Microelectronics Reliability

Article	Citations
Multistate time lag dynamic Bayesian networks model for reliability prediction of smart meters	48
Elucidating the large variation in ion diffusivity of microelectronic packaging materials	46
Single event burnout failures caused in silicon and silicon carbide power devices by single alpha particles emitted from radioactive nuclides	42
Evaluating switch lifetime in soft-switched single-stage differential-mode SST	35
Interface traps in the sub-3 nm technology node: A comprehensive analysis and benchmarking of negative capacitance FinFET and nanosheet FETs - A reliability perspective from device to circuit level	34
A Π-shaped p-GaN HEMT for reliable enhancement mode operation	34
Editorial Board	33
Reliability assessment of miniaturised electromechanical RF relays for space applications	33
Correlative multimodal imaging and targeted lasering for automated high-precision IC decapsulation	32
A novel in-situ approach to monitor the variations in the on-resistance of power transistors during switching operation	31
Investigation of the role of pre-existing oxide in the initial degradation mechanism in AlGaN/GaN HEMTs under ON-state stress	31
New reliability model for power SiC MOSFET technologies under static and dynamic gate stress	31
Laser voltage probing and simulation of a flip-flop with undesired quasi-static switching	31
DC and RF/analog performances of split source horizontal pocket and hetero stack TFETs considering interface trap charges: A simulation study	29
Study on annealing effect of bipolar transistors at different temperatures after total dose irradiation	28
Editorial Board	28
Effect of solder junction void variation in power semiconductor package on power cycle lifetime	28
Failure analysis on capacitor failures using simple circuit edit passive voltage contrast method	27
The characterization of low-k thin films and their fracture analysis in a WLCSP device	27
Boosting the thermal stability of paralleled GaAs HBTs through temperature-dependent ballasting resistors: A proof-of-concept study	26
A physics-based electromigration model for advanced interconnects	26
Investigating the solder mask defects impact on leakage current on PCB under condensing humidity conditions	25
Impacts and mitigation strategies of process-induced packaging defects for enhancing reliability of power devices	25
Electrical deterioration of 4H-SiC MOS capacitors due to bulk and interface traps induced by proton irradiation	25
A remaining useful life prediction method of aluminum electrolytic capacitor based on wiener process and similarity measurement	25

Breakdown voltage and TDDB performance improvement by optimizing the PECVD dielectric film characteristics in MIM capacitors	24
Calibration methods and power cycling of double-side cooled SiC MOSFET power modules	24
Aging investigation of the latest standard dual power modules using improved interconnect technologies by power cycling test	23
Simulation assessment of solder joint reliability for fully assembled printed circuit boards	23
DNN-based error level prediction for reducing read latency in 3D NAND flash memory	23
Design optimization of a packaged thermoelectric generator for electrically active implants	23
Influence of cooling conditions on the estimated power cycling lifetime of a large-area substrate solder joint in power modules	22
High temperature reliability of pressureless sintered Cu joints for power SiC die attachment	21
Effect of microstructural variability on fatigue simulations of solder joints	21
Modeling of the impact of mechanical stress resulted from wafer probing and wire bonding on circuit under pad	21
Current balancing of parallel-connected silicon carbide (SiC) MOSFET power devices using peak detection via PCB sensors	21
Theoretical investigation of NBTI in P-LDMOS transistors using the four-state NMP model	21
Microstructure evolution and mechanical behavior of copper through‑silicon via structure under thermal cyclic loading	20
Editorial Board	19
Performance assessment and RUL prediction of power converters under the multiple components degradation	19
Editorial Board	19
Tilt- and warpage measurement as inline quality assessment tool	19
Investigation on the microstructure, mechanical properties and chlorine resistance of fine aluminum alloy wires	19
Impact of proton-induced total ionizing dose effects on electrical characteristics and safe operating area of trench field-stop IGBT devices	18
Evaluation of the helium hermeticity reliability of copper through-glass vias	18
Theoretical performance and reliability optimization of graphene based electrically doped tunnel FET under interface trap charge constraints: A device-level approach	18
Comprehensive study of hot-carrier stress in n-type logic CMOS devices at temperatures down to the deep-cryogenic regime	18
Mission profile-based digital twin framework using functional mock-up interfaces for assessing system's degradation behaviour	18
Sintering of mixed Cu Ag nanoparticles pretreated by formic acid vapor for Cu Cu low temperature bonding	18
