Microelectronics Reliability

Article	Citations
Lithium-ion battery performance degradation evaluation in dynamic operating conditions based on a digital twin model	50
A lithium-ion battery remaining useful life prediction method based on the incremental capacity analysis and Gaussian process regression	47
Thermal performance of heat sink using nano-enhanced phase change material (NePCM) for cooling of electronic components	45
Soft errors in DNN accelerators: A comprehensive review	42
Defect inspection of flip chip solder joints based on non-destructive methods: A review	41
FlexGripPlus: An improved GPGPU model to support reliability analysis	40
A comparative study of thermal fatigue life of Eutectic Sn-Bi, Hybrid Sn-Bi/SAC and SAC solder alloy BGAs	36
Development of low temperature Cu Cu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)	30
Challenges to overcome breakdown limitations in lateral β-Ga2O3 MOSFET devices	29
Microstructure evolution and hardness of MWCNT-reinforced Sn-5Sb/Cu composite solder joints under different thermal aging conditions	28
Effect of temperature and humidity on moisture diffusion in an epoxy moulding compound material	27
Remaining useful life (RUL) estimation of electronic solder joints in rugged environment under random vibration	27
Surge current capability of ultra-wide-bandgap Ga2O3 Schottky diodes	23
Flip Chip integration of ultra-thinned dies in low-cost flexible printed electronics; the effects of die thickness, encapsulation and conductive adhesives	22
Physics of failure of die-attach joints in IGBTs under accelerated aging: Evolution of micro-defects in lead-free solder alloys	21
Effect of micromorphology on corrosion and mechanical properties of SAC305 lead-free solders	21
A mixed-effects model of two-phase degradation process for reliability assessment and RUL prediction	20
Lithium-ion battery SoH estimation based on incremental capacity peak tracking at several current levels for online application	20
Mechanics-based acceleration for estimating thermal fatigue life of electronic packaging structure	20
Ultrasonic monitoring performance degradation of lithium ion battery	18
Accelerative reliability tests for Sn3.0Ag0.5Cu solder joints under thermal cycling coupling with current stressing	18
A simulation-based analysis of effect of interface trap charges on dc and analog/HF performances of dielectric pocket SOI-Tunnel FET	18
An improved lifetime prediction method for metallized film capacitor considering harmonics and degradation process	18
Characterisation & modelling of perovskite-based synaptic memristor device	18
Impact of interface trap charges on electrical performance characteristics of a source pocket engineered Ge/Si heterojunction vertical TFET with HfO2/Al2O3 laterally stacked gate oxide	18

The investigation of current condition mechanism of Al/Y2O3/p-Si Schottky barrier diodes in wide range temperature and illuminate	17
A comprehensive solution for modeling moisture induced delamination in electronic packaging during solder reflow	17
Improved deep learning based telemetry data anomaly detection to enhance spacecraft operation reliability	17
A hybrid system-level prognostics approach with online RUL forecasting for electronics-rich systems with unknown degradation behaviors	16
Design optimization of multi-resonant piezoelectric energy harvesters	16
Constituents and performance of no-clean flux for electronic solder	16
Fault diagnosis and prognosis based on physical knowledge and reliability data: Application to MOS Field-Effect Transistor	16
Recovery investigation of NBTI-induced traps in n-MOSFET devices	16
Evaluation of thermal conductivity for sintered silver considering aging effect with microstructure based model	15
Ionizing radiation hardness tests of GaN HEMTs for harsh environments	15
Ionizing radiation damage in 65 nm CMOS technology: Influence of geometry, bias and temperature at ultra-high doses	15
DC and RF/analog performances of split source horizontal pocket and hetero stack TFETs considering interface trap charges: A simulation study	15
Study on high power microwave nonlinear effects and degradation characteristics of C-band low noise amplifier	15
Heavy-ion induced single event effects and latent damages in SiC power MOSFETs	15
