Microelectronics Reliability

Article	Citations
New reliability model for power SiC MOSFET technologies under static and dynamic gate stress	75
The characterization of low-k thin films and their fracture analysis in a WLCSP device	74
Soft sensor design for estimation of thermal behavior of encapsulating materials in power electronic module	60
Aging investigation of the latest standard dual power modules using improved interconnect technologies by power cycling test	33
A programmable checker for automated 2.5D/3D IC latch-up verification and hot junctions detection	33
Study on annealing effect of bipolar transistors at different temperatures after total dose irradiation	29
Reliability assessment of miniaturised electromechanical RF relays for space applications	29
Highly reliable Cu Cu low temperature bonding using SAC305 solder with rGO interlayer	27
Modeling of the impact of mechanical stress resulted from wafer probing and wire bonding on circuit under pad	27
Editorial Board	26
Effect of high-temperature storage on the thermal conductivity of Cu nanoparticles/Bi-Sn hybrid bonding	26
Editorial Board	25
Failure analysis on capacitor failures using simple circuit edit passive voltage contrast method	25
Breakdown voltage and TDDB performance improvement by optimizing the PECVD dielectric film characteristics in MIM capacitors	25
Boosting the thermal stability of paralleled GaAs HBTs through temperature-dependent ballasting resistors: A proof-of-concept study	24
Single event burnout failures caused in silicon and silicon carbide power devices by single alpha particles emitted from radioactive nuclides	23
A novel in-situ approach to monitor the variations in the on-resistance of power transistors during switching operation	23
DNN-based error level prediction for reducing read latency in 3D NAND flash memory	22
A novel online 4-point rainflow counting algorithm for power electronics	22
Investigation of the role of pre-existing oxide in the initial degradation mechanism in AlGaN/GaN HEMTs under ON-state stress	22
Effect of solder junction void variation in power semiconductor package on power cycle lifetime	21
Investigating the solder mask defects impact on leakage current on PCB under condensing humidity conditions	21
Electrical deterioration of 4H-SiC MOS capacitors due to bulk and interface traps induced by proton irradiation	21
Investigation of microstructure, thermal properties, and mechanical performances of Ni-added Sn-5.0Sb-0.5Cu/Cu solder joints	21
Effect of microstructural variability on fatigue simulations of solder joints	21

Multistate time lag dynamic Bayesian networks model for reliability prediction of smart meters	20
Simulation assessment of solder joint reliability for fully assembled printed circuit boards	20
Quantitative analysis of void initiation in thermo-mechanical fatigue of polycrystalline copper films	20
Optical characterizations of “P-down” bonded InP pump lasers	20
Microstructure evolution and mechanical behavior of copper through‑silicon via structure under thermal cyclic loading	20
Interface traps in the sub-3 nm technology node: A comprehensive analysis and benchmarking of negative capacitance FinFET and nanosheet FETs - A reliability perspective from device to circuit level	20
High temperature reliability of pressureless sintered Cu joints for power SiC die attachment	19
Influence of phosphorus diffusion on the SiO2/4H-SiC (0001) interface during poly gate formation process	19
Calibration methods and power cycling of double-side cooled SiC MOSFET power modules	19
Accelerative reliability tests for Sn3.0Ag0.5Cu solder joints under thermal cycling coupling with current stressing	19
Laser voltage probing and simulation of a flip-flop with undesired quasi-static switching	19
Correlative multimodal imaging and targeted lasering for automated high-precision IC decapsulation	18
Design optimization of a packaged thermoelectric generator for electrically active implants	18
Current balancing of parallel-connected silicon carbide (SiC) MOSFET power devices using peak detection via PCB sensors	18
DC and RF/analog performances of split source horizontal pocket and hetero stack TFETs considering interface trap charges: A simulation study	18
A Π-shaped p-GaN HEMT for reliable enhancement mode operation	18
A remaining useful life prediction method of aluminum electrolytic capacitor based on wiener process and similarity measurement	18
Microstructure and mechanical behavior of SnBi-xAg and SnBi-xAg@P-Cu solder joints during isothermal aging	17
Elucidating the large variation in ion diffusivity of microelectronic packaging materials	17
Editorial Board	17
Editorial Board	16
Influence mechanism of solder aging and thermal network model optimization of multi-chip IGBT modules	16
In-field test solution for enhancing safety in automotive applications	16
Investigation on the microstructure, mechanical properties and chlorine resistance of fine aluminum alloy wires	16