Self-healing solder joints in power electronics: Experimental validation of die-attach void effects on reliability	18
Prognosis of LED lumen degradation using Bayesian optimized neural network approach	17
Condition monitoring for detection of humidity-induced failures in control electronics of power converters	17
Investigation of electromagnetic force effect in IGBT modules	17
Micro-Raman and SEM analyses of failed GaN HEMT multilayer architecture	17
In-field test solution for enhancing safety in automotive applications	17
Influence mechanism of solder aging and thermal network model optimization of multi-chip IGBT modules	16
Thermal-mechanical analysis of copper pillar pitch size during reflow soldering assembly process	16
Ultra-fast recovery transients in GaN MIS-HEMT submitted to OFF-state stress	16
Comparison of multiple AI models for failure classification in smart plug top case study	16
Degradation modeling considering multiple performance parameters degradation based on mixed effects models	16
Numerical modeling of FS-trench IGBTs by TCAD and its parameter extraction method	16
Evaluation of SEU impact on convolutional neural networks based on BRAM and CRAM in FPGAs	16
A BiLSTM-based digital twin model for photovoltaic strings under current mismatch condition	16
Effect of Sb content on the phase structure and interface structure of Sn1.0Ag0.5Cu lead-free solder	16
An efficient structure to improve the reliability of deep neural networks on ARMs	15
Effects of the hardness and roughness on the plastic deformation properties of electroplated gold bumps during thermocompression bonding	15
Investigation on vibration induced fretting in degraded contact interface	15
Editorial Board	15
Non-destructive fault diagnosis of electronic interconnects by learning signal patterns of reflection coefficient in the frequency domain	15
Impact of aging on temperature measurements performed using a resistive temperature sensor with sensor-to-microcontroller direct interface	15
Accuracy estimation of low-current voltage drop method for junction temperature monitoring under DC power cycling	15
Electroplated Ni-P film for power devices without cracks induced by high temperature heating	15
Application of deuterium oxide (D2O) isotope tracing technique for encapsulated QFN failure analysis	15
Failure degradation similarities on power SiC MOSFET devices submitted to short-circuit stress and accelerated switching conditions	15
Comparative analysis of mechanical and thermal stresses in ITO and AZO thin films on flexible PET substrates for flexible electronic applications	14

Effect of load sequence interaction for low ∆T's on the reliability of bonded aluminum wires in IGBTs	14
Crosstalk optimization and gate oxide reliability analysis in intercalation doped MLGNR with reduced vertical thickness	14
Compatibility study of no-clean flux residue and conformal coatings using two electrode electrochemical impedance method	14
Editorial Board	14
An FPGA-based architecture for time-resolved polarization probing of FeRAM fatigue	14
Cluster-aware allocation of spare TSVs for enhanced reliability in 3D ICs	14
Exploring the radiant impact of irradiance on the electrical resistance of organic thin film	14
Enhanced reliability of phosphor-converted white light-emitting diodes based on a laser-cured silicone encapsulant layer	14
Long-term (8000 h) reliability and failures of high-power LEDs for outdoor lighting stressed at high ambient temperatures	14
Design of compact-diode-SCR with low-trigger voltage for full-chip ESD protection	14
New temperature-independent aging indicator for power semiconductor devices – Application to IGBTs	14
Detailed total ionizing dose effects on LDMOS transistors	14
Multi-objective optimal design of thermal-vibration stress and return loss of TSV interconnect structures based on response surface-NSWOA optimization algorithm	14
A quantitative analysis and testing assessment method for functional damage state of electronic circuits under impact loads	14
Interlayer capacitance extraction for profiling interface states in LaB₆/H-diamond Schottky diodes	14
Composite powders with carbon nanotubes for laser printing of electronics	14
NSFET performance optimization through SiGe channel design - A simulation study	14
Characterization of a novel radiation hardened by design (RHD14) bit-cell based on 20-nm FinFET technology using TCAD simulations	13
On the sizing of PV inverters with reactive power capability to regulate power factor: A reliability approach	13
High-power microwave pulse induced failure on InGaP/GaAs heterojunction bipolar transistor	13
Underfill material property dependence of lifetime and mechanical behavior of BGA package: EBSD and FEM investigations	13
Uncertainty quantification in microelectronic packaging using feedback-enhanced adaptive polynomial chaos expansion	13
Amalgam illogical controller design using amended moth system for heat reduction in insulated gate bipolar transistor	13
