers for Microelectronics Using the Thermally Induced Curvature Approach6
Semantic Context Information Modeling With Neural Networks in Customer Order Behavior Classification6
Unrelated Parallel Machine Photolithography Scheduling Problem With Dual Resource Constraints6
Guest Editorial Process-Level Machine Learning Applications in Semiconductor Manufacturing6
RA-UNet: A New Deep Learning Segmentation Method for Semiconductor Wafer Defect Analysis on Fine-Grained Scanning Electron Microscope (SEM) Images6
Call for Nominations: 2024 EDS Early Career Award6
Fabrication of On-Silicon Aperture Coupled Patch Antenna Through Micromachining and Cu-Cu Thermocompression Bonding6
Prevention of Moisture Invasion by Flow Isolation Device (FID) for Mask Automatic Storage System (Stocker Room) in a Semiconductor Fabrication Plant (Fab)5
Macro and Micro-Scale Non-Contact Imaging of Electrically Active Extended Defects in 4H-SiC Merged PiN Schottky Diode Devices5
Anomaly Detection in Batch Manufacturing Processes Using Localized Reconstruction Errors From 1-D Convolutional AutoEncoders5
Current Status of Bulk β-Ga₂O₃ and β-(AlxGa₁-ₓ)₂O₃ Crystal Growth5
Guest Editorial Special Section on Sustainability5
IEEE Transactions on Semiconductor Manufacturing Information for Authors5
Table of Contents5
Defect Localization Approach for Wafer-to-Wafer Hybrid Bonding Interconnects5
Shear Force Classification Before Wire Bonding Based on Probe Mark 2-D Images Using Machine Learning Methods5
BCICTS 2023 Call for Papers5
Guest Editorial Introduction to the Joint Special Issue on Semiconductor Design for Manufacturing (DFM)5
Overlay Measurement Algorithm for Moiré Targets Using Frequency Analysis5
DSH to Extend-DSH: Chip-Level Chemical Mechanical Planarization (CMP) Model Upgrade Based on Decoupling Regression Strategy5
Improving Endpoint Detection Sensitivity in Plasma Etching With Small Openings5
Quantitative 3-D Flow Visualization of Conventional Purge Flow Within a Front Opening Unified Pod (FOUP)5
Automatic Pico Laser Trimming System for Silicon MEMS Resonant Devices Based on Image Recognition5
Unsupervised Representation Learning and Explainable Clustering for Wafer Map Pattern Analysis5
Editorial5
A Modified Lasso Model for Yield Analysis Considering the Interaction Effect in a Multistage Manufacturing Line5
Deep Learning-Based Multi-Horizon Forecasting for Automated Material Handling System Throughput in Semiconductor Fab5
Why Contour Averaging Works for SEM Metrology: Analysis and Validation5
Integrated Electrochemical Technology for Efficient Metal Recovery in Semiconductor Wastewater5
Multiobjective Order Promising for Outsourcing Supply Network of IC Design Houses5
Guest Editorial Special Section on the 2025 International Conference on Compound Semiconductor Manufacturing Technology (CS-MANTECH)4
IEEE Transactions on Semiconductor Manufacturing Information for Authors4
IEEE Transactions on Semiconductor Manufacturing Publication Information4
Performance Evaluation of Supervised Learning Model Based on Functional Data Analysis and Summary Statistics4
Editorial4
Comparative Study of Nondestructive Mapping of Conformal-Coating Thickness on Microelectronics by Terahertz Time-of-Flight Tomography4
Multi-Scale Content-Aware Enhancement Dual-Branch CNN for LED-Chip Defect Classification4
Surface Reconstruction for Enhancing the Overlay Modeling Optimization Procedure in Photolithography Processes4
TechRxiv: Share Your Preprint Research With the World!4
Understanding and Improving Virtual Metrology Systems Using Bayesian Methods4
Geometry-Based Curvilinear Mask Process Correction for Enhanced Pattern Fidelity, Contrast, and Manufacturability4
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Sustainable Technologies for Responsible Products and a More Sustainable Future4
Density-Based Spatial Clustering of Applications With Noise (DBSCAN) for Probe Card Production for Advanced Quality Control of Wafer Probing Test4
Chemical Mechanical Polishing of Single-Crystalline Diamond Epitaxial Layers for Electronics Applications4
Efficient and Refined Deep Convolutional Features Network for the Crack Segmentation of Solar Cell Electroluminescence Images4