Investigation of electromagnetic force effect in IGBT modules	15
Impact of proton-induced total ionizing dose effects on electrical characteristics and safe operating area of trench field-stop IGBT devices	15
Performance assessment and RUL prediction of power converters under the multiple components degradation	15
Numerical modeling of FS-trench IGBTs by TCAD and its parameter extraction method	15
Investigations on acceptable breakdown voltage variation of parallel-connected SiC MOSFETs applied to olid-state circuit breakers	15
Numerical simulation of reliability of 2.5D/3D package interconnect structure under temperature cyclic load	15
Effect of Sb content on the phase structure and interface structure of Sn1.0Ag0.5Cu lead-free solder	15
Short term reliability and robustness of ultra-thin barrier, 110 nm-gate AlN/GaN HEMTs	15
Evaluation of the helium hermeticity reliability of copper through-glass vias	14
Research on sintering process and thermal conductivity of hybrid nanosilver solder paste based on molecular dynamics simulation	14
Tilt- and warpage measurement as inline quality assessment tool	14
Repetitive short circuit capability of SiC MOSFET at specific low gate-source voltage bias for more robust extreme operation	14
Sintering of mixed Cu Ag nanoparticles pretreated by formic acid vapor for Cu Cu low temperature bonding	14
Effect of indium content and carrier distribution on the efficiency and reliability of InGaN/GaN-based multi quantum well light emitting diode	14
Prognosis of LED lumen degradation using Bayesian optimized neural network approach	14
Thermal aging of power module assemblies based on ceramic heat sink and multilayers pressureless silver sintering	14
Effect of indentation depth and strain rate on mechanical properties of Sn0.3Ag0.7Cu	14
Mission profile-based digital twin framework using functional mock-up interfaces for assessing system's degradation behaviour	14
Correction factors to strength of thin silicon die in three- and four-point bending tests due to nonlinear effects	14
Constructal design for the layout of multi-chip module based on thermal-flow-stress coupling calculation	13
Electron-beam-induced current (EBIC) imaging technique to quicken polysilicon defect localization in MOSFETs	13
Proceedings of the 32nd European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis	13
Compatibility study of no-clean flux residue and conformal coatings using two electrode electrochemical impedance method	13
Evaluation of SEU impact on convolutional neural networks based on BRAM and CRAM in FPGAs	13
Effects of the hardness and roughness on the plastic deformation properties of electroplated gold bumps during thermocompression bonding	13
Effect of intrinsic PCB parameters on the performance of fluoropolymer coating under condensing humidity conditions	13

Morphology and reliability aspects of 40 nm eSTM™ architecture	13
A reliability assessment approach for a Hodgkin-Huxley neuron circuit	13
An investigation on IGBT junction temperature estimation using online regression method	13
Enhanced reliability of phosphor-converted white light-emitting diodes based on a laser-cured silicone encapsulant layer	13
Cluster-aware allocation of spare TSVs for enhanced reliability in 3D ICs	13
Sintering of SiC chip via Au80Sn20 solder and its joint strength and thermomechanical reliability	12
Composite powders with carbon nanotubes for laser printing of electronics	12
Online monitoring of IGBT modules based on creating the non-interventional monitoring environment	12
A fast Binary Decision Diagram (BDD)-based reversible logic optimization engine driven by recent meta-heuristic reordering algorithms	12
Accuracy estimation of low-current voltage drop method for junction temperature monitoring under DC power cycling	12
Editorial Board	12
Exploring the radiant impact of irradiance on the electrical resistance of organic thin film	12
Application of deuterium oxide (D2O) isotope tracing technique for encapsulated QFN failure analysis	12
Failure degradation similarities on power SiC MOSFET devices submitted to short-circuit stress and accelerated switching conditions	12
Detailed total ionizing dose effects on LDMOS transistors	12
Investigation on vibration induced fretting in degraded contact interface	12
Electroplated Ni-P film for power devices without cracks induced by high temperature heating	12
A fault-tolerant reconfiguration system based on pilot switch for grid-connected inverters	12
Non-destructive fault diagnosis of electronic interconnects by learning signal patterns of reflection coefficient in the frequency domain	12
Temperature effects on the conducted emission of a high-side switch	12
An efficient structure to improve the reliability of deep neural networks on ARMs	12
Molecular dynamic study for concentration-dependent volume relaxation of vacancy	11
Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging	11