Methodology of backside preparation applied on a MRAM to lead a logical investigation with a near-field probe	13
Microstructure and diffusion mechanisms in nano-Cu sintered joints during aging: Effects of joint size, porosity, and aging atmosphere	13
Testing and simulation of lifetime for wire bond interconnections with varying bond foot angle	13
Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging	13
Performance investigation and impact of trap charges on novel lateral dual gate oxide-bilateral tunnelling based field effect transistor	13
Experiments, constitutive modeling, and simulations on the creep behavior of the AgSn transient liquid phase metallic bonds	13
Toward a multi-physical approach to connection ageing in power modules	13
Physics-informed Markov chains for remaining useful life prediction of wire bonds in power electronic modules	12
Optical, electrical, and mechanical reliability of 1700 PPI Micro-LED device	12
Local stress distribution in sintered nanoporous silver films under mechanical and thermal loading	12
Dynamic wetting and spreading mechanisms of SAC305 with added Au elements in the laser jet weld ball bonding process	12
Accurate and efficient simulation of PCB warpage during manufacturing processes using partitioned equivalent model	12
Research on equivalent modeling and model testing verification methods for material mechanics parameters of TXV structure	12
Design of gate drive voltage for SiC MOSFETs considering gate oxide TDDB lifetime and performance	12
Accelerated lifetime estimation and failure analysis of micromachined humidity sensors under high temperature and high humidity conditions	12
Optimization of the drain-side configuration in ESD-protection SCR-LDMOS for high holding-voltage applications	12
DC and RF aging test of AlGaN/GaN HEMT technology on SiC substrate	12
Design of an energy-efficient soft error resilient RHBD SRAM cell with high read stability and minimum write errors	12
Thermo-mechanical optimization of ceramic substrate with through ceramic vias by Taguchi-Grey method	11
Electrical characterization and temperature reliability of 4H-SiC Schottky barrier diodes after Electron radiation	11
ESD Human Body Model step stress distributions of GaN HEMTs and the correlation with one level test results	11
Vulnerability evaluation on 16 nm FinFET Ultrascale+ MPSoC using fault injection and proton irradiation	11
Evaluation of the impact of defects on threshold voltage drift employing SiO2 pMOS transistors	11
Software-controlled pipeline parity in GPU architectures for error detection	11
A high-efficiency aging test with new data processing method for semiconductor device	11
Long-term capacitance variation characteristics, law extraction, single and collaborative prediction of film capacitors at room temperature and humidity	11
Physics-of-failure based lifetime modelling for SiC based automotive power modules using rate- and temperature-dependent modelling of sintered silver	11
Calibration and efficient evaluation of electromigration lifetime for interconnect wire sizing of multi-port networks	11
The effect of Si3N4/Al2O3 stacked structure of AlGaN/GaN HEMTs	11
An Eigendecomposition-based dynamic characteristics design method of three-phase grid-connected inverters with considering reliability	11
Influence of LDD spacers on total ionizing dose response of the transconductance for bulk MOSFETs working at cryogenic temperatures	11
Editorial Board	11
Effect of Ag addition on the microstructure and distribution of second-phase particles in tin-based solder alloys	11
A PMOS-embedded low-voltage triggered silicon controlled rectifier ESD protection device for 3.3V I/O application	11
A shared page-aware machine learning assisted method for predicting and improving multi-level cell NAND flash memory life expectancy	11
Assessing thermal resistance as a degradation metric for solder bump arrays in discrete SiC MOSFET packages	11
Editorial Board	11
Material level analytical model of total ionizing dose induced DC characteristics shift for FDSOI IC design	11
Terminal strength test of TO-220 packaged Schottky barrier diode using finite element method	11
Research on ESD failure voltage model of the T-shaped wiring structure in GOA products	11
Orbital validation for tin whisker suppression by conformal coating	11
Thermal reliability of Cu sintering joints for high-temperature die attach	11
Aging modelling of Li-ion battery systems based on accelerated tests	11
Influence of normal load, electric current and sliding speed on tribological performance of electrical contact interface	11
Failure rate analysis of radiation tolerant design techniques on SRAM-based FPGAs	10
Electrothermal power cycling of GaN and SiC cascode devices	10
An online junction temperature detection circuit for SiC MOSFETs considering threshold voltage drift compensation	10
Non-volatile SRAM based on emerging memory: A comprehensive review and reliability challenges	10
Evaluation of bonding techniques for ultrasound transducers	10
