Microelectronics Reliability

Article	Citations
Multistate time lag dynamic Bayesian networks model for reliability prediction of smart meters	63
Elucidating the large variation in ion diffusivity of microelectronic packaging materials	52
Reliability assessment of miniaturised electromechanical RF relays for space applications	50
New reliability model for power SiC MOSFET technologies under static and dynamic gate stress	41
Investigation of the role of pre-existing oxide in the initial degradation mechanism in AlGaN/GaN HEMTs under ON-state stress	40
A novel in-situ approach to monitor the variations in the on-resistance of power transistors during switching operation	39
Laser voltage probing and simulation of a flip-flop with undesired quasi-static switching	38
Study on annealing effect of bipolar transistors at different temperatures after total dose irradiation	37
Editorial Board	36
Failure analysis on capacitor failures using simple circuit edit passive voltage contrast method	34
Boosting the thermal stability of paralleled GaAs HBTs through temperature-dependent ballasting resistors: A proof-of-concept study	33
Electrical deterioration of 4H-SiC MOS capacitors due to bulk and interface traps induced by proton irradiation	32
Theoretical investigation of NBTI in P-LDMOS transistors using the four-state NMP model	32
Investigating the solder mask defects impact on leakage current on PCB under condensing humidity conditions	32
Modeling of the impact of mechanical stress resulted from wafer probing and wire bonding on circuit under pad	31
Design optimization of a packaged thermoelectric generator for electrically active implants	31
Effect of solder junction void variation in power semiconductor package on power cycle lifetime	29
Single event burnout failures caused in silicon and silicon carbide power devices by single alpha particles emitted from radioactive nuclides	29
Breakdown voltage and TDDB performance improvement by optimizing the PECVD dielectric film characteristics in MIM capacitors	29
Influence of cooling conditions on the estimated power cycling lifetime of a large-area substrate solder joint in power modules	29
Current balancing of parallel-connected silicon carbide (SiC) MOSFET power devices using peak detection via PCB sensors	29
Impacts and mitigation strategies of process-induced packaging defects for enhancing reliability of power devices	29
Calibration methods and power cycling of double-side cooled SiC MOSFET power modules	28
Evaluating switch lifetime in soft-switched single-stage differential-mode SST	28
A physics-based electromigration model for advanced interconnects	27

High temperature reliability of pressureless sintered Cu joints for power SiC die attachment	27
Aging investigation of the latest standard dual power modules using improved interconnect technologies by power cycling test	26
Effect of microstructural variability on fatigue simulations of solder joints	26
Thermal reliability of 2D materials integrated with silicon-based CMOS ICs and analysis under complex conditions	25
A remaining useful life prediction method of aluminum electrolytic capacitor based on wiener process and similarity measurement	25
Microstructure evolution and mechanical behavior of copper through‑silicon via structure under thermal cyclic loading	24
The characterization of low-k thin films and their fracture analysis in a WLCSP device	24
Simulation assessment of solder joint reliability for fully assembled printed circuit boards	23
DC and RF/analog performances of split source horizontal pocket and hetero stack TFETs considering interface trap charges: A simulation study	23
Correlative multimodal imaging and targeted lasering for automated high-precision IC decapsulation	23
DNN-based error level prediction for reducing read latency in 3D NAND flash memory	23
Impact of proton-induced total ionizing dose effects on electrical characteristics and safe operating area of trench field-stop IGBT devices	22
Investigation on the microstructure, mechanical properties and chlorine resistance of fine aluminum alloy wires	22
Editorial Board	22
Editorial Board	22
Thermal-mechanical analysis of copper pillar pitch size during reflow soldering assembly process	22
Tilt- and warpage measurement as inline quality assessment tool	22
Interface traps in the sub-3 nm technology node: A comprehensive analysis and benchmarking of negative capacitance FinFET and nanosheet FETs - A reliability perspective from device to circuit level	22
Comprehensive study of hot-carrier stress in n-type logic CMOS devices at temperatures down to the deep-cryogenic regime	21
Degradation modeling considering multiple performance parameters degradation based on mixed effects models	21
Numerical modeling of FS-trench IGBTs by TCAD and its parameter extraction method	21
Influence mechanism of solder aging and thermal network model optimization of multi-chip IGBT modules	21
Mission profile-based digital twin framework using functional mock-up interfaces for assessing system's degradation behaviour	21