New temperature-independent aging indicator for power semiconductor devices – Application to IGBTs	11
Experimental study and signal analysis of acoustic emission from power MOSFET	11
Extensive fault emulation on RFID tags for fault tolerance and security evaluation	11
Editorial Board	11
Toward a multi-physical approach to connection ageing in power modules	11
Hot electron effects in AlGaN/GaN HEMTs during hard-switching events	11
Multi-objective optimal design of thermal-vibration stress and return loss of TSV interconnect structures based on response surface-NSWOA optimization algorithm	11
Crosstalk optimization and gate oxide reliability analysis in intercalation doped MLGNR with reduced vertical thickness	11
Dynamic wetting and spreading mechanisms of SAC305 with added Au elements in the laser jet weld ball bonding process	11
Testing and simulation of lifetime for wire bond interconnections with varying bond foot angle	11
Editorial Board	11
Research on equivalent modeling and model testing verification methods for material mechanics parameters of TXV structure	11
Long-term (8000 h) reliability and failures of high-power LEDs for outdoor lighting stressed at high ambient temperatures	11
Shear strength and fracture analysis of Sn-9Zn-2.5Bi-1.5In and Sn-3.0Ag-0.5Cu pastes with Cu-substrate joints under different reflow times	11
Reliability evaluation of FPGA based pruned neural networks	11
On the sizing of PV inverters with reactive power capability to regulate power factor: A reliability approach	11
Amalgam illogical controller design using amended moth system for heat reduction in insulated gate bipolar transistor	11
Assessing thermal resistance as a degradation metric for solder bump arrays in discrete SiC MOSFET packages	10
On-line temperature measurement during power cycle of PCB-embedded diode	10
Optical, electrical, and mechanical reliability of 1700 PPI Micro-LED device	10
Underfill material property dependence of lifetime and mechanical behavior of BGA package: EBSD and FEM investigations	10
NSFET performance optimization through SiGe channel design - A simulation study	10
Performance investigation and impact of trap charges on novel lateral dual gate oxide-bilateral tunnelling based field effect transistor	10
High-power microwave pulse induced failure on InGaP/GaAs heterojunction bipolar transistor	10
Impact of heat treatment on the lifetime of wire-bonded power modules	10
Vulnerability evaluation on 16 nm FinFET Ultrascale+ MPSoC using fault injection and proton irradiation	10
Experiments, constitutive modeling, and simulations on the creep behavior of the AgSn transient liquid phase metallic bonds	10
Editorial Board	10
Characterization of a novel radiation hardened by design (RHD14) bit-cell based on 20-nm FinFET technology using TCAD simulations	10
Material level analytical model of total ionizing dose induced DC characteristics shift for FDSOI IC design	10
A high-efficiency aging test with new data processing method for semiconductor device	10
Influence of LDD spacers on total ionizing dose response of the transconductance for bulk MOSFETs working at cryogenic temperatures	10
Methodology of backside preparation applied on a MRAM to lead a logical investigation with a near-field probe	10
Physics-informed Markov chains for remaining useful life prediction of wire bonds in power electronic modules	10
Evaluating the moisture resistance of Y3Al5O12: Ce3+ phosphor used in high power white LED packaging	10
Design of compact-diode-SCR with low-trigger voltage for full-chip ESD protection	10
Experimental analysis on estimating junction temperature and service life of high power LED array	10
Optimization of the drain-side configuration in ESD-protection SCR-LDMOS for high holding-voltage applications	10
Terminal strength test of TO-220 packaged Schottky barrier diode using finite element method	9
An online junction temperature detection circuit for SiC MOSFETs considering threshold voltage drift compensation	9
Application-aware aging analysis and mitigation for SRAM Design-for-Relability	9
Software-controlled pipeline parity in GPU architectures for error detection	9
The effect of Si3N4/Al2O3 stacked structure of AlGaN/GaN HEMTs	9
Thermal reliability of Cu sintering joints for high-temperature die attach	9
The impact of parasitic inductance on the dV/dt ruggedness of 4H-SiC Schottky diodes	9
Research on ESD failure voltage model of the T-shaped wiring structure in GOA products	9
A soft-error-tolerant, 1.25 GHz to 3.125 GHz, 3.18 ps RMS-jitter CPPLL in 40 nm CMOS process	9
The thickness and width of the intrinsic region effected electrical properties of GaAs p-i-n photodiodes	9
Electrical characterization and temperature reliability of 4H-SiC Schottky barrier diodes after Electron radiation	9
Failure mechanism and life estimate of metallized film capacitor under high temperature and humidity	9
