Microelectronics Reliability

Article	Citations
Lithium-ion battery performance degradation evaluation in dynamic operating conditions based on a digital twin model	61
A lithium-ion battery remaining useful life prediction method based on the incremental capacity analysis and Gaussian process regression	59
Thermal performance of heat sink using nano-enhanced phase change material (NePCM) for cooling of electronic components	56
Soft errors in DNN accelerators: A comprehensive review	53
A comparative study of thermal fatigue life of Eutectic Sn-Bi, Hybrid Sn-Bi/SAC and SAC solder alloy BGAs	49
Development of low temperature Cu Cu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)	42
Challenges to overcome breakdown limitations in lateral β-Ga2O3 MOSFET devices	32
Flip Chip integration of ultra-thinned dies in low-cost flexible printed electronics; the effects of die thickness, encapsulation and conductive adhesives	29
Surge current capability of ultra-wide-bandgap Ga2O3 Schottky diodes	27
Lithium-ion battery SoH estimation based on incremental capacity peak tracking at several current levels for online application	26
Ultrasonic monitoring performance degradation of lithium ion battery	25
Gate-switching-stress test: Electrical parameter stability of SiC MOSFETs in switching operation	24
DC and RF/analog performances of split source horizontal pocket and hetero stack TFETs considering interface trap charges: A simulation study	23
Effect of critical properties of epoxy molding compound on warpage prediction: A critical review	22
An interpretable remaining useful life prediction scheme of lithium-ion battery considering capacity regeneration	22
Constituents and performance of no-clean flux for electronic solder	21
Accelerative reliability tests for Sn3.0Ag0.5Cu solder joints under thermal cycling coupling with current stressing	21
A simulation-based analysis of effect of interface trap charges on dc and analog/HF performances of dielectric pocket SOI-Tunnel FET	21
A survey of the structure, fabrication, and characterization of advanced organic light emitting diodes	20
An improved lifetime prediction method for metallized film capacitor considering harmonics and degradation process	20
IGBT aging monitoring and remaining lifetime prediction based on long short-term memory (LSTM) networks	20
Impact of interface trap charges on electrical performance characteristics of a source pocket engineered Ge/Si heterojunction vertical TFET with HfO2/Al2O3 laterally stacked gate oxide	20
Improved deep learning based telemetry data anomaly detection to enhance spacecraft operation reliability	20
Experimental analysis on estimating junction temperature and service life of high power LED array	19
Heavy-ion induced single event effects and latent damages in SiC power MOSFETs	19

Thermal stress reduction strategy for high-temperature power electronics with Ag sintering	19
Constructal design for the layout of multi-chip module based on thermal-flow-stress coupling calculation	19
Stress/strain characterization in electronic packaging by micro-Raman spectroscopy: A review	19
The investigation of current condition mechanism of Al/Y2O3/p-Si Schottky barrier diodes in wide range temperature and illuminate	19
Accelerated aging test for gate-oxide degradation in SiC MOSFETs for condition monitoring	18
Study on high power microwave nonlinear effects and degradation characteristics of C-band low noise amplifier	18
Hydrothermal growth method for the deposition of ZnO films: Structural, chemical and optical studies	18
Ionizing radiation damage in 65 nm CMOS technology: Influence of geometry, bias and temperature at ultra-high doses	18
Design of low power, variation tolerant single bitline 9T SRAM cell in 16-nm technology in subthreshold region	17
Design optimization of multi-resonant piezoelectric energy harvesters	17
Reliability analysis of a fault-tolerant RISC-V system-on-chip	16
Ionizing radiation hardness tests of GaN HEMTs for harsh environments	16
Ab initio investigations in amorphous silicon dioxide: Proposing a multi-state defect model for electron and hole capture	16
From early microstructural evolution to intergranular crack propagation in SAC solders under thermomechanical fatigue	16
Prediction of IGBT junction temperature using improved cuckoo search-based extreme learning machine	16
Deep learning-based image analysis framework for hardware assurance of digital integrated circuits	16
Separation of electron and hole trapping components of PBTI in SiON nMOS transistors	16
Power cycling failure analysis of double side cooled IGBT modules for automotive applications	15
A physical lifetime prediction methodology for IGBT module by explicit emulation of solder layer degradation	15
An SEU-hardened ternary SRAM design based on efficient ternary C-elements using CNTFET technology	15
A low cost fault-attack resilient AES for IoT applications	15
Fault diagnosis of cracks in crystalline silicon photovoltaic modules through I-V curve	15
Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components	15
Recent review on failures in silicon carbide power MOSFETs	15