Analyzing the impact of soft errors in VGG networks implemented on GPUs	14
IGBT aging monitoring and remaining lifetime prediction based on long short-term memory (LSTM) networks	14
Constructal design for the layout of multi-chip module based on thermal-flow-stress coupling calculation	14
Reliability analysis of a fault-tolerant RISC-V system-on-chip	14
Deep learning-based image analysis framework for hardware assurance of digital integrated circuits	14
Separation of electron and hole trapping components of PBTI in SiON nMOS transistors	14
A low cost fault-attack resilient AES for IoT applications	14
Experimental analysis on estimating junction temperature and service life of high power LED array	14
An interpretable remaining useful life prediction scheme of lithium-ion battery considering capacity regeneration	14
Electrical characterization of SiC MOS capacitors: A critical review	13
Combined effect of Bi and Ni elements on the mechanical properties of low-Ag Cu/Sn-0.7Ag-0.5Cu/Cu solder joints	13
Stress/strain characterization in electronic packaging by micro-Raman spectroscopy: A review	13
Achieving microstructure refinement and superior mechanical performance of Sn-2.0Ag-0.5Cu-2.0Zn (SACZ) solder alloy with rotary magnetic field	13
Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components	13
Effect of Co content on the microstructure, spreadability, conductivity and corrosion resistance of Sn-0.7Cu alloy	13
Gate-switching-stress test: Electrical parameter stability of SiC MOSFETs in switching operation	13
Accelerated aging test for gate-oxide degradation in SiC MOSFETs for condition monitoring	13
Design of low power, variation tolerant single bitline 9T SRAM cell in 16-nm technology in subthreshold region	13
Effect of critical properties of epoxy molding compound on warpage prediction: A critical review	13
Combined experimental-FEM investigation of electrical ruggedness in double-sided cooled power modules	13
Hydrothermal growth method for the deposition of ZnO films: Structural, chemical and optical studies	12
Molecular dynamic study for concentration-dependent volume relaxation of vacancy	12
Analysis of the aging mechanism occurring at the bond-wire contact of IGBT power devices during power cycling	12
Effect of temperature and humidity conditioning on copper leadframe/mold compound interfacial delamination	12
Performance and reliability of Al2O3 nanoparticles doped multicomponent Sn-3.0Ag-0.5Cu-Ni-Ge solder alloy	12
Impact of inter-metallic compound thickness on thermo-mechanical reliability of solder joints in solar cell assembly	12
Energy based modeling for temperature cycling induced tin silver copper solder interconnect fatigue life	12
Recent review on failures in silicon carbide power MOSFETs	12
Inkjet-printed HF antenna made on PET substrate	12
Microstructure and mechanical behavior of SnBi-xAg and SnBi-xAg@P-Cu solder joints during isothermal aging	12
Gate-damage accumulation and off-line recovery in SiC power MOSFETs with soft short-circuit failure mode	12
A reliability evaluation method for multi-performance degradation products based on the Wiener process and Copula function	12
Thermal stress reduction strategy for high-temperature power electronics with Ag sintering	12
Investigation of critical factors effect to predict leakage current and time to failure due to ECM on PCB under humidity	12
Comparison study of gold coatings prepared by traditional and modified galvanic replacement deposition for corrosion prevention of copper	12
Analysis on the damage and recovery of typhoon disaster based on UAV orthograph	12

Lock-V: A heterogeneous fault tolerance architecture based on Arm and RISC-V	11
A humidity-induced novel failure mechanism in power semiconductor diodes	11
Influence of microstructure inhomogeneity on the current density and temperature gradient in microscale line-type Sn58Bi solder joints under current stressing	11
Threading dislocations in GaN high-voltage switches	11
Ab initio investigations in amorphous silicon dioxide: Proposing a multi-state defect model for electron and hole capture	11
Fault diagnosis of cracks in crystalline silicon photovoltaic modules through I-V curve	11
Experimental characterization of rolled annealed copper film used in flexible printed circuit boards: Identification of the elastic-plastic and low-cycle fatigue behaviors	11
