Microelectronics Reliability

Article	Citations
Elucidating the large variation in ion diffusivity of microelectronic packaging materials	48
Multistate time lag dynamic Bayesian networks model for reliability prediction of smart meters	48
Single event burnout failures caused in silicon and silicon carbide power devices by single alpha particles emitted from radioactive nuclides	47
Reliability assessment of miniaturised electromechanical RF relays for space applications	37
Correlative multimodal imaging and targeted lasering for automated high-precision IC decapsulation	36
New reliability model for power SiC MOSFET technologies under static and dynamic gate stress	35
Investigation of the role of pre-existing oxide in the initial degradation mechanism in AlGaN/GaN HEMTs under ON-state stress	35
Laser voltage probing and simulation of a flip-flop with undesired quasi-static switching	34
A novel in-situ approach to monitor the variations in the on-resistance of power transistors during switching operation	34
Study on annealing effect of bipolar transistors at different temperatures after total dose irradiation	33
Editorial Board	32
The characterization of low-k thin films and their fracture analysis in a WLCSP device	31
Failure analysis on capacitor failures using simple circuit edit passive voltage contrast method	31
Boosting the thermal stability of paralleled GaAs HBTs through temperature-dependent ballasting resistors: A proof-of-concept study	31
A remaining useful life prediction method of aluminum electrolytic capacitor based on wiener process and similarity measurement	30
Investigating the solder mask defects impact on leakage current on PCB under condensing humidity conditions	29
Electrical deterioration of 4H-SiC MOS capacitors due to bulk and interface traps induced by proton irradiation	28
Breakdown voltage and TDDB performance improvement by optimizing the PECVD dielectric film characteristics in MIM capacitors	28
Aging investigation of the latest standard dual power modules using improved interconnect technologies by power cycling test	27
DNN-based error level prediction for reducing read latency in 3D NAND flash memory	27
Effect of microstructural variability on fatigue simulations of solder joints	26
Design optimization of a packaged thermoelectric generator for electrically active implants	26
Simulation assessment of solder joint reliability for fully assembled printed circuit boards	26
Modeling of the impact of mechanical stress resulted from wafer probing and wire bonding on circuit under pad	26
Impacts and mitigation strategies of process-induced packaging defects for enhancing reliability of power devices	25

Thermal reliability of 2D materials integrated with silicon-based CMOS ICs and analysis under complex conditions	25
Influence of cooling conditions on the estimated power cycling lifetime of a large-area substrate solder joint in power modules	25
High temperature reliability of pressureless sintered Cu joints for power SiC die attachment	24
A Π-shaped p-GaN HEMT for reliable enhancement mode operation	24
Theoretical investigation of NBTI in P-LDMOS transistors using the four-state NMP model	23
Current balancing of parallel-connected silicon carbide (SiC) MOSFET power devices using peak detection via PCB sensors	23
A physics-based electromigration model for advanced interconnects	23
DC and RF/analog performances of split source horizontal pocket and hetero stack TFETs considering interface trap charges: A simulation study	22
Effect of solder junction void variation in power semiconductor package on power cycle lifetime	22
Interface traps in the sub-3 nm technology node: A comprehensive analysis and benchmarking of negative capacitance FinFET and nanosheet FETs - A reliability perspective from device to circuit level	21
Calibration methods and power cycling of double-side cooled SiC MOSFET power modules	21
Investigation on the microstructure, mechanical properties and chlorine resistance of fine aluminum alloy wires	21
Microstructure evolution and mechanical behavior of copper through‑silicon via structure under thermal cyclic loading	21
Editorial Board	21
Evaluating switch lifetime in soft-switched single-stage differential-mode SST	21
Impact of proton-induced total ionizing dose effects on electrical characteristics and safe operating area of trench field-stop IGBT devices	20
Tilt- and warpage measurement as inline quality assessment tool	20
Editorial Board	20
Theoretical performance and reliability optimization of graphene based electrically doped tunnel FET under interface trap charge constraints: A device-level approach	19
Numerical modeling of FS-trench IGBTs by TCAD and its parameter extraction method	19
Sintering of mixed Cu Ag nanoparticles pretreated by formic acid vapor for Cu Cu low temperature bonding	19
Performance assessment and RUL prediction of power converters under the multiple components degradation	19
Effect of Sb content on the phase structure and interface structure of Sn1.0Ag0.5Cu lead-free solder	19