Positive and negative charge trapping GaN HEMTs: Interplay between thermal emission and transport-limited processes	15
Effects of bismuth additions on mechanical property and microstructure of SAC-Bi solder joint under current stressing	14
Investigation of critical factors effect to predict leakage current and time to failure due to ECM on PCB under humidity	14
Prediction of solar particle events with SRAM-based soft error rate monitor and supervised machine learning	14
Thermal fatigue analysis of gold wire bonding solder joints in MEMS pressure sensors by thermal cycling tests	14
Inkjet-printed HF antenna made on PET substrate	14
Performance prediction of current-voltage characteristics of Schottky diodes at low temperatures using artificial intelligence	14
Interfacial trap charge and self-heating effect based reliability analysis of a Dual-Drain Vertical Tunnel FET	14
Reliability of automotive and consumer MEMS sensors - An overview	14
Combined experimental-FEM investigation of electrical ruggedness in double-sided cooled power modules	14
A reliability evaluation method for multi-performance degradation products based on the Wiener process and Copula function	13
Reliability assessment on 16 nm ultrascale+ MPSoC using fault injection and fault tree analysis	13
Machine learning for board-level drop response of BGA packaging structure	13
Investigations of short-circuit failure in double trench SiC MOSFETs through three-dimensional electro-thermal-mechanical stress analysis	13
Threading dislocations in GaN high-voltage switches	13
Lock-V: A heterogeneous fault tolerance architecture based on Arm and RISC-V	13
Investigation of microstructure, thermal properties, and mechanical performances of Ni-added Sn-5.0Sb-0.5Cu/Cu solder joints	13
Influence of microstructure inhomogeneity on the current density and temperature gradient in microscale line-type Sn58Bi solder joints under current stressing	13
Failure mechanism and life estimate of metallized film capacitor under high temperature and humidity	13
A 3-D thermal network model for the temperature monitoring of thermal grease as interface material	13
Novel lockstep-based fault mitigation approach for SoCs with roll-back and roll-forward recovery	13
Understanding and eliminating thermo-mechanically induced radial cracks in fully metallized through-glass via (TGV) substrates	13
Electromigration in solder joints: A cross-sectioned model system for real-time observation	13
OFF-state trapping phenomena in GaN HEMTs: Interplay between gate trapping, acceptor ionization and positive charge redistribution	13
Evaluation of thermomechanical fatigue lifetime of BGA lead-free solder joints and impact of isothermal aging	13
Experimental characterization of rolled annealed copper film used in flexible printed circuit boards: Identification of the elastic-plastic and low-cycle fatigue behaviors	13

Molecular dynamic study for concentration-dependent volume relaxation of vacancy	13
Analysis of the aging mechanism occurring at the bond-wire contact of IGBT power devices during power cycling	13
A numerical study on the effect of the fixation methods on the vibration fatigue of electronic packages	13
Low actuation voltage cantilever-type RF-MEMS shunt switches for 5G applications	13
Effects of anisotropy on the reliability of TSV microstructure	12
Tensile characterization and constitutive modeling of sintered nano-silver particles over a range of strain rates and temperatures	12
A novel Bayesian multivariate linear regression model for online state-of-health estimation of Lithium-ion battery using multiple health indicators	12
Improved HV-H3TRB robustness of a 1700 V IGBT chip set in standard power modules	12
Microstructure and mechanical behavior of SnBi-xAg and SnBi-xAg@P-Cu solder joints during isothermal aging	12
Gate-damage accumulation and off-line recovery in SiC power MOSFETs with soft short-circuit failure mode	12
Impact of inter-metallic compound thickness on thermo-mechanical reliability of solder joints in solar cell assembly	12
A humidity-induced novel failure mechanism in power semiconductor diodes	12
Fault diagnosis of PID in crystalline silicon photovoltaic modules through I-V curve	11
Vertical GaN devices: Process and reliability	11
Time-dependent dielectric breakdown of gate oxide on 4H-SiC with different oxidation processes	11
Gate leakage current sensing for in situ temperature monitoring of p-GaN gate HEMTs	11
Three-parameter Weibull distribution with upper limit applicable in reliability studies and materials testing	11
Wafer defect pattern classification with detecting out-of-distribution	11
Role of the AlGaN barrier on the long-term gate reliability of power HEMTs with p-GaN gate	11
Thermal analysis of the design parameters of a QFN package soldered on a PCB using a simulation approach	11
Improving the reliability of SRAM-based PUFs under varying operation conditions and aging degradation	11
Temperature-dependent electrical characteristics of neutron-irradiated GaN Schottky barrier diodes	11
Finite element method modeling of temperature gradient-induced Cu atomic thermomigration in Cu/Sn/Cu micro solder joint	11