Calibration and efficient evaluation of electromigration lifetime for interconnect wire sizing of multi-port networks	9
A shared page-aware machine learning assisted method for predicting and improving multi-level cell NAND flash memory life expectancy	9
Physics-of-failure based lifetime modelling for SiC based automotive power modules using rate- and temperature-dependent modelling of sintered silver	9
Large area bare Cu-Cu interconnection using micro-Cu paste at different sintering temperatures and pressures	9
Thermo-mechanical optimization of ceramic substrate with through ceramic vias by Taguchi-Grey method	9
Evaluation of bonding techniques for ultrasound transducers	9
Long-term capacitance variation characteristics, law extraction, single and collaborative prediction of film capacitors at room temperature and humidity	9

An Eigendecomposition-based dynamic characteristics design method of three-phase grid-connected inverters with considering reliability	9
Novel testability modelling and diagnosis method considering the supporting relation between faults and tests	8
Evaluation of the impact of defects on threshold voltage drift employing SiO2 pMOS transistors	8
Influence of electron beam irradiation induced charging-effect on nanoprobing localization of a crystal defect in MOSFET	8
Micro-additives and their impact on tensile and fracture performance of solder	8
A PMOS-embedded low-voltage triggered silicon controlled rectifier ESD protection device for 3.3V I/O application	8
Improved HV-H3TRB robustness of a 1700 V IGBT chip set in standard power modules	8
Influence of normal load, electric current and sliding speed on tribological performance of electrical contact interface	8
Analysis of the impact of power loss due to snail trails in a 95-kWp photovoltaic power system	8
Experimental analysis on stochastic behavior of preswitching time in STT-MRAM	8
Thermomechanical model of an oxide-confined GaAs-based VCSEL emitter	8
Electrothermal power cycling of GaN and SiC cascode devices	8
Hot-carrier evaluation of a zero-cost transistor developed via process optimization in an embedded non-volatile memory CMOS technology	8
Impact of an AlGaN spike in the buffer in 0.15 μm AlGaN/GaN HEMTs during step stress	8
A non-volatile and radiation-hardened SRAM based on fourteen transistors and two perpendicular anisotropy magnetic tunnel junctions	8
Vulcanization failure mechanism analysis of lead-frame LED package	8
Carbon ion implantation as healing strategy for improved reliability in phase-change memory arrays	8
Aggravated NBTI reliability due to hard-to-detect open defects	8
A simulation-based analysis of effect of interface trap charges on dc and analog/HF performances of dielectric pocket SOI-Tunnel FET	8
Evaluating reliability through soft error triggered exceptions at ARM Cortex-A9 microprocessor	8
Analysis of solder joint degradation and output power drop in silicon photovoltaic modules for reliability improvement	8
Application of artificial neural networks to the identification of weak electrical regions in large area MIM structures	8
Epitaxial hillocks defects caused by subsurface damage from InAs substrate	8
Failure rate analysis of radiation tolerant design techniques on SRAM-based FPGAs	8
Enhanced gate biasing resilience in asymmetric and double trench SiC MOSFETs towards generalized highly reliable power electronics	8
Wavelet-based rapid identification of IGBT switch breakdown in voltage source converter	8
ESD Human Body Model step stress distributions of GaN HEMTs and the correlation with one level test results	8
Characteristics and avalanche investigation of SiC VDMOSFETs with enhanced P-Based implantation	8
Towards development of an intelligent failure analysis system based on infrared thermography	8
Observation framework of errors in microprocessors with machine learning location inference of radiation-induced faults	8
Single event burnout of SiC MOSFET induced by atmospheric neutrons	7
Influence of Interface Traps on MOSFET thermal coefficients and its effects on the ZTC current	7
Evaluating softcore GPU in SRAM-based FPGA under radiation-induced effects	7
Time-dependent statistical NBTI model for aging assessment in circuit level implemented with open model interface	7
Microelectronics Reliability: Publisher’s note	7
Editorial Board	7
Thermal cycling reliability of electronic components in bolted assemblies: A study of the influence of bolt position	7
Charge deposition analysis of heavy-ion-induced single-event burnout in low-voltage power VDMOSFET	7
Origin of trap assisted tunnelling in ammonia annealed SiC trench MOSFETs	7
A review on warpage measurement metrologies for advanced electronic packaging	7
Sixer: A low-overhead, fully-distributed test scheme with guaranteed delivery of packets in networks-on-chip	7
A humidity-induced novel failure mechanism in power semiconductor diodes	7
Revisiting the effectiveness of diamond heat spreaders on multi-finger gate GaN HEMT using chip-to-package-level thermal simulation	7