Investigation of electromagnetic force effect in IGBT modules	20
Ultra-fast recovery transients in GaN MIS-HEMT submitted to OFF-state stress	20
Comparison of multiple AI models for failure classification in smart plug top case study	20
Theoretical performance and reliability optimization of graphene based electrically doped tunnel FET under interface trap charge constraints: A device-level approach	19
Micro-Raman and SEM analyses of failed GaN HEMT multilayer architecture	19
Method for geometric correction of indentation hardness on curved surfaces: Implications for solder joint structures	18
Effect of Sb content on the phase structure and interface structure of Sn1.0Ag0.5Cu lead-free solder	18
Sintering of mixed Cu Ag nanoparticles pretreated by formic acid vapor for Cu Cu low temperature bonding	18
In-field test solution for enhancing safety in automotive applications	18
Prognosis of LED lumen degradation using Bayesian optimized neural network approach	18
A BiLSTM-based digital twin model for photovoltaic strings under current mismatch condition	18
Condition monitoring for detection of humidity-induced failures in control electronics of power converters	18
Performance assessment and RUL prediction of power converters under the multiple components degradation	17
Evaluation of SEU impact on convolutional neural networks based on BRAM and CRAM in FPGAs	17
High-reliability level shifter with self-adaptive noise immunity for GaN devices	17
Thermal-mechanical reliability enhancement of thermal interface material in lidded FCBGA packaging via SVR-based coverage degradation prediction	17
Failure degradation similarities on power SiC MOSFET devices submitted to short-circuit stress and accelerated switching conditions	17
Impact of dynamic gate bias on dynamic reverse bias degradation and failure of 1.2 kV SiC MOSFETs	17
Self-healing solder joints in power electronics: Experimental validation of die-attach void effects on reliability	17
Evaluation of the helium hermeticity reliability of copper through-glass vias	17
Editorial Board	17
Non-destructive fault diagnosis of electronic interconnects by learning signal patterns of reflection coefficient in the frequency domain	16
An efficient structure to improve the reliability of deep neural networks on ARMs	16
Effects of the hardness and roughness on the plastic deformation properties of electroplated gold bumps during thermocompression bonding	16
Investigation on vibration induced fretting in degraded contact interface	16
Compatibility study of no-clean flux residue and conformal coatings using two electrode electrochemical impedance method	16
Interlayer capacitance extraction for profiling interface states in LaB₆/H-diamond Schottky diodes	16

Impact of aging on temperature measurements performed using a resistive temperature sensor with sensor-to-microcontroller direct interface	16
A quantitative analysis and testing assessment method for functional damage state of electronic circuits under impact loads	16
Accuracy estimation of low-current voltage drop method for junction temperature monitoring under DC power cycling	16
Advanced fluxes for low-temperature copper-aluminum microjoining: Mechanisms and design	16
Cluster-aware allocation of spare TSVs for enhanced reliability in 3D ICs	16
Exploring the radiant impact of irradiance on the electrical resistance of organic thin film	15
Detailed total ionizing dose effects on LDMOS transistors	15
Composite powders with carbon nanotubes for laser printing of electronics	15
Crosstalk optimization and gate oxide reliability analysis in intercalation doped MLGNR with reduced vertical thickness	15
Effect of load sequence interaction for low ∆T's on the reliability of bonded aluminum wires in IGBTs	15
Multi-objective optimal design of thermal-vibration stress and return loss of TSV interconnect structures based on response surface-NSWOA optimization algorithm	15
New temperature-independent aging indicator for power semiconductor devices – Application to IGBTs	15
Enhanced reliability of phosphor-converted white light-emitting diodes based on a laser-cured silicone encapsulant layer	15
Long-term (8000 h) reliability and failures of high-power LEDs for outdoor lighting stressed at high ambient temperatures	15
Application of deuterium oxide (D2O) isotope tracing technique for encapsulated QFN failure analysis	14
Amalgam illogical controller design using amended moth system for heat reduction in insulated gate bipolar transistor	14
NSFET performance optimization through SiGe channel design - A simulation study	14
Design of an energy-efficient soft error resilient RHBD SRAM cell with high read stability and minimum write errors	14
Experiments, constitutive modeling, and simulations on the creep behavior of the AgSn transient liquid phase metallic bonds	14
Comparative analysis of mechanical and thermal stresses in ITO and AZO thin films on flexible PET substrates for flexible electronic applications	14
Editorial Board	14
Methodology of backside preparation applied on a MRAM to lead a logical investigation with a near-field probe	14