Microstructure, resistivity, and shear strength of electrically conductive adhesives made of silver-coated copper powder	11
Multiple failure mode identification of SiC planar MOSFETs in short-circuit operation	11
Accumulative total ionizing dose (TID) and transient dose rate (TDR) effects on planar and vertical ferroelectric tunneling-field-effect-transistors (TFET)	11
In-situ temperature-dependent characterization of copper through glass via (TGV)	11
Shear strength and fracture analysis of Sn-9Zn-2.5Bi-1.5In and Sn-3.0Ag-0.5Cu pastes with Cu-substrate joints under different reflow times	11
A remaining useful life prediction method of aluminum electrolytic capacitor based on wiener process and similarity measurement	11
Reliability assessment of film capacitors oriented by dependent and nonlinear degradation considering three-source uncertainties	10
Reliability based design optimization applied to the high electron mobility transistor (HEMT)	10
Dielectric investigation of In4Se96-xSx semiconductor: Relaxation and conduction mechanism	10
Exploration of gate trench module for vertical GaN devices	10
Improving GPU register file reliability with a comprehensive ISA extension	10
Self-healing behaviors of metallized high-temperature dielectric films for capacitor applications	10
IGBT reliability analysis of photovoltaic inverter with reactive power output capability	10
High-level fault injection to assess FMEA on critical systems	10
UIS performance and ruggedness of stand-alone and cascode SiC JFETs	10
Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization	10
A Π-shaped p-GaN HEMT for reliable enhancement mode operation	10
Modeling and fault diagnosis of multi-phase winding inter-turn short circuit for five-phase PMSM based on improved trust region	10
A triple-node upset self-healing latch for high speed and robust operation in radiation-prone harsh-environment	10
A high-efficiency aging test with new data processing method for semiconductor device	10
Multiscale warpage behaviour in a Fan-Out Panel during thermal cycles	10
Effect of aging time and loading rate on fracture behavior of Cu/Sn-0.7Cu solder joints	10
A lifetime assessment and prediction method for large area solder joints	10
Effect of temperature on the low cycle fatigue properties of BGA solder joints	10
Aging investigation of the latest standard dual power modules using improved interconnect technologies by power cycling test	10
CNN weight sharing based on a fast accuracy estimation metric	10
Real-time estimation of junction temperature in IGBT inverter with a simple parameterized power loss model	10
Online junction temperature estimation using integrated NTC thermistor in IGBT modules for PMSM drives	10
On the analysis of radiation-induced failures in the AXI interconnect module	9
Analytical modeling of thermo-mechanical stress for bond wire of IGBT module	9
Comparisons of SnO2 gas sensor degradation under elevated storage and working conditions	9
Investigation of hygrothermally induced failures in multilayer ceramic capacitors during thermal reflow process	9
Study on the influence of fretting wear on electrical performance of SMA connector	9
Design optimization of a miniaturized thermoelectric generator via parametric model order reduction	9
Impact of unpreventable induced interface trapped charges on HZO based FDSOI NCFET	9
Remaining useful life prediction in embedded systems using an online auto-updated machine learning based modeling	9
Crack identification and evaluation in BEoL stacks of two different samples utilizing acoustic emission testing and nano X-ray computed tomography	9
Reliability analysis and condition monitoring of SAC+ solder joints under high thermomechanical stress conditions using neuronal networks	9
Equivalent circuits for electromigration	9
A novel on-wafer approach to test the stability of GaN-based devices in hard switching conditions: Study of hot-electron effects	9
Fatigue crack evolution and effect analysis of Ag sintering die-attachment in SiC power devices under power cycling based on phase-field simulation	9
Parametric system-level models for position-control of novel electromagnetic free flight microactuator	9
Experimental and simulative study of warpage behavior for fan-out wafer-level packaging	9
Numerical simulation of reliability of 2.5D/3D package interconnect structure under temperature cyclic load	9
Evaluating the soft error sensitivity of a GPU-based SoC for matrix multiplication	9
Influence of post-bonding heating process on the long-term reliability of Cu/Al contact	9
Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi	9
A method to extract lumped thermal networks of capacitors for reliability oriented design	9
The impact of mission profile on system level reliability of cascaded H-bridge multilevel PV inverter	9
Physical security of deep learning on edge devices: Comprehensive evaluation of fault injection attack vectors	9
Hot-Carrier degradation in P- and N-channel EDMOS for smart power application	9
Measurement and simulation of short circuit current sharing under parallel connection: SiC MOSFETs and SiC Cascode JFETs	9
Effects of multi-cracks and thermal-mechanical coupled load on the TSV reliability	9
