OOIR: Observatory of International Research

Papers

(The H4-Index of IEEE Transactions on Semiconductor Manufacturing is 17. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-09-01 to 2025-09-01.)

Article	Citations
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Semiconductor Device Modeling for Circuit and System Design"	43
IEEE Transactions on Semiconductor Manufacturing Publication Information	39
Investigations of Fast Vacuum Pump-Down Processes Between Parallel Isothermal Disks	38
Minimization of Particle Deposition on Wafers Caused by the Pressure Change in the Vacuum Chamber Through a Pressure Control Regulation Process	34
Guest Editorial Special Section on the 2022 SEMI Advanced Semiconductor Manufacturing Conference	33
Call for Nominations for Editor-in-Chief: IEEE Electron Device Letters	32
Adaptive Weight Tuning of EWMA Controller via Model-Free Deep Reinforcement Learning	31
Fabrication of Porous Cu–Sn Microbumps for Low-Temperature Cu–Cu Bonding	31
Fast and High-Precision Temperature Control in Semiconductor Vertical Furnace via Iterative Experiments	27
Machine Learning-Based Process-Level Fault Detection and Part-Level Fault Classification in Semiconductor Etch Equipment	23
Defect Reduction and Line Width Roughness Improvement by Using a Post Precoat Treatment in Waferless Chamber Conditioning	23
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications"	22
Call for Papers for IEEE Transactions on Materials for Electron Devices	22
Nondestructive Detection of Buried and Latent Defects by Negative Mode E-Beam Inspection	22
Computational Study of Chemical Uniformity Impacts on Electrodeposition	20
TCAD-Enabled Machine Learning—An Efficient Framework to Build Highly Accurate and Reliable Models for Semiconductor Technology Development and Fabrication	19
The Effect of Purge Flow Rate and Wafer Arrangement on Humidity Invasion Into a Loaded Front Opening Unified Pod (FOUP)	18