A non-volatile and radiation-hardened SRAM based on fourteen transistors and two perpendicular anisotropy magnetic tunnel junctions	10
Failure mechanism and life estimate of metallized film capacitor under high temperature and humidity	10
Structural optimization design of LTCC substrate and their impacts on thermal performances of system-in-package	10
The thickness and width of the intrinsic region effected electrical properties of GaAs p-i-n photodiodes	10
Large area bare Cu-Cu interconnection using micro-Cu paste at different sintering temperatures and pressures	10
Optimization and reliability of ultrasonic wedge bonding performance of copper wires on gold pads for MEMS devices	10
Reinforcement learning-based weighting factors auto-tuning for thermal management in assembled inverters	10
Enhanced gate biasing resilience in asymmetric and double trench SiC MOSFETs towards generalized highly reliable power electronics	10

Radiation effect in FD-SOI nanowire FETs due to high dose rate gamma-ray under variable irradiation temperatures	10
Multi-board parallel irradiation testing of neutron-induced soft errors in 16 nm FinFET and 22 nm planar FPGAs	10
Application-aware aging analysis and mitigation for SRAM Design-for-Relability	10
Thermal cycling reliability of electronic components in bolted assemblies: A study of the influence of bolt position	10
Characteristics and avalanche investigation of SiC VDMOSFETs with enhanced P-Based implantation	9
Crack propagation in ultrasonic-bonded copper wires investigated by power cycling and accelerated mechanical fatigue interconnection test methods	9
Observation framework of errors in microprocessors with machine learning location inference of radiation-induced faults	9
Experimental analysis on stochastic behavior of preswitching time in STT-MRAM	9
Isolation properties and failure mechanisms of vertical Pt / n-GaN SBDs	9
Aggravated NBTI reliability due to hard-to-detect open defects	9
Thermomechanical model of an oxide-confined GaAs-based VCSEL emitter	9
Effect of gate oxide thickness on gate latent damage induced by heavy ion in SiC power MOSFETs	9
Design of soft error correction flip-flop cells for highly reliable applications	9
Thermal-optical coupled reliability for micro-LED projection systems: Mechanistic modeling and parametric analysis	9
Single event burnout of SiC MOSFET induced by atmospheric neutrons	9
Advanced power cycling test strategies on discrete SiC MOSFETs in different operating modes and the impact on lifetime	9
Prediction of the electrochemical migration induced failure on power PCBs under humidity condition — A case study	9
Influence of electron beam irradiation induced charging-effect on nanoprobing localization of a crystal defect in MOSFET	9
Origin of trap assisted tunnelling in ammonia annealed SiC trench MOSFETs	9
An informer network-based circuit boards fault detection method using infrared temperature series	9
Experimental study of transient dose rate effect on radiation-hardened digital signal processor	9
Fault and self-repair for high reliability in die-to-die interconnection of 2.5D/3D IC	9
A review on warpage measurement metrologies for advanced electronic packaging	9
Effect of the load inductor on the avalanche ruggedness of 1200-volt silicon diodes during unclamped inductive switching	9
Epitaxial hillocks defects caused by subsurface damage from InAs substrate	9
Microelectronics Reliability: Publisher’s note	9
Hybrid domain-based fast transient thermal evaluation method for power semiconductor modules in EV motor drive	9
Exploring the fracture mechanism of multilayer ceramic capacitors via combined simulation and experiment	9
Fault-tolerant multiplier using self-healing technique	9
Vulcanization failure mechanism analysis of lead-frame LED package	9
Wavelet-based rapid identification of IGBT switch breakdown in voltage source converter	9
Facile polyol synthesis of thermally stable Ag Ni composite nanowires for flexible transparent heater applications	9
Influence of Interface Traps on MOSFET thermal coefficients and its effects on the ZTC current	8
Interphase effect on the effective moisture diffusion in epoxy–SiO2 composites	8
Sixer: A low-overhead, fully-distributed test scheme with guaranteed delivery of packets in networks-on-chip	8
Analysis of the stress state in QFN package during four point bending and temperature experiments utilizing piezoresistive stress sensor	8
Time-dependent statistical NBTI model for aging assessment in circuit level implemented with open model interface	8
Thermal and electrical characterization of flexible microheaters: Influence of material choice and geometry	8
Reduced-order model for solder balls – Potential of projection-based approaches for representing viscoplastic behavior	8
Micro-additives and their impact on tensile and fracture performance of solder	8
Towards development of an intelligent failure analysis system based on infrared thermography	8
Charge deposition analysis of heavy-ion-induced single-event burnout in low-voltage power VDMOSFET	8