A methodology to calculate the equivalent static loading for simulating electronic assemblies under impact	9
Power cycling tests under driving ΔTj = 125 °C on the Cu clip bonded EV power module	9
Passivation-layer thickness and field-plate optimization to obtain high breakdown voltage in AlGaN/GaN HEMTs with short gate-to-drain distance	9
Accelerated aging for gate oxide of SiC MOSFETs under continuous switching conditions by applying advanced HTGB test	9

A power transfer model-based method for lithium-ion battery discharge time prediction of electric rotatory-wing UAV	9
Gate drive circuit for current balancing of parallel-connected SiC-JFETs under avalanche mode	9
The influence of the vibration test mode on the failure rate of electrical connectors	9
Degradation mechanisms-based reliability modeling for metallized film capacitors under temperature and voltage stresses	8
Capture and emission time map to investigate the positive VTH shift in p-GaN power HEMTs	8
Physics of failure based lifetime modelling for sintered silver die attach in power electronics: Accelerated stress testing by isothermal bending and thermal shock in comparison	8
Comphy v3.0—A compact-physics framework for modeling charge trapping related reliability phenomena in MOS devices	8
Transformation of reflow solder flux residue under humid conditions	8
Health monitoring of mechanically fatigued flexible lithium ion battery by electrochemical impedance spectroscopy	8
Mechanical behavior investigation of press-fit connector based on finite element simulation and its reliability evaluation	8
Comparative evaluation of reliability assessment methods of power modules in motor drive inverter	8
Practical aspects of thermomechanical modeling in electronics packaging: A case study with a SiC power package	8
A novel BIST for monitoring aging/temperature by self-triggered scheme to improve the reliability of STT-MRAM	8
Effects of silver nano-particles and nano-wires on properties of electrically conductive adhesives	8
Physical mechanisms for gate damage induced by heavy ions in SiC power MOSFET	8
Analysis of drain current transient stability of AlGaN/GaN HEMT stressed under HTOL & HTRB, by random telegraph noise and low frequency noise characterizations	8
BP neural network for non-invasive IGBT junction temperature online detection	8
Effect of leveler on performance and reliability of copper pillar bumps in wafer electroplating under large current density	8
Double-node-upset aware SRAM bit-cell for aerospace applications	8
Novel radiation-hardened SRAM for immune soft-error in space-radiation environments	8
Effects of Ag content on microstructure evolution, intermetallic compound (IMC) and mechanical behaviour of SAC solder joints	8
Packaging design for improving the uniformity of Chip scale package (CSP) LED luminescence	8
Research on sintering process and thermal conductivity of hybrid nanosilver solder paste based on molecular dynamics simulation	8
New power module concept in PCB-embedded technology with silver sintering die attach	8
Study on the relationship between Cu protrusion behavior and stresses evolution in the through-silicon via characterized by in-situ μ-Raman spectroscopy	8
Influence of CdTe solar cell properties on stability at high temperatures	8
Towards virtual twin for electronic packages in automotive applications	8
Microstructural characterization of alloyed palladium coated copper wire under high temperature	8
Reliability analysis in GeTe and GeSbTe based phase-change memory 4 kb arrays targeting storage class memory applications	8
Void and solder joint detection for chip resistors based on X-ray images and deep neural networks	8
State-of-the-art of the bond wire failure mechanism and power cycling lifetime in power electronics	8
1200V 4H-SiC trench MOSFET with superior figure of merit and suppressed quasi-saturation effect	8
New definition of critical energy for SiC MOSFET robustness under short circuit operations: The repetitive critical energy	8
Effect of Bi content and aging on solder joint shear properties considering strain rate	8
Effect of electroless Cu depositions for micro-via structure and thermal cycling reliability	8
Simulation studies on the transient dose rate effect of analog delay locked loops	8
Effects of alloying elements in high reliability copper wire bond material for high temperature applications	8
Experimental setup to monitor non-destructive single events triggered by ionizing radiation in power devices	8
Engineering application research on reliability prediction of the combined DC-DC power supply	8
Monitoring of parameter stability of SiC MOSFETs in real application tests	8
A non-invasive SiC MOSFET Junction temperature estimation method based on the transient light Emission from the intrinsic body diode	8
Co-relation scan attack analysis (COSAA) on AES: A comprehensive approach	8
Neural networks for enhanced stress prognostics for encapsulated electronic packages - A comparison	7
Review of condition monitoring methods for capacitors used in power converters	7
Investigation into thermo-mechanical reliability of copper trace lines in stacked dies ball grid array packaging	7
