Microelectronics Reliability

Article	Citations
Investigation of ESD protection devices for SiC-based monolithic integrated circuits	74
Interface trap charge modeling of surrounding gate-engineered tubular channel junctionless MOSFET exploring temperature induced variations	72
Analyzing the electrical response of Au-GaAs Schottky diodes to proton irradiation at room temperature	61
Multistate time lag dynamic Bayesian networks model for reliability prediction of smart meters	60
Semi-empirical law for fatigue resistance of redistribution layers in chip-scale packages	33
Laser voltage probing and simulation of a flip-flop with undesired quasi-static switching	29
Solving bump bonding issues with 2.0 mil copper wire: A study on FSM integration and workability improvements	27
Failure analysis and simulation of IGBT under active and passive thermal cycling	26
Assessment of the solidification behavior and microhardness of Sb-modified Sn-Ag alloys	26
FEM-based development of novel 3D-printable plastic direct coolers for power semiconductor modules	26
Changes in the extraction and collection efficiency of GaN-based MQW solar cells under optical step-stress	24
Total ionizing dose and single event effect response of 22 nm ultra-thin body and buried oxide fully depleted silicon-on-insulator technology	24
Degradation modeling of InGaAs/InP avalanche photodiodes using calibrated technology computer-aided design	24
A method to improve the accuracy and efficiency for metallized-film capacitor's reliability assessment using joint simulation	24
Numerical evaluation of radiation degradation for P-MOSFET power devices under total ionizing dose effect	24
Impact of interface trap charges on electrical performance characteristics of a source pocket engineered Ge/Si heterojunction vertical TFET with HfO2/Al2O3 laterally stacked gate oxide	23
A remaining useful life prediction method of aluminum electrolytic capacitor based on wiener process and similarity measurement	23
Effects of rare earth Ce addition on the microstructure and shear property of Cu/In-50Ag/Cu composite solder joint	23
Interdiffusion and formation of intermetallic compounds in high-temperature power electronics substrate joints fabricated by transient liquid phase bonding	23
Calibration methods and power cycling of double-side cooled SiC MOSFET power modules	21
A degradation model for separable electrical contacts based on the failure caused by surface oxide film	21
Expedient validation of LED reliability with anomaly detection through multi-output Gaussian process regression	21
In-situ temperature-dependent characterization of copper through glass via (TGV)	21
Reliability forecasting and Accelerated Lifetime Testing in advanced CMOS technologies	20
Influence of SiC chip thickness on the power cycling capability of power electronics assemblies – A comprehensive numerical study	20

Influence of phosphorus diffusion on the SiO2/4H-SiC (0001) interface during poly gate formation process	20
Performance prediction of current-voltage characteristics of Schottky diodes at low temperatures using artificial intelligence	20
Analysis of the stress state in QFN package during four point bending and temperature experiments utilizing piezoresistive stress sensor	19
Research on thermal management of 3D-ICs assisted by deep learning	19
500 μm heavy micro-alloyed Cu wire for IGBT application: The study on microstructure characteristics, electrical fatigue fracture mechanism and bonding reliability	19
Design and power optimization of a QCA-based universal reversible logic gate architecture using cell interaction approach	19
Correlative multimodal imaging and targeted lasering for automated high-precision IC decapsulation	19
A highly reliable radiation tolerant 13T SRAM cell for deep space applications	18
Conducted EMI susceptibility analysis of a COTS processor as function of thermal cycling and overvoltage stresses	18
Editorial Board	18
Physical insights into the reliability of sunken source connected field plate GaN HEMTs for mm-wave applications	18
Degradation in super-junction MOSFET under successive exposure of heavy ion strike and gamma ray irradiation	18
Long-term electrical stability of next generation LV Trench IGBT at Hitachi ABB Power Grids	17
A novel percolation model of leakage fluctuation behavior in gate-control dual-direction silicon controlled rectifier	17
A Π-shaped p-GaN HEMT for reliable enhancement mode operation	17
Interphase effect on the effective moisture diffusion in epoxy–SiO2 composites	17
An improved crack probability model for silicon oxide layers using three-parameter Weibull analysis	16
Performance optimized approximate multiplier architecture ST-AxM - based on statistical analysis and static compensation	16
A novel in-situ approach to monitor the variations in the on-resistance of power transistors during switching operation	16
Early failure of high-power white LEDs for outdoor applications under extreme electrical stress: Role of silicone encapsulant	16