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices: Reliability of Advanced Nodes4
Coherent Fourier Scatterometry for Detection of Killer Defects on Silicon Carbide Samples4
Development of SiGe Indentation Process Control for Gate-All-Around FET Technology Enablement4
Model-Based OPC With Adaptive PID Control Through Reinforcement Learning4
Real-Time Change Detection for Automated Test Socket Inspection Using Advanced Computer Vision and Machine Learning4
Simulations of Modified Shallow Water Equation and Reaction Kinetics of Poly Etching on Single Wafer Process3
Fast Optical Proximity Correction Using Graph Convolutional Network With Autoencoders3
Mechanistic Analysis of the Effect of Gap on Convex Curves of Wafer in Double-Sided Polishing3
Group-Exclusive Feature Group Lasso and Applications to Automatic Sensor Selection for Virtual Metrology in Semiconductor Manufacturing3
A Diffusion-Model-Based Methodology for Virtual Silicon Data Generation3
IEEE Transactions on Semiconductor Manufacturing Information for Authors3
Enhancing Current Gain in Polysilicon Emitter Bipolar Transistors Through Emitter-Base Interface Engineering3
Product Design Enhancement With Test Structures for Non-Contact Detection of Yield Detractors3
IEEE Transactions on Semiconductor Manufacturing Information for Authors3
Editorial3
Production-Level Artificial Intelligence Applications in Semiconductor Supply Chains3
The Modeling of Post-Annealing and Etching Processes of ALD SiO₂ Using Intermediate Variables Considering Digital Twin Model Reusability3
Comprehensive Study of the Impact of LWR on Device Performance in VLSI Technology3
Front Cover3
Practical Reinforcement Learning for Adaptive Photolithography Scheduler in Mass Production3
Analysis of Image Hashing in Wafer Map Failure Pattern Recognition3
Vacancy-Type Defects in HfO2 Layers and Their Role in Amorphous-to-Crystalline Transition Studied by Monoenergetic Positron Beams3
Wafer Scratch Pattern Reconstruction for High Diagnosis Accuracy and Yield Optimization3
Call for Nominations for Editor-in-Chief: IEEE Transactions on Semiconductor Manufacturing3
Study on Mechanical Cleavage Mechanism of GaAs via Anisotropic Stress Field and Experiments3
Avalanche Capability Improvement by Optimizing p+ Contact Resistance for N-Channel Trench Power MOSFETs3
Data Visualization of Anomaly Detection in Semiconductor Processing Tools3
Effects of the Applied Power of Remote Plasma System With Green Alternative Chamber Cleaning Gas of Carbonyl Fluoride3
Multi-Scale Adaptive Inspection Framework for Voids in MOSFETs3
Editorial3
An Autoencoder-Based Approach for Fault Detection in Multi-Stage Manufacturing: A Sputter Deposition and Rapid Thermal Processing Case Study3
BCICTS 2022 CALL FOR PAPERS3
Automatic Defect Classification Using Semi-Supervised Learning With Defect Localization2
Joint Dynamic Dispatching and Preventive Maintenance for Unrelated Parallel Machines With Equipment Health Considerations2
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Pioneering Fast and Safe Low-k Silicon Dioxide Synthesis for Modern Integrated Circuits2
Optimization of Void Defects at TiN/Si:HfO2 Interface for 3-D Ferroelectric Memory2
Call for Nominations for Editor-in-Chief: IEEE Transactions on Semiconductor Manufacturing2
Efficient Dual-Attention-Based Knowledge Distillation Network for Unsupervised Wafer Map Anomaly Detection2
Front Cover2
IEEE Transactions on Semiconductor Manufacturing Information for Authors2
Table of Contents2
Quantitative Comparison of Simulation and Experiment Enabling a Lithography Digital Twin2
Front Cover2
Metal Contamination Behavior on Silicon Dioxide Surface Rinsed With Deionized Water Containing Ultra-Trace Metal During Single-Wafer Cleaning2
Modeling and Designing a GaN-Growth Reactor With Halogen-Free Vapor Phase Epitaxy: NH3 Decomposition at the Catalytic Surface of Components to Replicate Parasitic Polycrystal Formation2
Ar/N₂ Gas Flow Rate Dependence on the Ferroelectric HfNₓ Thin Film Formation by ECR-Plasma Sputtering2
A Hierarchical Spatial-Test Attention Network for Explainable Multiple Wafer Bin Maps Classification2
Table of Contents2
Wafer Lot Assignment for Parallel-Producing Tools Based on Heuristic Clustering Algorithm2