Prediction of solar particle events with SRAM-based soft error rate monitor and supervised machine learning	11
Temperature-dependent electrical characteristics of neutron-irradiated GaN Schottky barrier diodes	11
Finite element method modeling of temperature gradient-induced Cu atomic thermomigration in Cu/Sn/Cu micro solder joint	11
Investigations of short-circuit failure in double trench SiC MOSFETs through three-dimensional electro-thermal-mechanical stress analysis	11
A 3-D thermal network model for the temperature monitoring of thermal grease as interface material	11
A physical lifetime prediction methodology for IGBT module by explicit emulation of solder layer degradation	11
Mechanistic study of copper wire-bonding failures on packaging devices in acidic chloride environments	11
Two phase cooling with nano-fluid for highly dense electronic systems-on-chip – A pilot study	11
Experimental and modeling studies of automotive-qualified OLEDs under electrical stress	11
Effects of anisotropy on the reliability of TSV microstructure	11
Accumulative total ionizing dose (TID) and transient dose rate (TDR) effects on planar and vertical ferroelectric tunneling-field-effect-transistors (TFET)	11
Three-phase SiC inverter with active limitation of all MOSFETs junction temperature	11
A numerical study on the effect of the fixation methods on the vibration fatigue of electronic packages	11
Improved HV-H3TRB robustness of a 1700 V IGBT chip set in standard power modules	10
Wafer defect pattern classification with detecting out-of-distribution	10
Parametric system-level models for position-control of novel electromagnetic free flight microactuator	10
Electromigration in solder joints: A cross-sectioned model system for real-time observation	10
A novel Bayesian multivariate linear regression model for online state-of-health estimation of Lithium-ion battery using multiple health indicators	10
Evaluation of thermomechanical fatigue lifetime of BGA lead-free solder joints and impact of isothermal aging	10
Reliability of automotive and consumer MEMS sensors - An overview	10
Modelling and analysis of vibration on power electronic module structure and application of model order reduction	10
Thermal analysis of the design parameters of a QFN package soldered on a PCB using a simulation approach	10
In situ investigation of atmospheric corrosion behavior of copper under thin electrolyte layer and static magnetic field	10
A simulation-based methodology for aiding advanced driver assistance systems hazard analysis and risk assessment	10
Prediction of IGBT junction temperature using improved cuckoo search-based extreme learning machine	10
Microstructure, resistivity, and shear strength of electrically conductive adhesives made of silver-coated copper powder	10
Vertical GaN devices: Process and reliability	10
Gate leakage current sensing for in situ temperature monitoring of p-GaN gate HEMTs	10
Investigation of microstructure, thermal properties, and mechanical performances of Ni-added Sn-5.0Sb-0.5Cu/Cu solder joints	10
Dielectric investigation of In4Se96-xSx semiconductor: Relaxation and conduction mechanism	10
Low actuation voltage cantilever-type RF-MEMS shunt switches for 5G applications	9
Impact of unpreventable induced interface trapped charges on HZO based FDSOI NCFET	9
Modeling and fault diagnosis of multi-phase winding inter-turn short circuit for five-phase PMSM based on improved trust region	9
Gate drive circuit for current balancing of parallel-connected SiC-JFETs under avalanche mode	9
Analysis of the vulnerability of MEMS tuning fork gyroscope during the gun launch	9
Real-time estimation of junction temperature in IGBT inverter with a simple parameterized power loss model	9
Online junction temperature estimation using integrated NTC thermistor in IGBT modules for PMSM drives	9
Stabilizing the sintered nanopore bondline by residual organics for high temperature electronics	9
Novel lockstep-based fault mitigation approach for SoCs with roll-back and roll-forward recovery	9
Effect of intermetallic compound thickness on mechanical fatigue properties of copper pillar micro-bumps	9
Soft error hardening enhancement analysis of NBTI tolerant Schmitt trigger circuit	9
