Microelectronics Reliability

Papers
(The H4-Index of Microelectronics Reliability is 20. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2020-11-01 to 2024-11-01.)
ArticleCitations
Lithium-ion battery performance degradation evaluation in dynamic operating conditions based on a digital twin model61
A lithium-ion battery remaining useful life prediction method based on the incremental capacity analysis and Gaussian process regression59
Thermal performance of heat sink using nano-enhanced phase change material (NePCM) for cooling of electronic components56
Soft errors in DNN accelerators: A comprehensive review53
A comparative study of thermal fatigue life of Eutectic Sn-Bi, Hybrid Sn-Bi/SAC and SAC solder alloy BGAs49
Development of low temperature Cu Cu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)42
Challenges to overcome breakdown limitations in lateral β-Ga2O3 MOSFET devices32
Flip Chip integration of ultra-thinned dies in low-cost flexible printed electronics; the effects of die thickness, encapsulation and conductive adhesives29
Surge current capability of ultra-wide-bandgap Ga2O3 Schottky diodes27
Lithium-ion battery SoH estimation based on incremental capacity peak tracking at several current levels for online application26
Ultrasonic monitoring performance degradation of lithium ion battery25
Gate-switching-stress test: Electrical parameter stability of SiC MOSFETs in switching operation24
DC and RF/analog performances of split source horizontal pocket and hetero stack TFETs considering interface trap charges: A simulation study23
Effect of critical properties of epoxy molding compound on warpage prediction: A critical review22
An interpretable remaining useful life prediction scheme of lithium-ion battery considering capacity regeneration22
A simulation-based analysis of effect of interface trap charges on dc and analog/HF performances of dielectric pocket SOI-Tunnel FET21
Constituents and performance of no-clean flux for electronic solder21
Accelerative reliability tests for Sn3.0Ag0.5Cu solder joints under thermal cycling coupling with current stressing21
Improved deep learning based telemetry data anomaly detection to enhance spacecraft operation reliability20
A survey of the structure, fabrication, and characterization of advanced organic light emitting diodes20
An improved lifetime prediction method for metallized film capacitor considering harmonics and degradation process20
IGBT aging monitoring and remaining lifetime prediction based on long short-term memory (LSTM) networks20
Impact of interface trap charges on electrical performance characteristics of a source pocket engineered Ge/Si heterojunction vertical TFET with HfO2/Al2O3 laterally stacked gate oxide20
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