Microelectronics Reliability

Article	Citations
Multistate time lag dynamic Bayesian networks model for reliability prediction of smart meters	69
Semi-empirical law for fatigue resistance of redistribution layers in chip-scale packages	67
Improved failure analysis in scanning acoustic microscopy via advanced signal processing techniques	53
A method to improve the accuracy and efficiency for metallized-film capacitor's reliability assessment using joint simulation	42
Interdiffusion and formation of intermetallic compounds in high-temperature power electronics substrate joints fabricated by transient liquid phase bonding	29
Expedient validation of LED reliability with anomaly detection through multi-output Gaussian process regression	26
A degradation model for separable electrical contacts based on the failure caused by surface oxide film	25
Calibration methods and power cycling of double-side cooled SiC MOSFET power modules	24
Performance prediction of current-voltage characteristics of Schottky diodes at low temperatures using artificial intelligence	24
In-situ temperature-dependent characterization of copper through glass via (TGV)	24
Analysis of the stress state in QFN package during four point bending and temperature experiments utilizing piezoresistive stress sensor	23
Design and power optimization of a QCA-based universal reversible logic gate architecture using cell interaction approach	23
Co-relation scan attack analysis (COSAA) on AES: A comprehensive approach	23
Research on thermal management of 3D-ICs assisted by deep learning	22
Physical insights into the reliability of sunken source connected field plate GaN HEMTs for mm-wave applications	22
Development of low temperature Cu Cu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)	21
A highly reliable radiation tolerant 13T SRAM cell for deep space applications	21
Influence of phosphorus diffusion on the SiO2/4H-SiC (0001) interface during poly gate formation process	20
Conducted EMI susceptibility analysis of a COTS processor as function of thermal cycling and overvoltage stresses	20
Degradation in super-junction MOSFET under successive exposure of heavy ion strike and gamma ray irradiation	20
Editorial Board	20
Long-term electrical stability of next generation LV Trench IGBT at Hitachi ABB Power Grids	19
A Π-shaped p-GaN HEMT for reliable enhancement mode operation	19
Performance optimized approximate multiplier architecture ST-AxM - based on statistical analysis and static compensation	18
A novel percolation model of leakage fluctuation behavior in gate-control dual-direction silicon controlled rectifier	18

Interphase effect on the effective moisture diffusion in epoxy–SiO2 composites	18
Early failure of high-power white LEDs for outdoor applications under extreme electrical stress: Role of silicone encapsulant	17
Editorial Board	17
Total ionizing dose and single event effect response of 22 nm ultra-thin body and buried oxide fully depleted silicon-on-insulator technology	17
An improved crack probability model for silicon oxide layers using three-parameter Weibull analysis	16
A novel in-situ approach to monitor the variations in the on-resistance of power transistors during switching operation	16
Impact of aging on the SEU immunity of FinFET-based embedded memory systems	16
Automated reliability calculation of failure rate, lifetime extrapolation and prediction for embedded Metal-Insulator-Metal capacitors using an optimized Time-Dependent-Dielectric-Breakdown model	16
Implementation of high failure current Schottky-embedded DDSCR	15
Thermal aging impact on microstructure, creep and corrosion behavior of lead-free solder alloy (SAC387) use in electronics	15
Editorial Board	15
Single-event burnout resilient design of 4H-SiC MOSFETs through staircase-like buffer layer	15
The effect of low temperature conditions on vibration durability of SAC105 interconnects	15
Breakdown voltage and TDDB performance improvement by optimizing the PECVD dielectric film characteristics in MIM capacitors	15
Editorial Board	15
Single event burnout failures caused in silicon and silicon carbide power devices by single alpha particles emitted from radioactive nuclides	15
Memoryless linearity in undoped and B-doped graphene FETs: A relative investigation to report improved reliability	14
Influence of post-bonding heating process on the long-term reliability of Cu/Al contact	14
Enhanced size effects on shear performance and fracture behavior of BGA structure micro-scale Cu/Sn–3.0Ag–0.5Cu/Cu joints at low temperatures	14
Editorial Board	14
Elucidating the large variation in ion diffusivity of microelectronic packaging materials	14
Boosting the thermal stability of paralleled GaAs HBTs through temperature-dependent ballasting resistors: A proof-of-concept study	14
Investigation of the role of pre-existing oxide in the initial degradation mechanism in AlGaN/GaN HEMTs under ON-state stress	14
3D process simulation-assisted device failure analysis with virtual defect injection in IC layout	14
Hang features of microcontroller exposed to pulsed ionizing radiation	14