Influence of post-bonding heating process on the long-term reliability of Cu/Al contact	9
Analyses on the large size PBGA packaging reliability under random vibrations for space applications	9
Power cycling failure analysis of double side cooled IGBT modules for automotive applications	9
Thermal fatigue analysis of gold wire bonding solder joints in MEMS pressure sensors by thermal cycling tests	9
Role of the AlGaN barrier on the long-term gate reliability of power HEMTs with p-GaN gate	9
Improving the reliability of SRAM-based PUFs under varying operation conditions and aging degradation	9
Reliability based design optimization applied to the high electron mobility transistor (HEMT)	9
Design optimization of a miniaturized thermoelectric generator via parametric model order reduction	9
Reliability analysis of multilayer polymer aluminum electrolytic capacitors	9
A Π-shaped p-GaN HEMT for reliable enhancement mode operation	9
A power transfer model-based method for lithium-ion battery discharge time prediction of electric rotatory-wing UAV	9
Reliability assessment on 16 nm ultrascale+ MPSoC using fault injection and fault tree analysis	9
Machine learning for board-level drop response of BGA packaging structure	9
Reliability assessment of film capacitors oriented by dependent and nonlinear degradation considering three-source uncertainties	9
A novel on-wafer approach to test the stability of GaN-based devices in hard switching conditions: Study of hot-electron effects	9
Understanding and eliminating thermo-mechanically induced radial cracks in fully metallized through-glass via (TGV) substrates	9
Mechanical reliability of Cu cored solder ball in flip chip package under thermal shock test	9
MEMS capacitive microphone with various materials in acoustic plate under shock loading	8
Three-parameter Weibull distribution with upper limit applicable in reliability studies and materials testing	8
Effects of alloying elements in high reliability copper wire bond material for high temperature applications	8
Performance prediction of current-voltage characteristics of Schottky diodes at low temperatures using artificial intelligence	8
A survey of the structure, fabrication, and characterization of advanced organic light emitting diodes	8
Positive and negative charge trapping GaN HEMTs: Interplay between thermal emission and transport-limited processes	8
New power module concept in PCB-embedded technology with silver sintering die attach	8
Simulation studies on the transient dose rate effect of analog delay locked loops	8
Physical mechanisms for gate damage induced by heavy ions in SiC power MOSFET	8
Comparisons of SnO2 gas sensor degradation under elevated storage and working conditions	8
Numerical simulation of reliability of 2.5D/3D package interconnect structure under temperature cyclic load	8
From early microstructural evolution to intergranular crack propagation in SAC solders under thermomechanical fatigue	8
In-situ temperature-dependent characterization of copper through glass via (TGV)	8
An SEU-hardened ternary SRAM design based on efficient ternary C-elements using CNTFET technology	8
A method to extract lumped thermal networks of capacitors for reliability oriented design	8

Effects of bismuth additions on mechanical property and microstructure of SAC-Bi solder joint under current stressing	8
Effect of aging time and loading rate on fracture behavior of Cu/Sn-0.7Cu solder joints	8
Hot-Carrier degradation in P- and N-channel EDMOS for smart power application	8
Multiple failure mode identification of SiC planar MOSFETs in short-circuit operation	8
Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization	8
Health monitoring of mechanically fatigued flexible lithium ion battery by electrochemical impedance spectroscopy	8
Microstructural characterization of alloyed palladium coated copper wire under high temperature	8
Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi	8
Reliability analysis and condition monitoring of SAC+ solder joints under high thermomechanical stress conditions using neuronal networks	8
Physical security of deep learning on edge devices: Comprehensive evaluation of fault injection attack vectors	8
High-level fault injection to assess FMEA on critical systems	8