DC and RF aging test of AlGaN/GaN HEMT technology on SiC substrate	14
Physics-informed Markov chains for remaining useful life prediction of wire bonds in power electronic modules	14
Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging	14
Performance investigation and impact of trap charges on novel lateral dual gate oxide-bilateral tunnelling based field effect transistor	14
Accelerated lifetime estimation and failure analysis of micromachined humidity sensors under high temperature and high humidity conditions	14
Microstructure and diffusion mechanisms in nano-Cu sintered joints during aging: Effects of joint size, porosity, and aging atmosphere	14
Underfill material property dependence of lifetime and mechanical behavior of BGA package: EBSD and FEM investigations	13
Dynamic wetting and spreading mechanisms of SAC305 with added Au elements in the laser jet weld ball bonding process	13
Optimization of the drain-side configuration in ESD-protection SCR-LDMOS for high holding-voltage applications	13
Lifetime evaluation of wire bonds in LED systems by modeling and accelerated testing	13
Local stress distribution in sintered nanoporous silver films under mechanical and thermal loading	13
Accurate and efficient simulation of PCB warpage during manufacturing processes using partitioned equivalent model	13
Design of gate drive voltage for SiC MOSFETs considering gate oxide TDDB lifetime and performance	13
Optical, electrical, and mechanical reliability of 1700 PPI Micro-LED device	13
Testing and simulation of lifetime for wire bond interconnections with varying bond foot angle	13
Research on equivalent modeling and model testing verification methods for material mechanics parameters of TXV structure	13
On the sizing of PV inverters with reactive power capability to regulate power factor: A reliability approach	13
Electrical characterization and temperature reliability of 4H-SiC Schottky barrier diodes after Electron radiation	13
An FPGA-based architecture for time-resolved polarization probing of FeRAM fatigue	13
Design of compact-diode-SCR with low-trigger voltage for full-chip ESD protection	13
Uncertainty quantification in microelectronic packaging using feedback-enhanced adaptive polynomial chaos expansion	13
High-performance cascode Schmitt-Trigger and C-element based triple node upset radiation hardened latch	13
High-power microwave pulse induced failure on InGaP/GaAs heterojunction bipolar transistor	13
Characterization of a novel radiation hardened by design (RHD14) bit-cell based on 20-nm FinFET technology using TCAD simulations	13
Editorial Board	13
Evaluation of the impact of defects on threshold voltage drift employing SiO2 pMOS transistors	12
Long-term capacitance variation characteristics, law extraction, single and collaborative prediction of film capacitors at room temperature and humidity	12
Research on ESD failure voltage model of the T-shaped wiring structure in GOA products	12
Influence of LDD spacers on total ionizing dose response of the transconductance for bulk MOSFETs working at cryogenic temperatures	12
Effect of Ag addition on the microstructure and distribution of second-phase particles in tin-based solder alloys	12
A high-efficiency aging test with new data processing method for semiconductor device	12
Electrothermal power cycling of GaN and SiC cascode devices	12
A PMOS-embedded low-voltage triggered silicon controlled rectifier ESD protection device for 3.3V I/O application	12
Material level analytical model of total ionizing dose induced DC characteristics shift for FDSOI IC design	12
An Eigendecomposition-based dynamic characteristics design method of three-phase grid-connected inverters with considering reliability	12
Physics-of-failure based lifetime modelling for SiC based automotive power modules using rate- and temperature-dependent modelling of sintered silver	12
Large area bare Cu-Cu interconnection using micro-Cu paste at different sintering temperatures and pressures	12
ESD Human Body Model step stress distributions of GaN HEMTs and the correlation with one level test results	12
Editorial Board	12
Software-controlled pipeline parity in GPU architectures for error detection	12
Failure rate analysis of radiation tolerant design techniques on SRAM-based FPGAs	12
Structural optimization design of LTCC substrate and their impacts on thermal performances of system-in-package	11
Aging modelling of Li-ion battery systems based on accelerated tests	11
Effect of addition carbon nanotubes (MWCNTs) on the microstructure, mechanical properties and wetting of nanocomposites Sn-Bi/MWCNTs solder alloys	11
Terminal strength test of TO-220 packaged Schottky barrier diode using finite element method	11
Calibration and efficient evaluation of electromigration lifetime for interconnect wire sizing of multi-port networks	11
Editorial Board	11
Reinforcement learning-based weighting factors auto-tuning for thermal management in assembled inverters	11