Thermal-mechanical analysis of copper pillar pitch size during reflow soldering assembly process	19
In-field test solution for enhancing safety in automotive applications	18
Mission profile-based digital twin framework using functional mock-up interfaces for assessing system's degradation behaviour	18
Self-healing solder joints in power electronics: Experimental validation of die-attach void effects on reliability	18
Evaluation of the helium hermeticity reliability of copper through-glass vias	18
Comprehensive study of hot-carrier stress in n-type logic CMOS devices at temperatures down to the deep-cryogenic regime	18
Method for geometric correction of indentation hardness on curved surfaces: Implications for solder joint structures	18
Comparison of multiple AI models for failure classification in smart plug top case study	17
Evaluation of SEU impact on convolutional neural networks based on BRAM and CRAM in FPGAs	17
Degradation modeling considering multiple performance parameters degradation based on mixed effects models	17
Prognosis of LED lumen degradation using Bayesian optimized neural network approach	16
Failure degradation similarities on power SiC MOSFET devices submitted to short-circuit stress and accelerated switching conditions	16
A BiLSTM-based digital twin model for photovoltaic strings under current mismatch condition	16
Investigation of electromagnetic force effect in IGBT modules	16
Micro-Raman and SEM analyses of failed GaN HEMT multilayer architecture	16
Ultra-fast recovery transients in GaN MIS-HEMT submitted to OFF-state stress	16
Condition monitoring for detection of humidity-induced failures in control electronics of power converters	16
Influence mechanism of solder aging and thermal network model optimization of multi-chip IGBT modules	16
Electroplated Ni-P film for power devices without cracks induced by high temperature heating	15
Interlayer capacitance extraction for profiling interface states in LaB₆/H-diamond Schottky diodes	15
Editorial Board	15
Impact of aging on temperature measurements performed using a resistive temperature sensor with sensor-to-microcontroller direct interface	15
Investigation on vibration induced fretting in degraded contact interface	15
An efficient structure to improve the reliability of deep neural networks on ARMs	15
Effects of the hardness and roughness on the plastic deformation properties of electroplated gold bumps during thermocompression bonding	15
Non-destructive fault diagnosis of electronic interconnects by learning signal patterns of reflection coefficient in the frequency domain	15
Accuracy estimation of low-current voltage drop method for junction temperature monitoring under DC power cycling	15

Application of deuterium oxide (D2O) isotope tracing technique for encapsulated QFN failure analysis	15
New temperature-independent aging indicator for power semiconductor devices – Application to IGBTs	14
A quantitative analysis and testing assessment method for functional damage state of electronic circuits under impact loads	14
Comparative analysis of mechanical and thermal stresses in ITO and AZO thin films on flexible PET substrates for flexible electronic applications	14
Composite powders with carbon nanotubes for laser printing of electronics	14
Characterization of a novel radiation hardened by design (RHD14) bit-cell based on 20-nm FinFET technology using TCAD simulations	14
Long-term (8000 h) reliability and failures of high-power LEDs for outdoor lighting stressed at high ambient temperatures	14
Detailed total ionizing dose effects on LDMOS transistors	14
Crosstalk optimization and gate oxide reliability analysis in intercalation doped MLGNR with reduced vertical thickness	14
Compatibility study of no-clean flux residue and conformal coatings using two electrode electrochemical impedance method	14
Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging	14
Multi-objective optimal design of thermal-vibration stress and return loss of TSV interconnect structures based on response surface-NSWOA optimization algorithm	14
Exploring the radiant impact of irradiance on the electrical resistance of organic thin film	14
Cluster-aware allocation of spare TSVs for enhanced reliability in 3D ICs	14
Effect of load sequence interaction for low ∆T's on the reliability of bonded aluminum wires in IGBTs	14
Amalgam illogical controller design using amended moth system for heat reduction in insulated gate bipolar transistor	14
Enhanced reliability of phosphor-converted white light-emitting diodes based on a laser-cured silicone encapsulant layer	14
Editorial Board	13
Accurate and efficient simulation of PCB warpage during manufacturing processes using partitioned equivalent model	13
On the sizing of PV inverters with reactive power capability to regulate power factor: A reliability approach	13
Experiments, constitutive modeling, and simulations on the creep behavior of the AgSn transient liquid phase metallic bonds	13
Uncertainty quantification in microelectronic packaging using feedback-enhanced adaptive polynomial chaos expansion	13