A novel online 4-point rainflow counting algorithm for power electronics	14
Observation of photoemission behaviour during avalanche breakdown of insulated gate bipolar transistor with defect in the metal contact	14
High temperature reliability of pressureless sintered Cu joints for power SiC die attachment	14
Mobile ions entering the IGBT gate oxide - electrical detection and failure localization by lock-in thermography	14
Reduced length redundancy adaptive protection for the cascaded integrator-comb interpolation filter on FPGA	14
Editorial Board	13
A comprehensive framework for cell-aware diagnosis of customer returns	13
Dynamic EFI and circuit analysis case studies on integrated circuit buried via void defects	13
Editorial Board	13
Generating and characterizing condensation phenomena in power modules	13
Residual strain around a through-silicon via	13
Failure analysis on capacitor failures using simple circuit edit passive voltage contrast method	13
Prediction of the void formation in no-flow underfill process using machine learning-based algorithm	13
Editorial Board	13
EEPROM endurance degradation at different temperatures: State of the art TCAD simulation	13
A cost-effective repair scheme for clustered TSV defects in 3D ICs	12
Sixer: A low-overhead, fully-distributed test scheme with guaranteed delivery of packets in networks-on-chip	12
Editorial Board	12
Impact of place and route strategy on FPGA electromagnetic emission	12
Study on formation mechanism of different differential resistance branches at avalanche breakdown curve of SGT-MOSFET	12
Effect of high-temperature storage on the thermal conductivity of Cu nanoparticles/Bi-Sn hybrid bonding	12
Creep-fatigue lifetime estimation of efficient photovoltaic module ribbon interconnections	12
Embedded systems and printed circuit boards as weak spots in HV-H3TRB tests	12
Lifetime prediction for press pack IGBT device by considering fretting wear failure	11
Multi-scale in-situ micro-mechanical characterization of Polymer Core Solder Ball (PCSB) coatings for BGA interconnections	11

Study of the characteristics and growth of tin whiskers in orbit	11
The characterization of low-k thin films and their fracture analysis in a WLCSP device	11
Design optimization of a packaged thermoelectric generator for electrically active implants	11
Cryogenic-temperature investigation of negative bias stress inducing threshold voltage instabilities on 4H-SiC MOSFETs	11
Experimental identification and prioritization of design and process parameters on hole fill in mini wave soldering	11
Effect of microstructural variability on fatigue simulations of solder joints	11
Die level predictive modeling to reduce latent reliability defect escapes	11
DNN-based error level prediction for reducing read latency in 3D NAND flash memory	11
Fatigue performance and microstructure of lead-free solder joints in BGA assembly at room temperature	11
Influence of SiC chip thickness on the power cycling capability of power electronics assemblies – A comprehensive numerical study	11
Improving the reliability of power modules through layered diffusion solder interconnects – Comparative study based on experiments and FE-simulation	11
Early detection of photovoltaic system inverter faults	10
Thermal characterization of GaN lateral power HEMTs on Si, SOI, and poly-AlN substrates	10
Modeling the electrical characteristic of InGaN/GaN blue-violet LED structure under electrical stress	10
A comparative radiation analysis of reconfigurable memory technologies: FinFET versus bulk CMOS	10
Total ionizing dose radiation hardening technology based on double-charge multiple-step ion implantation	10
Experimental research on performance degradation of TSV microstructure under thermal cycling, vibration and electrical stress	10
Editorial Board	10
Displacement damage and single event effects of SiC diodes and MOSFETs by neutron, heavy ions and pulsed laser	10
Effects of Ga alloying on microstructure and comprehensive performances of Sn–9Zn–2Bi alloys for the microelectronics industry	10
Modeling of MEMS Electrothermal Microgripper employing POD-DEIM and POD method	10
High-temperature integrated SiC MOSFET bi-directional switch in power-overlay technology	10
Ionizing radiation defects and reliability of Gallium Nitride-based III-V semiconductor devices: A comprehensive review	10
Study on the properties of epoxy-based Sn 58Bi solder joints	10
Multi-physics coupling analysis of high-power IGBT module bonding wires fault considering stray inductance of main circuit	10
Thermo-mechanical modeling of stacked die flash memory package EMI shielding layer crack under thermal cycling test	10
Trap-assisted degradation mechanisms in E-mode p-GaN power HEMT: A review	10
New reliability model for power SiC MOSFET technologies under static and dynamic gate stress	10
Microstructure evolution and mechanical behavior of copper through‑silicon via structure under thermal cyclic loading	10
Optical characterizations of “P-down” bonded InP pump lasers	10
