Microelectronics Reliability

Article	Citations
Soft sensor design for estimation of thermal behavior of encapsulating materials in power electronic module	83
Reliability assessment of miniaturised electromechanical RF relays for space applications	80
Study on annealing effect of bipolar transistors at different temperatures after total dose irradiation	50
Highly reliable Cu Cu low temperature bonding using SAC305 solder with rGO interlayer	36
Effect of high-temperature storage on the thermal conductivity of Cu nanoparticles/Bi-Sn hybrid bonding	34
Editorial Board	32
Editorial Board	30
Failure analysis on capacitor failures using simple circuit edit passive voltage contrast method	27
Breakdown voltage and TDDB performance improvement by optimizing the PECVD dielectric film characteristics in MIM capacitors	27
Boosting the thermal stability of paralleled GaAs HBTs through temperature-dependent ballasting resistors: A proof-of-concept study	26
A novel in-situ approach to monitor the variations in the on-resistance of power transistors during switching operation	25
DNN-based error level prediction for reducing read latency in 3D NAND flash memory	25
Investigation of the role of pre-existing oxide in the initial degradation mechanism in AlGaN/GaN HEMTs under ON-state stress	25
Laser voltage probing and simulation of a flip-flop with undesired quasi-static switching	24
Optical characterizations of “P-down” bonded InP pump lasers	24
Microstructure evolution and mechanical behavior of copper through‑silicon via structure under thermal cyclic loading	24
Quantitative analysis of void initiation in thermo-mechanical fatigue of polycrystalline copper films	24
Aging investigation of the latest standard dual power modules using improved interconnect technologies by power cycling test	23
Calibration methods and power cycling of double-side cooled SiC MOSFET power modules	23
A programmable checker for automated 2.5D/3D IC latch-up verification and hot junctions detection	23
A Π-shaped p-GaN HEMT for reliable enhancement mode operation	23
Modeling of the impact of mechanical stress resulted from wafer probing and wire bonding on circuit under pad	23
Investigating the solder mask defects impact on leakage current on PCB under condensing humidity conditions	22
Electrical deterioration of 4H-SiC MOS capacitors due to bulk and interface traps induced by proton irradiation	22
Correlative multimodal imaging and targeted lasering for automated high-precision IC decapsulation	22

Current balancing of parallel-connected silicon carbide (SiC) MOSFET power devices using peak detection via PCB sensors	21
Influence of phosphorus diffusion on the SiO2/4H-SiC (0001) interface during poly gate formation process	21
Simulation assessment of solder joint reliability for fully assembled printed circuit boards	21
DC and RF/analog performances of split source horizontal pocket and hetero stack TFETs considering interface trap charges: A simulation study	20
Effect of solder junction void variation in power semiconductor package on power cycle lifetime	20
Multistate time lag dynamic Bayesian networks model for reliability prediction of smart meters	20
Effect of microstructural variability on fatigue simulations of solder joints	20
The characterization of low-k thin films and their fracture analysis in a WLCSP device	20
Elucidating the large variation in ion diffusivity of microelectronic packaging materials	20
Investigation of microstructure, thermal properties, and mechanical performances of Ni-added Sn-5.0Sb-0.5Cu/Cu solder joints	19
High temperature reliability of pressureless sintered Cu joints for power SiC die attachment	19
Single event burnout failures caused in silicon and silicon carbide power devices by single alpha particles emitted from radioactive nuclides	19
New reliability model for power SiC MOSFET technologies under static and dynamic gate stress	19
Design optimization of a packaged thermoelectric generator for electrically active implants	19
Editorial Board	18
Interface traps in the sub-3 nm technology node: A comprehensive analysis and benchmarking of negative capacitance FinFET and nanosheet FETs - A reliability perspective from device to circuit level	18
A remaining useful life prediction method of aluminum electrolytic capacitor based on wiener process and similarity measurement	18
Condition monitoring for detection of humidity-induced failures in control electronics of power converters	17
Editorial Board	17
Ultra-fast recovery transients in GaN MIS-HEMT submitted to OFF-state stress	17
Microstructure and mechanical behavior of SnBi-xAg and SnBi-xAg@P-Cu solder joints during isothermal aging	17
Micro-Raman and SEM analyses of failed GaN HEMT multilayer architecture	17
Research on sintering process and thermal conductivity of hybrid nanosilver solder paste based on molecular dynamics simulation	16
Constructal design for the layout of multi-chip module based on thermal-flow-stress coupling calculation	16
