Microelectronics Reliability

Papers
(The H4-Index of Microelectronics Reliability is 21. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-05-01 to 2025-05-01.)
ArticleCitations
New reliability model for power SiC MOSFET technologies under static and dynamic gate stress75
The characterization of low-k thin films and their fracture analysis in a WLCSP device74
Soft sensor design for estimation of thermal behavior of encapsulating materials in power electronic module60
Aging investigation of the latest standard dual power modules using improved interconnect technologies by power cycling test33
A programmable checker for automated 2.5D/3D IC latch-up verification and hot junctions detection33
Study on annealing effect of bipolar transistors at different temperatures after total dose irradiation29
Reliability assessment of miniaturised electromechanical RF relays for space applications29
Highly reliable Cu Cu low temperature bonding using SAC305 solder with rGO interlayer27
Modeling of the impact of mechanical stress resulted from wafer probing and wire bonding on circuit under pad27
Editorial Board26
Effect of high-temperature storage on the thermal conductivity of Cu nanoparticles/Bi-Sn hybrid bonding26
Failure analysis on capacitor failures using simple circuit edit passive voltage contrast method25
Breakdown voltage and TDDB performance improvement by optimizing the PECVD dielectric film characteristics in MIM capacitors25
Editorial Board25
Boosting the thermal stability of paralleled GaAs HBTs through temperature-dependent ballasting resistors: A proof-of-concept study24
A novel in-situ approach to monitor the variations in the on-resistance of power transistors during switching operation23
Single event burnout failures caused in silicon and silicon carbide power devices by single alpha particles emitted from radioactive nuclides23
A novel online 4-point rainflow counting algorithm for power electronics22
Investigation of the role of pre-existing oxide in the initial degradation mechanism in AlGaN/GaN HEMTs under ON-state stress22
DNN-based error level prediction for reducing read latency in 3D NAND flash memory22
Investigating the solder mask defects impact on leakage current on PCB under condensing humidity conditions21
Electrical deterioration of 4H-SiC MOS capacitors due to bulk and interface traps induced by proton irradiation21
Investigation of microstructure, thermal properties, and mechanical performances of Ni-added Sn-5.0Sb-0.5Cu/Cu solder joints21
Effect of microstructural variability on fatigue simulations of solder joints21
Effect of solder junction void variation in power semiconductor package on power cycle lifetime21
0.16107106208801