A unified model for TCAD simulation of the charge generated in semiconductors by low-energy alpha particles and protons	9
Modeling of the impact of mechanical stress resulted from wafer probing and wire bonding on circuit under pad	9
Short-circuit protection scheme with efficient soft turn-off for power modules	9
Revisiting the effectiveness of diamond heat spreaders on multi-finger gate GaN HEMT using chip-to-package-level thermal simulation	9
Optimization of Ag-alloy ribbon bonding — An approach to reliable interconnection for high power IC packaging	9
Investigation of edge computing hardware architectures processing tiny machine learning under neutron-induced radiation effects	9
Electrical deterioration of 4H-SiC MOS capacitors due to bulk and interface traps induced by proton irradiation	9
Thermal stress and drop stress analysis based on 3D package reliability study	9
Memoryless nonlinearity in IT JL FinFET with spacer technology: Investigation towards reliability	9
RF signals over field emission currents: A theoretical study for MEMS capacitive switches	9
Characterization of electrically stressed power device metallization using nano-CT imaging	9
Effect of thermal cycling on microstructure and mechanical properties of nano-silver microsolder joint	9
DC and RF/analog performances of split source horizontal pocket and hetero stack TFETs considering interface trap charges: A simulation study	9
Impact of unpreventable induced interface trapped charges on HZO based FDSOI NCFET	9
Charge deposition analysis of heavy-ion-induced single-event burnout in low-voltage power VDMOSFET	9
Quantitative analysis of void initiation in thermo-mechanical fatigue of polycrystalline copper films	9
Influence of the size and the material of the magnetic core on thermal properties of the inductor	9
Optimal read voltages decision scheme eliminating read retry operations for 3D NAND flash memories	9
Phase field study on the effect of roughness on interfacial intermetallic compounds of micro-solder joints under multifield coupling	9
Testing single via related defects in digital VLSI designs	9
SiC Super-Junction MOSFET robustness assessment and method to improve avalanche capability	9
Designing a Deep Neural Network engine for LLC block reuse prediction to mitigate Soft Error in Multicore	9
Simulation assessment of solder joint reliability for fully assembled printed circuit boards	9
Effect of solder junction void variation in power semiconductor package on power cycle lifetime	9
Time-dependent statistical NBTI model for aging assessment in circuit level implemented with open model interface	9
Effects of rare earth Ce addition on the microstructure and shear property of Cu/In-50Ag/Cu composite solder joint	9
Microstructural characterization of alloyed palladium coated copper wire under high temperature	9
Thermo-mechanical reliability of glass substrate and Through Glass Vias (TGV): A comprehensive review	9
A novel p-GaN HEMT with AlInN/AlN/GaN double heterostructure and InAlGaN back-barrier	9
Impact of interface trap charges on electrical performance characteristics of a source pocket engineered Ge/Si heterojunction vertical TFET with HfO2/Al2O3 laterally stacked gate oxide	9
Scaling-friendly approaches to minimize the magnitude and asymmetry of wafer warpage during 3-D NAND fabrication	9
Functional cyclic bending test for integrated inductors on flexible Kapton substrate	8
Influence of charge traps on charge plasma-germanium double-gate TFET for RF/Analog & low-power switching applications	8
Warpage characterization of a large size fan-out panel subjected to inhomogeneous heating by a digital fringe projection system	8
Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin	8
Threshold voltage shift model for p-GaN gate enhancement mode HEMT	8
A lifetime prediction approach for LED packages in paralleled under thermal-electronic coupling effects	8
Squeeze-out and bond strength of patterned Cu Sn SLID seal-frames	8
Application of N parallel-connected SiC MOSFETs to solid-state circuit breakers based on UIS tests	8
Correlative multimodal imaging and targeted lasering for automated high-precision IC decapsulation	8
A theoretical investigation of mole fraction-based N+	8
The integrated fast short-circuit protection technique with soft turn-off for SiC MOSFET	8
Influence of Interface Traps on MOSFET thermal coefficients and its effects on the ZTC current	8
Experimental study of total ionizing dose effect on SiC MOSFETs at temperature from −233 °C to 175 °C	8
Rolling reliability of polyurethane and polyurethane-acrylic ICAs interconnections on printed stretchable electronics	8
An aging model for current DACs, and its application to analyzing lifetime degradation in a wireline equalizer	8
Lifetime reliability modeling on EMC performance of digital ICs influenced by the environmental and aging constraints: A case study	8
Aging investigation of the latest standard dual power modules using improved interconnect technologies by power cycling test	8
Reliability assessment of miniaturised electromechanical RF relays for space applications	8