Performance investigation and impact of trap charges on novel lateral dual gate oxide-bilateral tunnelling based field effect transistor	13
Physics-informed Markov chains for remaining useful life prediction of wire bonds in power electronic modules	13
High-power microwave pulse induced failure on InGaP/GaAs heterojunction bipolar transistor	13
An FPGA-based architecture for time-resolved polarization probing of FeRAM fatigue	13
Local stress distribution in sintered nanoporous silver films under mechanical and thermal loading	13
NSFET performance optimization through SiGe channel design - A simulation study	13
Methodology of backside preparation applied on a MRAM to lead a logical investigation with a near-field probe	13
Accelerated lifetime estimation and failure analysis of micromachined humidity sensors under high temperature and high humidity conditions	13
Testing and simulation of lifetime for wire bond interconnections with varying bond foot angle	13
Microstructure and diffusion mechanisms in nano-Cu sintered joints during aging: Effects of joint size, porosity, and aging atmosphere	13
Optical, electrical, and mechanical reliability of 1700 PPI Micro-LED device	12
Optimization of the drain-side configuration in ESD-protection SCR-LDMOS for high holding-voltage applications	12
DC and RF aging test of AlGaN/GaN HEMT technology on SiC substrate	12
Failure mechanism and life estimate of metallized film capacitor under high temperature and humidity	12
Research on equivalent modeling and model testing verification methods for material mechanics parameters of TXV structure	12
Underfill material property dependence of lifetime and mechanical behavior of BGA package: EBSD and FEM investigations	12
Electrical characterization and temperature reliability of 4H-SiC Schottky barrier diodes after Electron radiation	12
Design of an energy-efficient soft error resilient RHBD SRAM cell with high read stability and minimum write errors	12
Design of compact-diode-SCR with low-trigger voltage for full-chip ESD protection	12
Dynamic wetting and spreading mechanisms of SAC305 with added Au elements in the laser jet weld ball bonding process	12
Design of gate drive voltage for SiC MOSFETs considering gate oxide TDDB lifetime and performance	12
Editorial Board	12
Evaluation of the impact of defects on threshold voltage drift employing SiO2 pMOS transistors	11
A PMOS-embedded low-voltage triggered silicon controlled rectifier ESD protection device for 3.3V I/O application	11
An Eigendecomposition-based dynamic characteristics design method of three-phase grid-connected inverters with considering reliability	11
A shared page-aware machine learning assisted method for predicting and improving multi-level cell NAND flash memory life expectancy	11
Enhanced gate biasing resilience in asymmetric and double trench SiC MOSFETs towards generalized highly reliable power electronics	11
Editorial Board	11
Radiation effect in FD-SOI nanowire FETs due to high dose rate gamma-ray under variable irradiation temperatures	11
Terminal strength test of TO-220 packaged Schottky barrier diode using finite element method	11
A high-efficiency aging test with new data processing method for semiconductor device	11
Aging modelling of Li-ion battery systems based on accelerated tests	11
Electrothermal power cycling of GaN and SiC cascode devices	11
Calibration and efficient evaluation of electromigration lifetime for interconnect wire sizing of multi-port networks	11
Assessing thermal resistance as a degradation metric for solder bump arrays in discrete SiC MOSFET packages	11
Physics-of-failure based lifetime modelling for SiC based automotive power modules using rate- and temperature-dependent modelling of sintered silver	11
Reinforcement learning-based weighting factors auto-tuning for thermal management in assembled inverters	11
Software-controlled pipeline parity in GPU architectures for error detection	11
Vulnerability evaluation on 16 nm FinFET Ultrascale+ MPSoC using fault injection and proton irradiation	11
Material level analytical model of total ionizing dose induced DC characteristics shift for FDSOI IC design	11
ESD Human Body Model step stress distributions of GaN HEMTs and the correlation with one level test results	11
Research on ESD failure voltage model of the T-shaped wiring structure in GOA products	11
Orbital validation for tin whisker suppression by conformal coating	11
Effect of Ag addition on the microstructure and distribution of second-phase particles in tin-based solder alloys	11
Failure rate analysis of radiation tolerant design techniques on SRAM-based FPGAs	11
Structural optimization design of LTCC substrate and their impacts on thermal performances of system-in-package	11
Influence of LDD spacers on total ionizing dose response of the transconductance for bulk MOSFETs working at cryogenic temperatures	11
Influence of normal load, electric current and sliding speed on tribological performance of electrical contact interface	10
Application-aware aging analysis and mitigation for SRAM Design-for-Relability	10