The thickness and width of the intrinsic region effected electrical properties of GaAs p-i-n photodiodes	11
Optimization and reliability of ultrasonic wedge bonding performance of copper wires on gold pads for MEMS devices	11
Thermal-mechanical co-design and optimization of 2.5D chiplet integration	11
Non-volatile SRAM based on emerging memory: A comprehensive review and reliability challenges	11
Failure mechanism and life estimate of metallized film capacitor under high temperature and humidity	11
Evaluation of bonding techniques for ultrasound transducers	11
Radiation effect in FD-SOI nanowire FETs due to high dose rate gamma-ray under variable irradiation temperatures	11
An online junction temperature detection circuit for SiC MOSFETs considering threshold voltage drift compensation	11
The effect of Si3N4/Al2O3 stacked structure of AlGaN/GaN HEMTs	11
A shared page-aware machine learning assisted method for predicting and improving multi-level cell NAND flash memory life expectancy	11

Enhanced gate biasing resilience in asymmetric and double trench SiC MOSFETs towards generalized highly reliable power electronics	11
Design of high failure current embedded dual direction SCR with segmented topology for high-voltage ESD protection	11
Multi-board parallel irradiation testing of neutron-induced soft errors in 16 nm FinFET and 22 nm planar FPGAs	11
Thermal reliability of Cu sintering joints for high-temperature die attach	11
Thermomechanical model of an oxide-confined GaAs-based VCSEL emitter	10
Influence of electron beam irradiation induced charging-effect on nanoprobing localization of a crystal defect in MOSFET	10
Assessing thermal resistance as a degradation metric for solder bump arrays in discrete SiC MOSFET packages	10
BP neural network for non-invasive IGBT junction temperature online detection	10
Experimental analysis on stochastic behavior of preswitching time in STT-MRAM	10
Observation framework of errors in microprocessors with machine learning location inference of radiation-induced faults	10
Advanced power cycling test strategies on discrete SiC MOSFETs in different operating modes and the impact on lifetime	10
Aggravated NBTI reliability due to hard-to-detect open defects	10
Influence of normal load, electric current and sliding speed on tribological performance of electrical contact interface	10
Towards development of an intelligent failure analysis system based on infrared thermography	10
Hybrid domain-based fast transient thermal evaluation method for power semiconductor modules in EV motor drive	10
Experimental study of transient dose rate effect on radiation-hardened digital signal processor	10
Epitaxial hillocks defects caused by subsurface damage from InAs substrate	10
Micro-additives and their impact on tensile and fracture performance of solder	10
Exploring the fracture mechanism of multilayer ceramic capacitors via combined simulation and experiment	10
Orbital validation for tin whisker suppression by conformal coating	10
Thermal cycling reliability of electronic components in bolted assemblies: A study of the influence of bolt position	10
Isolation properties and failure mechanisms of vertical Pt / n-GaN SBDs	10
Prediction of the electrochemical migration induced failure on power PCBs under humidity condition — A case study	10
A non-volatile and radiation-hardened SRAM based on fourteen transistors and two perpendicular anisotropy magnetic tunnel junctions	10
Characteristics and avalanche investigation of SiC VDMOSFETs with enhanced P-Based implantation	10
A review on warpage measurement metrologies for advanced electronic packaging	9
Single event burnout of SiC MOSFET induced by atmospheric neutrons	9
Effect of gate oxide thickness on gate latent damage induced by heavy ion in SiC power MOSFETs	9
Facile polyol synthesis of thermally stable AgNi composite nanowires for flexible transparent heater applications	9
Wavelet-based rapid identification of IGBT switch breakdown in voltage source converter	9
Thermal-optical coupled reliability for micro-LED projection systems: Mechanistic modeling and parametric analysis	9
Editorial Board	9
Morphological characterization of 325 mesh-grinding-induced defects on silicon wafer surface	9
Time-dependent statistical NBTI model for aging assessment in circuit level implemented with open model interface	9
Reduced-order model for solder balls – Potential of projection-based approaches for representing viscoplastic behavior	9
Microelectronics Reliability: Publisher’s note	9
Design of soft error correction flip-flop cells for highly reliable applications	9
Fault-tolerant multiplier using self-healing technique	9
Vulcanization failure mechanism analysis of lead-frame LED package	9
Origin of trap assisted tunnelling in ammonia annealed SiC trench MOSFETs	9
Reliability-oriented electro-thermal testing of early electromigration degradation in 3D power chiplet architectures for automotive inverters	9
Revisiting the effectiveness of diamond heat spreaders on multi-finger gate GaN HEMT using chip-to-package-level thermal simulation	9