Study on annealing effect of bipolar transistors at different temperatures after total dose irradiation	8

Thermo-mechanical-optical coupling within a digital twin development for automotive LiDAR	8
500 μm heavy micro-alloyed Cu wire for IGBT application: The study on microstructure characteristics, electrical fatigue fracture mechanism and bonding reliability	8
High complexity reliable space applications in commercial microprocessors	8
Verification of creep properties and rupture lifetime evaluation methods using small diameter Sn-3.0Ag-0.5Cu/Sn-58Bi/Sn-5Sb specimens	7
A programmable checker for automated 2.5D/3D IC latch-up verification and hot junctions detection	7
Understanding board level vibrations in automotive electronic modules	7
Effect of filer content on the thermal characteristics of underfill materials for Ball-Grid-Array component package	7
Effect of Al and Bi addition on the corrosion behaviour, hardness, and melting temperature of lead-free solder alloys	7
Investigating the solder mask defects impact on leakage current on PCB under condensing humidity conditions	7
Cross-scale numerical analysis of PCB lamination process by an innovative partitioned homogenization method for the non-uniform curing shrinkage effect	7
Effect of thermal loading definitions on the mission profile-based reliability evaluation of power devices in PV inverters	7
Morphological characterization of 325 mesh-grinding-induced defects on silicon wafer surface	7
Wear-out failure analysis of modular multilevel converter-based STATCOM: The role of the modulation strategy and IGBT blocking voltage	7
Investigating real-time control-flow error detection in hardware: How fast can we detect errors and take action?	7
Soft sensor design for estimation of thermal behavior of encapsulating materials in power electronic module	7
Study on the high-temperature triggering and holding characteristics of PDSOI SCR devices	7
Effects of humidity, ionic contaminations and temperature on the degradation of silicone-based sealing materials used in microelectronics	7
Effect of substrate thinning on heavy ion induced single event effect in silicon carbide power junction barrier Schottky diodes	7
New translation method to STC of photovoltaic module characteristics: A comparison of conventional approaches and proposal of a novel method	7
Single event effects of SiC diode demonstrated by pulsed-laser two photon absorption	7
Comparing structures of two-dimensional error correction codes	7
PS-BBICS: Pulse stretching bulk built-in current sensor for on-chip measurement of single event transients	7
Enlarged tensile strain at edge of flexible substrate due to anticlastic curvature	7
Self-heating temperature measurement in AlInN/GaN HEMTs by using CeO2 and TiO2 micro-Raman thermometers	7
Accelerated aging for gate oxide of SiC MOSFETs under continuous switching conditions by applying advanced HTGB test	7
Highly reliable Cu Cu low temperature bonding using SAC305 solder with rGO interlayer	7
Effect of EVA discoloration in 25-year-old single crystalline silicon photovoltaic modules operated under moderate climate	7
Interface traps in the sub-3 nm technology node: A comprehensive analysis and benchmarking of negative capacitance FinFET and nanosheet FETs - A reliability perspective from device to circuit level	7
Reliability forecasting and Accelerated Lifetime Testing in advanced CMOS technologies	7
Numerical investigation of solder joint shape for micro-spring package during vacuum vapor phase soldering	7
Comprehensive investigation on different ions of geostationary orbit induced single event burnout in GaN HEMT power devices	7
Local capacitance-voltage profiling and high voltage stress effect study of SiO2/SiC structures by time-resolved scanning nonlinear dielectric microscopy	7
Effects of silver nano-particles and nano-wires on properties of electrically conductive adhesives	7
Corrosion and conductivity damage of AgNW transparent conductive thin films under a simulated sulfur-containing atmosphere and mechanical force	7
A novel Bayesian multivariate linear regression model for online state-of-health estimation of Lithium-ion battery using multiple health indicators	7
Support region of μ-law logarithmic quantizers for Laplacian source applied in neural networks	7
The effect of oxide scaling on ionising radiation response of sense-switch flash cells	6
Analysis of the viscoplastic behavior of Pb-free solder using lap shear joints	6
Cost-effective reliability enhancement for video stitching applications based on error-tolerance	6
Investigation of ESD protection devices for SiC-based monolithic integrated circuits	6
An efficient thermal model of chiplet heterogeneous integration system for steady-state temperature prediction	6
Stability of wireless power transfer using gamma-ray irradiated GaN power HEMTs	6
Power-aware test scheduling framework for IEEE 1687 multi-power domain networks using formal techniques	6
Investigations on acceptable breakdown voltage variation of parallel-connected SiC MOSFETs applied to olid-state circuit breakers	6