The effect of Si3N4/Al2O3 stacked structure of AlGaN/GaN HEMTs	10
Non-volatile SRAM based on emerging memory: A comprehensive review and reliability challenges	10
Thermal cycling reliability of electronic components in bolted assemblies: A study of the influence of bolt position	10
Exploring the fracture mechanism of multilayer ceramic capacitors via combined simulation and experiment	10
An online junction temperature detection circuit for SiC MOSFETs considering threshold voltage drift compensation	10
Evaluation of bonding techniques for ultrasound transducers	10
Multi-board parallel irradiation testing of neutron-induced soft errors in 16 nm FinFET and 22 nm planar FPGAs	10
Large area bare Cu-Cu interconnection using micro-Cu paste at different sintering temperatures and pressures	10
Influence of electron beam irradiation induced charging-effect on nanoprobing localization of a crystal defect in MOSFET	10

Aggravated NBTI reliability due to hard-to-detect open defects	10
Thermal reliability of Cu sintering joints for high-temperature die attach	10
Optimization and reliability of ultrasonic wedge bonding performance of copper wires on gold pads for MEMS devices	10
Design of high failure current embedded dual direction SCR with segmented topology for high-voltage ESD protection	10
Long-term capacitance variation characteristics, law extraction, single and collaborative prediction of film capacitors at room temperature and humidity	10
Thermomechanical model of an oxide-confined GaAs-based VCSEL emitter	10
The thickness and width of the intrinsic region effected electrical properties of GaAs p-i-n photodiodes	10
OFF-state breakdown and threshold voltage stability of vertical GaN-on-Si trench MOSFETs	9
Observation framework of errors in microprocessors with machine learning location inference of radiation-induced faults	9
Epitaxial hillocks defects caused by subsurface damage from InAs substrate	9
Fault and self-repair for high reliability in die-to-die interconnection of 2.5D/3D IC	9
Facile polyol synthesis of thermally stable AgNi composite nanowires for flexible transparent heater applications	9
Microelectronics Reliability: Publisher’s note	9
Origin of trap assisted tunnelling in ammonia annealed SiC trench MOSFETs	9
Towards development of an intelligent failure analysis system based on infrared thermography	9
BP neural network for non-invasive IGBT junction temperature online detection	9
Fault-tolerant multiplier using self-healing technique	9
Effect of gate oxide thickness on gate latent damage induced by heavy ion in SiC power MOSFETs	9
Advanced power cycling test strategies on discrete SiC MOSFETs in different operating modes and the impact on lifetime	9
Prediction of the electrochemical migration induced failure on power PCBs under humidity condition — A case study	9
Toward stable FeFET multi-level cell operations using novel weight freezing methodology with recovery cycling scheme for neuromorphic applications	9
Experimental analysis on stochastic behavior of preswitching time in STT-MRAM	9
Single event burnout of SiC MOSFET induced by atmospheric neutrons	9
Hybrid domain-based fast transient thermal evaluation method for power semiconductor modules in EV motor drive	9
Characteristics and avalanche investigation of SiC VDMOSFETs with enhanced P-Based implantation	9
Thermal-optical coupled reliability for micro-LED projection systems: Mechanistic modeling and parametric analysis	9
Design and power optimization of a QCA-based universal reversible logic gate architecture using cell interaction approach	9
A review on warpage measurement metrologies for advanced electronic packaging	9
Wavelet-based rapid identification of IGBT switch breakdown in voltage source converter	9
An informer network-based circuit boards fault detection method using infrared temperature series	9
Design of soft error correction flip-flop cells for highly reliable applications	9
Effect of the load inductor on the avalanche ruggedness of 1200-volt silicon diodes during unclamped inductive switching	9
Vulcanization failure mechanism analysis of lead-frame LED package	9
A non-volatile and radiation-hardened SRAM based on fourteen transistors and two perpendicular anisotropy magnetic tunnel junctions	9
Isolation properties and failure mechanisms of vertical Pt / n-GaN SBDs	9
Experimental study of transient dose rate effect on radiation-hardened digital signal processor	9
Micro-additives and their impact on tensile and fracture performance of solder	9
Editorial Board	9
Crack propagation in ultrasonic-bonded copper wires investigated by power cycling and accelerated mechanical fatigue interconnection test methods	9
Sixer: A low-overhead, fully-distributed test scheme with guaranteed delivery of packets in networks-on-chip	8
System in package: Advanced FA techniques to minimize analysis time and cost	8
Improved failure analysis in scanning acoustic microscopy via advanced signal processing techniques	8
Experimental and simulative study of warpage behavior for fan-out wafer-level packaging	8