Investigation of electromagnetic force effect in IGBT modules	16
Numerical simulation of reliability of 2.5D/3D package interconnect structure under temperature cyclic load	16
Evaluation of SEU impact on convolutional neural networks based on BRAM and CRAM in FPGAs	16
Effect of indentation depth and strain rate on mechanical properties of Sn0.3Ag0.7Cu	16
Thermal-mechanical analysis of copper pillar pitch size during reflow soldering assembly process	16
Correction factors to strength of thin silicon die in three- and four-point bending tests due to nonlinear effects	16
Performance assessment and RUL prediction of power converters under the multiple components degradation	16
Investigations on acceptable breakdown voltage variation of parallel-connected SiC MOSFETs applied to olid-state circuit breakers	15
Prognosis of LED lumen degradation using Bayesian optimized neural network approach	15
Thermal aging of power module assemblies based on ceramic heat sink and multilayers pressureless silver sintering	15
Sintering of mixed Cu Ag nanoparticles pretreated by formic acid vapor for Cu Cu low temperature bonding	15
In-field test solution for enhancing safety in automotive applications	15
Effect of Sb content on the phase structure and interface structure of Sn1.0Ag0.5Cu lead-free solder	15
Effect of indium content and carrier distribution on the efficiency and reliability of InGaN/GaN-based multi quantum well light emitting diode	15
Repetitive short circuit capability of SiC MOSFET at specific low gate-source voltage bias for more robust extreme operation	14
Mission profile-based digital twin framework using functional mock-up interfaces for assessing system's degradation behaviour	14
Influence mechanism of solder aging and thermal network model optimization of multi-chip IGBT modules	14
Impact of proton-induced total ionizing dose effects on electrical characteristics and safe operating area of trench field-stop IGBT devices	14
Tilt- and warpage measurement as inline quality assessment tool	14
Effects of the hardness and roughness on the plastic deformation properties of electroplated gold bumps during thermocompression bonding	14
Numerical modeling of FS-trench IGBTs by TCAD and its parameter extraction method	14
Evaluation of the helium hermeticity reliability of copper through-glass vias	14
Investigation on the microstructure, mechanical properties and chlorine resistance of fine aluminum alloy wires	14
Morphology and reliability aspects of 40 nm eSTM™ architecture	13
Impact of aging on temperature measurements performed using a resistive temperature sensor with sensor-to-microcontroller direct interface	13
Temperature effects on the conducted emission of a high-side switch	13

An efficient structure to improve the reliability of deep neural networks on ARMs	13
Composite powders with carbon nanotubes for laser printing of electronics	13
Cluster-aware allocation of spare TSVs for enhanced reliability in 3D ICs	13
Sintering of SiC chip via Au80Sn20 solder and its joint strength and thermomechanical reliability	13
An investigation on IGBT junction temperature estimation using online regression method	13
Electroplated Ni-P film for power devices without cracks induced by high temperature heating	13
Non-destructive fault diagnosis of electronic interconnects by learning signal patterns of reflection coefficient in the frequency domain	13
Proceedings of the 32nd European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis	13
Editorial Board	13
Effect of load sequence interaction for low ∆T's on the reliability of bonded aluminum wires in IGBTs	13
Detailed total ionizing dose effects on LDMOS transistors	13
Failure degradation similarities on power SiC MOSFET devices submitted to short-circuit stress and accelerated switching conditions	13
Accuracy estimation of low-current voltage drop method for junction temperature monitoring under DC power cycling	13
Investigation on vibration induced fretting in degraded contact interface	12
New temperature-independent aging indicator for power semiconductor devices – Application to IGBTs	12
Online monitoring of IGBT modules based on creating the non-interventional monitoring environment	12
Shear strength and fracture analysis of Sn-9Zn-2.5Bi-1.5In and Sn-3.0Ag-0.5Cu pastes with Cu-substrate joints under different reflow times	12
Research on equivalent modeling and model testing verification methods for material mechanics parameters of TXV structure	12
Editorial Board	12
Electron-beam-induced current (EBIC) imaging technique to quicken polysilicon defect localization in MOSFETs	12
Multi-objective optimal design of thermal-vibration stress and return loss of TSV interconnect structures based on response surface-NSWOA optimization algorithm	12
Exploring the radiant impact of irradiance on the electrical resistance of organic thin film	12
Compatibility study of no-clean flux residue and conformal coatings using two electrode electrochemical impedance method	12