Numerical simulation approach for consideration of ageing effects in PCB substrates by modifying viscoelastic materials properties	6
Signal integrity and heat transfer performance of through-boron nitride via	6
Modeling and optimization of OC fault diagnosis for inverters based on GR-PTA-BN	6
Influence of power cycling ageing on the current and voltage transitions during hard switching of IGBT devices	6
The influence of thermal cycling test parameters on the failure rate of electrical connectors	6
Research on the damage mechanism of the PIN limiter diode SMP1330 under EMP	6
Modeling of interface trap charges induced degradation in underlap DG and GAA MOSFETs	6
A remaining useful life prediction method of aluminum electrolytic capacitor based on wiener process and similarity measurement	6
Advanced low damage manufacturing processes to fabricate SOI FinFETs and measurement of electrical properties	6
Solvent-free Cu sintering pastes using acidic activators	6
Single Event Transient tolerant Count Min Sketches	6
Recurrent neural networks model based reliability assessment of power semiconductors in PMSG converter	6
Thermal aging of power module assemblies based on ceramic heat sink and multilayers pressureless silver sintering	6
Accelerative reliability tests for Sn3.0Ag0.5Cu solder joints under thermal cycling coupling with current stressing	6
Editorial Board	6
Investigation of microstructure, thermal properties, and mechanical performances of Ni-added Sn-5.0Sb-0.5Cu/Cu solder joints	6
Performance assessment and RUL prediction of power converters under the multiple components degradation	6
Passivation-layer thickness and field-plate optimization to obtain high breakdown voltage in AlGaN/GaN HEMTs with short gate-to-drain distance	6
Remaining useful life (RUL) regression using Long–Short Term Memory (LSTM) networks	6
Preparation of silver nanopowders and its application in low temperature electrically conductive adhesive	6
Synthesis and photoluminescence properties of Ce3+ and Tb3+ doped Na3Gd(PO4)2 phosphors for white LEDs	6
Thickness and metallization layer effect on interfacial and vertical cracking of sintered silver layer: A numerical investigation	6
Interface trap charge modeling of surrounding gate-engineered tubular channel junctionless MOSFET exploring temperature induced variations	6
Analyzing the electrical response of Au-GaAs Schottky diodes to proton irradiation at room temperature	6
Practical aspects of thermomechanical modeling in electronics packaging: A case study with a SiC power package	6
FEM analysis of a HF coreless transformer for automotive applications	6
A HCI-hardened self-healing operational amplifier circuit	6
A comprehensive investigation of total ionizing dose effects on bulk FinFETs through TCAD simulation	6
Performance degradation and reliability analysis of a MEMS flow sensor with accelerated degradation testing	6
A humidity-induced novel failure mechanism in power semiconductor diodes	6
Cross-scale finite element analysis of PCBA thermal cycling based on manufacturing history for more accurate fatigue life prediction of solder joints	6
Performance and reliability improvement of 905 nm high power laser diode by design, fabrication and characterization of high damage threshold mirrors	5
Microstructure and mechanical behavior of SnBi-xAg and SnBi-xAg@P-Cu solder joints during isothermal aging	5
Evaluating reliability against SEE of embedded systems: A comparison of RTOS and bare-metal approaches	5
Study on the interface mechanism of copper migration failure in solder mask-substrate package	5
Investigation on temperature limitation and failure mechanism of SiC MOSFETs under avalanche conditions	5
An equivalent circuit model of NBTI effect for short-channel P-MOSFET	5
Engineering application research on reliability prediction of the combined DC-DC power supply	5
Design optimization of a miniaturized thermoelectric generator via parametric model order reduction	5
Effect of Bi content and aging on solder joint shear properties considering strain rate	5
Electro-thermal stress minimisation of motor-drive inverter switches by hybrid modulation strategy technique	5
High-performance and space-qualified hybrid integrated circuit based on multi-group homogeneous gradient eutectic in quality conformance inspection	5
Online NBTI-induced partially depleted (PD) SOI degradation and recovery prediction utilizing long short-term memory (LSTM)	5
Electrical instabilities of a-IGZO TFTs under different conditions of bias and illumination stress	5
Effect of Sb content on the phase structure and interface structure of Sn1.0Ag0.5Cu lead-free solder	5
A survey on two-dimensional Error Correction Codes applied to fault-tolerant systems	5
Research progress of hybrid bonding technology for three-dimensional integration	5
Asymmetric aging effect on modern microprocessors	5
Thermal management in high-frequency, high-power density, solar PV integrated GaN converter system	5
Temperature distribution in multichip IGBT module and its impact on collector current sharing	5
Bonding wire characterization using non-destructive X-ray imaging	5