Degradation assessment of 1.2-kV SiC MOSFETs and comparative study with 1.2-kV Si IGBTs under power cycling	7
Wear-out failure of an IGBT module in motor drives due to uneven thermal impedance of power semiconductor devices	7
Influence mechanism of solder aging and thermal network model optimization of multi-chip IGBT modules	7
Performance and reliability improvement of 905 nm high power laser diode by design, fabrication and characterization of high damage threshold mirrors	7
Analysis of total ionizing dose response of optimized fin geometry workfunction modulated SOI-FinFET	7
A comparative analysis of printed circuit drying methods for the reliability of assembly process	7
Analysis of solder joint degradation and output power drop in silicon photovoltaic modules for reliability improvement	7
GaN-based high-periodicity multiple quantum well solar cells: Degradation under optical and electrical stress	7
Modeling hot carrier damage interaction between on and off modes for 28 nm AC RF applications	7
Modeling of MEMS Electrothermal Microgripper employing POD-DEIM and POD method	7
CFD modeling of additive manufacturing liquid cold plates for more reliable power press-pack assemblies	7
Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding	7
Damage based PoF model of solder joints under temperature cycling and electric coupling condition	7
Stability of the threshold voltage in fluorine-implanted normally-off AlN/GaN HEMTs co-integrated with commercial normally-on GaN HEMT technology	7
Effect of short-circuit degradation on the remaining useful lifetime of SiC MOSFETs and its failure analysis	7
Ionizing radiation response of bismuth titanate-based metal-ferroelectric-semiconductor (MFS) type capacitor	7
Prediction of software reliability	7
Mitigating single event upset of FPGA for the onboard bus control of satellite	7
Impact reliability analysis of a rigid-flex PCB system under acceleration loads	7
Optimal read voltages decision scheme eliminating read retry operations for 3D NAND flash memories	7
Influence of ionizing radiation on the conducted electromagnetic emission of integrated circuits	7
A novel online 4-point rainflow counting algorithm for power electronics	7
Finite element analysis of moisture induced thermo-mechanical delamination of semiconductor packages considering in-situ moisture desorption during reflow process	7
A highly reliable radiation tolerant 13T SRAM cell for deep space applications	7
Equivalent thermal model of through silicon via and bump for advanced packaging of integrated circuits	7
Theoretical examination of thermo-migration in novel platinum microheaters	7
A novel accelerated life-test method under thermal cyclic loadings for electronic devices considering multiple failure mechanisms	7
Characterization method of IGBT comprehensive health index based on online status data	7
A unified viscoplastic model for characterizing the softening behavior of the Sn3.0Ag0.5Cu solder under monotonic and cyclic loading conditions	7
A fault-tolerant reconfiguration system based on pilot switch for grid-connected inverters	7
Alternative manufacturing process of 3-dimensional interconnect device using thermoforming process	7
Heavy-ion induced gate damage and thermal destruction in double-trench SiC MOSFETs	7
Electron trapping effects in SiC Schottky diodes: Review and comment	7
Non-destructive automatic die-level defect detection of counterfeit microelectronics using machine vision	7
Reliability prediction of FinFET FPGAs by MTOL	7
Single event effects of SiC diode demonstrated by pulsed-laser two photon absorption	7
Reliability estimation of thin film platinum resistance MEMS thermal mass flowmeter by step-stress accelerated life testing	7
Multimodal fault-tolerant control for single-phase cascaded off-grid PV-storage system with PV failure using hybrid modulation	7
Wear-out failure analysis of modular multilevel converter-based STATCOM: The role of the modulation strategy and IGBT blocking voltage	6
Investigation of the mechanical properties of corroded sintered silver layers by using Nanoindentation	6
Modeling the electrical characteristic of InGaN/GaN blue-violet LED structure under electrical stress	6
Quantitative analysis of void initiation in thermo-mechanical fatigue of polycrystalline copper films	6
Memoryless nonlinearity in IT JL FinFET with spacer technology: Investigation towards reliability	6
Wire-bond contact degradation modeling for remaining useful lifetime prognosis of IGBT power modules	6
Effects of Ga alloying on microstructure and comprehensive performances of Sn–9Zn–2Bi alloys for the microelectronics industry	6
Evaluation based on performance and failure of PV system in 10 years field-aged 1 MW PV power plant	6
Preparation of silver nanopowders and its application in low temperature electrically conductive adhesive	6
Trap-assisted degradation mechanisms in E-mode p-GaN power HEMT: A review	6
Thermal characterization of GaN lateral power HEMTs on Si, SOI, and poly-AlN substrates	6
Improved failure analysis in scanning acoustic microscopy via advanced signal processing techniques	6