Automated reliability calculation of failure rate, lifetime extrapolation and prediction for embedded Metal-Insulator-Metal capacitors using an optimized Time-Dependent-Dielectric-Breakdown model	16
Editorial Board	16
Editorial Board	15
The effect of low temperature conditions on vibration durability of SAC105 interconnects	15
Thermal aging impact on microstructure, creep and corrosion behavior of lead-free solder alloy (SAC387) use in electronics	15
Impact of aging on the SEU immunity of FinFET-based embedded memory systems	15
Single event burnout failures caused in silicon and silicon carbide power devices by single alpha particles emitted from radioactive nuclides	15
A novel online 4-point rainflow counting algorithm for power electronics	14
3D process simulation-assisted device failure analysis with virtual defect injection in IC layout	14
Memoryless linearity in undoped and B-doped graphene FETs: A relative investigation to report improved reliability	14
Editorial Board	14
Editorial Board	14
Enhanced size effects on shear performance and fracture behavior of BGA structure micro-scale Cu/Sn–3.0Ag–0.5Cu/Cu joints at low temperatures	14
Observation of photoemission behaviour during avalanche breakdown of insulated gate bipolar transistor with defect in the metal contact	14
Breakdown voltage and TDDB performance improvement by optimizing the PECVD dielectric film characteristics in MIM capacitors	14
Mobile ions entering the IGBT gate oxide - electrical detection and failure localization by lock-in thermography	14
Investigation of the role of pre-existing oxide in the initial degradation mechanism in AlGaN/GaN HEMTs under ON-state stress	14
Boosting the thermal stability of paralleled GaAs HBTs through temperature-dependent ballasting resistors: A proof-of-concept study	14
Implementation of high failure current Schottky-embedded DDSCR	14
Hang features of microcontroller exposed to pulsed ionizing radiation	13
Editorial Board	13
Editorial Board	13
EEPROM endurance degradation at different temperatures: State of the art TCAD simulation	13
Dynamic EFI and circuit analysis case studies on integrated circuit buried via void defects	13
Editorial Board	13
Elucidating the large variation in ion diffusivity of microelectronic packaging materials	13
Residual strain around a through-silicon via	13
Failure analysis on capacitor failures using simple circuit edit passive voltage contrast method	13
Editorial Board	12
Creep-fatigue lifetime estimation of efficient photovoltaic module ribbon interconnections	12

Generating and characterizing condensation phenomena in power modules	12
Impact of place and route strategy on FPGA electromagnetic emission	12
Study on formation mechanism of different differential resistance branches at avalanche breakdown curve of SGT-MOSFET	12
Effect of high-temperature storage on the thermal conductivity of Cu nanoparticles/Bi-Sn hybrid bonding	12
Sixer: A low-overhead, fully-distributed test scheme with guaranteed delivery of packets in networks-on-chip	12
Embedded systems and printed circuit boards as weak spots in HV-H3TRB tests	12
A comprehensive framework for cell-aware diagnosis of customer returns	12
A cost-effective repair scheme for clustered TSV defects in 3D ICs	12
Experimental identification and prioritization of design and process parameters on hole fill in mini wave soldering	11
New reliability model for power SiC MOSFET technologies under static and dynamic gate stress	11
Cryogenic-temperature investigation of negative bias stress inducing threshold voltage instabilities on 4H-SiC MOSFETs	11
Quantitative analysis of void initiation in thermo-mechanical fatigue of polycrystalline copper films	11
Improving the reliability of power modules through layered diffusion solder interconnects – Comparative study based on experiments and FE-simulation	11
Multi-scale in-situ micro-mechanical characterization of Polymer Core Solder Ball (PCSB) coatings for BGA interconnections	11
DNN-based error level prediction for reducing read latency in 3D NAND flash memory	11
Investigating the solder mask defects impact on leakage current on PCB under condensing humidity conditions	11
Study of the characteristics and growth of tin whiskers in orbit	11
Effect of microstructural variability on fatigue simulations of solder joints	11
The characterization of low-k thin films and their fracture analysis in a WLCSP device	11
Fatigue performance and microstructure of lead-free solder joints in BGA assembly at room temperature	11
Lifetime prediction for press pack IGBT device by considering fretting wear failure	11
Phase field study on the effect of roughness on interfacial intermetallic compounds of micro-solder joints under multifield coupling	11
Die level predictive modeling to reduce latent reliability defect escapes	11
Experimental research on performance degradation of TSV microstructure under thermal cycling, vibration and electrical stress	10
Editorial Board	10
Multi-physics coupling analysis of high-power IGBT module bonding wires fault considering stray inductance of main circuit	10
Modeling the electrical characteristic of InGaN/GaN blue-violet LED structure under electrical stress	10