A Condition Monitoring Method via a New Signal Expansion Strategy for the Crystal Lifting and Rotating Mechanism2
Automatic Defect Detection in Epitaxial Layers by Micro Photoluminescence Imaging2
A Novel Multiscale Residual Aggregation Network-Based Image Super-Resolution Algorithm for Semiconductor Defect Inspection2
Significant Lifetime Improvement of Negative Bias Thermal Instability by Plasma Enhanced Atomic Layer Deposition SiN in Stress Memorization Technique2
A Real-Time Automatic Structural-Loss Detection and Stopping Rule of Semiconductor Single-Crystal-Silicon-Growth <100> and <111>2
Observation and Suppression of Growth Pits Formed on 4H-SiC Epitaxial Films Grown Using Halide Chemical Vapor Deposition Process2
Iterative Learning-Based Predictive Control Method for Electronic Grade Silicon Single Crystal Batch Process2
Improved Color Defect Detection With Machine Learning for After Develop Inspections in Lithography2
IEEE Transactions on Semiconductor Manufacturing Information for Authors2
Buckling and Stress Controlled RF MEMS Structures Using Annealing2
An Alternative PECVD Chamber Cleaning Gas of COF2 for Low-GWP Consideration2
Data-Driven Coordinated Control of Czochralski Silicon Single Crystal Growth Operation Process Based on Indirect Control Strategy2
Image-Based Defect Classification for TFT-LCD Array via Convolutional Neural Network2
Call for Papers for a Special Issue of IEEE Journal of the Electron Devices Society on "Materials, Processing and Integration for Neuromorphic Devices and In-Memory Computing"2
3-D NAND Oxide/Nitride Tier Stack Thickness and Zonal Measurements With Infrared Metrology2
Feature Extraction From Diffraction Images Using a Spatial Light Modulator in Scatterometry1
A Study on Particle Emission Efficiency of a Plasma Enhanced Chemical Vapor Deposition Chamber During Periodic Cycle Purge Process Using an Improved Single Particle Light Scattering Method1
Call for Papers for RFIC 20231
A Fine-Grained, End-to-End Feature-Scale CMP Modeling Paradigm Based on Fully Convolutional Neural Networks1
Boundless Engineering for Yield to Cope With the Complexity of High-Volume Manufacturing1
Fabrication of the Highly Ordered Silicon Nanocone Array With Sub-5 nm Tip Apex by Tapered Silicon Oxide Mask1
DeePattern: Layout Pattern Generation With Transforming Convolutional Auto-Encoder1
Eco-Friendly Dry-Cleaning and Diagnostics of Silicon Dioxide Deposition Chamber1
Manufacturing of g-C3N4-ZnS-Doped TiO2 Nanofibers by Electrospinning and Their Application to Dye-Sensitized Solar Cell as an Additional Layer in Photoanode1
SnS₂ and ZnO Nanocomposite Prepared by Dispersion Method for Photodetector Application1
Prediction of Highly Imbalanced Semiconductor Chip-Level Defects in Module Tests Using Multimodal Fusion and Logit Adjustment1
Fast and Precise Temperature Control for a Semiconductor Vertical Furnace via Heater-Cooler Integration1
E-Test Validation of Space Error Budget and Metrology1
Sequential Residual Learning for Multistep Processes in Semiconductor Manufacturing1
On Uses of Noise Analysis for the Uncertainty Quantification of Line Edge Roughness Estimation1
Leading Sustainability Applications for More Responsible Logic Technology Development1
Yield Methodology and Heater Process Variation in Phase Change Memory (PCM) Technology for Analog Computing1
ML-Guided Curvilinear OPC: Fast, Accurate, and Manufacturable Curve Correction1
Optimizing Scanning Acoustic Tomography Image Segmentation With Segment Anything Model for Semiconductor Devices1
Autonomous Robot Orchestration Solution for OHT With Active Q Routing and Digital Twin FA: Factory Automation1
Table of Contents1
A Computational Method for Screening Low-GWP Fluorinated Gases in Semiconductor Manufacturing1
Virtual Metrology of Critical Dimensions in Plasma Etch Processes Using Entire Optical Emission Spectrum1
Call for Papers for a Special Issue of IEEE Journal of the Electron Devices Society on "Materials, Processing and Integration for Neuromorphic Devices and In-Memory Computing"1
Plasma Pretreatment System for the Reduction of By-Product Particles in Semiconductor Manufacturing1