Toward a multi-physical approach to connection ageing in power modules	12
Application of deuterium oxide (D2O) isotope tracing technique for encapsulated QFN failure analysis	12
Long-term (8000 h) reliability and failures of high-power LEDs for outdoor lighting stressed at high ambient temperatures	12
A fault-tolerant reconfiguration system based on pilot switch for grid-connected inverters	12
Crosstalk optimization and gate oxide reliability analysis in intercalation doped MLGNR with reduced vertical thickness	12
Enhanced reliability of phosphor-converted white light-emitting diodes based on a laser-cured silicone encapsulant layer	12
Extensive fault emulation on RFID tags for fault tolerance and security evaluation	12
High-power microwave pulse induced failure on InGaP/GaAs heterojunction bipolar transistor	11
Dynamic wetting and spreading mechanisms of SAC305 with added Au elements in the laser jet weld ball bonding process	11
Experiments, constitutive modeling, and simulations on the creep behavior of the AgSn transient liquid phase metallic bonds	11
Reliability evaluation of FPGA based pruned neural networks	11
Methodology of backside preparation applied on a MRAM to lead a logical investigation with a near-field probe	11
Editorial Board	11
Characterization of a novel radiation hardened by design (RHD14) bit-cell based on 20-nm FinFET technology using TCAD simulations	11
Testing and simulation of lifetime for wire bond interconnections with varying bond foot angle	11
On the sizing of PV inverters with reactive power capability to regulate power factor: A reliability approach	11
Optimization of the drain-side configuration in ESD-protection SCR-LDMOS for high holding-voltage applications	11
Physics-informed Markov chains for remaining useful life prediction of wire bonds in power electronic modules	11
Editorial Board	11
NSFET performance optimization through SiGe channel design - A simulation study	11
Optical, electrical, and mechanical reliability of 1700 PPI Micro-LED device	11
Performance investigation and impact of trap charges on novel lateral dual gate oxide-bilateral tunnelling based field effect transistor	11
DC and RF aging test of AlGaN/GaN HEMT technology on SiC substrate	11
Design of compact-diode-SCR with low-trigger voltage for full-chip ESD protection	11
Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging	11
Amalgam illogical controller design using amended moth system for heat reduction in insulated gate bipolar transistor	11
Underfill material property dependence of lifetime and mechanical behavior of BGA package: EBSD and FEM investigations	11
On-line temperature measurement during power cycle of PCB-embedded diode	10
Design of an energy-efficient soft error resilient RHBD SRAM cell with high read stability and minimum write errors	10
Influence of LDD spacers on total ionizing dose response of the transconductance for bulk MOSFETs working at cryogenic temperatures	10
A soft-error-tolerant, 1.25 GHz to 3.125 GHz, 3.18 ps RMS-jitter CPPLL in 40 nm CMOS process	10
Influence of normal load, electric current and sliding speed on tribological performance of electrical contact interface	10
Experimental study and signal analysis of acoustic emission from power MOSFET	10
Material level analytical model of total ionizing dose induced DC characteristics shift for FDSOI IC design	10
Vulnerability evaluation on 16 nm FinFET Ultrascale+ MPSoC using fault injection and proton irradiation	10
Application-aware aging analysis and mitigation for SRAM Design-for-Relability	10
An online junction temperature detection circuit for SiC MOSFETs considering threshold voltage drift compensation	10
Hot electron effects in AlGaN/GaN HEMTs during hard-switching events	10
A high-efficiency aging test with new data processing method for semiconductor device	10
Research on ESD failure voltage model of the T-shaped wiring structure in GOA products	10
Software-controlled pipeline parity in GPU architectures for error detection	10
Terminal strength test of TO-220 packaged Schottky barrier diode using finite element method	10
Influence of electron beam irradiation induced charging-effect on nanoprobing localization of a crystal defect in MOSFET	9
Application of artificial neural networks to the identification of weak electrical regions in large area MIM structures	9
ESD Human Body Model step stress distributions of GaN HEMTs and the correlation with one level test results	9
Aging modelling of Li-ion battery systems based on accelerated tests	9
Large area bare Cu-Cu interconnection using micro-Cu paste at different sintering temperatures and pressures	9
Novel testability modelling and diagnosis method considering the supporting relation between faults and tests	9
Long-term capacitance variation characteristics, law extraction, single and collaborative prediction of film capacitors at room temperature and humidity	9