System in package: Advanced FA techniques to minimize analysis time and cost	9
Squeeze-out and bond strength of patterned Cu Sn SLID seal-frames	9
Changes in the extraction and collection efficiency of GaN-based MQW solar cells under optical step-stress	9
Comprehensive investigation on different ions of geostationary orbit induced single event burnout in GaN HEMT power devices	9
An informer network-based circuit boards fault detection method using infrared temperature series	9
OFF-state breakdown and threshold voltage stability of vertical GaN-on-Si trench MOSFETs	9
Crack propagation in ultrasonic-bonded copper wires investigated by power cycling and accelerated mechanical fatigue interconnection test methods	9
Effect of the load inductor on the avalanche ruggedness of 1200-volt silicon diodes during unclamped inductive switching	9
Toward stable FeFET multi-level cell operations using novel weight freezing methodology with recovery cycling scheme for neuromorphic applications	9
Editorial Board	9
Influence of Interface Traps on MOSFET thermal coefficients and its effects on the ZTC current	9
New methodology for optimal preconditioning of GaN HEMT devices	9
Implementation of high failure current Schottky-embedded DDSCR	9
Degradation modeling of InGaAs/InP avalanche photodiodes using calibrated technology computer-aided design	9
Fault and self-repair for high reliability in die-to-die interconnection of 2.5D/3D IC	9
Cost-effective reliability enhancement for video stitching applications based on error-tolerance	8
Analysis of the stress state in QFN package during four point bending and temperature experiments utilizing piezoresistive stress sensor	8
Error correction improvement based on weak-bit-flipping for resistive memories	8
Long-term positive and negative gate bias stress tests on parallel connected SiC MOSFETs at −40 °C and 175 °C	8
Using X-ray imaging for the study of crack development in solder reliability testing	8
Coupled dual-parameter wiener degradation modeling of IGBTs for remaining useful life prediction	8
Effects of multi-factors on the junction temperature of LED automotive lamp chips	8
A screening test of GaN-HEMTs for improvement of breakdown voltage uniformity	8
Design and power optimization of a QCA-based universal reversible logic gate architecture using cell interaction approach	8
Electro-thermal stress minimisation of motor-drive inverter switches by hybrid modulation strategy technique	8
Dynamic EFI and circuit analysis case studies on integrated circuit buried via void defects	8
Single event effects hardening in SiC double-trench MOSFETs	8
Electrical properties and application stability of the effects of La2O3 doping RuO2-CuO based resistive pastes with near-linear positive TCR	8
Humidity related failure mechanism of IGBTs considering dynamic avalanche	8
Thermal and electrical characterization of flexible microheaters: Influence of material choice and geometry	8
Impact of neutron irradiation on SiC power MOSFETs after stress tests qualification	8
Editorial Board	8
A survey on two-dimensional Error Correction Codes applied to fault-tolerant systems	8
Two-step sub-modeling framework for thermomechanical fatigue analysis of solder joints in DRAM module	8
Analysis of the transient dose rate effect on clock resources of JXCV5SX95T FPGA	8
The behaviour of 350 V GaN HEMTs during heavy ion irradiations	8
Fatigue performance and microstructure of lead-free solder joints in BGA assembly at room temperature	8
Reliability analysis of the intricacies of interfacial trap charges in HD-VS-FeFinFET and its applicability as CMOS inverter	8
Improvement of sensitivity for power cycle degradation by a new device structure	8
Editorial Board	8
Improvement in bond wire reliability by adjustments in bond wire microstructure via heat treatment	8
Evidence of resistive switching in SiNx thin films for MEMS capacitors: The role of metal contacts	8
Warpage measurements to support the development of mmWave modules	8
TID evaluation based on variabilities of space radiation and device failure dose in typical navigation satellite orbits	8
Preliminary 2D elastoplastic modeling of gate cracking in SiC MOSFETs under short-circuit conditions across a wide temperature-range using rankine's damage energetic approach	8
Failure mechanism of 4H-SiC junction barrier Schottky diodes under harsh thermal cycling stress	8
Thermo–vibration coupled reliability methodology of BGA solder joints considering the preload effect of heat sink bolts	8
Reliability estimation of complex systems based on a Wiener process with random effects and D-vine copulas	8
Sixer: A low-overhead, fully-distributed test scheme with guaranteed delivery of packets in networks-on-chip	8
Development of eutectic gallium-indium-based transparent conductive electrodes on flexible substrates for touch sensor integration	8
Charge deposition analysis of heavy-ion-induced single-event burnout in low-voltage power VDMOSFET	8
Editorial Board	8
Reliability assessment of graphene channel vertical TFET: Role of trap-assisted tunneling	8