Automated endpointing in microelectronics failure analysis using laser induced breakdown spectroscopy	8
Robust resistive switching characteristics of AlOx CBRAM using simple and cost-effective thermal evaporation process	8
A reliability assessment methodology of system-in-package based virtual qualification	8
Morphological characterization of 325 mesh-grinding-induced defects on silicon wafer surface	8
Analysis of the stress state in QFN package during four point bending and temperature experiments utilizing piezoresistive stress sensor	8
Investigation of ESD protection devices for SiC-based monolithic integrated circuits	8
New methodology for optimal preconditioning of GaN HEMT devices	8
Improvement in bond wire reliability by adjustments in bond wire microstructure via heat treatment	8
Influence of Interface Traps on MOSFET thermal coefficients and its effects on the ZTC current	8
Interphase effect on the effective moisture diffusion in epoxy–SiO2 composites	8
Changes in the extraction and collection efficiency of GaN-based MQW solar cells under optical step-stress	8
Squeeze-out and bond strength of patterned Cu Sn SLID seal-frames	8
Dynamic EFI and circuit analysis case studies on integrated circuit buried via void defects	8
Mobile ions entering the IGBT gate oxide - electrical detection and failure localization by lock-in thermography	8
Revisiting the effectiveness of diamond heat spreaders on multi-finger gate GaN HEMT using chip-to-package-level thermal simulation	8
Error correction improvement based on weak-bit-flipping for resistive memories	8
Warpage measurements to support the development of mmWave modules	8
Cost-effective reliability enhancement for video stitching applications based on error-tolerance	8
Electro-thermal stress minimisation of motor-drive inverter switches by hybrid modulation strategy technique	8
Improvement of sensitivity for power cycle degradation by a new device structure	8
Thermal and electrical characterization of flexible microheaters: Influence of material choice and geometry	8
Study on the optimization of bending-vibration coupling stress of QFN solder joints based on Taguchi orthogonal experimental design and Harris Hawks Optimization algorithm	8
Charge deposition analysis of heavy-ion-induced single-event burnout in low-voltage power VDMOSFET	8
Comprehensive investigation on different ions of geostationary orbit induced single event burnout in GaN HEMT power devices	8
Understanding board level vibrations in automotive electronic modules	8
Single event effects hardening in SiC double-trench MOSFETs	8
Degradation modeling of InGaAs/InP avalanche photodiodes using calibrated technology computer-aided design	8
Editorial Board	8
Fatigue performance and microstructure of lead-free solder joints in BGA assembly at room temperature	8
Evidence of resistive switching in SiNx thin films for MEMS capacitors: The role of metal contacts	8
Impact of neutron irradiation on SiC power MOSFETs after stress tests qualification	8
Editorial Board	8
Humidity related failure mechanism of IGBTs considering dynamic avalanche	8
Implementation of high failure current Schottky-embedded DDSCR	8
Over-voltage and cross-conduction hard switching stress on schottky gate-type p-GaN HEMT in half-bridge operation. Experimental and physical approaches	8
Time-dependent statistical NBTI model for aging assessment in circuit level implemented with open model interface	8
Effects of Ga alloying on microstructure and comprehensive performances of Sn–9Zn–2Bi alloys for the microelectronics industry	8
Electrical properties and application stability of the effects of La2O3 doping RuO2-CuO based resistive pastes with near-linear positive TCR	8
Reliability assessment of graphene channel vertical TFET: Role of trap-assisted tunneling	8
Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin	8
Reduced-order model for solder balls – Potential of projection-based approaches for representing viscoplastic behavior	8
Interfacial fracture behavior of polyimide/copper in RDL structures for advanced electronic packaging	7
Analysis of slow-current transients or current collapse in AlGaN/GaN HEMTs with field plate and high-k passivation layer	7
Influence of high frequency power cycles on SiC power module lifetime under automotive mission profile	7
A data-driven self-terminating write circuit with enhanced reliability for STT-MRAM using MUX logic	7
Response of the bipolar voltage regulator under neutron irradiation and consecutive pulsed gamma irradiation	7
The sensitivity analysis of geometric parameters on the power cycling reliability of bond wires	7
A methodology to calculate the equivalent static loading for simulating electronic assemblies under impact	7
Editorial Board	7
Electrical modelisation of a bitflip in SRAM cell memory induced by laser fault injection	7
Comparative study: AutoDPR-SEM for enhancing CNN reliability in SRAM-based FPGAs through autonomous reconfiguration	7
Power cycling tests under driving ΔTj = 125 °C on the Cu clip bonded EV power module	7