Tensile characterization and constitutive modeling of sintered nano-silver particles over a range of strain rates and temperatures	8
Packaging design for improving the uniformity of Chip scale package (CSP) LED luminescence	7
Experimental setup to monitor non-destructive single events triggered by ionizing radiation in power devices	7
Wear-out failure of an IGBT module in motor drives due to uneven thermal impedance of power semiconductor devices	7
UIS performance and ruggedness of stand-alone and cascode SiC JFETs	7
Multimodal fault-tolerant control for single-phase cascaded off-grid PV-storage system with PV failure using hybrid modulation	7
Measurement and simulation of short circuit current sharing under parallel connection: SiC MOSFETs and SiC Cascode JFETs	7
BTI saturation and universal relaxation in SiC power MOSFETs	7
Time-dependent dielectric breakdown of gate oxide on 4H-SiC with different oxidation processes	7
Co-relation scan attack analysis (COSAA) on AES: A comprehensive approach	7
Interfacial trap charge and self-heating effect based reliability analysis of a Dual-Drain Vertical Tunnel FET	7
Modelling stress evolution and voiding in advanced copper nano-interconnects under thermal gradients	7
Improving GPU register file reliability with a comprehensive ISA extension	7
Degradation mechanisms-based reliability modeling for metallized film capacitors under temperature and voltage stresses	7
Design guideline on board-level thermomechanical reliability of 2.5D package	7
New definition of critical energy for SiC MOSFET robustness under short circuit operations: The repetitive critical energy	7
Damage based PoF model of solder joints under temperature cycling and electric coupling condition	7
Capture and emission time map to investigate the positive VTH shift in p-GaN power HEMTs	7
A fault-tolerant reconfiguration system based on pilot switch for grid-connected inverters	7
Efficiency droop in green InGaN/GaN light emitting diodes: Degradation mechanisms and initial characteristics	7
Effect of short-circuit degradation on the remaining useful lifetime of SiC MOSFETs and its failure analysis	7
Analysis of drain current transient stability of AlGaN/GaN HEMT stressed under HTOL & HTRB, by random telegraph noise and low frequency noise characterizations	7
Effects of multi-cracks and thermal-mechanical coupled load on the TSV reliability	7
Exploration of gate trench module for vertical GaN devices	7
A comparative analysis of printed circuit drying methods for the reliability of assembly process	7
Reliability prediction of FinFET FPGAs by MTOL	7
Power cycling tests under driving ΔTj = 125 °C on the Cu clip bonded EV power module	7
Research of single-event burnout and hardened GaN MISFET with embedded PN junction	7
Crack identification and evaluation in BEoL stacks of two different samples utilizing acoustic emission testing and nano X-ray computed tomography	7
Fault diagnosis of PID in crystalline silicon photovoltaic modules through I-V curve	7
Bending reliability of transparent electrode of printed invisible silver-grid/PEDOT:PSS on flexible epoxy film substrate for powder electroluminescent device	7
Comparative evaluation of reliability assessment methods of power modules in motor drive inverter	7
Shear strength and fracture analysis of Sn-9Zn-2.5Bi-1.5In and Sn-3.0Ag-0.5Cu pastes with Cu-substrate joints under different reflow times	7
1200V 4H-SiC trench MOSFET with superior figure of merit and suppressed quasi-saturation effect	7
Accelerated aging for gate oxide of SiC MOSFETs under continuous switching conditions by applying advanced HTGB test	7
Comphy v3.0—A compact-physics framework for modeling charge trapping related reliability phenomena in MOS devices	7
Passivation-layer thickness and field-plate optimization to obtain high breakdown voltage in AlGaN/GaN HEMTs with short gate-to-drain distance	7
Double-node-upset aware SRAM bit-cell for aerospace applications	7
OFF-state trapping phenomena in GaN HEMTs: Interplay between gate trapping, acceptor ionization and positive charge redistribution	7
Study on the influence of fretting wear on electrical performance of SMA connector	7
Shear strength of die attachments prepared using dry nanosilver film by a time-reduced sintering process	7