Designing a Deep Neural Network engine for LLC block reuse prediction to mitigate Soft Error in Multicore	10
Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin	10
Simulation assessment of solder joint reliability for fully assembled printed circuit boards	10
High-temperature integrated SiC MOSFET bi-directional switch in power-overlay technology	10
Optical characterizations of “P-down” bonded InP pump lasers	10
A comparative radiation analysis of reconfigurable memory technologies: FinFET versus bulk CMOS	10
Study on the properties of epoxy-based Sn 58Bi solder joints	10
Thermal stress and drop stress analysis based on 3D package reliability study	10
Characterization of electrically stressed power device metallization using nano-CT imaging	10
Effects of Ga alloying on microstructure and comprehensive performances of Sn–9Zn–2Bi alloys for the microelectronics industry	10
Displacement damage and single event effects of SiC diodes and MOSFETs by neutron, heavy ions and pulsed laser	10
Microstructure evolution and mechanical behavior of copper through‑silicon via structure under thermal cyclic loading	10
Modeling of MEMS Electrothermal Microgripper employing POD-DEIM and POD method	10
Early detection of photovoltaic system inverter faults	10
Thermo-mechanical modeling of stacked die flash memory package EMI shielding layer crack under thermal cycling test	10
Modeling of the impact of mechanical stress resulted from wafer probing and wire bonding on circuit under pad	10
Effect of thermal cycling on microstructure and mechanical properties of nano-silver microsolder joint	10
SiC Super-Junction MOSFET robustness assessment and method to improve avalanche capability	10
Total ionizing dose radiation hardening technology based on double-charge multiple-step ion implantation	10
Electrical deterioration of 4H-SiC MOS capacitors due to bulk and interface traps induced by proton irradiation	9
Revisiting the effectiveness of diamond heat spreaders on multi-finger gate GaN HEMT using chip-to-package-level thermal simulation	9
Testing single via related defects in digital VLSI designs	9
A novel p-GaN HEMT with AlInN/AlN/GaN double heterostructure and InAlGaN back-barrier	9
Thermo-mechanical reliability of glass substrate and Through Glass Vias (TGV): A comprehensive review	9
Reliability assessment of miniaturised electromechanical RF relays for space applications	9
Study on annealing effect of bipolar transistors at different temperatures after total dose irradiation	9
Investigation of edge computing hardware architectures processing tiny machine learning under neutron-induced radiation effects	9
Application of N parallel-connected SiC MOSFETs to solid-state circuit breakers based on UIS tests	9
Optimal read voltages decision scheme eliminating read retry operations for 3D NAND flash memories	9
Short-circuit protection scheme with efficient soft turn-off for power modules	9
Scaling-friendly approaches to minimize the magnitude and asymmetry of wafer warpage during 3-D NAND fabrication	9
High temperature reliability of pressureless sintered Cu joints for power SiC die attachment	9
Functional cyclic bending test for integrated inductors on flexible Kapton substrate	9
A theoretical investigation of mole fraction-based N+	9
Lifetime reliability modeling on EMC performance of digital ICs influenced by the environmental and aging constraints: A case study	9
Time-dependent statistical NBTI model for aging assessment in circuit level implemented with open model interface	9
Effect of solder junction void variation in power semiconductor package on power cycle lifetime	9
DC and RF/analog performances of split source horizontal pocket and hetero stack TFETs considering interface trap charges: A simulation study	9
RF signals over field emission currents: A theoretical study for MEMS capacitive switches	9
Memoryless nonlinearity in IT JL FinFET with spacer technology: Investigation towards reliability	9
Impact of unpreventable induced interface trapped charges on HZO based FDSOI NCFET	9
Aging investigation of the latest standard dual power modules using improved interconnect technologies by power cycling test	9
Influence of the size and the material of the magnetic core on thermal properties of the inductor	9
Optimization of Ag-alloy ribbon bonding — An approach to reliable interconnection for high power IC packaging	9
Single event effects of SiC diode demonstrated by pulsed-laser two photon absorption	8
Experimental study of total ionizing dose effect on SiC MOSFETs at temperature from −233 °C to 175 °C	8
Influence of Interface Traps on MOSFET thermal coefficients and its effects on the ZTC current	8
Warpage characterization of a large size fan-out panel subjected to inhomogeneous heating by a digital fringe projection system	8
Numerical investigation of solder joint shape for micro-spring package during vacuum vapor phase soldering	8
Effect of filer content on the thermal characteristics of underfill materials for Ball-Grid-Array component package	8
Study on the high-temperature triggering and holding characteristics of PDSOI SCR devices	8