Effects of Ga alloying on microstructure and comprehensive performances of Sn–9Zn–2Bi alloys for the microelectronics industry	7
Developed non-destructive verification methods for accelerated temperature cycling of power MOSFETs	7
Study on proton-induced single event effect of SiC diode and MOSFET	7
Fatigue performance and microstructure of lead-free solder joints in BGA assembly at room temperature	7
Fault and self-repair for high reliability in die-to-die interconnection of 2.5D/3D IC	7
Understanding board level vibrations in automotive electronic modules	7
Prediction of the electrochemical migration induced failure on power PCBs under humidity condition — A case study	7
Cost-effective reliability enhancement for video stitching applications based on error-tolerance	7
Characterization of single-event transients induced by high LET heavy ions in 16 nm bulk FinFET inverter chains	7
Mobile ions entering the IGBT gate oxide - electrical detection and failure localization by lock-in thermography	7
Isolation properties and failure mechanisms of vertical Pt / n-GaN SBDs	7
Generation of a fault-tolerant clock through redundant crystal oscillators	7
Impact reliability analysis of a rigid-flex PCB system under acceleration loads	7
Memoryless linearity in undoped and B-doped graphene FETs: A relative investigation to report improved reliability	7
Degradation modeling of InGaAs/InP avalanche photodiodes using calibrated technology computer-aided design	7
Comprehensive investigation on different ions of geostationary orbit induced single event burnout in GaN HEMT power devices	7
Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin	7
Effect of gate oxide thickness on gate latent damage induced by heavy ion in SiC power MOSFETs	7
Study on high power microwave nonlinear effects and degradation characteristics of C-band low noise amplifier	7
Changes in the extraction and collection efficiency of GaN-based MQW solar cells under optical step-stress	7
Fault-tolerant multiplier using self-healing technique	7
Morphological characterization of 325 mesh-grinding-induced defects on silicon wafer surface	7
Hybrid domain-based fast transient thermal evaluation method for power semiconductor modules in EV motor drive	7
Squeeze-out and bond strength of patterned Cu Sn SLID seal-frames	7
Design of soft error correction flip-flop cells for highly reliable applications	7
Implementation of high failure current Schottky-embedded DDSCR	7
Influence of different test strategies on the power cycling test results of 6.5 kV SiC MOSFETs	7
Modeling of MEMS Electrothermal Microgripper employing POD-DEIM and POD method	7
A cost-effective repair scheme for clustered TSV defects in 3D ICs	7
Improved failure analysis in scanning acoustic microscopy via advanced signal processing techniques	7
Dynamic EFI and circuit analysis case studies on integrated circuit buried via void defects	7
Analysis of the stress state in QFN package during four point bending and temperature experiments utilizing piezoresistive stress sensor	7
Design and power optimization of a QCA-based universal reversible logic gate architecture using cell interaction approach	7
Investigation of ESD protection devices for SiC-based monolithic integrated circuits	7
BP neural network for non-invasive IGBT junction temperature online detection	7
Study on single-event burnout hardening with reduction of hole current density by top polysilicon diode of SOI LDMOS based on TCAD simulations	6
Reliability estimation of complex systems based on a Wiener process with random effects and D-vine copulas	6
A screening test of GaN-HEMTs for improvement of breakdown voltage uniformity	6
Impact of neutron irradiation on SiC power MOSFETs after stress tests qualification	6
Warpage measurements to support the development of mmWave modules	6
A survey on two-dimensional Error Correction Codes applied to fault-tolerant systems	6
Editorial Board	6
Automated endpointing in microelectronics failure analysis using laser induced breakdown spectroscopy	6
TID evaluation based on variabilities of space radiation and device failure dose in typical navigation satellite orbits	6
Humidity related failure mechanism of IGBTs considering dynamic avalanche	6
The sensitivity analysis of geometric parameters on the power cycling reliability of bond wires	6
Constitutive equations for strain rate and temperature dependent mechanical behaviour of porous Ag-sintered joints in electronic packages	6
The behaviour of 350 V GaN HEMTs during heavy ion irradiations	6
Research progress on the stability of transparent conductive films for silver nanowires	6
Failure mechanism of 4H-SiC junction barrier Schottky diodes under harsh thermal cycling stress	6
A reliability assessment methodology of system-in-package based virtual qualification	6
Analysis of slow-current transients or current collapse in AlGaN/GaN HEMTs with field plate and high-k passivation layer	6