High-energy proton irradiation effects on GaN hybrid-drain-embedded gate injection transistors	7
Analysis of solder joint degradation and output power drop in silicon photovoltaic modules for reliability improvement	7
CFD modeling of additive manufacturing liquid cold plates for more reliable power press-pack assemblies	7
Failure mechanism and life estimate of metallized film capacitor under high temperature and humidity	7
MEMS gyroscope fault detection and elimination for an underwater robot using the combination of smooth switching and dynamic redundancy method	6
Prediction of software reliability	6
Quantitative analysis of void initiation in thermo-mechanical fatigue of polycrystalline copper films	6
Single event effects of SiC diode demonstrated by pulsed-laser two photon absorption	6
Research on the damage mechanism of the PIN limiter diode SMP1330 under EMP	6
Towards virtual twin for electronic packages in automotive applications	6
Non-destructive automatic die-level defect detection of counterfeit microelectronics using machine vision	6
Characterization method of IGBT comprehensive health index based on online status data	6
Evaluation of ISO 26262 and IEC 61508 metrics for transient faults of a multi-processor system-on-chip through radiation testing	6
Towards a safe failure mode under short-circuit operation of power SiC MOSFET using optimal gate source voltage depolarization	6
A unified viscoplastic model for characterizing the softening behavior of the Sn3.0Ag0.5Cu solder under monotonic and cyclic loading conditions	6
Study on atomic migration of copper through-silicon-vias with Bosch scallops	6
Alternative manufacturing process of 3-dimensional interconnect device using thermoforming process	6
Lifetime performance index of electronic products	6
Influence of CdTe solar cell properties on stability at high temperatures	6
GaN-based high-periodicity multiple quantum well solar cells: Degradation under optical and electrical stress	6
Evaluating the soft error sensitivity of a GPU-based SoC for matrix multiplication	6
A remaining useful life prediction method of aluminum electrolytic capacitor based on wiener process and similarity measurement	6
Stability of the threshold voltage in fluorine-implanted normally-off AlN/GaN HEMTs co-integrated with commercial normally-on GaN HEMT technology	6
Reliability analysis in GeTe and GeSbTe based phase-change memory 4 kb arrays targeting storage class memory applications	6
A novel material detection method using femtosecond laser, confocal imaging and image processing enabling endpointing in fast inspection of microelectronics	6
A novel BIST for monitoring aging/temperature by self-triggered scheme to improve the reliability of STT-MRAM	6
A lifetime assessment and prediction method for large area solder joints	6
Effect of temperature on the low cycle fatigue properties of BGA solder joints	6
Improving avalanche robustness of SiC MOSFETs by optimizing three-region P-well doping profile	6
Analyzing and increasing soft error resilience of Deep Neural Networks on ARM processors	6
Engineering application research on reliability prediction of the combined DC-DC power supply	6
An ion beam layer removal method of determining the residual stress in the as-fabricated TSV-Cu/TiW/SiO2/Si interface on a nanoscale	6
Evaluation based on performance and failure of PV system in 10 years field-aged 1 MW PV power plant	6
Modeling of MEMS Electrothermal Microgripper employing POD-DEIM and POD method	6
On the analysis of radiation-induced failures in the AXI interconnect module	6
A novel online 4-point rainflow counting algorithm for power electronics	6
Growth of intermetallic compounds in solder joints based on strongly coupled thermo–mechano–electro–diffusional theory	6
A non-invasive SiC MOSFET Junction temperature estimation method based on the transient light Emission from the intrinsic body diode	6
Theoretical examination of thermo-migration in novel platinum microheaters	6
FEM-based combined degradation model of wire bond and die-attach for lifetime estimation of power electronics	6
Monitoring of parameter stability of SiC MOSFETs in real application tests	6
Mechanical integrity of back-end-of-line with Ru nanowires and airgaps	6
Soft error hardened voltage bootstrapped Schmitt trigger design for reliable circuits	6