OOIR: Observatory of International Research

Papers

(The H4-Index of IEEE Transactions on Semiconductor Manufacturing is 16. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-08-01 to 2026-08-01.)

Article	Citations
Guest Editorial Special Section on the 2022 SEMI Advanced Semiconductor Manufacturing Conference	59
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Semiconductor Device Modeling for Circuit and System Design"	48
IEEE Transactions on Semiconductor Manufacturing Publication Information	41
Call for Nominations for Editor-in-Chief: IEEE Electron Device Letters	37
Fabrication of Porous Cu–Sn Microbumps for Low-Temperature Cu–Cu Bonding	31
Investigations of Fast Vacuum Pump-Down Processes Between Parallel Isothermal Disks	29
Scalable Multi-Site Test Architecture for Chiplet-Based Systems on ATE Platforms	25
Minimization of Particle Deposition on Wafers Caused by the Pressure Change in the Vacuum Chamber Through a Pressure Control Regulation Process	24
Fast and High-Precision Temperature Control in Semiconductor Vertical Furnace via Iterative Experiments	23
High-precision Acoustic Image Reconstruction for Uneven Surfaces using a YOLO-based Approach	21
Defect Reduction and Line Width Roughness Improvement by Using a Post Precoat Treatment in Waferless Chamber Conditioning	20
Adaptive Weight Tuning of EWMA Controller via Model-Free Deep Reinforcement Learning	20
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications"	17
Editorial	17
Call for Papers for IEEE Transactions on Materials for Electron Devices	17
Mitigation of Dopant Deactivation in Heavily Phosphorus-doped Silicon via Nitrogen Co-implantation	17
Grain Morphology Effects on Void Formation and Electromigration-Induced Failure in Copper Interconnects	16
Run-to-run control of chemical mechanical polishing head with adjustable partition pressure based on deep reinforcement learning	16
Nondestructive Detection of Buried and Latent Defects by Negative Mode E-Beam Inspection	16
Single-Mask Fabrication of Sharp SiO_x Nanocones	16