Cross-scale numerical analysis of PCB lamination process by an innovative partitioned homogenization method for the non-uniform curing shrinkage effect	8
An aging model for current DACs, and its application to analyzing lifetime degradation in a wireline equalizer	8

Squeeze-out and bond strength of patterned Cu Sn SLID seal-frames	8
A lifetime prediction approach for LED packages in paralleled under thermal-electronic coupling effects	8
Effect of substrate thinning on heavy ion induced single event effect in silicon carbide power junction barrier Schottky diodes	8
Effects of humidity, ionic contaminations and temperature on the degradation of silicone-based sealing materials used in microelectronics	8
A programmable checker for automated 2.5D/3D IC latch-up verification and hot junctions detection	8
Effect of Al and Bi addition on the corrosion behaviour, hardness, and melting temperature of lead-free solder alloys	8
Threshold voltage shift model for p-GaN gate enhancement mode HEMT	8
Rolling reliability of polyurethane and polyurethane-acrylic ICAs interconnections on printed stretchable electronics	8
The integrated fast short-circuit protection technique with soft turn-off for SiC MOSFET	8
High complexity reliable space applications in commercial microprocessors	8
Comparing structures of two-dimensional error correction codes	8
Understanding board level vibrations in automotive electronic modules	8
Morphological characterization of 325 mesh-grinding-induced defects on silicon wafer surface	7
Interface traps in the sub-3 nm technology node: A comprehensive analysis and benchmarking of negative capacitance FinFET and nanosheet FETs - A reliability perspective from device to circuit level	7
The effect of oxide scaling on ionising radiation response of sense-switch flash cells	7
Signal integrity and heat transfer performance of through-boron nitride via	7
Advanced low damage manufacturing processes to fabricate SOI FinFETs and measurement of electrical properties	7
Modeling of interface trap charges induced degradation in underlap DG and GAA MOSFETs	7
Self-heating temperature measurement in AlInN/GaN HEMTs by using CeO2 and TiO2 micro-Raman thermometers	7
PS-BBICS: Pulse stretching bulk built-in current sensor for on-chip measurement of single event transients	7
Wear-out failure analysis of modular multilevel converter-based STATCOM: The role of the modulation strategy and IGBT blocking voltage	7
Verification of creep properties and rupture lifetime evaluation methods using small diameter Sn-3.0Ag-0.5Cu/Sn-58Bi/Sn-5Sb specimens	7
Local capacitance-voltage profiling and high voltage stress effect study of SiO2/SiC structures by time-resolved scanning nonlinear dielectric microscopy	7
Investigating real-time control-flow error detection in hardware: How fast can we detect errors and take action?	7
Cost-effective reliability enhancement for video stitching applications based on error-tolerance	7
Influence of charge traps on charge plasma-germanium double-gate TFET for RF/Analog & low-power switching applications	7
Accelerative reliability tests for Sn3.0Ag0.5Cu solder joints under thermal cycling coupling with current stressing	7
Investigation of microstructure, thermal properties, and mechanical performances of Ni-added Sn-5.0Sb-0.5Cu/Cu solder joints	7
Synthesis and photoluminescence properties of Ce3+ and Tb3+ doped Na3Gd(PO4)2 phosphors for white LEDs	7
Passivation-layer thickness and field-plate optimization to obtain high breakdown voltage in AlGaN/GaN HEMTs with short gate-to-drain distance	7
Corrosion and conductivity damage of AgNW transparent conductive thin films under a simulated sulfur-containing atmosphere and mechanical force	7
Effects of silver nano-particles and nano-wires on properties of electrically conductive adhesives	7
Highly reliable Cu Cu low temperature bonding using SAC305 solder with rGO interlayer	7
Support region of μ-law logarithmic quantizers for Laplacian source applied in neural networks	7
An efficient thermal model of chiplet heterogeneous integration system for steady-state temperature prediction	7
Thickness and metallization layer effect on interfacial and vertical cracking of sintered silver layer: A numerical investigation	7
Preparation of silver nanopowders and its application in low temperature electrically conductive adhesive	7
Influence of power cycling ageing on the current and voltage transitions during hard switching of IGBT devices	7
A comprehensive investigation of total ionizing dose effects on bulk FinFETs through TCAD simulation	7
Research on the damage mechanism of the PIN limiter diode SMP1330 under EMP	7
A humidity-induced novel failure mechanism in power semiconductor diodes	7
Analysis of the viscoplastic behavior of Pb-free solder using lap shear joints	7
Effect of thermal loading definitions on the mission profile-based reliability evaluation of power devices in PV inverters	7
Enlarged tensile strain at edge of flexible substrate due to anticlastic curvature	7
A novel Bayesian multivariate linear regression model for online state-of-health estimation of Lithium-ion battery using multiple health indicators	7