Failure mechanism and life estimate of metallized film capacitor under high temperature and humidity	9
Hot-carrier evaluation of a zero-cost transistor developed via process optimization in an embedded non-volatile memory CMOS technology	9
Impact of an AlGaN spike in the buffer in 0.15 μm AlGaN/GaN HEMTs during step stress	9
An Eigendecomposition-based dynamic characteristics design method of three-phase grid-connected inverters with considering reliability	9
Thermo-mechanical optimization of ceramic substrate with through ceramic vias by Taguchi-Grey method	9
A PMOS-embedded low-voltage triggered silicon controlled rectifier ESD protection device for 3.3V I/O application	9
Failure rate analysis of radiation tolerant design techniques on SRAM-based FPGAs	9
Calibration and efficient evaluation of electromigration lifetime for interconnect wire sizing of multi-port networks	9

Thermal reliability of Cu sintering joints for high-temperature die attach	9
The effect of Si3N4/Al2O3 stacked structure of AlGaN/GaN HEMTs	9
Electrothermal power cycling of GaN and SiC cascode devices	9
Evaluation of the impact of defects on threshold voltage drift employing SiO2 pMOS transistors	9
Epitaxial hillocks defects caused by subsurface damage from InAs substrate	9
Electrical characterization and temperature reliability of 4H-SiC Schottky barrier diodes after Electron radiation	9
A shared page-aware machine learning assisted method for predicting and improving multi-level cell NAND flash memory life expectancy	9
The thickness and width of the intrinsic region effected electrical properties of GaAs p-i-n photodiodes	9
Impact of heat treatment on the lifetime of wire-bonded power modules	9
Physics-of-failure based lifetime modelling for SiC based automotive power modules using rate- and temperature-dependent modelling of sintered silver	9
Carbon ion implantation as healing strategy for improved reliability in phase-change memory arrays	9
Assessing thermal resistance as a degradation metric for solder bump arrays in discrete SiC MOSFET packages	9
Evaluation of bonding techniques for ultrasound transducers	9
Enhanced gate biasing resilience in asymmetric and double trench SiC MOSFETs towards generalized highly reliable power electronics	9
Characterization of single-event transients induced by high LET heavy ions in 16 nm bulk FinFET inverter chains	8
Fault and self-repair for high reliability in die-to-die interconnection of 2.5D/3D IC	8
Aggravated NBTI reliability due to hard-to-detect open defects	8
Improved HV-H3TRB robustness of a 1700 V IGBT chip set in standard power modules	8
Experimental analysis on stochastic behavior of preswitching time in STT-MRAM	8
Vulcanization failure mechanism analysis of lead-frame LED package	8
Prediction of the electrochemical migration induced failure on power PCBs under humidity condition — A case study	8
Impact reliability analysis of a rigid-flex PCB system under acceleration loads	8
Hybrid domain-based fast transient thermal evaluation method for power semiconductor modules in EV motor drive	8
Exploring the fracture mechanism of multilayer ceramic capacitors via combined simulation and experiment	8
Isolation properties and failure mechanisms of vertical Pt / n-GaN SBDs	8
A review on warpage measurement metrologies for advanced electronic packaging	8
Observation framework of errors in microprocessors with machine learning location inference of radiation-induced faults	8
Evaluating reliability through soft error triggered exceptions at ARM Cortex-A9 microprocessor	8
Characteristics and avalanche investigation of SiC VDMOSFETs with enhanced P-Based implantation	8
Fault-tolerant multiplier using self-healing technique	8
Study on high power microwave nonlinear effects and degradation characteristics of C-band low noise amplifier	8
Crack propagation in ultrasonic-bonded copper wires investigated by power cycling and accelerated mechanical fatigue interconnection test methods	8
Analysis of solder joint degradation and output power drop in silicon photovoltaic modules for reliability improvement	8
Thermomechanical model of an oxide-confined GaAs-based VCSEL emitter	8
Influence of different test strategies on the power cycling test results of 6.5 kV SiC MOSFETs	8
Developed non-destructive verification methods for accelerated temperature cycling of power MOSFETs	8
Towards development of an intelligent failure analysis system based on infrared thermography	8
Advanced power cycling test strategies on discrete SiC MOSFETs in different operating modes and the impact on lifetime	8
Evaluating softcore GPU in SRAM-based FPGA under radiation-induced effects	8
Microelectronics Reliability: Publisher’s note	8
OFF-state breakdown and threshold voltage stability of vertical GaN-on-Si trench MOSFETs	8
Wavelet-based rapid identification of IGBT switch breakdown in voltage source converter	7
New methodology for optimal preconditioning of GaN HEMT devices	7
