Microelectronics Reliability

Papers
(The H4-Index of Microelectronics Reliability is 19. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2020-04-01 to 2024-04-01.)
ArticleCitations
Lithium-ion battery performance degradation evaluation in dynamic operating conditions based on a digital twin model50
A lithium-ion battery remaining useful life prediction method based on the incremental capacity analysis and Gaussian process regression47
Thermal performance of heat sink using nano-enhanced phase change material (NePCM) for cooling of electronic components45
Soft errors in DNN accelerators: A comprehensive review42
Defect inspection of flip chip solder joints based on non-destructive methods: A review41
FlexGripPlus: An improved GPGPU model to support reliability analysis40
A comparative study of thermal fatigue life of Eutectic Sn-Bi, Hybrid Sn-Bi/SAC and SAC solder alloy BGAs36
Development of low temperature Cu Cu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)30
Challenges to overcome breakdown limitations in lateral β-Ga2O3 MOSFET devices29
Microstructure evolution and hardness of MWCNT-reinforced Sn-5Sb/Cu composite solder joints under different thermal aging conditions28
Effect of temperature and humidity on moisture diffusion in an epoxy moulding compound material27
Remaining useful life (RUL) estimation of electronic solder joints in rugged environment under random vibration27
Surge current capability of ultra-wide-bandgap Ga2O3 Schottky diodes23
Flip Chip integration of ultra-thinned dies in low-cost flexible printed electronics; the effects of die thickness, encapsulation and conductive adhesives22
Effect of micromorphology on corrosion and mechanical properties of SAC305 lead-free solders21
Physics of failure of die-attach joints in IGBTs under accelerated aging: Evolution of micro-defects in lead-free solder alloys21
Lithium-ion battery SoH estimation based on incremental capacity peak tracking at several current levels for online application20
Mechanics-based acceleration for estimating thermal fatigue life of electronic packaging structure20
A mixed-effects model of two-phase degradation process for reliability assessment and RUL prediction20
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