Correlated Bayesian Co-Training for Virtual Metrology1
Spatial and Channel-Wise Co-Attention-Based Twin Network System for Inspecting Integrated Circuit Substrate1
Application of Plasma Information-Based Virtual Metrology (PI-VM) for Etching in C₄F₈/Ar/O₂ Plasma1
Integrated Test Pattern Extraction and Generation for Accurate Lithography Modeling1
Practical Q-Learning-Based Route-Guidance and Vehicle Assignment for OHT Systems in Semiconductor Fabs1
The Research on Screening Method to Reduce Chip Test Escapes by Using Multi-Correlation Analysis of Parameters1
Table of Contents1
TAFF-YOLO: An Enhanced YOLO Model With Transformer and Attention Feature Fusion for Chip Internal Defect Detection1
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on Wide Band Gap Semiconductors for Automotive Applications1
Wireless Measurement of the Degradation Rates of Thin Film Bioresorbable Metals Using Reflected Impedance1
Three-Dimensional Flow Analysis and Humidity Level Evaluation for a FOUP During Open Door Operation Conditions1
Watermark Detection in CMOS Image Sensors Using Cosine-Convolutional Semantic Networks1
Use of E-Beam Lithography to Optimize Lithography Patterning on SiC Wafers1
A Case Study on Sputtered Chromium Sacrificial Layer for Ti2O3 Microstructure Fabrication1
Fully Automated Wafer-Level Edge Coupling Measurement System for Silicon Photonics Integrated Circuits1
Process-Aware Digital Twins by Deep Learning for DUV Photolithography and Plasma Etch1
Sustainable Semiconductor Manufacturing: The Role of Lithography1
Virtual Metrology for Etch Profile in Silicon Trench Etching With SF₆/O₂/Ar Plasma1
Optimizing Polysilicon Resistor Fabrication via BF2 + F Co-Implantation: A Manufacturing-Compatible Approach for Low Resistance and High Reliability in MOS Devices1
High Accuracy Simulation of Silicon Oxynitride Film Grown by Plasma Enhanced Chemical Vapor Deposition1
Optimal Cyclic Scheduling of Wafer-Residency-Time-Constrained Dual-Arm Cluster Tools by Configuring Processing Modules and Robot Waiting Time1
High Voltage Design Strategies for Gallium Oxide Power Devices1
Process Control in Semiconductor Manufacturing Based on Deep Distributional Soft Actor-Critic Reinforcement Learning1
IEEE Transactions on Semiconductor Manufacturing Information for Authors1
Integrated Scheduling of Jobs, Tools, Machines, and Two Different Set of Transbots1
Advancing Condition-Based Maintenance in the Semiconductor Industry: Innovations, Challenges and Future Directions for Predictive Maintenance1
A Practical Approach for Managing End-of-Life Systems in Semiconductor Manufacturing Using Health Index1
CPDD: A Cross-Scenario Photovoltaic Defect Detector Based on Fine-Grained Feature Autoencoding and Pseudo-Box Contrastive Learning1
Customer Order Behavior Classification Via Convolutional Neural Networks in the Semiconductor Industry1
Identifying Good-Dice-in-Bad-Neighborhoods Using Artificial Neural Networks0
Simulation and Experimental Analysis of Contactless Chip Pickup Process Based on a Vortex Flow Gripper0
Guest Editorial Special Section on the 2024 SEMI Advanced Semiconductor Manufacturing Conference0
Call for Papers for a Special Issue of IEEE Transactions on Materials for Electron Devices: "Exploration of the Exciting World of Multifunctional Oxide-Based Electronic Devices: From Material to Syste0
Parametric Optimization for Moisture Infiltration Prevention Into a FOUP (Front Opening Unified Pod)0
A Dry Etch Approach To Reduce Roughness and Eliminate Visible Grind Marks in Silicon Wafers Post Back-Grind0
IEEE Transactions on Semiconductor Manufacturing Information for Authors0
The Environmental Footprint of IC Production: Review, Analysis, and Lessons From Historical Trends0
Table of Contents0
IEEE Transactions on Semiconductor Manufacturing Information for Authors0
Shape and Roughness Extraction of Line Gratings by Small Angle X-Ray Scattering: Statistics and Simulations0
A Lightweight Chip-Scale Chemical Mechanical Polishing Model Based on Polynomial Network0
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on Ultrawide Band Gap Semiconductor Devices for RF, Power and Optoelectronic Applications0
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