Single event burnout of SiC MOSFET induced by atmospheric neutrons	7
Thermo-mechanical modeling of stacked die flash memory package EMI shielding layer crack under thermal cycling test	7
Reduced-order model for solder balls – Potential of projection-based approaches for representing viscoplastic behavior	7
Design of soft error correction flip-flop cells for highly reliable applications	7
Changes in the extraction and collection efficiency of GaN-based MQW solar cells under optical step-stress	7
Electro-thermal stress minimisation of motor-drive inverter switches by hybrid modulation strategy technique	7
Comparative study: AutoDPR-SEM for enhancing CNN reliability in SRAM-based FPGAs through autonomous reconfiguration	7
Squeeze-out and bond strength of patterned Cu Sn SLID seal-frames	7
A methodology to calculate the equivalent static loading for simulating electronic assemblies under impact	7
Morphological characterization of 325 mesh-grinding-induced defects on silicon wafer surface	7
Editorial Board	7
Improved failure analysis in scanning acoustic microscopy via advanced signal processing techniques	7
Understanding board level vibrations in automotive electronic modules	7
Influence of Interface Traps on MOSFET thermal coefficients and its effects on the ZTC current	7
Mobile ions entering the IGBT gate oxide - electrical detection and failure localization by lock-in thermography	7
Design and power optimization of a QCA-based universal reversible logic gate architecture using cell interaction approach	7
Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin	7
Origin of trap assisted tunnelling in ammonia annealed SiC trench MOSFETs	7
Evidence of resistive switching in SiNx thin films for MEMS capacitors: The role of metal contacts	7
BP neural network for non-invasive IGBT junction temperature online detection	7
Effects of Ga alloying on microstructure and comprehensive performances of Sn–9Zn–2Bi alloys for the microelectronics industry	7
Micro-additives and their impact on tensile and fracture performance of solder	7
Modeling of MEMS Electrothermal Microgripper employing POD-DEIM and POD method	7
Improvement of sensitivity for power cycle degradation by a new device structure	7
Single event effects hardening in SiC double-trench MOSFETs	7
Cost-effective reliability enhancement for video stitching applications based on error-tolerance	7
Editorial Board	7
Investigation of ESD protection devices for SiC-based monolithic integrated circuits	7
Experimental and simulative study of warpage behavior for fan-out wafer-level packaging	7
Revisiting the effectiveness of diamond heat spreaders on multi-finger gate GaN HEMT using chip-to-package-level thermal simulation	7
Comprehensive investigation on different ions of geostationary orbit induced single event burnout in GaN HEMT power devices	7
A cost-effective repair scheme for clustered TSV defects in 3D ICs	7
Editorial Board	7
Study on proton-induced single event effect of SiC diode and MOSFET	7
Fatigue performance and microstructure of lead-free solder joints in BGA assembly at room temperature	7
Thermal cycling reliability of electronic components in bolted assemblies: A study of the influence of bolt position	7
System in package: Advanced FA techniques to minimize analysis time and cost	7
Analysis of the stress state in QFN package during four point bending and temperature experiments utilizing piezoresistive stress sensor	7
A non-volatile and radiation-hardened SRAM based on fourteen transistors and two perpendicular anisotropy magnetic tunnel junctions	7
Analysis of the impact of power loss due to snail trails in a 95-kWp photovoltaic power system	7
Degradation modeling of InGaAs/InP avalanche photodiodes using calibrated technology computer-aided design	7
Sixer: A low-overhead, fully-distributed test scheme with guaranteed delivery of packets in networks-on-chip	7
Editorial Board	7
Preliminary 2D elastoplastic modeling of gate cracking in SiC MOSFETs under short-circuit conditions across a wide temperature-range using rankine's damage energetic approach	7
Time-dependent statistical NBTI model for aging assessment in circuit level implemented with open model interface	7
Robust resistive switching characteristics of AlOx CBRAM using simple and cost-effective thermal evaporation process	7
Interphase effect on the effective moisture diffusion in epoxy–SiO2 composites	7
Charge deposition analysis of heavy-ion-induced single-event burnout in low-voltage power VDMOSFET	7
Dynamic EFI and circuit analysis case studies on integrated circuit buried via void defects	7
Over-voltage and cross-conduction hard switching stress on schottky gate-type p-GaN HEMT in half-bridge operation. Experimental and physical approaches	7
Effect of gate oxide thickness on gate latent damage induced by heavy ion in SiC power MOSFETs	7
Memoryless linearity in undoped and B-doped graphene FETs: A relative investigation to report improved reliability	7