Accelerated aging for gate oxide of SiC MOSFETs under continuous switching conditions by applying advanced HTGB test	7
Soft sensor design for estimation of thermal behavior of encapsulating materials in power electronic module	7
Influence of thermal interface material using discrete Si-IGBTs and consideration of power cycling conditions	6
Charge deposition analysis of heavy-ion-induced single-event burnout in low-voltage power VDMOSFET	6
Reliability analysis of the intricacies of interfacial trap charges in HD-VS-FeFinFET and its applicability as CMOS inverter	6
Modeling and optimization of OC fault diagnosis for inverters based on GR-PTA-BN	6
The research on the infrared time-sequence imaging inspection method for internal defects of 3D TSV packaging	6
New translation method to STC of photovoltaic module characteristics: A comparison of conventional approaches and proposal of a novel method	6
Heat-resistant durability of AMB substrates for SiC power devices: AlN and Si3N4, which one is thermally strong?	6
Development of low temperature Cu Cu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)	6
Single event effects hardening in SiC double-trench MOSFETs	6
A unified model for TCAD simulation of the charge generated in semiconductors by low-energy alpha particles and protons	6
Microstructural characterization of alloyed palladium coated copper wire under high temperature	6
A breakthrough for temperature and linearity stability from device to circuit-level with 14 nm junctionless SOI FinFET: Advancing K-band LNA performance	6
Improved failure analysis in scanning acoustic microscopy via advanced signal processing techniques	6
Short term reliability and robustness of ultra-thin barrier, 110 nm-gate AlN/GaN HEMTs	6
Investigations on acceptable breakdown voltage variation of parallel-connected SiC MOSFETs applied to olid-state circuit breakers	6
Design optimization of a miniaturized thermoelectric generator via parametric model order reduction	6
Investigation of thermal efficiency of recessed Γ gate over Γ gate, T gate and rectangular gate AlGaN/GaN HEMT on BGO substrate	6
TCAD investigation of the transport of carriers deposited by alpha particles in silicon carbide power Schottky devices	6
Die shear analyze of electrically conductive adhesives in GaN wafer application	6
Solder joints reliability of through hole assemblies with various land and hole design	6
Reliability prediction of multi-level power supply system based on Failure Precursor Parameters	6
Numerical modeling of FS-trench IGBTs by TCAD and its parameter extraction method	6
Design optimization of multi-resonant piezoelectric energy harvesters	6
Thermo-mechanical-optical coupling within a digital twin development for automotive LiDAR	6
Effects of multi-factors on the junction temperature of LED automotive lamp chips	6
Prediction of the void formation in no-flow underfill process using machine learning-based algorithm	6
Trap-assisted degradation mechanisms in E-mode p-GaN power HEMT: A review	6
Effect of EVA discoloration in 25-year-old single crystalline silicon photovoltaic modules operated under moderate climate	6
Editorial Board	6
ECS an endeavor towards providing similar cache reliability behavior in different programs	6
Analysis of radiation-induced transient errors on 7 nm FinFET technology	6
Ionizing radiation defects and reliability of Gallium Nitride-based III-V semiconductor devices: A comprehensive review	6
Microstructure and mechanical evolution of sintered silver on Ni/Pd/Au and Ni/Au finished substrates	6
Heavy-ion induced gate damage and thermal destruction in double-trench SiC MOSFETs	6
Investigation of electromagnetic force effect in IGBT modules	6
A RUL prediction method for lithium-ion batteries based on improved singular spectrum analysis and CSA-KELM	6
Evaluation and thermal ageing of power semiconductor die attachments based on porous film electrodeposition	6
Single-event burnout resilient design of 4H-SiC MOSFETs through staircase-like buffer layer	6
Study on electron and gamma irradiation effects and damage mechanism of GaN HEMT	6
Error correction improvement based on weak-bit-flipping for resistive memories	6
Comprehensive investigation on different ions of geostationary orbit induced single event burnout in GaN HEMT power devices	6
Co-relation scan attack analysis (COSAA) on AES: A comprehensive approach	6
Design optimization of a packaged thermoelectric generator for electrically active implants	6
Asymmetric aging effect on modern microprocessors	6
Experimental and numerical analysis of cyclic ratchetting and low cycle fatigue behaviour in meander-shaped interconnects for stretchable electronics applications	6
Impact of thermal interface material on power cycling lifetime of IGBT module	6
Constitutive equations for strain rate and temperature dependent mechanical behaviour of porous Ag-sintered joints in electronic packages	5
Performance and reliability improvement of 905 nm high power laser diode by design, fabrication and characterization of high damage threshold mirrors	5