A screening test of GaN-HEMTs for improvement of breakdown voltage uniformity	8
Failure mechanism of 4H-SiC junction barrier Schottky diodes under harsh thermal cycling stress	8
Study on the optimization of bending-vibration coupling stress of QFN solder joints based on Taguchi orthogonal experimental design and Harris Hawks Optimization algorithm	8
Electrical properties and application stability of the effects of La2O3 doping RuO2-CuO based resistive pastes with near-linear positive TCR	8
Editorial Board	8
Interfacial fracture behavior of polyimide/copper in RDL structures for advanced electronic packaging	8
Squeeze-out and bond strength of patterned Cu Sn SLID seal-frames	8
Evidence of resistive switching in SiNx thin films for MEMS capacitors: The role of metal contacts	8
Comprehensive investigation on different ions of geostationary orbit induced single event burnout in GaN HEMT power devices	8
Revisiting the effectiveness of diamond heat spreaders on multi-finger gate GaN HEMT using chip-to-package-level thermal simulation	8
Changes in the extraction and collection efficiency of GaN-based MQW solar cells under optical step-stress	8
Improved failure analysis in scanning acoustic microscopy via advanced signal processing techniques	8
Design and power optimization of a QCA-based universal reversible logic gate architecture using cell interaction approach	8
Fatigue performance and microstructure of lead-free solder joints in BGA assembly at room temperature	8
Implementation of high failure current Schottky-embedded DDSCR	8
Dynamic EFI and circuit analysis case studies on integrated circuit buried via void defects	8
Improvement of sensitivity for power cycle degradation by a new device structure	8
Humidity related failure mechanism of IGBTs considering dynamic avalanche	8
New methodology for optimal preconditioning of GaN HEMT devices	8
Improvement in bond wire reliability by adjustments in bond wire microstructure via heat treatment	8
Understanding board level vibrations in automotive electronic modules	8
Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin	8
Morphological characterization of 325 mesh-grinding-induced defects on silicon wafer surface	8
Mobile ions entering the IGBT gate oxide - electrical detection and failure localization by lock-in thermography	8
OFF-state breakdown and threshold voltage stability of vertical GaN-on-Si trench MOSFETs	8
Effects of Ga alloying on microstructure and comprehensive performances of Sn–9Zn–2Bi alloys for the microelectronics industry	8
Degradation modeling of InGaAs/InP avalanche photodiodes using calibrated technology computer-aided design	8
Editorial Board	8
BP neural network for non-invasive IGBT junction temperature online detection	8
Reliability assessment of graphene channel vertical TFET: Role of trap-assisted tunneling	8
The behaviour of 350 V GaN HEMTs during heavy ion irradiations	8
Research progress on the stability of transparent conductive films for silver nanowires	8
Cost-effective reliability enhancement for video stitching applications based on error-tolerance	8
System in package: Advanced FA techniques to minimize analysis time and cost	8
Investigation of ESD protection devices for SiC-based monolithic integrated circuits	8
Single-event burnout hardening of RC-IGBT with the raised N-buffer layer	7
Dependence between drain current saturation level and short-circuit robustness of p-GaN HEMTs	7
Research on the multi-physical field coupling modelling of IGBT package module and the effect of different structure failure interaction	7
Effect of proton irradiation damage on SnAg/Cu microbump simulation using Monte Carlo method	7
Two-step sub-modeling framework for thermomechanical fatigue analysis of solder joints in DRAM module	7
Effects of multi-factors on the junction temperature of LED automotive lamp chips	7
Study on interfacial reaction behavior of Sn Ag based lead-free solder with (111) single crystal copper substrate	7
PBO delamination and RDL corrosion detection on WLCSP package products	7
Power cycling tests under driving ΔTj = 125 °C on the Cu clip bonded EV power module	7
A reliability assessment methodology of system-in-package based virtual qualification	7
TID evaluation based on variabilities of space radiation and device failure dose in typical navigation satellite orbits	7
Preliminary 2D elastoplastic modeling of gate cracking in SiC MOSFETs under short-circuit conditions across a wide temperature-range using rankine's damage energetic approach	7
Study on single-event burnout hardening with reduction of hole current density by top polysilicon diode of SOI LDMOS based on TCAD simulations	7
Editorial Board	7
Experimental and simulative study of warpage behavior for fan-out wafer-level packaging	7
Long-term positive and negative gate bias stress tests on parallel connected SiC MOSFETs at −40 °C and 175 °C	7
Electrical modelisation of a bitflip in SRAM cell memory induced by laser fault injection	7
Low actuation voltage cantilever-type RF-MEMS shunt switches for 5G applications	7